Furnace passing carrier for experimental PCB (Printed Circuit Board)

Abstract

The utility model belongs to the technical field of LEDs (light-emitting diodes), and particularly relates to a furnace passing carrier for an experimental PCB (printed circuit board). Comprising a carrier plate and a cover body, the cover body is detachably installed on the carrier plate, and after the cover body and the carrier plate are installed, a containing cavity used for installing an experiment PCB is formed; the carrier plate is provided with a first hollow part communicated with the accommodating cavity, and the cover body is provided with a second hollow part communicated with the accommodating cavity; and a positioning structure and a limiting structure for locking the cover body are also arranged between the carrier plate and the cover body. The device is suitable for being used in cooperation with an experiment PCB mounted on a whole-piece type LED support, can be mounted and allows the experiment PCB to directly pass through a furnace, and the efficiency is greatly improved.

Description

Technical Field

[0001] This utility model belongs to the technical field of LEDs, and in particular relates to a reflow carrier for experimental PCB boards. Background Technology

[0002] Current SMD LED bracket products undergo high and low temperature thermal shock reliability testing by peeling the encapsulated LED bracket into individual LED chips, which are then sorted and taped. The individual LED chips are then mounted onto the corresponding test PCB board using a pick-and-place machine. After mounting, the chips undergo reflow soldering to solidify them for subsequent testing. Current test PCB boards are designed for single-LED chip mounting and are directly mounted on a carrier board for reflow. Utility Model Content

[0003] The purpose of this utility model is to provide a reflow carrier for experimental PCB boards, which is compatible with experimental PCB boards with integral LED bracket mounting, and can be installed and directly reflowed, greatly improving efficiency.

[0004] Based on this, the present invention provides a reflow carrier for experimental PCB boards, including a carrier board and a cover, wherein the cover is detachably mounted on the carrier board, and the cover and the carrier board, after being installed, form a receiving cavity for mounting the experimental PCB board.

[0005] The carrier plate has a first hollow portion communicating with the accommodating cavity, and the cover has a second hollow portion communicating with the accommodating cavity;

[0006] The carrier plate and the cover are further provided with a positioning structure and a limiting structure for locking the cover.

[0007] As described above, in a reflow oven for an experimental PCB board, both the first and second cutout portions are grid-shaped and have vertical strip-shaped cutouts.

[0008] As described above, in a reflow carrier for an experimental PCB board, the cutouts of the first cutout portion and the cutouts of the second cutout portion are aligned one-to-one, and the cutouts of the second cutout portion are aligned one-to-one with the strip-shaped connection areas on the experimental PCB board.

[0009] As described above, a reflow carrier for an experimental PCB board has a recessed cavity on the end face where the carrier board is assembled with the cover, and the cover covers the cavity to form the receiving cavity.

[0010] As described above, in a reflow oven for an experimental PCB board, the contour of the cavity matches the outer contour of the experimental PCB board, and the two sides of the cavity also have recesses extending outward and communicating with the cavity, with the first cutout located inside the cavity.

[0011] As described above, in a reflow oven for an experimental PCB board, a protruding limiting post is provided on the outer periphery of the first cutout portion inside the cavity.

[0012] As described above, a reflow carrier for an experimental PCB board includes a positioning protrusion on the carrier plate and a limiting hole on the cover through which the positioning protrusion passes. The positioning protrusion is provided on the carrier plate at least around the first cutout portion.

[0013] As described above, a reflow carrier for an experimental PCB board includes a limiting structure comprising a movable clamp on the carrier plate and a clamping position on the cover. The movable clamp is rotatably disposed on the end face of the carrier plate and can be pressed against the end face. The clamping position is a recess extending inward from the outer edge of the cover, and the movable clamp can rotate to enter or disengage from the clamping position.

[0014] The movable clamps include at least four, which are respectively arranged opposite each other on both sides of the first hollow part, and the clamping positions correspond one-to-one with the movable clamps.

