Wafer positioning tool

Abstract

The utility model belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer positioning tool which comprises a body provided with a bearing surface used for bearing a wafer; the limiting assembly is arranged on the body and comprises a limiting pin which is telescopic relative to the bearing surface; the number of the limiting assemblies is at least two. The side pushing assembly is arranged on the body and selectively applies side pushing force towards the limiting assembly; and the connecting lines of the side pushing assembly and the at least two limiting assemblies form a triangle. Through cooperation of the at least two limiting assemblies and the side pushing assemblies, the wafer is fixed in multiple directions, displacement is prevented, the bearing surface air channels can generate adsorption force to assist fixation, the side pushing assemblies and the limiting assemblies are configured with elasticity through the elastic pieces and can contract when encountering external force, hard contact with the wafer is avoided, and the probability of wafer damage can be reduced. The side pushing assembly and the limiting assembly are made of PEEK materials and are resistant to corrosion and abrasion, impurities cannot be generated due to friction, and the probability that the wafer is polluted is reduced.

Description

Technical Field

[0001] This application belongs to the field of semiconductor manufacturing technology, and in particular relates to a wafer positioning fixture. Background Technology

[0002] In semiconductor manufacturing, bonding technology is widely used to join two wafers together. Currently, wafer bonding technologies require the alignment of the upper and lower wafers, and the alignment accuracy significantly affects the yield rate after bonding. The positional accuracy of the upper and lower wafers determines the amount of movement during the alignment process.

[0003] In existing technologies, simple locating pins are used for wafer loading. These pins need to be installed during loading and removed afterward for subsequent alignment. In practical applications, installing and removing the locating pins requires operating space and can easily contaminate the wafer chuck. Furthermore, rigid locating pins can easily cause friction, pressure, or other hard contact with the wafer, leading to wafer damage. Utility Model Content

[0004] The purpose of this invention is to provide a wafer positioning fixture to improve the positional accuracy of wafer loading and reduce damage to the wafer during the loading process.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A wafer positioning fixture includes: a body having a bearing surface for bearing a wafer; the body is in the shape of a disk similar to the wafer, but its diameter is larger than that of the wafer.

[0007] A limiting component is provided on the body, which includes a limiting pin that is retractable relative to the bearing surface;

[0008] There are at least two limiting components;

[0009] A lateral thrust assembly, disposed on the body, can selectively apply a lateral thrust toward the limiting assembly;

[0010] The line connecting the side-pushing component and at least two of the limiting components forms a triangle.

[0011] After the wafer is placed on the support surface, it is blocked by at least two limiting pins. Then, the drive push assembly begins operation, applying a lateral pushing force towards the limiting pins. This lateral pushing force acts on the sidewall of the wafer, creating a compressive force on the sidewall, thereby firmly fixing the wafer in place and ensuring that it will not easily shift during subsequent processing or operations, thus guaranteeing the accuracy and stability of the relevant processes.

[0012] Furthermore, the bearing surface is provided with air channels, which can selectively form an adsorption force to adsorb and fix the wafer on the bearing surface.

[0013] When it is necessary to fix the wafer on the carrier surface, the adsorption force generated by the air channel can firmly hold the wafer, keeping the wafer in a stable position on the carrier surface and avoiding unnecessary displacement of the wafer during certain operations, such as slight vibration of the equipment or transportation.

[0014] Furthermore, the main body is provided with a mounting groove;

[0015] The mounting groove has an open end facing the bearing surface, and the side-push assembly is disposed within the mounting groove.

[0016] Furthermore, the side-push assembly includes a first mounting base, which is fixed within the mounting groove and includes a receiving cavity; it also includes a side-push block disposed within the receiving cavity.

