Liquid splashing detection device and cleaning equipment

Abstract

The utility model provides a liquid splashing detection device and cleaning equipment. The liquid splashing detection device comprises a detection unit and a signal amplifier, the detection unit is arranged on the side wall of the process chamber and is matched with the height of the process disc; the detection unit is communicated with the signal amplifier; wherein the detection unit comprises a conducting wire layer and a covering layer, a plurality of through holes are formed in the covering layer, the conducting wire layer is exposed out of the through holes, and the liquid is splashed into the through holes and makes contact with the conducting wire layer, so that conduction of the internal lock loop is achieved. According to the configuration, the detection unit is arranged on the side wall of the process chamber, so that the detection unit can detect the splashing of the liquid at the initial stage, and the sensitivity of the detection unit is improved; a plurality of through holes are formed in the covering layer, so that the attachment and gathering capacity of splashed liquid is improved; in addition, the detection unit is communicated with the internal lock loop through the signal amplifier, when the liquid is splashed, an alarm signal is generated to prompt an operator, and the yield loss of products is avoided.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a liquid splash detection device and cleaning equipment. Background Technology

[0002] In monolithic wet process, different cleaning solutions and process gases are ejected through different nozzles, act on the silicon wafer surface, and are then recovered through different recycling pipelines. Please refer to [the relevant documentation / reference] for details. Figure 1 The silicon wafer rotates around the axis driven by the rotating shaft, and at the same time, it moves up and down through the lifting platform to switch between different recycling pipelines.

[0003] During the process of the lifting platform moving the process tray up and down, cleaning fluid may splash, mainly for two reasons:

[0004] 1) Abnormal dynamic balance of the process tray (e.g.) Figure 2 (As shown); including uneven weight distribution of the process tray, eccentric rotation of the rotating shaft, and uneven edges of the process tray, etc.

[0005] 2) Abnormal floor height correction of the lifting platform (e.g.) Figure 3 (As shown); including abnormalities in the lifting motor, positioning sensor, etc.

[0006] Splashed cleaning waste liquid may adhere to the nozzle, and during nozzle movement, there is a possibility that the waste liquid may drip onto the silicon wafer surface. During the subsequent drying process, only the moisture can be dried, and the particulate contaminants in the waste liquid will adhere to the silicon wafer surface, thereby affecting product yield.

[0007] Most existing leak sensors need to be installed at the bottom of the process chamber and will only trigger the alarm mechanism after the liquid splashes to a certain extent; while some highly sensitive leak sensors are difficult to install and require auxiliary installation structures, which occupy a large amount of space.

[0008] Therefore, how to improve the sensitivity of the leakage sensor so that it can detect and alarm in the early stage of liquid splashing, and how to reduce the installation difficulty and space occupation rate have become technical problems that need to be solved by those skilled in the art. Utility Model Content

[0009] The purpose of this invention is to provide a liquid splash detection device and cleaning equipment to solve the problems of low sensitivity and difficult installation of existing leakage sensors, which require the use of auxiliary installation structures.

[0010] To achieve the above objectives, this utility model provides a liquid splash detection device, comprising: a detection unit and a signal amplifier;

[0011] The detection unit is located on the side wall of the process chamber and is adapted to the height of the process tray;

[0012] The detection unit is connected to the signal amplifier, which is used to connect to the machine's internal lock circuit so that when the detection unit detects liquid splashing, it activates the internal lock circuit to generate an alarm signal.

[0013] The detection unit includes a conductor layer and a cover layer. The cover layer covers the conductor layer and has multiple through holes. The conductor layer is exposed at the through holes so that when liquid splashes into the through holes and comes into contact with the conductor layer, the internal locking circuit is activated.

[0014] Optionally, the detection unit further includes an adhesive layer, the wire layer is disposed between the adhesive layer and the cover layer, and the adhesive layer is disposed near the side wall of the process chamber for attaching to the side wall of the process chamber.