[0015] As described above, in the reflow carrier for an experimental PCB board, the width of a single cutout in the second cutout section is 1.5-3mm, and the distance between two adjacent cutouts is 1-2.5mm.

[0016] As described above, the reflow carrier for an experimental PCB board has a thickness of 4-6 mm, and the carrier board has outwardly extending side edges on both sides. The thickness of the side edges is less than the thickness of the carrier board, and the end face of the side edges is flush with one end face of the carrier board mounting cover.

[0017] Implementing the embodiments of this utility model has the following beneficial effects:

[0018] This utility model provides a reflow carrier for experimental PCB boards. By combining a carrier plate and a cover, it can install and position experimental PCB boards with a whole-piece LED bracket. The corresponding first and second cutouts can effectively solidify the PCB board and LED bracket installed inside the accommodating cavity during reflow soldering, greatly improving efficiency. Moreover, it is suitable for use with experimental PCB boards that retain the entire LED bracket, resulting in better overall stability and avoiding loosening of connections due to impacts. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the carrier plate of this utility model;

[0021] Figure 2 This is a schematic diagram of the structure of the cover of this utility model;

[0022] Figure 3 This is a schematic diagram of the carrier plate from another angle;

[0023] Figure 4 This is a schematic diagram of the experimental PCB board.

[0024] Figure 5 for Figure 4 Enlarged view of part A;

[0025] Figure 6 for Figure 4 Enlarged view of part B;

[0026] Figure 7 This is a schematic diagram of the LED bracket structure;

[0027] Figure 8 for Figure 7 Enlarged view of part C;

[0028] Figure 9 This is a schematic diagram of a single LED bead on an LED bracket. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] like Figures 1 to 4 As shown, this utility model embodiment provides a reflow carrier for an experimental PCB board, including a carrier plate 1 and a cover 2. The cover 2 is detachably installed on the carrier plate 1. After the cover 2 and the carrier plate 1 are installed, they form a receiving cavity 102 for installing the experimental PCB board 91.

[0031] The carrier plate 1 has a first cutout portion 101 communicating with the accommodating cavity, and the cover 2 has a second cutout portion 201 communicating with the accommodating cavity. Through the combination of the carrier plate and the cover, the experimental PCB board with the whole LED bracket is installed and positioned. The corresponding first and second cutout portions enable the PCB board and LED bracket installed inside the accommodating cavity to be effectively cured during reflow soldering, which greatly improves efficiency. Moreover, it is suitable for use with experimental PCB boards that retain the entire LED bracket, resulting in better overall stability and avoiding loosening of the connection due to bumps.

[0032] In addition, to enhance the installation and positioning effect, this solution includes a positioning structure and a limiting structure for locking the cover 2 between the carrier plate 1 and the cover 2. The limiting structure allows the cover 2 to be quickly locked or disassembled from the carrier plate 1, making the assembly and disassembly operations simpler and easier.

[0033] Specifically, in this embodiment of the invention, the positioning structure includes positioning protrusions 31 on the carrier plate 1 and limiting holes 32 on the cover 2 through which the positioning protrusions 31 can pass. The carrier plate 1 has positioning protrusions 31 on at least all four sides of the first hollow portion 101. Through the cooperation of the positioning protrusions 31 and the limiting holes 32, the cover 2 can be installed on the carrier plate in the correct posture. For example, the positioning protrusions 31 and the limiting holes 32 must be aligned before installation. Of course, in this solution, the cover 2 preferably adopts a rectangular structure, and swapping its top and bottom long sides does not affect its use. Therefore, in this solution, the positioning protrusions 31 and the limiting holes 32 are arranged at the four corners.