[0017] Furthermore, it also includes a first elastic element, which is disposed between the first mounting base and the side push block;

[0018] The side push block has a pressing surface facing the bearing surface;

[0019] The side push block is configured to have a first state and a second state;

[0020] The first state includes the side push block moving away from the limiting component when the pressing surface is subjected to force;

[0021] The second state includes the side push block moving toward the limiting component when the pressure of the pressing surface is released.

[0022] Preferably, the first elastic element is a spring;

[0023] Preferably, the side of the push block facing the limiting component is an arc surface;

[0024] Preferably, the side push block and the limiting pin are made of polyetheretherketone (PEEK).

[0025] Furthermore, a first guide structure is provided on the side wall of the receiving cavity;

[0026] The side push block is provided with a second guide structure;

[0027] The first guide structure cooperates with the second guide structure to limit the movement direction of the side push block.

[0028] Preferably, the first guide structure includes, but is not limited to, grooves, guide rails, slides, protrusions, guide posts, and hole structures;

[0029] Preferably, the second guide structure includes, but is not limited to, grooves, guide rails, slides, guide posts, protrusions, and hole structures.

[0030] Furthermore, the body is provided with intersecting holes;

[0031] The cross holes form the mounting space for the limiting component.

[0032] Furthermore, the cross hole includes a first mounting hole arranged in the horizontal direction and a second mounting hole arranged in the vertical direction.

[0033] Furthermore, the limiting component includes a second mounting base, a wedge-shaped rod, and a limiting pin;

[0034] The second mounting base is fixedly disposed in the first mounting hole;

[0035] The wedge-shaped rod is slidably disposed in the first mounting hole;

[0036] A second elastic element is disposed between the wedge-shaped rod and the second mounting base.

[0037] Furthermore, the limiting pin is disposed in the second mounting hole;

[0038] The limiting pin and the wedge-shaped rod have a contact surface;

[0039] The limiting pin is configured to move along the second mounting hole when the contact surface is subjected to a change in force.

[0040] The beneficial effects of this utility model are:

[0041] The wafer positioning fixture provided by this utility model uses at least two limiting components and a side-pushing component to fix the wafer from multiple directions, preventing displacement. The air passage on the bearing surface can also generate an adsorption force to assist in fixation. Both the side-pushing component and the limiting component are equipped with elastic elements, which contract upon encountering external force, avoiding hard contact with the wafer and reducing the probability of wafer damage. The side-pushing component and the limiting component are made of PEEK material, which is high in strength, corrosion-resistant, and wear-resistant, and will not generate impurities due to friction, reducing the probability of wafer contamination. Attached Figure Description

[0042] Figure 1 This is a schematic diagram of the wafer positioning fixture structure of this utility model;

[0043] Figure 2 This is a schematic diagram of the structure of the wafer positioning fixture of this utility model after it supports the wafer;

[0044] Figure 3 This is a utility model Figure 2 A magnified view of a portion of point A in the middle;

[0045] Figure 4 This is a utility model Figure 2 A magnified view of a portion of point B in the middle;

[0046] Figure 5 This is a schematic diagram of the structure of a side push block in an embodiment of this utility model;

[0047] Figure 6 This is a schematic diagram of the structure of a limiting component in an embodiment of this utility model;

[0048] In the figure: 1. Body; 2. Bearing surface; 3. Air passage; 4. Limiting component; 41. First mounting hole; 42. Second mounting base; 43. Second elastic element; 44. Wedge rod; 45. Second mounting hole; 46. Limiting pin; 5. Side push component; 51. Mounting groove; 52. First mounting base; 53. Side push block; 54. Support column; 55. Guide column; 56. First elastic element; 6. Wafer. Detailed Implementation

[0049] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.

[0050] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0051] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0052] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0053] Example 1

[0054] See Figure 1-6 This embodiment presents a wafer positioning fixture, the main body 1 of which is disc-shaped and has a bearing surface 2 for supporting the wafer 6. In this embodiment, the bearing surface 2 has a wafer placement area with a size similar to the wafer, and this wafer placement area is provided with air channels 3, which are connected to a negative pressure pipeline. When the negative pressure pipeline is opened, an adsorption force is generated in the air channels 3 to adsorb the wafer 6.

