Photovoltaic module

Abstract

The photovoltaic module comprises first packaging front plate glass, a front-layer packaging adhesive film layer, a semi-finished product laminated piece, a rear-layer packaging adhesive film layer and first packaging cover plate glass which are stacked in sequence, the semi-finished product laminated piece comprises second packaging front plate glass, a first adhesive film layer, a battery piece array layer, a second adhesive film layer and second packaging cover plate glass which are stacked in sequence; the second packaging front plate glass is attached to a front packaging adhesive film layer; the second packaging cover plate glass is attached to a rear packaging adhesive film layer; the second packaging front plate glass and the second packaging cover plate glass are made of non-tempered glass; the first packaging front plate glass and the first packaging cover plate glass are made of at least one of tempered glass or semi-tempered glass. According to the invention, the edge of the module has no overpressure phenomenon, the glass and the adhesive film have no stress concentration phenomenon, the thickness distribution is uniform, the phenomena of delamination, relaxation and the like caused by stress release of the edge of the module in an outdoor actual use environment can be prevented, and the reliability of the module is improved.

Description

Technical Field

[0001] This application relates to the field of photovoltaic technology, and in particular to a photovoltaic module. Background Technology

[0002] Currently, the photovoltaic industry uniformly chooses to use tempered or semi-tempered glass to make double-glass modules. The main reason is that after tempering, the impact resistance and bending strength of the glass are 3-5 times that of ordinary glass. Therefore, the mechanical strength of photovoltaic modules made of tempered glass is greatly improved, and their performance is better than that of ordinary glass.

[0003] Tempered glass is made by heat-treating ordinary glass at high temperatures and then annealing it. During the high-temperature heat treatment and annealing, different areas may experience inconsistent heating and cooling rates, resulting in varying degrees of tempering in different areas.

[0004] Due to inconsistent tempering effects in different areas of tempered glass, a noticeable phenomenon occurs during the lamination process of double-glass photovoltaic modules: During lamination, the temperature reaches approximately 140℃. The front and back glass, heated at high temperatures and with inconsistent heating rates, experience warping at all four edges, especially the corners. This means the module edges are subjected not only to the pressure applied by the laminator but also to additional stress from the glass edge deformation. Consequently, the encapsulant film at the edges of the laminated double-glass module is abnormally compressed, resulting in a difference in thickness between the edge and center of the module—the edge thickness is less than the center thickness. This thickness difference leads to encapsulant film delamination at the module edges during reliability testing and real-world outdoor use, especially under prolonged exposure to alternating hot and cold environments or extreme climates. This results in decreased sealing and waterproofing performance, as well as reduced mechanical strength.

[0005] Therefore, it is necessary to design a photovoltaic module to solve the technical problems mentioned above. Utility Model Content

[0006] Based on this, a photovoltaic module is provided to solve the problem that the thickness of the module edge is lower than that of the central area of ​​the module due to the thermal deformation of tempered glass during the lamination process.

[0007] To address the above issues, this application provides a photovoltaic module, comprising: a first encapsulation front glass, a front encapsulation film layer, a semi-finished laminate, a rear encapsulation film layer, and a first encapsulation cover glass, stacked sequentially; the semi-finished laminate comprises a second encapsulation front glass, a first encapsulation film layer, a cell array layer, a second encapsulation film layer, and a second encapsulation cover glass, stacked sequentially; the second encapsulation front glass is bonded to the front encapsulation film layer; the second encapsulation cover glass is bonded to the rear encapsulation film layer; wherein the second encapsulation front glass and the second encapsulation cover glass are made of non-tempered glass; the first encapsulation front glass and the first encapsulation cover glass are made of at least one of tempered or semi-tempered glass.

[0008] A preferred embodiment is that the thickness of the first encapsulation front glass and the first encapsulation cover glass is set to 0.5 to 2.0 mm.

[0009] A preferred embodiment is that the thickness of the second encapsulation front glass and the second encapsulation cover glass is set to 0.5 to 2.0 mm.

