Power module heat dissipation module, vehicle-mounted charger and electric control equipment

Abstract

The utility model discloses a power module heat radiation module, a vehicle-mounted charger and an electric control device, and relates to the technical field of power devices, the power module heat radiation module comprises a power element, a circuit board, a heat conduction member and a radiator provided with a heat conduction groove; the circuit board comprises a heat conduction area, a plurality of via holes are formed in the heat conduction area and filled with first heat conduction media, one face of the heat conduction area is in heat conduction connection with the heat dissipation face of the power element, and the other face of the heat conduction area is in heat conduction connection with the heat conduction part. The heat-conducting piece is arranged in the heat-conducting groove, and a gap between the heat-conducting piece and the heat-conducting groove is filled with a second heat-conducting medium; heat generated by the power element is conducted to the heat conducting piece through the first heat conducting medium filled in the plurality of via holes in the circuit board, and is conducted to the radiator through the heat conducting piece, the second heat conducting medium and the heat conducting groove for heat dissipation. The utility model aims to improve the heat dissipation efficiency of the power module.

Description

Technical Field

[0001] This utility model relates to the field of power device technology, and in particular to a power module heat dissipation module, an on-board charger, and an electronic control device. Background Technology

[0002] In related technologies, electronic components generate heat during operation, requiring timely heat dissipation to ensure their normal operation. Taking power transistors as an example, power transistors are commonly used semiconductor devices, widely applied in amplifiers, switches, voltage control, and power control due to their fast switching speed, high efficiency, and good thermal stability.

[0003] Existing power transistor cooling solutions typically involve soldering the power transistor onto a circuit board, with the transistor's heat dissipation surface connected to the water channel housing via vias in the circuit board. However, the circuit board and vias in the water channel housing have relatively high thermal resistance, which hinders heat transfer and prevents the heat from being quickly transferred to the housing, making it difficult to effectively reduce the power transistor's temperature. Utility Model Content

[0004] The main purpose of this invention is to provide a power module heat dissipation module, an on-board charger, and an electronic control device, which aim to improve the heat dissipation efficiency of the power module.

[0005] To achieve the above objectives, this utility model proposes a power module heat dissipation module, comprising:

[0006] Power components, circuit boards, heat-conducting components, and heat sinks with heat-conducting grooves;

[0007] The circuit board includes a heat-conducting area with a plurality of through holes. The through holes are filled with a first heat-conducting medium. One side of the heat-conducting area is thermally connected to the heat dissipation surface of the power element, and the other side of the heat-conducting area is thermally connected to the heat-conducting component. The heat-conducting component is disposed in the heat-conducting groove, and the gap between the heat-conducting component and the heat-conducting groove is filled with a second heat-conducting medium.

[0008] The heat generated by the power element is conducted to the heat-conducting component through the first thermally conductive medium filled in the vias on the circuit board, and then conducted to the heat sink for heat dissipation through the heat-conducting component, the second thermally conductive medium, and the thermally conductive groove.

[0009] In one embodiment, the second thermally conductive medium is a thermally conductive gel, which fills the gap between the outer wall of the thermally conductive element and the wall of the thermally conductive groove.

[0010] In one embodiment, the heat dissipation surface of the heat-conducting element and the power element has a projected area on the circuit board that covers the area where several of the vias are located on the circuit board.

[0011] In one embodiment, the projected area of ​​the heat-conducting element on the circuit board is greater than or equal to the projected area of ​​the heat dissipation surface of the power element on the circuit board.

[0012] In one embodiment, the first thermally conductive medium is tin, one side of the thermally conductive area is soldered to the heat dissipation surface of the power element through tin in a plurality of vias, and the other side of the thermally conductive area is soldered to the thermally conductive component through tin in a plurality of vias.

[0013] In one embodiment, the heat-conducting element is a copper block or an aluminum block.

[0014] In one embodiment, the heat-conducting groove is separately disposed from the heat sink, and the heat-conducting groove is welded to the heat sink; or, the heat-conducting groove and the heat sink are integrally formed.

[0015] In one embodiment, the radiator is a liquid-cooled radiator or an air-cooled radiator.

[0016] This utility model also provides an on-board charger, including the power module heat dissipation module as described above.

[0017] This utility model also provides an electrical control device, including the power module heat dissipation module as described above.

