Wafer back cleaning device and semiconductor integrated circuit manufacturing equipment

Abstract

The embodiment of the utility model relates to a wafer back cleaning device and semiconductor integrated circuit manufacturing equipment, and the device comprises a cover body which is located below a wafer placement position, and the side wall of the cover body is provided with a through hole; the spray head assembly is used for spraying cleaning fluid to the back surface of the wafer; one end of the bracket is fixedly connected to the cover body, and the other end of the bracket extends to a space between the cover body and the wafer placement position and is provided with a first mounting part for mounting the spray head assembly; the liquid supply pipeline extends from the interior of the cover body to the exterior of the cover body through the through hole and is connected to the spray head assembly, and the liquid supply pipeline is configured to convey cleaning fluid to the spray head assembly during cleaning; therefore, the risk that the cleaning fluid falling back from the back surface of the wafer leaks into the cover body is avoided, and meanwhile, the cleaning fluid is prevented from generating a dead angle of accumulating the cleaning fluid at the junction; in addition, the installation limitation of the spray head assembly on the support is small, and flexible adjustment can be achieved.

Description

Technical Field

[0001] This application relates to the field of semiconductor integrated circuit manufacturing equipment, and in particular to a wafer backside cleaning apparatus and semiconductor integrated circuit manufacturing equipment. Background Technology

[0002] In the semiconductor manufacturing industry, wafers, as the fundamental material for integrated circuits, have surface cleanliness that is crucial to the performance and yield of the final product. As the feature size of integrated circuits continues to shrink, the requirements for wafer cleanliness are also increasing. During the manufacturing process, various tiny particles often adhere to the back side of the wafer. To ensure the wafer remains clean during processing, the back side of the wafer needs to be cleaned before processing.

[0003] In existing wafer backside cleaning devices, the nozzles used to clean the backside of the wafer are generally fixed to the upper wall of the housing. This structure has many drawbacks. The most prominent one is that during the process of spraying cleaning fluid onto the backside of the wafer, the cleaning fluid falls back onto the housing, which can easily cause leakage into the housing at the junction of the nozzle and the housing. It can also easily create dead zones where cleaning fluid accumulates. In addition, the nozzles are directly set on the upper wall of the housing, which makes the nozzles relatively fixed and difficult to adjust flexibly. Utility Model Content

[0004] In view of the above, this application provides a wafer backside cleaning apparatus and a semiconductor integrated circuit manufacturing equipment to solve at least one problem existing in the background art.

[0005] In a first aspect, embodiments of this application provide a wafer backside cleaning apparatus for cleaning the backside of a wafer when it is in a wafer mounting position. The wafer backside cleaning apparatus includes: a cover located below the wafer mounting position, with a through hole on the side wall of the cover; a nozzle assembly for spraying cleaning fluid onto the backside of the wafer; a bracket, one end of which is fixedly connected to the cover, and the other end extending into the space between the cover and the wafer mounting position and having a first mounting portion for mounting the nozzle assembly; and a liquid supply line extending from the inside of the cover through the through hole to the outside of the cover and connected to the nozzle assembly, the liquid supply line being configured to deliver cleaning fluid to the nozzle assembly during cleaning.

[0006] In conjunction with the first aspect of this application, in an optional embodiment, the sidewall of the cover includes a plurality of planar sub-sidewalls distributed circumferentially; the sub-sidewalls are provided with a second mounting portion;

[0007] One end of the bracket is fixedly connected to the sub-side wall of the cover via the second mounting part.

[0008] In conjunction with the first aspect of this application, in an optional embodiment, a through hole is provided on the side wall of the cover, specifically including: a through hole is provided on the sub-side wall;

[0009] For the same nozzle assembly, the through hole through which the liquid supply line connected to the nozzle assembly passes and the second mounting part corresponding to the bracket on which the nozzle assembly is mounted are located on the same sub-side wall.

[0010] In conjunction with the first aspect of this application, in an optional embodiment, the number of the supports is multiple, and the multiple supports are evenly distributed in the circumferential direction of the cover.