[0010] A preferred embodiment is that the front encapsulation film layer and the rear encapsulation film layer are made of hot melt adhesive, pressure-sensitive adhesive, or liquid silicone; and the first film layer and the second film layer are made of hot melt adhesive.

[0011] A preferred embodiment is that the cell array layer includes a plurality of cells and solder ribbons connecting the cells in a string; the side of the second encapsulation front glass and / or the second encapsulation cover glass near the cell array layer is provided with a solder ribbon placement groove for placing the solder ribbons.

[0012] A preferred embodiment is that the cell array layer further includes busbars connecting the solder strips; the side of the second encapsulation front glass and / or the second encapsulation cover glass near the cell array layer is also provided with a busbar placement groove for placing the busbars.

[0013] A preferred embodiment is that the solder ribbon placement groove extends continuously on the second encapsulation front glass and / or the second encapsulation cover glass along the direction in which the solder ribbon is placed; the solder ribbon placement groove is provided in a one-to-one correspondence with the solder ribbons on the battery cell array layer.

[0014] A preferred embodiment is that the cross-section of the welding strip placement groove is arc-shaped; and the opening width of the welding strip placement groove is greater than the diameter of the welding strip.

[0015] A preferred embodiment is that the second encapsulation cover glass has an enamel layer or a film layer on either or both of its opposite sides; the position of the enamel layer or film layer corresponds to the gap between multiple battery cells in the battery cell array layer.

[0016] Beneficial effects:

[0017] The lamination process of photovoltaic modules is divided into two steps. First, the second encapsulation front glass, the first encapsulation film layer, the cell array layer, the second encapsulation film layer, and the second encapsulation cover glass are laminated to form a semi-finished laminate. Since the second encapsulation front glass and the second encapsulation cover glass used to make the semi-finished laminate are made of non-tempered glass, this type of glass has low surface stress. During the lamination heating process, the glass will not warp or deform at the edges, and the glass will remain flat overall. The edge thickness of the semi-finished laminate made in this way is equal to the internal center thickness, that is, there will be no overpressure phenomenon at the edge of the module. Then, the first encapsulation front glass, the front encapsulation film layer, the rear encapsulation film layer, and the first encapsulation cover glass are laminated with the semi-finished laminate and laminated again to form the finished laminate, that is, the module. Since the first encapsulation front glass and the first encapsulation cover glass are made of tempered or semi-tempered glass, the impact resistance and bending resistance of the photovoltaic module can be improved, thereby improving the performance of the module. Because there is no overpressure at the edges of the component, there is no stress concentration in the glass and the film, and the thickness distribution is uniform. This prevents delamination and loosening of the component edges due to stress release in actual outdoor use environments, thus improving the reliability of the component. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the photovoltaic module in this embodiment;

[0019] Figure 2 This is a schematic diagram of the structure of the semi-finished laminate in this embodiment;

[0020] Figure 3 This is a cross-sectional schematic diagram of the semi-finished laminate when no placement groove is provided on the second encapsulation front glass and the second encapsulation cover glass in this embodiment;

[0021] Figure 4 This is a cross-sectional schematic diagram of the semi-finished laminate when placement grooves are provided on the second encapsulation front glass and the second encapsulation cover glass in this embodiment;

[0022] Figure 5 This is a schematic cross-sectional view of the second encapsulation front glass in this embodiment;

[0023] Figure 6 This is a cross-sectional schematic diagram of the second encapsulation cover glass in this embodiment.

[0024] Reference numerals: 10, photovoltaic module; 11, first encapsulation front glass; 12, front encapsulation film layer; 13, semi-finished laminate; 131, second encapsulation front glass; 132, first encapsulation film layer; 133, cell array layer; 1331, cell; 1332, solder ribbon; 134, second encapsulation film layer; 135, second encapsulation cover glass; 14, rear encapsulation film layer; 15, first encapsulation cover glass; 16, solder ribbon placement groove. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0026] It should be noted that the illustrations provided in this embodiment are only schematic representations of the basic concept of this application. Therefore, the drawings only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0027] The orientations or positional relationships indicated by terms such as "upper," "lower," "left," "right," "middle," "longitudinal," "lateral," "horizontal," "inner," "outer," "radial," and "circumferential" used in this specification are based on the orientations or positional relationships shown in the accompanying drawings and are used only for the purpose of simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In order to solve the problem in the existing technology that the edge of the tempered glass lamination of double glass modules curls and deforms when heated, resulting in excessive pressure on the edge of the module and thus the thickness of the edge film being less than that in the middle.