[0015] Optionally, the cover layer, the adhesive layer, and the conductor layer are integrally formed.

[0016] Optionally, the cover layer, the adhesive layer, and the conductor layer are thermoformed.

[0017] Optionally, the conductor layer includes two conductors, which are arranged in an alternating manner and connected to the two ports of the signal amplifier in a one-to-one correspondence.

[0018] Optionally, the wires have a comb-like structure, and the comb teeth of the two wires are arranged to cross each other;

[0019] The lengths of the individual comb teeth of the same conductor may be equal or unequal.

[0020] Optionally, the two wires are coiled together to form a circular or ring structure.

[0021] Optionally, the conductor is stamped from SUS304 stainless steel.

[0022] Optionally, the plurality of through holes are evenly distributed on the cover layer, and the spacing between the plurality of through holes is adapted to the spacing between the two wires.

[0023] To achieve the above objectives, this utility model provides a cleaning device, including: a process tray, a process chamber, a nozzle, and a liquid splash detection device as described above;

[0024] Both the process tray and the nozzle are disposed inside the process chamber; the process tray is used to support the silicon wafer and drive the silicon wafer to rotate and / or move around an axis; the nozzle is used to spray cleaning fluid or process gas onto the surface of the silicon wafer.

[0025] The liquid splash detection device is attached to the side wall of the process chamber and is adapted to the height of the process tray to detect liquid splashing during the cleaning process.

[0026] Compared with existing leakage detection methods, the liquid splash detection device and cleaning equipment provided in this application have the following advantages:

[0027] The liquid splash detection device provided in this application improves sensitivity by placing the detection unit on the side wall of the process chamber and adapting it to the height of the process tray, enabling the detection unit to detect splashing of cleaning fluid in its early stages. Furthermore, multiple through-holes are provided on the cover layer, exposing the conductive layer at these holes. When cleaning fluid splashes, liquid drips from these holes, contacts the conductive layer, reduces its resistance, and increases the current, triggering an alarm signal. The through-holes also increase the adhesion and aggregation of splashed liquid. In addition, the detection unit is connected to the machine's internal lock circuit via a signal amplifier. When there is no liquid splashing, the internal lock circuit is open, and no alarm signal is generated. When liquid splashing occurs, the internal lock circuit is activated, generating an alarm signal to prompt operators to handle the situation and prevent product yield loss.

[0028] Furthermore, by setting an adhesive layer, the adhesive layer, wire layer, and cover layer are molded as a single unit, eliminating the need for auxiliary installation structures, thus reducing installation difficulty and space occupancy.

[0029] Furthermore, the conductors are made of SUS304 stainless steel by stamping, which reduces the thickness of the conductor layer and saves costs. The two conductors are interlaced to form conductor layers of different shapes such as square and round, which has greater flexibility and can be adapted to different shaped chambers. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of a wet process in the prior art;

[0031] Figure 2 This is a schematic diagram illustrating liquid splashing due to abnormal dynamic balance of the process disk in existing technology.

[0032] Figure 3 This is a schematic diagram illustrating liquid splashing due to abnormal floor height correction of the lifting platform in existing technology.

[0033] Figure 4 A schematic diagram of the structure of the liquid splash detection device provided in this embodiment of the utility model;

[0034] Figure 5 This is a schematic diagram of the structure of the detection unit provided in an embodiment of the present utility model;

[0035] Figure 6 A schematic diagram of the conductor layer provided in an embodiment of this utility model;

[0036] Figure 7 A schematic diagram of the structure of the covering layer provided in an embodiment of this utility model;

[0037] Figure 8 This is a schematic diagram of the adhesive layer structure provided in an embodiment of the present invention;

[0038] Figure 9 This is a schematic diagram of the structure of the first type of conductor layer provided in an embodiment of the present utility model;

[0039] Figure 10 This is a schematic diagram of the structure of the second type of conductor layer provided in an embodiment of the present invention;

[0040] Figure 11 This is a schematic diagram of the structure of the third type of conductor layer provided in an embodiment of the present invention;

[0041] Figure 12 This is a schematic diagram of the structure of the fourth type of conductor layer provided in the embodiment of this utility model.