[0011] In conjunction with the first aspect of this application, in an optional embodiment, the other end of the support is provided with a plurality of first mounting portions, the plurality of first mounting portions being distributed in a direction corresponding to the radial direction of the wafer.

[0012] In conjunction with the first aspect of this application, in an optional embodiment, when the wafer backside cleaning apparatus is in operation, the sidewalls of the cover are perpendicular to the horizontal plane; or,

[0013] On the plane where the wafer is placed, the vertical projection of the through hole falls within the range of the vertical projection of the upper surface of the cover. The upper surface of the cover is the surface of the cover facing the wafer placement position, and the sidewall is connected to the upper surface.

[0014] In conjunction with the first aspect of this application, in an alternative embodiment, the bracket includes a first bracket portion and a second bracket portion that are perpendicular to each other;

[0015] One end of the bracket is fixedly connected to the cover, specifically: the first bracket part is fixedly connected to the side wall of the cover; when the wafer backside cleaning device is in working state, the side wall of the cover is perpendicular to the horizontal plane, and the second bracket part extends in the horizontal direction.

[0016] In conjunction with the first aspect of this application, in an alternative embodiment, the first mounting portion mounts the nozzle assembly via a mounting axis, the nozzle assembly being rotatable about the mounting axis to adjust its orientation relative to the wafer placement position.

[0017] In conjunction with the first aspect of this application, in an alternative embodiment, it further includes: a drive mechanism configured to drive the nozzle assembly to rotate about the mounting axis.

[0018] Secondly, embodiments of this application provide a semiconductor integrated circuit manufacturing apparatus, including a wafer backside cleaning apparatus as described in any one of the first aspects.

[0019] The wafer backside cleaning apparatus and semiconductor integrated circuit manufacturing equipment provided in this application include: a housing located below the wafer placement position, with a through hole on the side wall of the housing; a nozzle assembly for spraying cleaning fluid onto the backside of the wafer; a bracket, one end of which is fixedly connected to the housing, and the other end extending into the space between the housing and the wafer placement position and having a first mounting portion for mounting the nozzle assembly; and a liquid supply line extending from the inside of the housing through the through hole to the outside of the housing and connected to the nozzle assembly, the liquid supply line being configured to deliver cleaning fluid to the nozzle assembly during cleaning. Thus, the nozzle assembly is not directly fixed to the upper wall of the housing, but is mounted via the bracket. The cleaning fluid is delivered to the nozzle assembly through the liquid supply line through the housing, and the junction of the liquid supply line and the housing is located on the side wall of the housing, avoiding the risk of cleaning fluid falling back from the wafer backside leaking into the housing, and also avoiding dead zones where cleaning fluid accumulates at the junction. Furthermore, the installation of the nozzle assembly on the bracket is less restricted, allowing for flexible adjustment.

[0020] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0021] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0022] Figure 1 This is a three-dimensional schematic diagram of the main structure of a wafer backside cleaning device in a related technology;

[0023] Figure 2 This is a perspective view of the wafer backside cleaning apparatus after the wafer has been placed in the embodiments of this application;

[0024] Figure 3 This is a perspective view of the wafer backside cleaning apparatus provided in the embodiments of this application;

[0025] Figure 4 This is a side view projection of the wafer backside cleaning apparatus after the wafer has been placed in the embodiment of this application;

[0026] Figure 5 A perspective view of the main structure of the wafer backside cleaning apparatus provided in the embodiments of this application;

[0027] Figure 6 This is a perspective view of the support and nozzle assembly in the wafer backside cleaning apparatus provided in an embodiment of this application.

[0028] Figure label:

[0029] 110. Cover; 1101. Sub-sidewall; 111. Through hole; 112. Second mounting part; 120. Nozzle assembly; 130. Wafer fixing assembly; 140. Bracket; 1401. First bracket part; 1402. Second bracket part; 1403. Connecting part; 1404. Main body part; 141. First mounting part; 150. Liquid supply pipeline; 200. Wafer. Detailed Implementation

[0030] To make the technical solution and beneficial effects of this application more apparent and understandable, a detailed description is provided below by listing specific embodiments. The accompanying drawings are not necessarily drawn to scale, and local features may be enlarged or reduced to more clearly show the details of the local features; unless otherwise defined, the technical and scientific terms used herein have the same meanings as those in the technical field to which this application pertains.

