Silicon wafer transmission device

Abstract

The utility model discloses a silicon wafer transmission device. The silicon wafer transmission device comprises a silicon wafer carrier plate, a first transmission mechanism and a second transmission mechanism, the silicon wafer carrier plate is connected between the first transmission mechanism and the second transmission mechanism; each of the first transmission mechanism and the second transmission mechanism comprises a side carrier plate, and a first upper carrier plate, a second upper carrier plate, a first lower carrier plate and a second lower carrier plate which are sequentially arranged in the first direction; one end of the side carrier plate is connected with one end of the first upper carrier plate, the other end of the side carrier plate is connected with one end of the second lower carrier plate, and the side carrier plate is connected with the silicon wafer carrier plate in the second direction; a spring array is arranged between the first upper carrier plate and the second upper carrier plate, a spring array is arranged between the first lower carrier plate and the second lower carrier plate, and a plurality of rollers are arranged between the second upper carrier plate and the first lower carrier plate. According to the silicon wafer transmission device, micro-vibration generated due to reduction of the friction coefficient of the rolling wheels is counteracted through kinetic energy provided by the spring array, and the stability of the silicon wafer transmission device is improved.

Description

Technical Field

[0001] This application relates to the field of transmission equipment technology, and specifically to a silicon wafer transmission device. Background Technology

[0002] In semiconductor manufacturing, the silicon wafer transport device is a key piece of equipment, and its performance directly affects production efficiency and product quality. Traditional silicon wafer transport devices typically use friction drive to move the silicon wafer. This method uses friction to provide kinetic energy, thereby driving the silicon wafer to travel along a predetermined path.

[0003] However, friction, as an indirect force, is subject to many uncontrollable factors. Specifically, the magnitude of friction is affected by a variety of factors, including but not limited to material surface properties, contact area, and external environmental conditions. Of particular note is that the coefficient of friction changes over time. Due to wear and tear on mechanical components caused by long-term use, the coefficient of friction often gradually decreases. This change not only leads to a decrease in transmission efficiency but, more importantly, may induce micro-vibrations, thereby threatening the overall stability of the silicon wafer transmission device. Utility Model Content

[0004] In view of the above problems, this application provides a silicon wafer transmission device to solve the above technical problems.

[0005] This application provides a silicon wafer transport device, which includes a silicon wafer carrier, a first transport mechanism, and a second transport mechanism;

[0006] The silicon wafer carrier is fixedly connected between the first transmission mechanism and the second transmission mechanism to support the silicon wafer;

[0007] Both the first and second transmission mechanisms include a side carrier plate and a first upper carrier plate, a second upper carrier plate, a first download plate, and a second download plate arranged sequentially along a first direction; one end of the side carrier plate is fixedly connected to one end of the first upper carrier plate, the other end of the side carrier plate is fixedly connected to one end of the second download plate, and the side carrier plate is fixedly connected to the silicon wafer carrier plate along the second direction.

[0008] A spring array is provided between the first and second loading plates, a spring array is provided between the first and second downloading plates, and multiple rollers are provided between the second loading plate and the first downloading plate.

[0009] In some embodiments, the first transmission mechanism and the second transmission mechanism further include a plurality of T-shaped first fixing components and a plurality of T-shaped second fixing components;

[0010] The first upper plate is provided with a cavity at a preset distance. The vertical part of the first fixing component of each T-shaped component passes through the cavity of the first upper plate and is fixedly connected to the second upper plate. The horizontal part is suspended on the side of the first upper plate away from the second upper plate.

[0011] The second download plate has a cavity at preset intervals. The vertical part of each T-shaped second fixing component passes through the cavity of the second download plate and is fixedly connected to the first download plate, while the horizontal part is suspended on the side of the second download plate away from the first download plate.

[0012] In some embodiments, a spring array is provided between the vertical portion of the first fixing component of the T-shape and the first upper plate;

[0013] A spring array is provided between the vertical portion of the T-shaped second fixing component and the second download plate.