[0034] More specifically, in this embodiment of the present invention, the limiting structure includes a movable clamp 41 disposed on the carrier plate 1 and a clamping position 42 disposed on the cover 2. The movable clamp 41 is rotatably disposed on the end face of the carrier plate 1 and can be pressed against the end face. The clamping position 42 is a recess extending inward from the outer edge of the cover 2, and the movable clamp 41 can rotate to enter or disengage from the clamping position 42.

[0035] The movable clamps 41 include at least four, which are respectively arranged opposite to each other on both sides of the first hollow portion 101. The clamping positions 42 correspond one-to-one with the movable clamps 41. By rotating the movable clamps 41, the cover 2 can be pressed tightly onto the carrier plate. Disassembly is also performed by rotating the clamps, making the locking operation simpler.

[0036] In this embodiment of the invention, the first cutout portion 101 and the second cutout portion 201 can be shapes adapted to the entire LED bracket, or at least shapes adapted to the areas on the LED bracket where LED beads are set. As a preferred embodiment, both the first cutout portion 101 and the second cutout portion 201 are grid-shaped and have vertical strip-shaped cutouts. Furthermore, the cutouts of the first cutout portion 101 and the second cutout portion 201 are aligned one-to-one, and the cutouts of the second cutout portion 201 are aligned one-to-one with the strip-shaped connection areas on the experimental PCB board 91. This adapts to the LED beads set on the LED bracket, ensuring that each vertical column of LED beads is aligned with a single grid opening, facilitating the curing of the LED bracket and PCB board during reflow oven processing.

[0037] Furthermore, in this embodiment of the present invention, the accommodating cavity 102 serves as a cavity for placing and installing the experimental PCB, and also has a positioning and limiting function. It can be provided on the carrier plate 1 and / or the cover 2, such as providing recessed cavities at corresponding positions on the carrier plate 1 and the cover 2, forming the entire accommodating cavity after being closed, or provided separately on the carrier plate or the cover. Preferably, in order to facilitate installation, the accommodating cavity is directly provided on the carrier plate 1, that is, the end face of the carrier plate 1 and the cover 2 has a recessed cavity, and the cover 2 is closed on the cavity to form the accommodating cavity 102.

[0038] Furthermore, the contour of the cavity matches the outer contour of the experimental PCB board 91. In addition, for easy handling, the cavity has recesses 1021 extending outward and connecting to the cavity on both sides, with the first cutout 101 located inside the cavity. The recesses 1021 on both sides provide space for gripping, thus providing a fixed position for picking up and placing the PCB board, whether manually or with equipment, to facilitate automation.

[0039] In this embodiment of the invention, a protruding limiting post 1022 is provided on the outer periphery of the first hollow portion 101 inside the cavity. The limiting post 1022 is used to position and install the experimental PCB board, so that it can play a good limiting role after entering the cavity, and can also play a certain role in preventing mistake-proofing and avoiding reverse mounting.

[0040] In addition, in this embodiment of the invention, to achieve better curing effect, the gridded cutouts not only need to be adapted to the size of the LED beads on the LED bracket, but also need to reserve a reasonable width and spacing to ensure that the cutouts are slightly larger than a single row of LEDs on the LED bracket, while also accommodating multiple rows of LED beads. The width of a single cutout in the second cutout portion 201 is 1.5-3mm, and the distance between two adjacent cutouts is 1-2.5mm. Preferably, the width of a single cutout is 2mm, and the distance between two adjacent cutouts is 1.5mm.

[0041] Furthermore, the thickness of the carrier plate 1 is 4-6mm, and the carrier plate 1 has outwardly extending side edges 19 on both sides. The thickness of the side edges 19 is less than the thickness of the carrier plate 1, and the end face of the side edges 19 is flush with one end face of the mounting cover 2 of the carrier plate 1. Preferably, in this solution, the thickness of the carrier plate 1 is 5mm, and the thickness of the side edges 19 is 2.5mm, and the thickness of the side edges 19 is less than the thickness of the carrier plate 1, so that a step is formed on the rear side. The step on both sides facilitates the positioning and transportation of the carrier plate 1 in the automated transport line, thereby facilitating product automation.