[0042] The explanations of the reference numerals in the accompanying drawings are as follows:

[0043] 1-Process plate; 2-Recovery ring; 3-Rotating shaft; 4-Lifting platform; 5-Recovery pipeline; 6-Nozzle;

[0044] 10-Wire layer; 11-Cover layer; 12-Adhesive layer; 13-Signal amplifier; 14-Internal lock circuit; 15-Machinery; 100-Wire; 110-Through hole. Detailed Implementation

[0045] To make the objectives, advantages, and features of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that the drawings are all in a very simplified form and are not drawn to scale, and are only used to facilitate and clarify the explanation of the objectives of the embodiments of this utility model. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, different drawings may emphasize different aspects and sometimes use different scales.

[0046] As used herein, the singular forms “a,” “an,” and “the” include plural objects; the term “or” is generally used to mean “and / or”; the term “a number” is generally used to mean “at least one”; and the term “at least two” is generally used to mean “two or more”. Furthermore, the terms “first,” “second,” and “third” are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as “first,” “second,” or “third” may explicitly or implicitly include one or at least two of that feature. “One end” and “the other end,” as well as “proximal end” and “distal end,” generally refer to two corresponding parts, including not only endpoints. The terms “installed,” “connected,” and “joined” should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two elements or the interaction between two elements. Furthermore, as used in this specification, the phrase "one element is disposed on another element" generally only indicates that there is a connection, coupling, cooperation, or transmission relationship between the two elements, and the connection, coupling, cooperation, or transmission between the two elements can be direct or indirect through an intermediate element. It should not be construed as indicating or implying a spatial positional relationship between the two elements, i.e., one element can be located arbitrarily inside, outside, above, below, or to the side of another element, unless otherwise explicitly stated. The terms "above," "below," "top," and "bottom" generally refer to relative positional relationships arranged according to the direction of gravity; the terms "vertical" or "vertical direction" generally refer to the direction of gravity, which is generally perpendicular to the ground; "horizontal" or "horizontal plane direction" generally refers to a direction parallel to the ground. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0047] The purpose of this invention is to provide a liquid splash detection device and cleaning equipment to solve the problems of low sensitivity and difficult installation of existing leakage sensors, which require the use of auxiliary installation structures.

[0048] In an optional embodiment, such as Figure 1 As shown, existing wet process equipment typically includes a process tray 1, a rotating shaft 3, a lifting platform 4, a recovery ring 2, and multiple nozzles 6. The process tray 1 holds the silicon wafer; the rotating shaft 3 drives the process tray 1 to rotate around its axis; the lifting platform 4 drives the rotating shaft 3 and the process tray 1 to move up and down; the multiple nozzles 6 spray different cleaning solutions and process gases onto the silicon wafer surface, and each nozzle 6 needs to move back and forth above the silicon wafer while spraying different cleaning solutions and process gases; the recovery ring 2 is equipped with multiple recovery pipes 5, each recovery pipe 5 is arranged along the circumference of the recovery ring 2, and the multiple recovery pipes 5 are arranged along... Figure 1 The nozzles are arranged vertically. During the movement of the nozzles 6, the lifting platform 4 needs to drive the rotating shaft 3 and the process disk 1 to move together, positioning the process disk 1 to the height corresponding to the recovery pipeline 5. Throughout the wet process, if the cleaning fluid splashes and adheres to the outer wall of the nozzles 6, and this splashed cleaning fluid often contains particulate contaminants, forming waste liquid, the nozzles 6 may drip this waste liquid onto the silicon wafer surface during their back-and-forth movement, resulting in a loss of silicon wafer yield.

