Adsorption device for wafer test and wafer test system

Abstract

The utility model discloses an adsorption device for wafer testing and a wafer testing system, which comprise a lifting assembly, a supporting assembly, a gas circuit assembly and a platform assembly, and are characterized in that the platform assembly comprises a vacuum tank bottom plate (10), a flexible sealing element fixing ring (11), a flexible sealing element (12) and a sealing groove (23); the sealing groove (23) is formed in the position, corresponding to the periphery of a wafer, of the vacuum groove bottom plate (10), the flexible sealing piece fixing ring (11) and the flexible sealing piece (12) are arranged in the sealing groove (23), after the wafer is placed, the air path assembly vacuumizes the space formed between the wafer and the vacuum groove bottom plate (10), and the flexible sealing piece (12) is arranged in the sealing groove (23). And the flexible sealing element (12) completely supports the wafer to be adsorbed on the surface of the vacuum tank bottom plate (10), so that the wafer overcomes large warping, and the flatness is improved. The wafer flatness is ensured, and the execution of the subsequent wafer test operation and the accuracy of the corresponding test result are ensured at the same time.

Description

Technical fields:

[0001] This utility model relates to the field of wafer processing technology, specifically to an adsorption device and a wafer testing system for wafer testing. Background technology:

[0002] In semiconductor manufacturing, wafers, as the objects to be inspected, generally need to be fixed on a support stage for measurement, inspection, transfer, and other processing. During the wafer inspection process in a wafer testing system, due to the dispersion of stress, some wafers undergoing testing may experience significant warping. For these wafers with large warping, pressing their surface against the support stage can lead to surface contamination. Therefore, current practices typically use vacuum adsorption to fix the wafers onto the support stage. However, in most existing wafer testing adsorption devices, the rigid contact surface around the support stage comes into contact with the hard wafer during adsorption. This creates numerous tiny air gaps at the contact points, often failing to securely adhere the wafer to the stage and compromise wafer flatness. Since wafer testing systems have extremely high requirements for wafer surface flatness, if the wafer is not fixed flat, it directly affects the execution of wafer testing operations, impacting test results and potentially causing mechanical damage to the wafer. Utility model content:

[0003] To address the problem that wafers cannot be perfectly adsorbed onto the wafer support stage, thus failing to guarantee high flatness, this invention proposes an adsorption device and a wafer testing system for wafer testing.

[0004] The wafer testing adsorption device proposed in this utility model includes a lifting assembly, a support assembly, a gas path assembly, and a platform assembly. The platform assembly comprises a vacuum tank base plate, a flexible sealing ring, a flexible seal, and a sealing groove. The sealing groove is located on the vacuum tank base plate at a position corresponding to the periphery of the wafer. The flexible sealing ring and the flexible seal are disposed within the sealing groove. When the wafer is placed, the gas path assembly evacuates the space between the wafer and the vacuum tank base plate. Under the pressure difference between the upper and lower surfaces of the wafer, the flexible seal completely supports the wafer, allowing it to adhere to the surface of the vacuum tank base plate, thus overcoming large warpage and improving flatness.

[0005] As a further improvement of this utility model, the vacuum tank bottom plate is also provided with a vacuum annular gas passage groove and a vacuum air hole. Multiple sets of the vacuum annular gas passage groove and the vacuum air hole are connected to the gas passage assembly and are arranged in concentric circles from the center of the vacuum tank bottom plate outward.

[0006] As a further improvement of this utility model, the lifting assembly includes a guide column, a linear bearing, a cylinder, a linear bearing fixing plate, a wafer support column, and a proximity sensor; one end of the linear bearing fixing plate is connected to the linear bearing, and the other end is connected to the wafer support column.

[0007] As a further improvement of this utility model, the gas path assembly includes a vacuum pressure gauge, a gas path plug, a vacuum gas path channel, a gas pipe connector vacuum interface, a compressed air interface, and an external vacuum interface; the vacuum gas path channel is connected to the vacuum air hole.

[0008] As a further improvement of this utility model, the cross-sectional shape of the sealing groove is an inverted trapezoid.

[0009] As a further improvement of this utility model, the sealing groove has a rectangular cross-sectional shape.

[0010] As a further improvement of this utility model, the flexible sealing element is a rubber sealing ring.

[0011] As a further improvement of this utility model, the cross-section of the flexible seal is zigzag-shaped.

[0012] As a further improvement of this utility model, the cross-section of the flexible seal is V-shaped.

[0013] This utility model also provides a wafer testing system, including an adsorption force testing mechanism and an adhesion force testing mechanism, characterized in that: it further includes the adsorption device for wafer testing as described in any one of the above.