[0042] like Figures 4 to 9 As shown, in this utility model, the carrier is applicable to the PCB board on which the entire LED bracket is mounted. Its specific structure includes a substrate 901, on which a test area 911, a mounting area 912, and a positioning area 913 are provided. The mounting area is used to dock with the LED bracket 99 and connect with the LED beads on the LED bracket 99 to facilitate the inspection of individual LED beads in subsequent testing experiments. The positioning area 913 ensures the alignment of the LED bracket 99 during installation to facilitate stability after installation.

[0043] In this design, the mounting area 912 is planar and designed to accommodate a single LED bracket 99. The mounting area contains several regularly arranged LED connection positions 9120. When the single LED bracket 99 is mounted on the substrate 901, each LED on the bracket corresponds one-to-one with a connection position 9120. The positioning area 913 is located outside the mounting area 912 and is used to position and mount the single LED bracket 99. The testing area 911 is located outside the mounting area 912 and is connected to the LED connection positions 9120. This design allows for mounting with the single LED bracket, ensuring that the mounting area aligns with each LED on the bracket. Reliability testing can then be performed through the testing area, resulting in higher overall installation efficiency. Furthermore, it eliminates the need to disassemble the LEDs in traditional LED brackets, preserving the entire bracket. This allows for tracing the source of reliability issues based on information recorded on the bracket, improving the accuracy of tracing the source of reliability anomalies. This facilitates targeted improvements to address anomalies, rapidly enhances product quality, and effectively reduces the defect rate.

[0044] Traditional LED thermal shock testing boards involve peeling the packaged LED substrate into individual LED chips, then shuffling and spinning the chips through processes like beam splitting and mixing, winding them into rolls, and finally mounting them onto corresponding test PCBs using an SMT (Surface Mount Technology) machine for reliability testing. From the entire LED substrate to the LED chips mounted on the PCB, multiple processes such as beam splitting and mixing occur. When anomalies occur during testing, it's impossible to trace the source of the problem, hindering precise improvement. This solution, compared to the traditional single-LED chip mounting method, retains the entire LED substrate and its associated information. Therefore, when a chip on a single LED substrate fails, this information can be used to trace back to the production source in the previous process, allowing for timely parameter adjustments and effectively improving yield.

[0045] In this embodiment of the invention, preferably, the LED bracket is directly mounted on the substrate 901. Compared to mounting individual LED beads, this significantly improves installation efficiency. The LED beads, along with the entire bracket, are mounted on the PCB board, increasing adhesion between the LED beads and the PCB board and preventing loosening or detachment of individual beads due to impacts. This reduces the proportion of misjudgments in experiments caused by loosening of LED beads due to impacts, resulting in better overall stability and more accurate test results.

[0046] Of course, the regular arrangement of the LED connection positions 9120 in this solution can be arranged according to a certain design trajectory, such as the conventional straight line or matrix type, or a certain trajectory shape, such as arc or ring. It can at least cover each LED bead on the LED bracket. Preferably, it corresponds one-to-one with each LED bead on the LED bracket.

[0047] Specifically, in this embodiment of the invention, the mounting area 912 is rectangular and matches the area on the LED bracket 99 where LED lights are mounted. Its structure is simple and easy to adapt to the installation of LED brackets.

[0048] In this embodiment of the invention, the mounting area 912 is formed by a plurality of LED connection positions 9120. These LED connection positions 9120 form multiple parallel, spaced strip-shaped connection areas, which are formed by the vertical arrangement of the LED connection positions 9120. Specifically, a single LED connection position 9120 is paired with a single LED bead. These individual LED connection positions 9120 are arranged vertically to form a strip-shaped connection area, and the multiple parallel and spaced strip-shaped connection areas form a panel, thus adapting to the panel formed by multiple LED beads generated in a conventional LED bracket. During mounting, only the corresponding panel needs to be used, ensuring that each LED bead is paired with its corresponding LED connection position. This simplifies installation and improves installation efficiency.