[0031] In the description of this application, the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "height", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this application and do not indicate that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. In other words, they should not be construed as limitations on this application.

[0032] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating the relative importance of the indicated features or the number of indicated technical features. Therefore, a feature specified as "first" or "second" may explicitly include at least one of those features. In the description of this application, "multiple" means at least two, such as two, three, etc.; "several" means at least one, such as one, two, three, etc., unless otherwise explicitly specified.

[0033] In this application, unless otherwise expressly defined, the terms "installation," "connection," "linking," "fixing," "setting," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can also refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In this application, unless otherwise expressly defined, the terms "above," "on top of," "over," "above," "below," "below," "below," or "below" for "first feature over second feature" can refer to the first and second features being in direct contact, or to the first and second features being in indirect contact through an intermediate medium. Furthermore, "above," "over," and "below" for "first feature over second feature" can mean the first feature is directly above or diagonally above the second feature, or simply indicates that the horizontal height of the first feature is higher than the horizontal height of the second feature. Similarly, "below," "below," and "below" for "first feature over second feature" can mean the first feature is directly below or diagonally below the second feature, or simply indicates that the horizontal height of the first feature is lower than the horizontal height of the second feature.

[0035] The main working principle of a wafer back-side cleaning unit is to spray cleaning fluid or cleaning gas onto the back side of the wafer to remove contaminants. For example, after the wafer undergoes an etching process, not only does the front side of the wafer need to be cleaned, but the back side may also have etching fluid residue. If it is not cleaned in time, it may cause corrosion on the back side of the wafer, and in the next process, the etching fluid residue on the back side of the wafer will seriously affect the cleanliness and may even contaminate the machine.

[0036] Figure 1 The main structure of a wafer backside cleaning apparatus in a related art is shown in the figure. As shown, the wafer backside cleaning apparatus includes a housing 110, a nozzle assembly 120, and a wafer holding assembly 130. When the wafer is fixed to the wafer holding assembly 130 with its backside adsorbed, the nozzle assembly 120 can spray cleaning fluid towards the backside of the wafer. The nozzle assembly 120 is fixed to the top wall of the housing 110, and the cleaning fluid is supplied to the nozzle assembly 120 from inside the housing 110. The nozzle assembly 120 is fixed at a certain angle towards the backside of the wafer to align with the spray area. During cleaning, the wafer holding assembly 130 rotates the wafer, allowing the nozzle assembly 120 to spray the entire circumference of the wafer.

[0037] Understandably, after the cleaning fluid is sprayed onto the back side of the wafer, it will fall back under the combined action of the wafer's reaction force and gravity, with a large amount of cleaning fluid landing on the cover 110, which protects the components inside from being soaked in the cleaning fluid. However, in practical applications, it has been found that cleaning fluid often leaks into the cover 110 at the junction of the nozzle assembly 120 and the cover 110, causing contamination inside the cover 110. Moreover, the junction has become a dead zone for cleaning fluid accumulation. On the other hand, the fixed design of the nozzle assembly 120 on the upper wall of the cover 110 results in a fixed spray angle for the nozzle assembly 120, which cannot be adjusted according to process requirements.

[0038] Based on this, embodiments of this application provide a wafer backside cleaning apparatus for cleaning the backside of a wafer when the wafer is in the wafer placement position. Please refer to [reference needed]. Figures 2 to 6 The wafer backside cleaning apparatus includes: a housing 110 located below the wafer placement position, with a through hole 111 on the side wall of the housing 110; a nozzle assembly 120 for spraying cleaning fluid onto the backside of the wafer; a bracket 140, one end of which is fixedly connected to the housing 110, and the other end extends into the space between the housing 110 and the wafer placement position and is provided with a first mounting portion 141 for mounting the nozzle assembly 120; and a liquid supply line 150 extending from the inside of the housing 110 through the through hole 111 to the outside of the housing 110 and connected to the nozzle assembly 120, the liquid supply line 150 being configured to deliver cleaning fluid to the nozzle assembly 120 during cleaning.