[0029] Therefore, in view of the above problems, this application provides a photovoltaic module and a manufacturing method to solve the problem that the thickness of the module edge is lower than that of the central area of ​​the module due to the thermal deformation of the tempered glass during the lamination process of the photovoltaic double glass module.

[0030] This application provides a photovoltaic module. The photovoltaic module provided in this embodiment will be described in detail below with reference to the accompanying drawings. Figure 1 , Figure 2As shown, the photovoltaic module 10 includes: a first encapsulation front glass 11, a front encapsulation film layer 12, a semi-finished laminate 13, a rear encapsulation film layer 14, and a first encapsulation cover glass 15, which are stacked sequentially; the semi-finished laminate 13 includes a second encapsulation front glass 131, a first encapsulation film layer 132, a cell array layer 133, a second encapsulation film layer 134, and a second encapsulation cover glass 135, which are stacked sequentially; the second encapsulation front glass 131 is bonded to the front encapsulation film layer 12; the second encapsulation cover glass 135 is bonded to the rear encapsulation film layer 14; wherein, the second encapsulation front glass 131 and the second encapsulation cover glass 135 are made of non-tempered glass, and the first encapsulation front glass 11 and the first encapsulation cover glass 15 are made of tempered glass or semi-tempered glass.

[0031] This application also provides a method for preparing the above-mentioned photovoltaic module, the method comprising the following steps:

[0032] Step 1: Fabrication of semi-finished laminate 13: The second encapsulation front glass 131, the first adhesive film layer 132, the battery cell array layer 133, the second adhesive film layer 134, and the second encapsulation cover glass 135 are laid in sequence and laminated at a first temperature to obtain the semi-finished laminate 13. The second encapsulation front glass 131 and the second encapsulation cover glass 135 are made of non-tempered glass.

[0033] Step 2: Fabrication of finished laminate: The first encapsulation front glass 11, the front encapsulation film layer 12, the semi-finished laminate 13, the rear encapsulation film layer 14, and the first encapsulation cover glass 15 are laid in sequence and laminated at a second temperature to obtain the finished laminate, wherein the first encapsulation front glass 11 and the first encapsulation cover glass 15 are at least one of tempered glass or semi-tempered glass.

[0034] In the embodiments of this application, the lamination process of the photovoltaic module 10 is divided into two steps. First, the first lamination is performed in the order of stacking the second encapsulation front glass 131, the first encapsulation film layer 132, the cell array layer 133, the second encapsulation film layer 134, and the second encapsulation cover glass 135 to produce a semi-finished laminate 13. The temperature of the first lamination is a first temperature, which can be 120-230℃. Since the second encapsulation front glass 131 and the second encapsulation cover glass 135 in the semi-finished laminate 13 are made of non-tempered glass, this type of glass will not deform to different degrees due to different tempering degrees during the lamination heating process. The glass will not warp or deform at the edges when heated and will still remain flat. The edge thickness of the semi-finished laminate 13 produced in this way is equal to the internal center thickness, that is, the edge of the module will not be over-pressed. Then, the front encapsulation film layer 12 is first laid on the first encapsulation front glass 11, and then the cooled semi-finished laminate is... The semi-finished laminate 13 is laid on the front encapsulation film layer 12, and the second encapsulation front glass 131 is bonded to the front encapsulation film layer 12. Then, the rear encapsulation film layer 14 and the first encapsulation cover glass 15 are laid sequentially on the second encapsulation cover glass 135 above the semi-finished laminate 13. After the laying is completed, the module undergoes a second lamination to produce the finished laminate, which is the final photovoltaic module 10. The temperature of the second lamination is the second temperature, which depends on the type of the front encapsulation film layer 12 and the rear encapsulation film layer 14. However, the second temperature is lower than the first temperature, so that the first encapsulation cover glass 15 and the second encapsulation cover glass 134 can be bonded together at low temperature, and the first encapsulation front glass 11 and the second encapsulation front glass 131 can be bonded together. At the same time, the first encapsulation front glass 11 and the first encapsulation cover glass 15 will not deform, and the first encapsulation film layer 132 and the second encapsulation film layer 134 will not soften, thus not damaging the semi-finished laminate 13.