[0018] The power module heat dissipation module proposed in this utility model sets a heat-conducting area on the circuit board, and opens through holes filled with a first thermally conductive medium in the heat-conducting area. Simultaneously, a thermally conductive component is placed in the heat-conducting groove of the heat sink, which is in close contact with the heat-conducting area. A second thermally conductive medium is filled between the thermally conductive component and the heat-conducting groove. This allows heat from the power component to be transferred to the thermally conductive component via the first thermally conductive medium and the circuit board, and then rapidly conducted to the heat sink via the second thermally conductive medium. This design can supplement the heat sink with the thermally conductive component, thereby increasing the overall heat dissipation area and heat capacity, and thus reducing the junction temperature of the power component. It effectively solves the problems of low heat transfer efficiency and difficulty in reducing power transistor temperature in existing heat dissipation solutions, thereby improving the reliability and service life of the power module. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0020] Figure 1 A schematic diagram of the structure of an embodiment of the power module heat dissipation module provided by this utility model.

[0021] Explanation of icon numbers:

[0022] 100. Power module heat dissipation module; 1. Power component; 2. Circuit board; 21. Via; 3. First heat conduction medium; 4. Heat conduction component; 5. Heat sink; 6. Heat conduction groove; 7. Second heat conduction medium.

[0023] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0025] It should be noted that if the embodiments of this utility model involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0026] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0027] This utility model proposes a power module heat dissipation module.

[0028] This utility model proposes a power module heat dissipation module 100.

[0029] Please see Figure 1 To achieve the above objectives, this utility model proposes a power module heat dissipation module 100, including a power element 1, a circuit board 2, a heat-conducting component 4, and a heat sink 5 with a heat-conducting groove 6. The circuit board 2 includes a heat-conducting area with a plurality of through holes 21. The through holes 21 are filled with a first heat-conducting medium 3. One side of the heat-conducting area is thermally connected to the heat dissipation surface of the power element 1, and the other side of the heat-conducting area is thermally connected to the heat-conducting component 4. The heat-conducting component 4 is disposed in the heat-conducting groove 6, and the gap between the heat-conducting component 4 and the heat-conducting groove 6 is filled with a second heat-conducting medium 7. The heat generated by the power element 1 is conducted to the heat-conducting component 4 through the first heat-conducting medium 3 filled in the plurality of through holes 21 on the circuit board 2, and then conducted to the heat sink 5 for heat dissipation through the heat-conducting component 4, the second heat-conducting medium 7, and the heat-conducting groove 6.

[0030] The power module heat dissipation module proposed in this utility model sets a heat-conducting area on the circuit board 2, and opens a through hole 21 filled with a first thermally conductive medium 3 in the heat-conducting area. At the same time, a thermally conductive element 4 is set in the heat-conducting groove 6 of the heat sink 5, which is in contact with the heat-conducting area, and a second thermally conductive medium 7 is filled in the gap between the thermally conductive element 4 and the heat-conducting groove 6. This realizes that the heat of the power component 1 is transferred to the thermally conductive element 4 through the first thermally conductive medium 3 and the circuit board 2, and then the heat of the thermally conductive element 4 is quickly conducted to the heat sink 5 through the second thermally conductive medium 7. This design can make the thermally conductive element 4 a supplement to the heat sink, thereby increasing the overall heat dissipation area and heat capacity, and thus reducing the junction temperature of the power component 1. It effectively solves the problems of low heat transfer efficiency and difficulty in reducing the temperature of the power tube in the existing heat dissipation scheme, thereby improving the reliability and service life of the power module.

[0031] It should be noted that the heat-conducting component 4 (such as the heat sink 5, heat pipe, thermal pad, etc.), the first thermally conductive medium 3 (such as thermal oil, thermal paste, etc.), and the second thermally conductive medium 7 (such as thermal paste, thermal gel, etc.) are all materials or components used to transfer heat. They usually have high thermal conductivity and can effectively transfer heat. Since they are used in electronic products, the selection of materials for both needs to take into account factors such as their thermal conductivity and high-temperature resistance to ensure stability and efficiency in the heat transfer process, thereby effectively improving thermal management capabilities and ensuring the stability and reliability of the equipment. The phrase "the gap between the heat-conducting component 4 and the thermal groove 6 is filled with the second thermally conductive medium 7" means that the second thermally conductive medium 7 at least wraps or covers the outer side of part of the structure of the heat-conducting component 4 other than the outer surface in contact with the circuit board 2 (it can be a full wrap), so that the heat-conducting component 4 can increase its heat dissipation area through the second thermally conductive medium 7.

[0032] In one embodiment, the second thermally conductive medium 7 is a thermally conductive gel, which fills the gap between the outer wall of the thermally conductive element 4 and the wall of the thermally conductive groove 6. The thermally conductive gel has good plasticity, can fill the gap between the thermally conductive groove 6 and the thermally conductive element 4, ensuring good thermal contact, and can also provide a certain degree of insulation protection to prevent short circuits.