[0014] The beneficial effects of this utility model are as follows: by adding a sealing groove at the position corresponding to the periphery of the wafer on the bottom plate of the vacuum tank, and by setting a flexible sealing ring and a flexible sealing element in the sealing groove, as well as multiple sets of vacuum annular air passage grooves and vacuum holes arranged concentrically from the center of the bottom plate of the vacuum tank, the wafer can be fully attached to the surface of the bottom plate of the vacuum tank, and the wafer will not warp. This ensures the flatness of the wafer and also ensures the execution of subsequent wafer testing operations and the accuracy of the corresponding test results. Attached image description:

[0015] Figure 1 This is an exploded view of the overall structure of the adsorption device for wafer testing according to this utility model;

[0016] Figure 2 These are front view, perspective view, and partial enlarged view of the adsorption device for wafer testing of this utility model;

[0017] Figure 3 This is a partial detail image of the flexible seal in its unfolded state;

[0018] Figure 4This is a partial detail image of a flexible seal under compression.

[0019] The correspondence between the reference numerals and the component names is as follows:

[0020] Base plate—1; Guide column—2; Linear bearing—3; Vacuum tank base plate support block—4; Cylinder—5;

[0021] Right outer casing—6; Vacuum pressure gauge—7; Left outer casing—8; Linear bearing fixing plate—9; Vacuum tank bottom plate—10;

[0022] Flexible sealing retaining ring—11; Flexible sealing element—12; Wafer support pillar—13; Wafer—14;

[0023] Proximity sensor—15; Air path plug—16; Vacuum air path channel—17; Air pipe connector vacuum interface—18;

[0024] Vacuum annular air passage groove—19; Vacuum air vent—20; Compressed air interface—21; External vacuum interface—22;

[0025] Sealing groove—23; Detailed implementation method:

[0026] The technical solutions of the present invention will be described in detail below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0027] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0028] like Figures 1 to 4 The image shows an embodiment of the adsorption device for wafer testing according to this utility model, comprising a base plate 1, a guide column 2, a linear bearing 3, a vacuum tank base plate support block 4, a cylinder 5, a right outer shell 6, a vacuum pressure gauge 7, a left outer shell 8, a linear bearing fixing plate 9, a vacuum tank base plate 10, a flexible sealing ring fixing ring 11, a flexible sealing element 12, a wafer support column 13, a wafer 14, a proximity sensor 15, an air passage plug 16, a vacuum air passage channel 17, an air pipe connector vacuum interface 18, a vacuum annular air passage groove 19, a vacuum air hole 20, a compressed air interface 21, an external vacuum interface 22, and a sealing groove 23.

[0029] like Figures 1 to 3As shown, in terms of specific structure, the support assembly includes the base plate 1, the vacuum tank base plate support block 4, the right outer shell 6 and the left outer shell 8; the base plate 1 is provided with the guide post 2, the vacuum tank base plate support block 4, the cylinder 5 and the proximity sensor 15, and the vacuum tank base plate support block 4 is used to support the fixed vacuum tank base plate 10.

[0030] The lifting assembly includes the guide column 2, the linear bearing 3, the cylinder 5, the linear bearing fixing plate 9, the wafer support column 13, and the proximity sensor 15; the guide column 2 guides the linear bearing 3 in the up-down direction, the cylinder 5 body is fixedly connected to the base plate 1, the piston rod is fixedly connected to the linear bearing plate 9, and the wafer support column 13 and the linear bearing 3 are fixedly connected to the linear bearing plate 9.

[0031] The platform components include the vacuum tank base plate 10, the flexible sealing element fixing ring 11, the flexible sealing element 12, the vacuum annular gas passage groove 19, the vacuum air hole 20, and the sealing groove 23. The sealing groove 23 is disposed on the vacuum tank base plate 10 at a position corresponding to the periphery of the wafer. The flexible sealing element 12 is fixed in the sealing groove 23 by the flexible sealing element fixing ring 11. Multiple sets of vacuum annular gas passage grooves 19 and vacuum air holes 20 are arranged concentrically outward from the center of the vacuum tank base plate 10.

[0032] The gas path assembly includes the vacuum pressure gauge 7, the gas path plug 16, the vacuum gas path channel 17, the gas pipe connector vacuum interface 18, the compressed air interface 21, and the external vacuum interface 22; the gas path plug 16 is disposed on both sides of the vacuum tank bottom plate 10, the vacuum gas path channel 17 is interconnected with the vacuum air hole 20, and the gas pipe connector vacuum interface 18 is connected to the external vacuum interface 22 by a gas pipe.