[0049] As mentioned earlier, there are two main reasons for the splashing of the cleaning fluid. One is the abnormal dynamic balance of process plate 1, such as... Figure 2 As shown, during the rotation of process disk 1, if the weight distribution is uneven, the rotating shaft 3 rotates eccentrically, or the edge of process disk 1 is uneven, abnormal vibration of process disk 1 will occur. The cleaning fluid sprayed onto the silicon wafer surface will spread outwards due to centrifugal force and be collected by the recovery pipe 5 of the recovery ring 2. If process disk 1 vibrates abnormally during rotation, it will affect the movement path of the cleaning fluid, causing it to hit the side wall of the recovery ring 2, forming a splashing phenomenon, and may splash onto the outer wall of the nozzle 6, thus affecting the silicon wafer yield. Secondly, abnormal layer height correction of the lifting platform 4, such as... Figure 3 As shown, the cleaning fluid can spread outwards to the silicon wafer due to centrifugal force. However, due to the abnormality of the motor or positioning sensor of the lifting platform 4, the process tray 1 after lifting may be higher or lower than the recycling pipeline 5. This causes the outward-spreading cleaning fluid to directly collide with the side wall of the recycling ring 2, forming splashes, which may also splash onto the outer wall of the nozzle 6.

[0050] Therefore, to prevent liquid splashing and waste liquid dripping onto silicon wafers, which could lead to yield loss, leakage sensors are needed for detection and timely handling of splashing events to minimize their impact on yield. However, existing leakage sensors have low sensitivity to splashing, high space requirements, and are inconvenient to install. Conventional float-type and optical leakage sensors can only be installed at the bottom of the process chamber, requiring the splashed cleaning fluid to flow to the bottom of the chamber and reach a certain volume before they can be detected, resulting in insufficient sensitivity. While current-type leakage sensors can be installed anywhere in the process chamber, installation is inconvenient, requiring operators to arrange the wiring on-site inside the chamber, making fixing at bends difficult, and the protective sleeve is relatively thick, resulting in high space requirements. Furthermore, current-type leakage sensors are more expensive and require modification based on the shape of the process chamber.

[0051] Based on this, this embodiment provides a liquid splash detection device and a cleaning device. By setting the detection unit on the side wall of the process chamber and adapting it to the height of the process plate, the detection unit can detect the splashing of the cleaning liquid in the early stage, thereby improving the sensitivity of the detection unit. Furthermore, by setting through holes in the cover layer, the adhesion and aggregation ability of the splashed cleaning liquid is increased, further enhancing the sensitivity of the detection unit.

[0052] Please refer to Figures 4 to 7 This utility model provides a liquid splash detection device, including: a detection unit and a signal amplifier 13; the detection unit is disposed on the side wall of the process chamber and is adapted to the height of the process tray; the detection unit is connected to the signal amplifier 13, and the signal amplifier 13 is used to connect to the internal lock circuit 14 of the machine tool 15, so that when the detection unit detects liquid splash, the internal lock circuit 14 is activated and an alarm signal is generated; wherein, the detection unit includes a wire layer 10 and a cover layer 11, the cover layer 11 covers the wire layer 10, and the cover layer 11 is provided with a plurality of through holes 110, the wire layer 10 is exposed at the through holes 110, so that when liquid splashes into the through holes 110 and comes into contact with the wire layer 10, the internal lock circuit 14 is activated. As will be understood by those skilled in the art, the process chamber generally has a transfer inlet and a maintenance inlet arranged opposite each other, as well as two side plates. The maintenance inlet is equipped with a cover. Since the cleaning fluid will spread outwards when splashed, the detection unit can be placed at any point on the cover of the maintenance inlet or on either of the two side plates. In this embodiment, the signal amplifier 13 can be a K7L-AT50 type leakage signal amplifier 13, which has eight ports, respectively connected to an external power supply, the conductor layer 10, and the internal locking circuit 14. The specific structure and operating principle of the signal amplifier 13 can be found in existing technology, and will not be described in detail here.