[0039] Understandably, in this embodiment, the nozzle assembly 120 is not directly fixed to the upper wall of the housing 110, but is installed via a bracket 140. The cleaning fluid is delivered to the nozzle assembly 120 through the liquid supply line 150 passing through the housing 110. The junction of the liquid supply line 150 and the housing 110 is located on the side wall of the housing 110, which avoids the risk of cleaning fluid falling back from the back of the wafer 200 leaking into the interior of the housing 110, and also avoids dead zones where cleaning fluid accumulates at the junction. In addition, the installation of the nozzle assembly 120 on the bracket 140 is less restricted and can be flexibly adjusted.

[0040] Figure 2 This is a perspective view of the wafer backside cleaning apparatus after wafer 200 has been placed in the embodiments of this application. Figure 3 This is a perspective view of the wafer backside cleaning apparatus provided in the embodiments of this application; combined with Figure 2 and Figure 3 In this application, the wafer placement position refers to the position of the wafer 200 in the wafer backside cleaning apparatus when the wafer 200 to be cleaned is placed in the wafer backside cleaning apparatus.

[0041] As an optional specific implementation, the wafer backside cleaning apparatus may further include a wafer holding assembly 130. The wafer holding assembly 130 is, for example, a vacuum suction cup, which holds the wafer 200 in place by adsorbing the backside of the wafer 200. The wafer backside cleaning apparatus may also include a rotating mechanism, allowing the wafer 200 to rotate relative to the nozzle assembly 120 under the holding action of the wafer holding assembly 130, thereby enabling the nozzle assembly 120 to spray the wafer 200 throughout its entire circumference. It should be noted that this application is not limited to this, and the wafer holding assembly 130 can obviously also hold the wafer 200 in other ways commonly used in the art.

[0042] Please refer to Figure 4 As a specific example, the wafer fixing assembly 130 is located on the upper surface of the cover 110 and is fixedly connected to the cover 110. The center plane of the wafer fixing assembly 130 in the thickness direction is parallel to the plane where the wafer is placed; in actual use, the wafer 200 is fixed on the surface of the wafer fixing assembly 130, and the center plane of the wafer fixing assembly 130 in the thickness direction is parallel to the wafer 200.

[0043] In this embodiment, the upper surface of the cover 110 may not have any through holes for mounting the nozzle assembly 120 or for connecting to the nozzle assembly 120, thereby avoiding the risk of leakage.

[0044] To further facilitate the sliding of cleaning fluid from the cover 110, in some embodiments, when the wafer backside cleaning apparatus is in operation, the sidewalls of the cover 110 are perpendicular to the horizontal plane; in other words, the sidewalls of the cover 110 extend vertically. Thus, the junction between the liquid supply line 150 and the cover 110 is a vertical plane, making it easier for the cleaning fluid to slide off under gravity, further preventing liquid accumulation and leakage. In other embodiments, on the plane where the wafer is positioned, the vertical projection of the through-hole 111 falls within the range of the vertical projection of the upper surface of the cover 110, where the upper surface of the cover 110 faces the wafer position, and the sidewalls are connected to the upper surface. Specifically, the side wall where the through hole 111 is located can be recessed or bent inward relative to the outer periphery of the upper surface, so that the through hole 111 is located inside the outer periphery of the upper surface of the cover 110. That is, the junction of the liquid supply line 150 and the cover 110 is located inside the outer periphery of the upper surface of the cover 110. In this way, the cleaning fluid is prevented from flowing through the junction in large quantities, thereby further reducing the risk of liquid accumulation and leakage.

[0045] Please refer to Figure 5 As an optional specific implementation, the sidewalls of the cover 110 include multiple planar sub-sidewalls 1101 distributed circumferentially. Specifically, on the plane where the wafer is placed, the vertical projection of the sidewalls of the cover 110 can be a polygon (or approximately a polygon); each sub-sidewall 1101 corresponds to multiple sides of the polygon. In practical applications, adjacent sub-sidewalls 1101 can be transitioned by an arc-shaped surface, and the corners of the corresponding projected polygons are rounded corners. The planar shape of the sub-sidewalls 1101 is more conducive to the installation and fixation of the bracket 140.