[0014] In some embodiments, the spring array includes a plurality of spring assemblies arranged laterally and longitudinally.

[0015] In some embodiments, the spring assembly includes:

[0016] The spring body and the damping structure that is sealed to the spring body;

[0017] In the spring array provided between the first upper plate and the second upper plate, the spring body is fixedly connected to the first upper plate, and the damping structure is fixedly connected to the side of the second upper plate close to the first upper plate.

[0018] In the spring array arranged between the first download plate and the second download plate, the spring body is fixedly connected to the second download plate, and the damping structure is fixedly connected to the side of the first download plate close to the second download plate;

[0019] In the spring array provided between the vertical part of the first fixing component of the T-shape and the first upper plate, the spring body is fixedly connected to the first upper plate, and the damping structure is fixedly connected to the vertical part of the first fixing component of the T-shape.

[0020] In the spring array provided between the vertical portion of the T-shaped second fixing component and the second download plate, the spring body is fixedly connected to the second download plate, and the damping structure is fixedly connected to the vertical portion of the T-shaped second fixing component.

[0021] In some embodiments, the damping structure includes a sealing layer, a sliding assembly, a media storage chamber, a first media flow chamber, and a second media flow chamber;

[0022] A sealing layer is provided at the opening of the media storage chamber to make the media storage chamber sealed, and a through hole is provided on the sealing layer so that the spring body passes through the through hole and connects with the sliding component;

[0023] The sliding component is slidably connected to the inner wall of the media storage chamber so as to slide along the inner wall of the media storage chamber following the spring body;

[0024] The media storage chamber contains fluid damping energy-dissipating materials;

[0025] The first medium flow chamber and the second medium flow chamber are symmetrically arranged on both sides of the medium storage chamber, and a first opening is provided between the medium storage chamber and the first medium flow chamber, and a second opening is provided between the medium storage chamber and the second medium flow chamber, so that the damping energy dissipation material flows from the first opening and the second opening.

[0026] In some embodiments, the damping structure further includes a first regulating valve and a second regulating valve;

[0027] The first regulating valve is installed in the first medium flow chamber to control the flow rate of the damping energy-consuming material in the first medium flow chamber;

[0028] The second regulating valve is located in the second medium flow chamber to control the flow rate of the damping energy-consuming material in the second medium flow chamber.

[0029] In some embodiments, the side of the second upload board closest to the first download board is a rough surface; the side of the first download board closest to the second upload board is a rough surface.

[0030] In some embodiments, the side of the second loading plate near the first downloading plate is provided with a groove to accommodate the roller, and the side of the first downloading plate near the second loading plate is provided with a groove to accommodate the roller.

[0031] In some embodiments, the second loading plate and the first downloading plate are spaced at a preset distance from the side loading plate.

[0032] In some embodiments, the first direction and the second direction are two mutually perpendicular directions.

[0033] The silicon wafer transport device provided in this application includes a silicon wafer carrier, a first transport mechanism, and a second transport mechanism. Both the first and second transport mechanisms include a side carrier and a first upper carrier, a second upper carrier, a first lower carrier, and a second lower carrier arranged sequentially along a first direction. One end of the side carrier is fixedly connected to the edge of the first upper carrier, and the other end of the side carrier is fixedly connected to the edge of the second lower carrier. The side carrier is fixedly connected to the silicon wafer carrier along a second direction. A spring array is provided between the first upper carrier and the second upper carrier, and a spring array is provided between the first lower carrier and the second lower carrier. Multiple rollers are provided between the second upper carrier and the first lower carrier. When the rollers roll, they generate friction to drive the first and second transport mechanisms to move, thereby driving the silicon wafer carrier to move. The silicon wafer transport device of this application has spring arrays arranged between the first upper plate and the second upper plate, and between the first lower plate and the second lower plate, to form a shock absorption device. In this way, the spring array can provide kinetic energy to the transport mechanism, thereby offsetting the micro-vibration phenomenon caused by the decrease of the friction coefficient between the roller and the plate over time, improving the vibration resistance of the transport mechanism during movement, and thus improving the stability of the silicon wafer transport device. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 A schematic diagram of a conventional silicon wafer transport device is shown.