[0053] exist Figure 4 In the illustrated example, the detection unit is connected in series to the interlock circuit 14 via a signal amplifier 13. When there is no liquid splashing, the interlock circuit 14 is open, no alarm signal is generated, and the machine 15 operates normally. When the detection unit detects liquid splashing, the interlock circuit 14 is turned on, generating an alarm signal. Silicon wafers that have already started the process reaction continue to be produced to complete the program, while silicon wafers that have not started the process reaction stop production. The machine 15 stops production and waits for engineers to handle the situation, so as to detect the problem in time and reduce the impact of liquid splashing on yield and productivity.

[0054] exist Figures 5 to 7 In the illustrated example, the detection unit includes a conductor layer 10 and a cover layer 11. The cover layer 11 is disposed relative to the sidewall of the process chamber away from the conductor layer 10, and covers the conductor layer 10, such as... Figure 7As shown, the cover layer 11 has multiple through holes 110, through which the conductor layer 10 can be exposed. When the cleaning fluid splashes, it can come into contact with the conductor layer 10 through the through holes 110, reducing the resistance of the conductor layer 10 and causing an increase in current to trigger an alarm signal. At the same time, the through holes 110 also improve the adhesion and aggregation of the cleaning fluid, so that even if only a small amount of liquid splashes, it can be detected, further improving the sensitivity of the detection unit.

[0055] Please refer to Figures 5 to 8 The detection unit also includes an adhesive layer 12, with a wire layer 10 disposed between the adhesive layer 12 and the cover layer 11. The adhesive layer 12 is located near the side wall of the process chamber and is used to attach to the side wall of the process chamber. In this embodiment, both the cover layer 11 and the adhesive layer 12 are PVC films, and an adhesive backing is provided on the side of the adhesive layer 12 near the side wall of the process chamber. During installation, the operator can directly use the adhesive backing to attach the detection unit to the side wall of the process chamber. At the same time, the PVC film further reduces the space occupied by the detection unit. Compared with existing leakage sensors that require on-site wiring by operators, the detection unit provided in this embodiment can be prefabricated and only needs to be directly attached on-site, which greatly improves the installation efficiency.

[0056] As an optional embodiment, the cover layer 11, adhesive layer 12, and conductive layer 10 are integrally formed. Further, the cover layer 11, adhesive layer 12, and conductive layer 10 are hot-pressed. It should be noted that in this embodiment, the detection unit can be pre-formed into various shapes according to the spatial shape of the process chamber, such as... Figures 5 to 8 The rectangle shown can also be a ring, circle, I-shape or other irregular shape, which effectively improves the practicality and flexibility of the detection unit and reduces the difficulty of on-site installation for operators; at the same time, the one-piece molding process can be hot pressing molding, welding molding, gluing molding, sewing molding, etc., and those skilled in the art can configure it according to the actual situation.

[0057] Please refer to Figures 9 to 12 The conductor layer 10 includes two conductors 100, which are arranged in an alternating manner and connected to the two ports of the signal amplifier 13 in a one-to-one correspondence. It should be noted that, in this embodiment, the two conductors 100 are respectively connected to the input port and the signal transmission port of the signal amplifier 13, so as to input current to the signal amplifier 13 and generate a signal after detecting the splashing of cleaning fluid.

[0058] In an optional embodiment, the conductor 100 has a comb-like structure, with the comb teeth of the two conductors 100 intersecting each other; the lengths of the comb teeth of the same conductor 100 may be equal or unequal. It should be noted that the conductor layer 10 is formed by the interlaced arrangement of the conductors 100. Figure 9In the middle, the conductor 100 has a comb-like structure, which has a comb back and mutually parallel comb teeth. The comb back and comb teeth are arranged perpendicular to each other, and the length of each comb tooth is equal. The comb teeth of the two conductors 100 are arranged to cross each other, ultimately forming a structure like... Figure 9 The rectangular conductor layer 10 is shown; in this case, the corresponding cover layer 11 and adhesive layer 12 are also rectangular structures. Figure 10 In the middle, the conductor 100 still has a comb-like structure, but the lengths of each comb tooth are not exactly equal. The comb teeth of the two conductors 100 are arranged to cross each other, ultimately forming a structure like... Figure 10 The U-shaped conductor layer 10 shown is also U-shaped in the corresponding cover layer 11 and adhesive layer 12. In other embodiments, the conductor layer 10 may also be I-shaped or other irregular shapes, which is not limited in this embodiment.