[0046] The side wall of the cover 110 is provided with a through hole 111, specifically, a through hole 111 is provided on a sub-side wall 1101. Furthermore, each sub-side wall 1101 may be provided with a through hole 111, so that one or more liquid supply pipes 150 can be led out from the location of one or more sub-side walls 1101 as needed, and finally the nozzle assembly 120 can be installed as needed.

[0047] When the wafer backside cleaning device is in operation, the sidewall of the cover 110 is perpendicular to the horizontal plane. Specifically, the sub-sidewall 1101 is perpendicular to the horizontal plane; in other words, the sub-sidewall 1101 extends in the vertical direction. As mentioned earlier, the junction of the liquid supply line 150 and the cover 110 is a vertical plane, making it easier for the cleaning fluid to slide off under the influence of gravity, further preventing liquid accumulation and leakage.

[0048] Optionally, a second mounting portion 112 is provided on the sub-side wall 1101; one end of the bracket 140 is fixedly connected to the sub-side wall 1101 of the cover 110 through the second mounting portion 112. The second mounting portion 112 is specifically, for example, a mounting hole, and there can be multiple mounting holes on a sub-side wall 1101, so that the bracket 140 and the sub-side wall 1101 form a more stable connection.

[0049] Please refer to Figure 6 The bracket 140 also has a mounting portion that mates with the second mounting portion 112, specifically including a corresponding mounting hole. The bracket 140 and the second mounting portion 112 of the sub-side wall 1101 can be connected by bolts, clips, or other means; this application does not specifically limit this connection. As a specific example, the bracket 140 may include a first bracket portion 1401 and a second bracket portion 1402, with the mounting portion located on the first bracket portion 1401. Specifically, the first bracket portion 1401 may include a main body portion 1404 and a connecting portion 1403 perpendicular to each other. The main body portion 1404 is connected to the second bracket portion 1402, and the mounting hole is specifically located on the connecting portion 1403. One end of the bracket 140 is fixedly connected to the cover 110, specifically, the connecting portion 1403 is fixedly connected to the cover 110. The connecting portion 1403 and the main body portion 1404 form a 90-degree angle, so that when the connecting portion 1403 is in contact with the plane where the sub-sidewall 1101 is located, the main body portion 1404 is perpendicular to the plane where the sub-sidewall 1101 is located. The extending direction of the main body portion 1404 can be perpendicular to the second support portion 1402, so that the second support portion 1402 bends and extends into the space between the cover 110 and the wafer placement position.

[0050] Please continue to refer to this. Figure 5Optionally, each sub-sidewall 1101 of the cover 110 is provided with a second mounting portion 112. Thus, when one or more liquid supply lines 150 are led out from the location of one or more sub-sidewalls 1101 as needed, one or more brackets 140 can be fixedly connected to the corresponding sub-sidewall 1101. Furthermore, please refer to... Figure 3 and Figure 4 The second mounting part 112 can also be used for the fixed connection between the cover 110 and other components (such as the outer cover) of the wafer backside cleaning device.

[0051] As an optional specific implementation, for the same nozzle assembly 120, the through hole 111 through which the liquid supply line 150 connected to the nozzle assembly 120 passes and the second mounting part 112 corresponding to the bracket 140 on which the nozzle assembly 120 is mounted are located on the same sub-side wall 1101. This makes the overall structure simpler, avoids interference between the bracket 140 and the liquid supply line 150 during installation, provides a more stable fixation for the nozzle assembly 120, and ensures smoother transmission of the cleaning fluid.

[0052] The number of supports 140 can be multiple. Although two supports 140 are shown as an example in the figure, it is understood that those skilled in the art can set three, four, five, six, or even more supports 140 according to actual needs. Correspondingly, the number of liquid supply lines 150 and nozzle assemblies 120 can also be multiple. The multiple supports 140 are evenly distributed in the circumferential direction of the cover 110. In this way, spraying of the back side of the wafer 200 can be better achieved.