[0033] The following is combined with Figures 1 to 4To further explain the specific adsorption process of this utility model: When the wafer 14 is detected approaching, the cylinder 5 drives the piston rod to extend, driving the linear bearing plate 9 and the wafer support column 13, causing the wafer support column 13 to pass through the vacuum tank bottom plate 10 and rise above the fixture table. After the transmitted wafer 14 lands on the top of the wafer support column 13, the piston rod of the cylinder 5 retracts, and the wafer support column 13 carries the wafer 14 down. During the descent, the wafer 14 is supported by the flexible sealing element 12. The wafer 14 descends in adaptive contact with the flexible sealing element 12 to form a sealed space. When the wafer 14 descends to a certain height, it is sensed by the proximity sensor 15. The external vacuum interface 22 introduces external vacuum gas into the vacuum passage 17 through the air pipe connector vacuum interface 18. The vacuum annular gas passage groove 19 connects to the vacuum passage 17 through the vacuum hole 20, thereby forming an integral gas passage. After vacuum is input, the wafer 14 is adsorbed onto the upper surface of the vacuum groove bottom plate 10, and then further combined. Figure 3 and Figure 4 As can be seen, since the flexible sealing element 12 is set in the sealing groove 23 and has a zigzag cross-section, when the wafer 14 is adsorbed on the upper surface of the vacuum tank bottom plate 10, under the action of the pressure difference between the upper and lower surfaces of the wafer 14, the flexible sealing element 12 retracts into the sealing groove 23 and supports the wafer 14 to be adsorbed on the vacuum tank bottom plate 10 to form a plane, so that the wafer 14 remains flat during the adsorption process.

[0034] It should be noted that in this embodiment, the sealing groove 23 has a rectangular cross-sectional shape, and the flexible sealing element 12 is specifically a rubber sealing ring with a zigzag cross-section. In other embodiments, the sealing groove 23 may also have an inverted trapezoidal cross-section, and the flexible sealing element 12 may also have a V-shaped cross-section, depending on the thickness of the sealing material used and the required vacuum suction force.

[0035] In summary, the wafer adsorption device for testing of this utility model, through the addition of a sealing groove at the position corresponding to the periphery of the wafer on the bottom plate of the vacuum tank, the flexible sealing fixing ring and flexible sealing element set in the sealing groove, and multiple sets of vacuum annular air passage grooves and vacuum holes arranged concentrically from the center of the bottom plate of the vacuum tank, enables the wafer to be adsorbed on the surface of the bottom plate of the vacuum tank throughout the process, without the wafer warping problem. This ensures the flatness of the wafer and also ensures the execution of subsequent wafer testing operations and the accuracy of the corresponding test results.

[0036] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered as belonging to the present invention.

Claims

1. An adsorption device for wafer testing, comprising a lifting assembly, a support assembly, an air passage assembly, and a platform assembly, characterized in that: The platform assembly includes a vacuum tank base plate (10), a flexible sealing ring (11), a flexible sealing element (12), and a sealing groove (23). The sealing groove (23) is located on the vacuum tank base plate (10) at a position corresponding to the periphery of the wafer. The flexible sealing ring (11) and the flexible sealing element (12) are located in the sealing groove (23). When the wafer is placed, the gas path assembly evacuates the space formed between the wafer and the vacuum tank base plate (10). Under the action of the pressure difference between the upper and lower surfaces of the wafer, the flexible sealing element (12) completely supports the wafer adsorbed on the surface of the vacuum tank base plate (10), so that the wafer overcomes large warpage and improves flatness.

2. The adsorption device for wafer testing according to claim 1, characterized in that: The vacuum tank bottom plate (10) is also provided with a vacuum annular gas passage groove (19) and a vacuum air hole (20). Multiple sets of the vacuum annular gas passage groove (19) and the vacuum air hole (20) are connected to the gas passage assembly and are arranged in concentric circles from the center of the vacuum tank bottom plate (10) outward.

3. The adsorption device for wafer testing according to claim 2, characterized in that: The lifting assembly includes a guide column (2), a linear bearing (3), a cylinder (5), a linear bearing fixing plate (9), a wafer support column (13), and a proximity sensor (15); one end of the linear bearing fixing plate (9) is connected to the linear bearing (3), and the other end is connected to the wafer support column (13).

4. The adsorption device for wafer testing according to claim 3, characterized in that: The gas path assembly includes a vacuum pressure gauge (7), a gas path plug (16), a vacuum gas path channel (17), a gas pipe connector vacuum interface (18), a compressed air interface (21), and an external vacuum interface (22); the vacuum gas path channel (17) is connected to the vacuum air hole (20).

5. The adsorption device for wafer testing according to claim 4, characterized in that: The sealing groove (23) has an inverted trapezoidal cross-sectional shape.

6. The adsorption device for wafer testing according to claim 4, characterized in that: The sealing groove (23) has a rectangular cross-sectional shape.

7. The adsorption device for wafer testing according to claim 5 or 6, characterized in that: The flexible seal (12) is a rubber sealing ring.

8. The adsorption device for wafer testing according to claim 7, characterized in that: The flexible seal (12) has a zigzag cross-section.

9. The adsorption device for wafer testing according to claim 7, characterized in that: The flexible seal (12) has a V-shaped cross section.

10. A wafer testing system, comprising an adsorption force testing mechanism and an adhesion force testing mechanism, characterized in that: It also includes the adsorption device for wafer testing as described in any one of claims 1-9.

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