[0059] In another alternative embodiment, the two wires 100 are coiled together to form a circular or ring-shaped structure. It should be noted that the two wires 100 can also be coiled together to form a shape such as... Figure 11 The circular conductor layer 10 shown can also be coiled as follows: Figure 12 The circular conductor layer 10 shown can be further modified in other embodiments by coiling the two conductors 100 into an ellipse, a rounded rectangle, or other irregular shapes. In such cases, the corresponding cover layer 11 and adhesive layer 12 should also be configured to fit the shape of the conductor layer 10.

[0060] Optionally, the wire 100 is stamped from SUS304 stainless steel. In this embodiment, the thickness of the wire 100 is 0.03 mm, further reducing the thickness of the wire layer 10 and saving costs. Meanwhile, the width of the wire 100 is 1 mm, and the spacing between the two wires 100 is also 1 mm. Of course, in other embodiments, the width of the wire 100 and the spacing between the two wires 100 can be changed depending on the detection range. Generally speaking, the wider the wire 100, the larger the detection range of the wire layer 10; the smaller the spacing between the two wires 100, the higher the sensitivity of the detection unit.

[0061] Please refer to Figure 5 and Figure 7 Multiple through-holes 110 are evenly distributed on the cover layer 11, and the spacing between the multiple through-holes 110 is adapted to the spacing between the two conductors 100. Figure 5 and Figure 7 In the example shown, the through holes 110 are rounded rectangles and the spacing between the through holes 110 is 1 mm. This configuration ensures that a wire 100 is exposed at each through hole 110, so that no matter which through hole 110 the splashed liquid lands on, it can contact the wire layer 10 through the through hole 110 and trigger an alarm signal.

[0062] In another embodiment, the present invention provides a cleaning device, including: a process tray, a process chamber, a nozzle, and a liquid splash detection device as described above; the process tray and the nozzle are both disposed inside the process chamber; the process tray is used to support silicon wafers and drive the silicon wafers to rotate and / or move around an axis; the nozzle is used to spray cleaning liquid or process gas onto the surface of the silicon wafers; the liquid splash detection device is attached to the side wall of the process chamber and adapted to the height of the process tray, and is used to detect liquid splashing during the cleaning process.

[0063] With this configuration, by using the aforementioned liquid splash detection device, the detection unit is attached to the side wall of the process chamber and adapted to the height of the process tray, enabling detection at the initial stage of cleaning liquid splashing, thus improving the sensitivity of the detection unit. At the same time, the evenly arranged multiple through holes 110 on the cover layer 11 also improves the adhesion and aggregation ability of the splashed cleaning liquid, further enhancing the sensitivity of the detection unit. In addition, the aforementioned liquid splash detection device can be directly attached during installation without the need for on-site wiring, making it convenient and quick, and effectively reducing the installation difficulty.

[0064] In summary, in the liquid splash detection device and cleaning equipment provided in this utility model embodiment, the liquid splash detection device includes: a detection unit and a signal amplifier; the detection unit is disposed on the side wall of the process chamber and is adapted to the height of the process tray; the detection unit is connected to the signal amplifier, which is used to connect to the internal lock circuit of the machine tool, so that when the detection unit detects liquid splash, the internal lock circuit is activated and an alarm signal is generated; wherein, the detection unit includes a wire layer and a cover layer, the cover layer covers the wire layer, and multiple through holes are provided on the cover layer, the wire layer is exposed at the through holes, and the liquid splashes into the through holes and contacts the wire layer to realize the activation of the internal lock circuit.