[0053] Optionally, the bracket 140 includes a first bracket portion 1401 and a second bracket portion 1402 that are perpendicular to each other. The bracket 140 may also be referred to as an L-shaped bracket. In the example where the first bracket portion 1401 includes a main body portion 1404 and a connecting portion 1403, specifically the second bracket portion 1402 is perpendicular to the connecting portion 1403, and the second bracket portion 1402 is also perpendicular to the main body portion 1404; in other words, referring to... Figure 6 The extension directions of the second support portion 1402, the connecting portion 1403, and the main body portion 1404 are perpendicular to each other. By configuring the support 140 to include mutually perpendicular portions, it is beneficial for the dripping of cleaning fluid splashed on its surface, so that cleaning fluid is less likely to remain on the surface of the support 140.

[0054] One end of the bracket 140 is fixedly connected to the cover 110. Specifically, the first bracket part 1401 is fixedly connected to the side wall of the cover 110. When the wafer backside cleaning device is in operation, the side wall of the cover 110 is perpendicular to the horizontal plane, and the second bracket part 1402 extends in the horizontal direction.

[0055] Understandably, in this embodiment of the application, by setting an L-shaped bracket, the nozzle assembly 120 is mounted on the L-shaped bracket and placed in the space between the cover 110 and the wafer placement position via the L-shaped bracket, thus avoiding the risk of leakage caused by directly opening holes on the upper surface of the cover 110.

[0056] Please refer to Figure 5 and Figure 6 In some embodiments, the other end of the support 140 is provided with a plurality of first mounting portions 141, which are distributed in a direction corresponding to the radial direction of the wafer. In this way, the nozzle assembly 120 can be selectively mounted on different first mounting portions 141 according to actual needs, so as to realize the position adjustment of the nozzle assembly 120 in the radial direction of the wafer, thereby facilitating the adaptation to different process requirements and realizing the cleaning of wafers of different sizes.

[0057] The first mounting part 141 can specifically be a mounting hole, such as... Figure 6 As shown, the other end of the bracket 140, specifically the end where the second bracket part 1402 is located, has multiple mounting holes, and the nozzle assembly 120 can be installed in any mounting hole as needed.

[0058] The nozzle assembly 120 and the first mounting part 141 can be connected by bolts, clips or other means, and this application does not make specific limitations in this regard.

[0059] In one optional embodiment, the first mounting portion 141 mounts the nozzle assembly 120 via a mounting shaft, and the nozzle assembly 120 is rotatable about the mounting shaft to adjust its orientation relative to the wafer placement position. This allows adjustment of the spray angle of the nozzle assembly 120, thereby increasing the coverage area of ​​the spray from the nozzle assembly 120 and making it more advantageous for cleaning the back side of the wafer 200.

[0060] Optionally, the wafer backside cleaning apparatus further includes a drive mechanism (not shown in the figure), configured to drive the nozzle assembly 120 to rotate about a mounting axis. This enables automatic adjustment of the spray angle of the nozzle assembly 120. The drive mechanism can specifically be a motor or other drive mechanism, and this application does not specifically limit its application to this.

[0061] In addition, the nozzle assembly 120 can also be manually adjusted to change its installation angle.

[0062] Compared to the fixed design of the nozzle assembly 120 on the upper wall of the cover 110 in related technologies, the nozzle assembly 120 in this embodiment is mounted on the bracket 140 and can rotate around the mounting axis to achieve adjustable spray angle; the angle can be adjusted automatically by the drive mechanism or manually; this greatly improves the flexibility of the nozzle assembly 120, increases the coverage of the spray from the nozzle assembly 120, and ultimately helps to improve the cleaning effect.

[0063] Please refer to Figure 3 , Figure 4 or Figure 5 One end of the liquid supply line 150 located inside the housing 110 can be connected to a container for storing cleaning fluid. The container for storing cleaning fluid can be located inside or outside the housing 110 (e.g., the liquid supply line 150 extends from below the housing 110 into its interior). The liquid supply line 150 can be either a liquid supply line or a gas supply line. Accordingly, the cleaning fluid can include cleaning liquid or cleaning gas. In this embodiment, the cleaning fluid includes at least cleaning liquid (also referred to as cleaning fluid).