[0036] Figure 2 A schematic diagram of a silicon wafer transport device provided in an embodiment of this application is shown.

[0037] Figure 3 A cross-sectional view of the transmission mechanism provided in an embodiment of this application is shown.

[0038] Figure 4 A top view of the transmission mechanism provided in an embodiment of this application is shown.

[0039] Figure 5 A partial schematic diagram of the transmission mechanism provided in an embodiment of this application is shown.

[0040] Figure 6 A schematic diagram of a spring assembly provided in an embodiment of this application is shown.

[0041] Figure label:

[0042] 10. Friction roller; 20. Transfer carrier plate; 30. Silicon wafer placement plate; 100. Silicon wafer carrier plate; 110. Silicon wafer; 201. First transfer mechanism; 202. Second transfer mechanism; 210. Side carrier plate; 221. First upper carrier plate; 222. Second upper carrier plate; 231. First download plate; 232. Second download plate; 241. First fixing assembly; 242. Second fixing assembly; 300. Roller; 400. Spring assembly; 410. Spring body; 421. Sealing layer; 422. Sliding assembly; 423. Medium storage chamber; 424. First medium flow chamber; 425. Second medium flow chamber; 426. First regulating valve; 427. Second regulating valve; 4241. First opening; 4252. Second opening; Detailed Implementation

[0043] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0044] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0045] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0046] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0047] Traditional silicon wafer transport devices rely on friction to provide kinetic energy. Figure 1 A schematic diagram of a conventional silicon wafer transport device is shown, such as Figure 1 As shown, the silicon wafer transport device uses the friction force generated between the friction roller 10 and the transport carrier 20 to drive the silicon wafer placement plate 30 to transport. However, the coefficient of friction between the friction roller 10 and the transport carrier 20 will decrease over time, which will generate micro-vibrations and affect the stability of the silicon wafer transport device itself. This will cause the silicon wafer to easily shift or even fall off the silicon wafer placement plate during the transport process, which will seriously affect the silicon wafer transport efficiency and transport cost.

[0048] In view of the above technical problems, a preferred embodiment of this application provides a silicon wafer transmission device. Figure 2 A schematic diagram of the silicon wafer transmission device provided in an embodiment of this application is shown, such as... Figure 2 As shown, the silicon wafer transmission device provided in this application embodiment includes a silicon wafer carrier 100, a first transmission mechanism 201, and a second transmission mechanism 202.

[0049] The silicon wafer carrier 100 is fixedly connected between the first transmission mechanism 201 and the second transmission mechanism 202 to support the silicon wafer 110.

[0050] Both the first transmission mechanism 201 and the second transmission mechanism 202 include a side carrier plate 210 and a first upper carrier plate 221, a second upper carrier plate 222, a first download plate 231, and a second download plate 232 arranged sequentially along the first direction (y direction).

[0051] One end of the side carrier plate 210 is fixedly connected to one end of the first upper carrier plate 221, and the other end of the side carrier plate 210 is fixedly connected to one end of the second download plate 232. That is, the side carrier plate 210, the first upper carrier plate 221, and the second download plate 232 are used to form a semi-closed cavity. The side carrier plate 210 is fixedly connected to the silicon wafer carrier plate 100 along the second direction (x direction).

[0052] In some embodiments of this application, the side carrier plate 210 is integrally connected with the first upper carrier plate 221 and the second download plate 232.