[0035] In this embodiment, it should be noted that a first encapsulation front glass 11 and a first encapsulation cover glass 15 are provided on both sides of the semi-finished laminate 13, and tempered or semi-tempered glass is used. The impact resistance and bending strength of this glass material are better than ordinary glass. Therefore, the glass, as the external contact surface, can achieve multiple protections for the power generation unit. That is, there are two layers of glass as encapsulation protection layers on both the front and back of the cell array layer 133. Even if the outermost encapsulation glass is damaged by external factors, the inside of the photovoltaic module 10 is still encapsulated and protected by glass, which greatly improves the lifespan and risk resistance of the photovoltaic module 10.

[0036] In an optional manner, the impact resistance of the second encapsulation front plate glass 131 is lower than that of the first encapsulation front plate glass 11. For example, the second encapsulation front plate glass 131 can be ordinary non-tempered glass, the first encapsulation front plate glass 11 is tempered glass, the thickness of the second encapsulation front plate glass 131 is a1, the thickness of the first encapsulation front plate glass is a2, a1 < a2, and the value of a1 + a2 is less than or equal to 3.2.

[0037] The impact resistance of the second encapsulation cover plate glass 135 is lower than that of the first encapsulation cover plate glass 15. For example, the second encapsulation cover plate glass 135 is ordinary non-tempered glass, and the first encapsulation cover plate glass 15 is tempered glass.

[0038] In this embodiment, it should also be noted that the thicknesses of the first encapsulation front plate glass 11 and the first encapsulation cover plate glass 15 are set to 0.5 - 2.0 mm; and / or, the thicknesses of the second encapsulation front plate glass 131 and the second encapsulation cover plate glass 135 are also set to 0.5 - 2.0 mm. Currently, the glass thickness dimensions of conventional photovoltaic modules have reached 1.6 or 2.0 mm; therefore, in this embodiment, based on the principle of cost reduction, the upper limit dimensions of the thicknesses of the first encapsulation front plate glass 11, the first encapsulation cover plate glass 15, the second encapsulation front plate glass 131, and the second encapsulation cover plate glass 135 are set to not be greater than 2.0 mm.

[0039] In some embodiments, the grammage per unit area of the front encapsulation film layer 12 and the rear encapsulation film layer 14 is less than 300 g / m 2 and / or, the grammage per unit area of the first film layer 132 and the second film layer 134 is also less than 300 g / m 2 . Currently, the gram weight limit of the film for conventional photovoltaic modules is around 300 g / m 2 . Since the film needs to have a certain thickness to wrap the solder tape (the diameter of the solder tape is generally about 0.2 mm), and at the same time, if the film is too thin, the product quality of the module cannot be guaranteed. Therefore, in this embodiment, the grammage per unit area of the front encapsulation film layer 12, the rear encapsulation film layer 14, the first film layer 132, and the second film layer 134 is set to be less than 300 g / m 2 , which can achieve reducing the film usage and saving costs.