[0064] Based on this, the present application also provides a semiconductor integrated circuit manufacturing equipment, which includes the wafer backside cleaning device in any of the foregoing embodiments.

[0065] It is understood that the wafer backside cleaning apparatus provided in the embodiments of this application can be a standalone device or a part of a semiconductor integrated circuit manufacturing equipment.

[0066] It should be understood that the above embodiments are exemplary and are not intended to encompass all possible implementations included in the claims. Various modifications and changes can be made to the above embodiments without departing from the scope of this disclosure. Similarly, the various technical features of the above embodiments can be arbitrarily combined to form other embodiments of this application that may not be explicitly described. Therefore, the above embodiments only illustrate several implementations of this application and do not limit the scope of protection of this patent application.

Claims

1. A wafer backside cleaning apparatus for cleaning the backside of a wafer when the wafer is in the wafer mounting position, characterized in that, The wafer backside cleaning apparatus includes: A cover is located below the wafer placement position, and a through hole is formed on the side wall of the cover; Nozzle assembly for spraying cleaning fluid onto the back side of the wafer; The bracket has one end fixedly connected to the cover, and the other end extends into the space between the cover and the wafer placement position and is provided with a first mounting part for mounting the nozzle assembly; A liquid supply line extends from the inside of the housing through the through hole to the outside of the housing and is connected to the nozzle assembly. The liquid supply line is configured to deliver cleaning fluid to the nozzle assembly during cleaning.

2. The wafer backside cleaning apparatus according to claim 1, characterized in that, The sidewall of the cover includes a plurality of planar sub-sidewalls distributed circumferentially; the sub-sidewalls are provided with a second mounting part; One end of the bracket is fixedly connected to the sub-side wall of the cover via the second mounting part.

3. The wafer backside cleaning apparatus according to claim 2, characterized in that, The side wall of the cover is provided with a through hole, specifically including: the sub-side wall is provided with a through hole; For the same nozzle assembly, the through hole through which the liquid supply line connected to the nozzle assembly passes and the second mounting part corresponding to the bracket on which the nozzle assembly is mounted are located on the same sub-side wall.

4. The wafer backside cleaning apparatus according to any one of claims 1 to 3, characterized in that, The number of brackets is multiple, and the multiple brackets are evenly distributed in the circumferential direction of the cover.

5. The wafer backside cleaning apparatus according to claim 1, characterized in that, The other end of the bracket is provided with a plurality of first mounting portions, which are distributed in a direction corresponding to the radial direction of the wafer.

6. The wafer backside cleaning apparatus according to claim 1, characterized in that, When the wafer backside cleaning device is in operation, the sidewalls of the cover are perpendicular to the horizontal plane; or... On the plane where the wafer is placed, the vertical projection of the through hole falls within the range of the vertical projection of the upper surface of the cover. The upper surface of the cover is the surface of the cover facing the wafer placement position, and the sidewall is connected to the upper surface.

7. The wafer backside cleaning apparatus according to claim 1, characterized in that, The support includes a first support portion and a second support portion that are perpendicular to each other; One end of the bracket is fixedly connected to the cover, specifically: the first bracket part is fixedly connected to the side wall of the cover; when the wafer backside cleaning device is in working state, the side wall of the cover is perpendicular to the horizontal plane, and the second bracket part extends in the horizontal direction.

8. The wafer backside cleaning apparatus according to claim 1, characterized in that, The first mounting part mounts the nozzle assembly via a mounting shaft, and the nozzle assembly is rotatable about the mounting shaft to adjust its orientation relative to the wafer placement position.

9. The wafer backside cleaning apparatus according to claim 8, characterized in that, Also includes: A drive mechanism configured to drive the nozzle assembly to rotate about the mounting axis.

10. A semiconductor integrated circuit manufacturing equipment, characterized in that, Includes the wafer backside cleaning apparatus as described in any one of claims 1 to 9.

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