[0053] Figure 3 A cross-sectional view of the transmission mechanism provided in an embodiment of this application is shown. Figure 4 A top view of the transmission mechanism provided in an embodiment of this application is shown, as follows: Figure 3 and Figure 4 As shown, a spring array is provided between the first loading plate 221 and the second loading plate 222, a spring array is provided between the first download plate 231 and the second download plate 232, and multiple rollers 300 are provided between the second loading plate 222 and the first download plate 231.

[0054] Optionally, the roller 300 is connected to an external power device, which drives the roller to roll, thereby generating friction to drive the first transmission mechanism 201 and the second transmission mechanism 202 to move.

[0055] It is understood that the driving method of the transmission mechanism is not limited in the embodiments of this application. For example, the roller is driven to roll by a power device to generate friction. The power device can be a motor, magnet or other driving device to drive the roller to roll. The connection method between the roller and the power device is also not limited in the embodiments of this application. For example, the roller can be connected to the power device through a transmission shaft so that it can be driven by a motor / magnet or other driving device to roll.

[0056] The silicon wafer transport device provided in this application embodiment has a spring array between the first upper plate and the second upper plate, and a spring array between the first lower plate and the second lower plate, thereby forming a shock absorption device. The spring array provides kinetic energy to the transport mechanism, thereby offsetting the micro-vibrations caused by the decrease in the friction coefficient between the rollers and the plate in the transport mechanism over time, improving the vibration resistance of the transport mechanism during its movement, and thus improving the stability of the silicon wafer transport device.

[0057] In some embodiments, such as Figures 3 to 4 As shown, in the silicon wafer transmission device provided in this application embodiment, both the first transmission mechanism 201 and the second transmission mechanism 202 further include multiple T-shaped first fixing components 241 and multiple T-shaped second fixing components 242.

[0058] Figure 5 A partial schematic diagram of the transmission mechanism provided in an embodiment of this application is shown, such as... Figure 5 As shown, the first upper plate 221 is provided with a cavity at a preset distance. The vertical part of the first fixing component 241 of each T-shape passes through the cavity of the first upper plate 221 and is fixedly connected to the second upper plate 222. The horizontal part is suspended on the side of the first upper plate 221 away from the second upper plate 222.

[0059] The second download plate 232 is provided with a cavity at preset intervals. The vertical part of each T-shaped second fixing component 242 passes through the cavity of the second download plate 232 and is fixedly connected to the first download plate 231. The horizontal part is suspended on the side of the second download plate 232 away from the first download plate 231.

[0060] The silicon wafer transfer device provided in this application embodiment has a T-shaped first fixing component to fix the second upper board and a T-shaped second fixing component to fix the first lower board, thereby preventing the second upper board and the first lower board from falling off.

[0061] In some embodiments, such as Figures 2 to 5As shown, in the silicon wafer transfer device provided in this application embodiment, a spring array is provided between the vertical portion of the T-shaped first fixing component 241 and the first upper loading plate 221; the spring array is also provided between the vertical portion of the T-shaped second fixing component 242 and the second lower loading plate 232.

[0062] The silicon wafer transport device provided in this application embodiment has a spring array between the first upper plate and the second upper plate, and a spring array between the first download plate and the second download plate, thereby eliminating micro-vibrations in the first direction (y direction). A spring array is also provided between the vertical portion of the T-shaped first fixing component 241 and the first upper plate 221, and between the vertical portion of the T-shaped second fixing component 242 and the second download plate 232, thereby eliminating micro-vibrations in the second direction (x direction) and improving the stability of the silicon wafer transport device.

[0063] In some embodiments, such as Figures 2 to 5 As shown in the embodiment of this application, the silicon wafer transport device includes a spring array comprising multiple spring assemblies 400 arranged laterally and longitudinally.

[0064] In some embodiments, Figure 6 A schematic diagram of a spring assembly provided in an embodiment of this application is shown, as follows: Figure 6 As shown, the spring assembly 400 includes a spring body 410 and a damping structure that is sealed to the spring body 410.