[0040] In this embodiment, it should also be noted that the photovoltaic module 10 adopts a step-by-step lamination process. The first step is to manufacture a semi-finished laminate 13. The second step is to laminate the semi-finished laminate 13 a second time to form a finished laminate. The purpose of the second lamination is to encapsulate the semi-finished laminate 13 together with the remaining encapsulation materials, such as the first encapsulation front glass 11, the front encapsulation film layer 12, the rear encapsulation film layer 14, and the first encapsulation cover glass 15, to form a whole. At this time, the battery cell array layer 133, which serves as the power generation unit, has been encapsulated in the semi-finished laminate 13. The temperature of the second lamination does not need to be consistent with the temperature of the semi-finished laminate 13 during lamination. In order to prevent the semi-finished laminate 13 from deforming or the formed film from melting during the second lamination process, the temperature of the second lamination should be lower than the temperature of the first lamination. For example, hot melt adhesive, pressure-sensitive adhesive, or liquid silicone can be used. The process temperature of the hot melt adhesive should be lower than the process temperature of the first and second films. For example, it can be a fast cross-linking film at 50-100°C. The purpose of using low temperature in the above process is to reduce the impact of temperature on the semi-finished laminate 13, the first encapsulation front glass 11, and the first encapsulation cover glass 15, to prevent the adhesive film inside the semi-finished laminate 13 from softening, and at the same time to prevent the first encapsulation front glass 11 and the first encapsulation cover glass 15 from deforming due to heat. The degree of deformation of the first encapsulation front glass 11 and the first encapsulation cover glass 15 is low, so that the thickness of the component's perimeter is consistent with the thickness of the component's center in the final finished laminate, and the problem of edge overpressure is solved.

[0041] In some embodiments, the first adhesive layer 132 and the second adhesive layer 134 are made of hot melt adhesive, such as thermally crosslinked materials or thermoplastic materials; wherein, the thermally crosslinked materials may include ethylene-vinyl acetate copolymer, polyolefin elastomer, liquid silicone; the thermoplastic materials may include polyvinyl butyral, thermoplastic polyolefin elastomer.

[0042] Please refer to Figures 2-4 As shown in the figure, in this embodiment, it should also be noted that the cell array layer 133 includes a plurality of cells 1331 arranged in rows. The cells 1331 are connected in series to form a cell string by solder ribbons 1332. The cell strings are then connected in series or in parallel by busbars. The side of the second encapsulation front glass 131 and / or the second encapsulation cover glass 135 near the cell array layer 133 is provided with a solder ribbon placement groove 16 for placing the solder ribbons 1332. The side of the second encapsulation front glass 131 and / or the second encapsulation cover glass 135 near the cell array layer 133 is also provided with a busbar placement groove (not shown in the figure) for placing the busbars.

[0043] During the encapsulation and lamination of photovoltaic modules, the solder strips 1332 on the corresponding side of the cell 1331 and the second encapsulation front glass 131 and / or the second encapsulation cover glass 135 can be embedded in the solder strip placement groove 16. The busbars at both ends of the cell string on the corresponding side of the cell 1331 and the second encapsulation front glass 131 and / or the second encapsulation cover glass 135 can be embedded in the busbar placement groove. This can reduce the phenomenon of microcracks and breakage of the cell 1331 during the encapsulation and lamination of photovoltaic modules, improve product yield and quality, reduce the thickness of the encapsulation film layer, reduce the amount of encapsulation material used, and reduce the cost of the module.