[0055] At least two limiting components 4 at a certain angle are provided around the periphery of the wafer placement area. These limiting components 4 are used to limit the position of the wafer 6 on the support surface 2. When the wafer is a flat-edge wafer, there can be three limiting components 4, two of which are located in the flat-edge placement area of ​​the wafer.

[0056] The main body 1 has a receiving cavity for accommodating the limiting component 4. This receiving cavity exists in the form of a cross hole. Specifically, it includes a horizontal first mounting hole 41 and a vertical second mounting hole 45, which have an intersection point.

[0057] The limiting component 4 consists of a second mounting base 42, a wedge-shaped rod 44, and a limiting pin 46. The second mounting base 42 and the wedge-shaped rod 44 are positioned within a first mounting hole 41, and a second elastic element 43 is disposed between the wedge-shaped rod 44 and the second mounting base 42. The limiting pin 46 is located within a second mounting hole 45. In this embodiment, the sidewall of the second mounting hole 45 has a slide rail, and the sidewall of the limiting pin 46 has a protrusion that mates with the slide rail, thereby limiting the limiting pin 46 to slide only along the slide rail direction. The limiting pin 46 is a cylindrical structure made of PEEK material.

[0058] When installing the limiting component 4, firstly, the limiting pin 46 is inserted into the second mounting hole 45. Then, the wedge-shaped rod 44 is inserted into the first mounting hole 41, so that the inclined surface of the wedge-shaped rod 44 abuts against the bottom end of the limiting pin 46, thereby locking the limiting pin 46 into the second mounting hole 45. Next, the second elastic member 43 is inserted into the first mounting hole 41, and then the second mounting seat 42 is installed into the first mounting hole 41. When the second mounting seat abuts against the second elastic member 43 and releases, it causes the wedge-shaped rod 44 to abut against the limiting pin 46. In one embodiment, the second mounting seat 42 includes a threaded portion, through which the second mounting seat 42 is threaded to one end of the first mounting hole 41. When the second elastic member 43 is in the released state, the inclined surface of the wedge-shaped rod 44 presses against the limiting pin 46, causing the limiting pin 46 to rise to its highest height, which is higher than the bearing surface 2.

[0059] During the placement of wafer 6, if wafer 6 comes into contact with the limiting pin 46, the limiting pin 46 will retract downwards under external force until its position is below the bearing surface 2. In this way, hard contact between wafer 6 and the limiting pin 46 can be effectively avoided, thereby preventing wafer 6 from being damaged by collision and ensuring the integrity and quality of the wafer during placement.

[0060] In addition, a side-pushing assembly 5 is provided, which is located at the periphery of the wafer placement area and opposite to the limiting assembly 4. When the wafer is placed in the wafer placement area, the side-pushing assembly 5 can apply a lateral pushing force towards the wafer sidewall. With the lateral pushing force applied by the side-pushing assembly 5 and the blocking force of the limiting assembly 4, the two work together to generate a compressive force in the circumferential direction of the wafer. This compressive force can firmly fix the wafer, thereby ensuring that the wafer's position will not shift.

[0061] The side-push assembly 5 is installed in the mounting groove 51 of the main body 1. The side-push assembly 5 includes a first mounting base 52 fixed in the mounting groove 51. The first mounting base 52 has a receiving cavity, in which a side-push block 53 is provided. A first elastic member 56 is located between the first mounting base 52 and the side-push block 53. The side-push block 53 has a pressing surface facing the bearing surface 2. In use, the side-push block 53 has two states. When the pressing surface is subjected to force, the side-push block 53 moves away from the limiting assembly 4 (first state); when the pressure of the pressing surface is released, the side-push block 53 moves towards the limiting assembly 4 (second state). In addition, the side wall of the receiving cavity has a first guide structure, and the side-push block has a second guide structure. The two cooperate to limit the movement direction of the side-push block. In this embodiment, the first guide structure is a guide post 55, and the second guide structure is a through hole provided on the side-push block 53. The side-push block 53 is made of polyetheretherketone, and the surface of the side-push block 53 facing the limiting assembly 4 is an arc surface. When wafer 6 is placed in the wafer placement area, the sidewall of the wafer can be squeezed by the arc surface of the side pusher block 53, reducing damage to the sidewall of the wafer.