[0065] like Figures 2 to 5 As shown, in the spring array arranged between the first upper plate 221 and the second upper plate 222, the spring body 410 is fixedly connected to the first upper plate 221, and the damping structure is fixedly connected to the side of the second upper plate 222 close to the first upper plate 221.

[0066] In the spring array disposed between the first download plate 231 and the second download plate 232, the spring body 410 is fixedly connected to the second download plate 232, and the damping structure is fixedly connected to the side of the first download plate 231 near the second download plate 232.

[0067] In the spring array provided between the vertical portion of the first fixing component 241 of the T-shape and the first upper plate 221, the spring body 410 is fixedly connected to the first upper plate 221, and the damping structure is fixedly connected to the vertical portion of the first fixing component 241 of the T-shape.

[0068] In the spring array disposed between the vertical portion of the T-shaped second fixing component 242 and the second download plate 232, the spring body 410 is fixedly connected to the second download plate 232, and the damping structure 420 is fixedly connected to the vertical portion of the T-shaped second fixing component 242.

[0069] It is understood that the connection method between the spring assembly and each carrier plate is not limited in the embodiments of this application. For example, such as Figure 5 As shown, in this embodiment of the application, a cavity can be provided on the carrier plate so that one end of the spring body can be accommodated in the cavity, thereby connecting the spring body to the carrier plate.

[0070] The silicon wafer transport device provided in this application embodiment uses a spring body to counteract the micro-vibrations generated by friction, and a damping structure to eliminate the vibration effect generated by the spring's own rebound, thereby improving the stability of the silicon wafer transport device.

[0071] In some embodiments, such as Figure 6 As shown, the damping structure includes a sealing layer 421, a sliding component 422, a medium storage chamber 423, a first medium flow chamber 424, and a second medium flow chamber 425.

[0072] A sealing layer 421 is disposed at the opening of the medium storage chamber 423 to seal the medium storage chamber 423. The sealing layer 421 has a through hole through which the spring body 410 passes and connects to the sliding assembly 422. The sliding assembly 422 is slidably connected to the inner wall of the medium storage chamber 423, sliding along the inner wall of the medium storage chamber following the spring body 410. The medium storage chamber 423 stores a fluid damping energy-dissipating material. A first medium flow chamber 424 and a second medium flow chamber 425 are symmetrically disposed on both sides of the medium storage chamber 423. A first opening 4241 is provided between the medium storage chamber 423 and the first medium flow chamber 424, and a second opening 4252 is provided between the medium storage chamber 423 and the second medium flow chamber 425, allowing the damping energy-dissipating material to flow from the first opening 4241 and the second opening 4252. Optionally, when the spring body 410 is compressed or extended, the sliding assembly 422 slides along the inner wall of the medium storage chamber 423 following the spring body 410. This causes the damping energy-dissipating material in the medium storage chamber to flow out of the medium storage chamber 423 through the first opening 4241 and the second opening 4252, and into the first medium flow chamber 424 and the second medium flow chamber 425, or to flow out of the first medium flow chamber 424 and the second medium flow chamber 425 through the first opening 4241 and the second opening 4252, and into the medium storage chamber 423. That is, the movement of the sliding assembly 422 will generate a force that pushes the damping energy-dissipating material downward or absorbs the damping energy-dissipating material upward, thereby counteracting the vibration effect of the spring body 410 itself.

[0073] It is understood that in the embodiments of this application, the damping energy dissipation material should be set as a fluid, such as oil or water, and the embodiments of this application do not limit the materials of the sealing layer and the sliding component. For example, the material of the sealing layer can be set as rubber, metal, plastic, composite material, etc., and the sliding component can be set as a metal slider, etc.

[0074] In some embodiments, such as Figure 6 As shown, the damping structure also includes a first regulating valve 426 and a second regulating valve 427.