[0044] Specifically, in this embodiment, solder ribbon placement grooves 16 are preferably provided on both the second encapsulation front glass 131 and the second encapsulation cover glass 135. The solder ribbon placement grooves 16 can accommodate the solder ribbon 1332, ensuring that the solder ribbon 1332 is spaced apart from the inner wall of the groove 16 and the space between them is filled with adhesive. Furthermore, since the solder ribbon 1332 is already contained within the groove 16, during the lamination process, it prevents the solder ribbon 1332 from first contacting and compressing the glass (i.e., the second encapsulation front glass 131 and the second encapsulation cover glass 135), thus avoiding the possibility of the solar cell 1331 breaking. This improves the thermal cycling resistance of the photovoltaic module 10 and increases the product yield. Additionally, referring to… Figure 3 and Figure 4 As shown, by setting the solder ribbon placement groove 16, the thickness of the first encapsulant layer 132 and the second encapsulant layer 134 can be reduced because the height of the solder ribbon 1332 protrusion is already accommodated within the solder ribbon placement groove 16. Therefore, the thickness of the first encapsulant layer 132 between the second encapsulation front glass 131 and the solar cell 1331, and the thickness of the second encapsulation cover glass 135 between the solar cell 1331 can be significantly reduced. For example, in a conventionally encapsulated photovoltaic module 10, when using a 0.26mm diameter solder ribbon 1332, the thickness limit of the (EVA) encapsulant film is 320-360 g / m². 2 The thickness of the laminated adhesive film is approximately equal to the diameter of the solder ribbon; in this embodiment, the thickness of the first adhesive film layer 132 and the second adhesive film layer 134 can be reduced to 200 g / m². 2 There is no lower limit below; it is only required that the adhesive film achieves a good bonding effect between the battery cell 1331 and the glass.

[0045] Please refer to Figures 4-6 As shown, in one possible implementation, since the second encapsulation front glass 131 and the second encapsulation cover glass 135 are made of non-tempered glass, the solder ribbon placement groove 16 can be easily etched on the side that attaches to the battery cell 1331, and then the solder ribbon 1332 can be accommodated and fixed by using the solder ribbon placement groove 16 (see schematic diagram). Figure 4This setup not only reduces the amount of encapsulating film used, thus lowering costs, but also enables components to have higher reliability.

[0046] In one example, the solder ribbon placement groove 16 extends continuously along the extension direction of the solder ribbon 1332 on the second encapsulation front glass 131 and the second encapsulation cover glass 135, and corresponds one-to-one with the solder ribbons 1332 on the cell array layer 133. The continuously extending solder ribbon placement groove 16 can accommodate the entire solder ribbon 1332, thereby reducing the amount of adhesive film used.

[0047] Please continue to refer to Figures 4-6 As shown, in one feasible embodiment, multiple sets of solder ribbon placement slots 16 are arranged parallel to each other on the second encapsulation front glass 131 and the second encapsulation cover glass 135 along the arrangement direction of the solder ribbons 1332. Each set of solder ribbon placement slots 16 corresponds one-to-one with the solder ribbons 1332 on the battery cell 1331. During arrangement, the solder ribbons 1332 are arranged in multiple sets, with a certain interval between adjacent sets. By providing multiple sets of solder ribbon placement slots 16 for each solder ribbon 1332, contact between adjacent solder ribbons 1332 can be avoided.

[0048] In one example, the shape of the solder ribbon 1332 is generally set to be circular or nearly circular, i.e., elliptical. To match the shape of the solder ribbon 1332, in this embodiment, the solder ribbon placement groove 16 is set as an arc-shaped groove with an arc-shaped cross-section. The circular or near-circular solder ribbon 1332 can reflect the light illuminating it onto the solar cell 1331 for secondary utilization, thereby improving light utilization. To facilitate the processing of the solder ribbon placement groove 16 and achieve one-time forming, the cross-section of the solder ribbon placement groove 16 is chosen to be arc-shaped, and the arc shape is a part of a circle or ellipse. Thus, using an arc-shaped solder ribbon placement groove 16 allows sufficient space between the solder ribbon placement groove 16 and the solder ribbon 1332 to fill with an appropriate amount of encapsulating film, thereby reducing the probability of solar cell 1331 cracking.