[0049] Furthermore, in this invention, the test area 911 includes multiple sets of test connection positions, each of which corresponds to and is electrically connected to one of the multiple strip-shaped connection areas. The main function of the test area 911 is to illuminate the corresponding LED beads by connecting the corresponding positions in the test area 911 when testing experimental equipment.

[0050] Taking a traditional tri-color LED bead as an example, the LED bead has three bright colors: RGB. In order to adapt to its experiment, this solution includes a first connecting pin 9121, a second connecting pin 9122, a third connecting pin 9123, and a fourth connecting pin 9124 for each LED connection pin. It can be understood that each connecting pin is a corresponding connection terminal. For example, the first connecting pin 9121 is the red positive terminal, which is the R terminal. Similarly, the second connecting pin 9122 is the G terminal, the third connecting pin 9123 is the B terminal, and the fourth connecting pin 9124 can be the common negative terminal.

[0051] In this solution, to facilitate conduction, among the multiple LED connection positions 9120 on a single strip-shaped connection area, the first connection pin 9121 of each LED connection position 9120 is interconnected and conduction is achieved; the second connection pin 9122 of each LED connection position 9120 is interconnected and conduction is achieved; the third connection pin 9123 of each LED connection position 9120 is interconnected and conduction is achieved; and the fourth connection pin 9124 of each LED connection position 9120 is interconnected and conduction is achieved.

[0052] Additionally, the test connection points described in the single group include a first test connection point 9111, a second test connection point 9112, and a third test connection point 9113; these correspond to the conduction of the R terminal, G terminal, and B terminal, specifically...

[0053] In this single-group test connection, the first test connection point 9111 and the first connection pin 9121 on the corresponding strip-shaped connection area are both conductive; the second test connection point 9112 and the second connection pin 9122 are both conductive; and the third test connection point 9113 and the third connection pin 9123 are both conductive. This structure allows for testing where only the first test connection point of the test area 911 is needed to illuminate multiple LED beads in a single strip. Similarly, this arrangement ensures that multiple first test connection points on the test connection positions are connected to signals, resulting in all LED beads on the entire LED bracket illuminating red for testing, thus making the testing process faster.

[0054] Furthermore, in this design, the substrate 901 is also provided with a connection bus 919, which is arranged along the outer periphery of the mounting area 912, and the fourth connecting pin 9124 on each of the strip-shaped connection areas is connected to the connection bus 919. This makes the overall wiring more compact, thereby helping to reduce the overall size. In this embodiment, the substrate 901 is rectangular, and its overall dimensions can be designed to be less than 100mm in width and less than 170mm in length. The width of the mounting area 912 is 60~90mm, and the length of the mounting area 912 is 145~170mm. As a preferred embodiment, its dimensions can be: substrate 901 width 90.1mm, length 162mm, mounting area 912 width 75mm, length 154mm. This layout design makes full use of space and makes the overall product volume smaller.

[0055] Of course, the substrate of this solution is a PCB board, and the above-mentioned connection points and buses are all printed on the substrate to realize the corresponding conduction method.

[0056] In this embodiment of the invention, the positioning area 913 and the LED bracket are pre-positioned before mounting, resulting in more accurate positioning and less displacement before mounting and fixing, preventing displacement from causing LED bead connection failure. The positioning area 913 includes multiple positioning structures located between the test area 911 and the mounting area 912. Specifically, the positioning structure in this solution can be a through hole in the positioning area 913. The above-mentioned positioning installation can be achieved by setting a corresponding protruding structure on the LED bracket, such as a protruding post. Of course, protruding posts can also be set on the positioning area, in which case only a corresponding through hole needs to be set on the LED bracket. Preferably, but not limited to, this solution provides at least multiple positioning structures along the length of the mounting area 912. Of course, multiple positioning structures can also be arranged around the entire periphery of the mounting area 912 to ensure effective pre-positioning after installation.