[0075] A first regulating valve 426 is disposed in a first medium flow chamber 424 to control the flow rate of the damping energy-dissipating material in the first medium flow chamber 424. A second regulating valve 427 is disposed in a second medium flow chamber 425 to control the flow rate of the damping energy-dissipating material in the second medium flow chamber 425.

[0076] The silicon wafer transport device provided in this application adjusts the flow rate of the damping energy-consuming material through the first regulating valve 426 and the second regulating valve 427, thereby adjusting the damping magnitude and further improving the reliability of the silicon wafer transport device.

[0077] In some embodiments of the silicon wafer transfer device provided in this application, the side of the second upper carrier plate 222 near the first download plate 231 is a rough plane; the side of the first download plate 231 near the second upper carrier plate 222 is also a rough plane, that is, the side of the carrier plate that contacts the roller 300 should be set as a rough plane. Optionally, the side of the carrier plate that contacts the roller 300 should be set as a rough surface, textured surface, frosted surface, corrugated surface, or other rough plane to generate friction with the roller.

[0078] In some embodiments, the silicon wafer transfer device provided in this application has a groove on the side of the second loading plate 222 near the first download plate 231 to accommodate the roller 300, and a groove on the side of the first download plate 231 near the second loading plate 222 to accommodate the roller 300, thereby preventing the roller from falling off.

[0079] In some embodiments, the silicon wafer transfer device provided in this application has the second loading board 222 and the first download board 231 set at a preset distance from the side loading board 210. Optionally, as shown... Figures 2 to 5 As shown, the second upper plate 222 and the first lower plate 231 are fixed by a T-shaped first fixing component 241 and a plurality of T-shaped second fixing components 242, respectively, so they do not need to be directly connected to the side plate 210, thereby reducing the cost of the transmission mechanism.

[0080] In some embodiments, the first direction and the second direction are two mutually perpendicular directions.

[0081] In some embodiments of this application, the first loading plate 221, the second loading plate 222, the first downloading plate 231, and the second downloading plate 232 are stainless steel carrier plates.

[0082] The silicon wafer transport device provided in this application embodiment has a spring array between the first upper plate and the second upper plate, and a spring array between the first lower plate and the second lower plate, thereby forming a shock absorption device. The spring array provides kinetic energy to the transport mechanism, thereby offsetting the micro-vibrations caused by the decrease in the coefficient of friction between the rollers and the plate in the first direction of the transport mechanism over time. Furthermore, in this application embodiment, a spring array is set between the vertical portion of the T-shaped first fixing component 241 and the first upper plate 221, and between the vertical portion of the T-shaped second fixing component 242 and the second lower plate 232, thereby offsetting the micro-vibrations caused by the decrease in the coefficient of friction between the rollers and the plate in the second direction (x direction) of the transport mechanism over time, improving the vibration resistance of the transport mechanism during movement, and thus improving the stability of the silicon wafer transport device.

[0083] The above description, in conjunction with specific embodiments, provides a further detailed explanation of this application and should not be construed as limiting the specific implementation of this application to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of this application, and all such modifications and substitutions should be considered within the scope of protection of this application.

Claims

1. A silicon wafer transport device, characterized in that, It includes a silicon wafer carrier, a first transmission mechanism, and a second transmission mechanism; The silicon wafer carrier is fixedly connected between the first transmission mechanism and the second transmission mechanism to support the silicon wafer; Both the first transmission mechanism and the second transmission mechanism include a side carrier plate and a first upper carrier plate, a second upper carrier plate, a first download plate, and a second download plate arranged sequentially along a first direction; one end of the side carrier plate is fixedly connected to one end of the first upper carrier plate, the other end of the side carrier plate is fixedly connected to one end of the second download plate, and the side carrier plate is fixedly connected to the silicon wafer carrier plate along the second direction; A spring array is provided between the first loading plate and the second loading plate, and the spring array is provided between the first download plate and the second download plate. Multiple rollers are provided between the second loading plate and the first download plate.