[0049] In another example, the opening width of the solder strip placement groove 16 is set to be greater than the diameter of the solder strip 1332, and the depth of the solder strip placement groove 16 is equal to or less than the diameter of the solder strip 1332, preferably equal to the diameter of the solder strip 1332. Of course, during the lamination process, the solder strip placement groove 16 does not need to completely contain the solder strip 1332. The purpose is to allow the adhesive film to exert a certain squeezing effect on the solder strip 1332 during the lamination of the semi-finished laminate 13, ensuring sufficient contact between the solder strip 1332 and the battery cell 1331. Since the opening width of the solder strip placement groove 16 is greater than the diameter of the solder strip 1332, on the one hand, it is convenient for the solder strip 1332 to be fixed in the solder strip placement groove 16, and on the other hand, a gap is left between the two sides of the solder strip 1332 and the side wall of the solder strip placement groove 16 to allow the adhesive film to flow in, so as to ensure that there is enough encapsulating adhesive film between the solder strip 1332 and the solder strip placement groove 16. In other embodiments, the depth of the solder ribbon placement groove 16 can also be set to be greater than the diameter of the solder ribbon 1332, so that the solder ribbon 1332 can be completely contained in the solder ribbon placement groove 16, and there is also space between the bottom of the solder ribbon placement groove 16 and the solder ribbon 1332 to fill an appropriate amount of encapsulating film, thereby avoiding the solder ribbon 1332 from contacting the glass first during the lamination process and forming compression, which would cause the battery cell 1331 to break.

[0050] The busbar placement slot corresponds one-to-one with the busbar, and the shape of the busbar placement slot matches the shape of the busbar. The size of the busbar placement slot is larger than the size of the busbar, so that the busbar can be placed in the busbar placement slot.

[0051] Please refer to Figure 1 , Figure 2 As shown in this embodiment, it should also be noted that an enamel layer or a film layer is provided on either or both sides of the second encapsulation cover glass 135, and the position of the enamel layer or film layer corresponds to the gap between the battery cell array layers 133.

[0052] When an enamel coating is provided, the enamel coating is printed on either one or both sides of the second encapsulation cover glass 135. The enamel coating can be set as a white enamel coating.

[0053] When a film layer is provided, the film layer is attached to either or both sides of the second encapsulation cover glass 135. The film layer can be a colored encapsulation film, such as a white or black film.

[0054] By utilizing the above-mentioned settings, incident light from the non-battery area of ​​the cell array layer 133 can be used, and no colored mesh material or gap film is placed on the first encapsulation cover glass 15. This can ensure the uniformity of the tempering degree of the first encapsulation cover glass 15 as much as possible. By utilizing gap lighting to increase the power of the module, the thermal shock resistance and mechanical shock resistance stability of the first encapsulation cover glass 15 can be improved.

[0055] The implementation principle of this embodiment is as follows: When manufacturing the photovoltaic module 10, the first step is to manufacture the semi-finished laminate 13. First, the second encapsulation front glass 131 is laid, then the first encapsulation film layer 132 is laid, then the cell array layer 133 is arranged, and finally the second encapsulation film layer 134 and the second encapsulation cover glass 135 are laid. At this time, the laid semi-finished laminate 13 is sent into the laminator for lamination. Since the second encapsulation front glass 131 and the second encapsulation cover glass 135 used on the semi-finished laminate 13 are ordinary non-tempered glass, the glass does not warp or deform when heated during the lamination process. The glass remains flat overall. Then, other auxiliary means are used, such as using lamination auxiliary tooling, i.e., lamination frame combined with mechanical pressure plate laminator, to apply uniform pressure to the module. Finally, the thickness of the edge of the semi-finished laminate 13 after lamination is consistent with the thickness of the central area.

[0056] The second step is to manufacture the finished laminate, i.e., the final module. First, the front encapsulation film layer 12 is laid on the first encapsulation front glass 11. Then, the cooled semi-finished laminate 13 is laid on the front encapsulation film layer 12, and the second encapsulation front glass 131 is bonded to the front encapsulation film layer 12. Then, the rear encapsulation film layer 14 and the first encapsulation cover glass 15 are laid sequentially on the second encapsulation cover glass 135 above the semi-finished laminate 13. After the laying is completed, the module undergoes a second lamination. During the second lamination, the semi-finished laminate 13 and the remaining encapsulation material are encapsulated again to form a whole. At this time, the lamination temperature does not need to be controlled by the semi-finished laminate 13. Maintaining a consistent lamination temperature can be achieved by appropriately selecting the materials for the front encapsulation film layer 12 and the rear encapsulation film layer 14. By applying a relatively low lamination temperature, such as 50–100°C, and then applying a certain pressure through a laminator, the front encapsulation film layer 12 and the rear encapsulation film layer 14 can melt rapidly and quickly bond the first encapsulation front glass 11, the first encapsulation cover glass 15, and the semi-finished laminate 13 into a single unit. Due to the low process temperature, the deformation of the first encapsulation front glass 11 and the first encapsulation cover glass 15 is low, resulting in the thickness of the component's edges being consistent with the thickness of the component's center, thus resolving the issue of edge overpressure.