[0062] When using a wafer positioning fixture for wafer loading, pressure is first applied to the pressing surface of the side push block 53, causing it to move away from the wafer placement area. Next, the wafer is placed in the wafer placement area. After wafer placement, the pressure on the pressing surface of the side push block 53 is released. The side push block 53 then moves towards the wafer placement area, pushing the wafer sidewall until it contacts the limiting pin 46. Finally, the squeezing force generated by the side push block 53 and the limiting pin 46 securely fixes the wafer in place.

[0063] During the wafer unloading operation, pressure is simply applied to the pressing surface of the side pusher 53 to eliminate the squeezing force acting on the wafer sidewall, and then the wafer can be removed. This operation method is simple and efficient, ensuring the stability and accuracy of the wafer during the unloading process, while avoiding damage to the wafer.

[0064] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.

Claims

1. A wafer positioning fixture, characterized in that, include: The body has a bearing surface for supporting a wafer; A limiting component is provided on the body, which includes a limiting pin that is retractable relative to the bearing surface; There are at least two limiting components; A lateral thrust assembly, disposed on the body, can selectively apply a lateral thrust toward the limiting assembly; The line connecting the side-pushing component and at least two of the limiting components forms a triangle.

2. The wafer positioning fixture according to claim 1, characterized in that: The bearing surface is provided with air channels, which can selectively form an adsorption force to adsorb and fix the wafer on the bearing surface.

3. The wafer positioning fixture according to claim 1, characterized in that: The main body is provided with a mounting slot; The mounting groove has an open end facing the bearing surface, and the side-push assembly is disposed within the mounting groove.

4. The wafer positioning fixture according to claim 3, characterized in that: The side-push assembly includes a first mounting base, which is fixed in the mounting groove and includes a receiving cavity; it also includes a side-push block disposed in the receiving cavity.

5. The wafer positioning fixture according to claim 4, characterized in that: It also includes a first elastic element, which is disposed between the first mounting base and the side push block; The side push block has a pressing surface facing the bearing surface; The side push block is configured to have a first state and a second state; The first state includes the side push block moving away from the limiting component when the pressing surface is subjected to force; The second state includes the side push block moving toward the limiting component when the pressure of the pressing surface is released.

6. The wafer positioning fixture according to claim 4, characterized in that: The side wall of the receiving cavity is provided with a first guide structure; The side push block is provided with a second guide structure; The first guide structure cooperates with the second guide structure to limit the movement direction of the side push block.

7. The wafer positioning fixture according to claim 1, characterized in that: The body is provided with intersecting holes; The cross hole serves as the mounting space for the limiting component.

8. The wafer positioning fixture according to claim 7, characterized in that: The cross hole includes a first mounting hole arranged horizontally and a second mounting hole arranged vertically.

9. The wafer positioning fixture according to claim 8, characterized in that: The limiting assembly includes a second mounting base, a wedge rod, and a limiting pin; The second mounting base is fixedly disposed in the first mounting hole; The wedge-shaped rod is slidably disposed in the first mounting hole; A second elastic element is disposed between the wedge-shaped rod and the second mounting base.

10. The wafer positioning fixture according to claim 9, characterized in that: The limiting pin is disposed in the second mounting hole; The limiting pin and the wedge-shaped rod have a contact surface; The limiting pin is configured to move along the second mounting hole when the contact surface is subjected to a change in force.

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