[0065] This configuration, by placing the detection unit on the side wall of the process chamber and adapting it to the height of the process tray, allows the detection unit to detect splashing of cleaning fluid in its early stages, improving its sensitivity. Furthermore, multiple through-holes are provided on the cover layer, exposing the conductive layer at these points. When cleaning fluid splashes, liquid drips from these holes, contacting the conductive layer and reducing its resistance, thus increasing the current and triggering an alarm signal. Simultaneously, the through-holes also increase the adhesion and aggregation of splashed liquid. In addition, the detection unit is connected to the machine's internal lock circuit via a signal amplifier. When there is no liquid splashing, the internal lock circuit is open, and no alarm signal is generated; when liquid splashing occurs, the internal lock circuit is open, generating an alarm signal to prompt operators to take action and avoid product yield loss.

[0066] Furthermore, by setting an adhesive layer, the adhesive layer, wire layer, and cover layer are molded as a single unit, eliminating the need for auxiliary installation structures, thus reducing installation difficulty and space occupancy.

[0067] Furthermore, the conductors are made of SUS304 stainless steel by stamping, which reduces the thickness of the conductor layer and saves costs. The two conductors are interlaced to form conductor layers of different shapes such as square and round, which has greater flexibility and can be adapted to different shaped chambers.

[0068] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A liquid splash detection device, characterized in that, include: Detection unit and signal amplifier; The detection unit is located on the side wall of the process chamber and is adapted to the height of the process tray; The detection unit is connected to the signal amplifier, which is used to connect to the machine's internal lock circuit so that when the detection unit detects liquid splashing, it activates the internal lock circuit to generate an alarm signal. The detection unit includes a conductor layer and a cover layer. The cover layer covers the conductor layer and has multiple through holes. The conductor layer is exposed at the through holes so that when liquid splashes into the through holes and comes into contact with the conductor layer, the internal locking circuit is activated.

2. The liquid splash detection device as described in claim 1, characterized in that, The detection unit further includes an adhesive layer, and the wire layer is disposed between the adhesive layer and the cover layer. The adhesive layer is disposed near the side wall of the process chamber and is used to attach to the side wall of the process chamber.

3. The liquid splash detection device as described in claim 2, characterized in that, The cover layer, the adhesive layer, and the conductor layer are integrally formed.

4. The liquid splash detection device as described in claim 3, characterized in that, The cover layer, the adhesive layer, and the conductor layer are thermoformed.

5. The liquid splash detection device as described in claim 1, characterized in that, The conductor layer includes two conductors, which are arranged in an alternating manner and connected to the two ports of the signal amplifier in a one-to-one correspondence.

6. The liquid splash detection device as described in claim 5, characterized in that, The conductor has a comb-like structure, and the comb teeth of the two conductors are arranged to cross each other; The lengths of the individual comb teeth of the same conductor may be equal or unequal.

7. The liquid splash detection device as described in claim 5, characterized in that, The two wires are coiled together to form a circular or ring structure.

8. The liquid splash detection device as described in claim 5, characterized in that, The conductor is formed by stamping from SUS304 stainless steel.

9. The liquid splash detection device as described in claim 5, characterized in that, Multiple through holes are evenly distributed on the cover layer, and the spacing between the multiple through holes is adapted to the spacing between the two wires.

10. A cleaning device, characterized in that, include: Process tray, process chamber, nozzle, and liquid splash detection device as described in any one of claims 1 to 9; Both the process tray and the nozzle are disposed inside the process chamber; the process tray is used to support the silicon wafer and drive the silicon wafer to rotate and / or move around an axis; the nozzle is used to spray cleaning fluid or process gas onto the surface of the silicon wafer. The liquid splash detection device is attached to the side wall of the process chamber and is adapted to the height of the process tray to detect liquid splashing during the cleaning process.

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