[0057] By using non-tempered glass in the first lamination step, the problem of thinning of the encapsulant film on both sides of the cell array layer due to glass edge deformation during lamination can be avoided, thus preventing it from affecting module quality. The second lamination step uses tempered glass, which, without damaging the semi-finished laminate formed in the first step, is laminated at a lower temperature, bonding the tempered and non-tempered glass together. The superior impact and bending strength of the tempered glass is then used to protect the module.

[0058] Therefore, this embodiment uses a step-by-step stacking process combined with non-tempered glass to produce a component with no overpressure at the edge. The thickness of the component edge is the same as the thickness of the component center area, which can improve the yield and reliability of the component.

[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A photovoltaic module, characterized in that, include: The first encapsulation front glass (11), the front encapsulation film layer (12), the semi-finished laminate (13), the rear encapsulation film layer (14), and the first encapsulation cover glass (15) are stacked in sequence. The semi-finished laminate (13) includes a second encapsulation front glass (131), a first adhesive film layer (132), a battery cell array layer (133), a second adhesive film layer (134), and a second encapsulation cover glass (135) stacked sequentially. The second encapsulation front glass (131) is bonded to the front encapsulation film layer (12); The second encapsulation cover glass (135) is bonded to the rear encapsulation film layer (14); The second encapsulation front glass (131) and the second encapsulation cover glass (135) are made of non-tempered glass. The first encapsulation front glass (11) and the first encapsulation cover glass (15) are made of tempered or semi-tempered glass.

2. The photovoltaic module according to claim 1, characterized in that, include: The thickness of the first encapsulation front glass (11) and the first encapsulation cover glass (15) is set to 0.5~2.0mm; And / or, the thickness of the second encapsulation front glass (131) and the second encapsulation cover glass (135) is set to 0.5~2.0mm.

3. The photovoltaic module according to claim 1, characterized in that, The first adhesive film layer (132) and the second adhesive film layer (134) are made of hot melt adhesive.

4. The photovoltaic module according to any one of claims 1-3, characterized in that, The cell array layer (133) includes a plurality of cells (1331) and solder strips (1332) that connect the individual cells (1331) into a string; The second encapsulation front glass (131) and / or the second encapsulation cover glass (135) have a solder strip placement groove (16) on the side near the cell array layer (133) for placing the solder strip (1332).

5. The photovoltaic module according to any one of claims 1-3, characterized in that, The battery cell array layer (133) also includes a busbar connecting the solder strip (1332); The second encapsulation front glass (131) and / or the second encapsulation cover glass (135) are also provided with a busbar placement groove for placing the busbar on the side near the cell array layer (133).

6. The photovoltaic module according to claim 4, characterized in that, include: The solder strip placement groove (16) is continuously extended on the second encapsulation front glass (131) and / or the second encapsulation cover glass (135) along the extension direction when the solder strip (1332) is placed; The solder strip placement slot (16) is set one-to-one with the solder strip (1332) on the battery cell array layer (133).

7. The photovoltaic module according to claim 6, characterized in that, The cross-section of the welding strip placement groove (16) is arc-shaped; And / or, the opening width of the solder strip placement groove (16) is greater than the diameter of the solder strip (1332).

8. The photovoltaic module according to claim 7, characterized in that, The second encapsulation cover glass (135) has an enamel layer or a film layer on either side or both sides of the opposite side; The position of the enamel layer or film layer corresponds to the gap between the multiple battery cells (1331) of the battery cell array layer (133).

Images