2. The silicon wafer transport device as described in claim 1, characterized in that, The first transmission mechanism and the second transmission mechanism further include multiple T-shaped first fixing components and multiple T-shaped second fixing components; The first upper plate is provided with a cavity at a preset distance. The vertical part of each T-shaped first fixing component passes through the cavity of the first upper plate and is fixedly connected to the second upper plate. The horizontal part is suspended on the side of the first upper plate away from the second upper plate. The second download board has a cavity at preset intervals. The vertical part of each T-shaped second fixing component passes through the cavity of the second download board and is fixedly connected to the first download board, while the horizontal part is suspended on the side of the second download board away from the first download board.

3. The silicon wafer transport device as described in claim 2, characterized in that, The spring array is provided between the vertical portion of the first fixing component of the T-shape and the first upper plate. The spring array is disposed between the vertical portion of the second fixing component of the T-shape and the second download plate.

4. The silicon wafer transport device as described in claim 3, characterized in that, The spring array comprises multiple spring assemblies arranged laterally and longitudinally.

5. The silicon wafer transport device as described in claim 4, characterized in that, The spring assembly includes: A spring body and a damping structure that is sealed to the spring body; In the spring array provided between the first upper plate and the second upper plate, the spring body is fixedly connected to the first upper plate, and the damping structure is fixedly connected to the side of the second upper plate close to the first upper plate; In the spring array provided between the first download board and the second download board, the spring body is fixedly connected to the second download board, and the damping structure is fixedly connected to the side of the first download board close to the second download board; In the spring array provided between the vertical portion of the first fixing component of the T-shape and the first upper plate, the spring body is fixedly connected to the first upper plate, and the damping structure is fixedly connected to the vertical portion of the first fixing component of the T-shape. In the spring array disposed between the vertical portion of the second fixing component of the T-shape and the second download plate, the spring body is fixedly connected to the second download plate, and the damping structure is fixedly connected to the vertical portion of the second fixing component of the T-shape.

6. The silicon wafer transport device as described in claim 5, characterized in that, The damping structure includes a sealing layer, a sliding component, a media storage chamber, a first media flow chamber, and a second media flow chamber; The sealing layer is disposed at the opening of the media storage chamber to seal the media storage chamber, and the sealing layer is provided with a through hole so that the spring body passes through the through hole and connects with the sliding assembly; The sliding component is slidably connected to the inner wall of the media storage chamber so as to slide along the inner wall of the media storage chamber following the spring body; The medium storage chamber stores a fluid damping energy-dissipating material; The first medium flow chamber and the second medium flow chamber are symmetrically arranged on both sides of the medium storage chamber, and a first opening is provided between the medium storage chamber and the first medium flow chamber, and a second opening is provided between the medium storage chamber and the second medium flow chamber, so that the damping energy dissipation material flows from the first opening and the second opening.

7. The silicon wafer transport device as described in claim 6, characterized in that, The damping structure also includes a first regulating valve and a second regulating valve; The first regulating valve is disposed in the first medium flow chamber to control the flow rate of the damping energy-consuming material in the first medium flow chamber; The second regulating valve is disposed in the second medium flow chamber to control the flow rate of the damping energy-consuming material in the second medium flow chamber.

8. The silicon wafer transport device as claimed in claim 1, characterized in that, The side of the second upload board closest to the first download board is a rough surface; the side of the first download board closest to the second upload board is a rough surface.

9. The silicon wafer transport device as claimed in claim 1, characterized in that, The second loading plate has a groove on the side near the first downloading plate to accommodate the roller, and the first downloading plate has a groove on the side near the second loading plate to accommodate the roller.

10. The silicon wafer transport device as claimed in claim 1, characterized in that, The second loading board and the first downloading board are spaced at a preset distance from the side loading board.

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