[0057] In this embodiment of the utility model, the substrate 901 is rectangular in shape, and positioning mounting holes 101 are provided on the four sides of the substrate 901. The positioning mounting holes 101 facilitate the use of the substrate 901 as a carrier for positioning and installation during testing experiments or when it is fixed to the LED bracket in the reflow oven.

[0058] It should be understood that the terms "first," "second," etc., are used in this utility model to describe various information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this utility model, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information. In addition, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0059] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A reflow oven carrier for experimental PCB boards, characterized in that, Includes a carrier plate (1) and a cover (2), the cover (2) being detachably mounted on the carrier plate (1), and the cover (2) forming a receiving cavity (102) for mounting an experimental PCB board (91) after being mounted on the carrier plate (1). The carrier plate (1) is provided with a first hollow part (101) communicating with the accommodating cavity, and the cover (2) is provided with a second hollow part (201) communicating with the accommodating cavity. The carrier plate (1) and the cover (2) are further provided with a positioning structure and a limiting structure for locking the cover (2).

2. The reflow carrier for experimental PCB boards according to claim 1, characterized in that, Both the first hollow part (101) and the second hollow part (201) are grid-shaped and have vertical strip-shaped hollow openings.

3. The reflow carrier for experimental PCB boards according to claim 2, characterized in that, The cutouts of the first cutout portion (101) are one-to-one with the cutouts of the second cutout portion (201), and the cutouts of the second cutout portion (201) are one-to-one with the strip-shaped connection area on the experimental PCB board (91).

4. The reflow carrier for experimental PCB boards according to claim 3, characterized in that, The end face of the carrier plate (1) and the cover (2) is recessed to form a cavity, and the cover (2) covers the cavity to form the accommodating cavity (102).

5. The reflow carrier for experimental PCB boards according to claim 4, characterized in that, The contour of the cavity matches the outer contour of the experimental PCB board (91). The two sides of the cavity also have recesses (1021) that extend outward and connect to the cavity. The first hollow part (101) is located inside the cavity.

6. The reflow carrier for experimental PCB boards according to claim 5, characterized in that, The cavity is also provided with a protruding limiting post (1022) on the outer periphery of the first hollow part (101).

7. A reflow carrier for experimental PCB boards according to any one of claims 1-6, characterized in that, The positioning structure includes a positioning protrusion (31) on the carrier plate (1) and a limiting hole (32) on the cover (2) through which the positioning protrusion (31) can pass. The positioning protrusion (31) is provided on the carrier plate (1) at least around the first hollow part (101).

8. A reflow carrier for experimental PCB boards according to any one of claims 1-6, characterized in that, The limiting structure includes a movable clamp (41) on the carrier plate (1) and a clamping position (42) on the cover (2). The movable clamp (41) is rotatably disposed on the end face of the carrier plate (1) and can be pressed against the end face. The clamping position (42) is a recess extending inward from the outer edge of the cover (2), and the movable clamp (41) can rotate to enter or disengage from the clamping position (42). The movable clamps (41) include at least four, and are respectively arranged opposite to each other on both sides of the first hollow part (101). The clamping positions (42) correspond one-to-one with the movable clamps (41).

9. The reflow carrier for experimental PCB boards according to claim 8, characterized in that, The width of a single cutout in the second cutout section (201) is 1.5-3mm, and the distance between two adjacent cutouts is 1-2.5mm.

10. A reflow carrier for experimental PCB boards according to claim 8, characterized in that, The thickness of the carrier plate (1) is 4-6 mm, and the carrier plate (1) has outwardly extending side edges (19) on both sides. The thickness of the side edges (19) is less than the thickness of the carrier plate (1), and the end face of the side edges (19) is flush with one end face of the carrier plate (1) mounting cover (2).

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