[0033] Considering that heat tends to concentrate in the via 21 area, in one embodiment, the projected area of ​​the heat dissipation surface of the heat-conducting element 4 and the power element 1 on the circuit board 2 covers the area where several vias 21 are located on the circuit board 2. By covering the via 21 area, the heat-conducting element 4 can more effectively transfer the heat on the circuit board 2 to itself, and then transfer it to the heat-conducting groove 6 and the heat sink 5 through the second heat-conducting medium 7, thereby improving the heat transfer efficiency.

[0034] To further improve heat dissipation efficiency, in one embodiment, the projected area of ​​the heat-conducting component 4 on the circuit board 2 is greater than or equal to the projected area of ​​the heat dissipation surface of the power component 1 on the circuit board 2. Since thermal resistance is inversely proportional to the area of ​​the conduction path, increasing the area of ​​the heat-conducting surface can further reduce thermal resistance, allowing heat to be conducted from the power component 1 to the heat sink 5 more quickly, reducing local hot spots, and improving the overall heat dissipation efficiency of the power module heat dissipation module 100.

[0035] In one embodiment, the first heat-conducting medium 3 is tin. One side of the heat-conducting area is soldered to the heat dissipation surface of the power component 1 through a plurality of vias 21, and the other side of the heat-conducting area is soldered to the heat-conducting component 4 through a plurality of vias 21. The tin soldering connection has high reliability, which can ensure the stability of the connection and prevent the connection from breaking or loosening. Therefore, by using tin as the first heat-conducting medium 3, heat can be effectively conducted and the heat-conducting area of ​​the circuit board 2 can be connected to the heat dissipation surface of the power component 1 and the heat-conducting component 4 together, forming an efficient heat conduction path, reducing thermal resistance, thereby improving heat dissipation efficiency and improving the reliability of the system.

[0036] In one embodiment, the heat-conducting element 4 is made of copper or aluminum. Using copper or aluminum allows the heat-conducting element 4 to meet the requirements of high thermal conductivity and structural strength, enabling it to conduct heat more effectively and withstand certain mechanical stresses. Furthermore, since the dimensions of the heat-conducting element 4 should be designed according to the heat dissipation requirements of the power element 1 and the dimensions of the heat sink 5, its shape can be flat, cylindrical, sheet-like, strip-like, etc. For example, a rectangular heat-conducting element 4 typically has a larger contact area, allowing for more effective contact with the heat source and thus improving heat conduction efficiency. A U-shaped heat-conducting element... 4 can better adapt to heat sources with special shapes, such as tightly arranged electronic components, thereby achieving more uniform heat conduction. Therefore, the specific shape and structure of the heat conductor 4 are not limited in this utility model, as long as heat can be conducted quickly. In addition, copper or aluminum blocks can be processed in various ways, such as milling and drilling, so it is convenient to manufacture the heat conductor 4 and the cost is low. In actual production, in order to increase the contact area between the heat conductor 4 and the heat sink 5 and the circuit board 2, the surface of the heat conductor 4 can be treated to improve its thermal conductivity, such as polishing or sandblasting.

[0037] In one embodiment, the heat conduction groove 6 and the radiator 5 are separately arranged, and the heat conduction groove 6 is welded to the radiator 5. The separate arrangement means that the heat conduction groove 6 and the radiator 5 are two independent components. The advantage of this design is that it is easy to manufacture and maintain, and the heat conduction groove 6 and the radiator 5 can be flexibly combined and used according to different heat dissipation requirements. Welding the heat conduction groove 6 and the radiator 5 can provide a good heat conduction path and connection strength, ensuring that the thermal resistance between the heat conduction groove 6 and the radiator 5 is as low as possible, and avoiding loosening due to vibration or temperature changes. If the radiator 5 or the heat conduction groove 6 needs to be replaced, it can be achieved by re-welding, which reduces the difficulty of maintenance to a certain extent.

[0038] In another embodiment, the heat conduction groove 6 and the heat sink 5 are integrally formed. Integral forming means that the heat conduction groove 6 and the heat sink 5 are manufactured simultaneously from the same material through casting, injection molding, die casting or other molding processes. On the one hand, it can simplify the production process, improve production efficiency, reduce production costs, and ensure the integrity of the heat sink 5 structure, avoiding interface problems that may occur during assembly, such as missing solder or loosening. On the other hand, since the integrally formed structure has no additional connecting interface, it can reduce thermal resistance, improve heat conduction efficiency, and thus improve heat dissipation performance.

[0039] In one embodiment, the heat sink 5 is either a liquid-cooled heat sink 5 or an air-cooled heat sink 5. The liquid-cooled heat sink 5 absorbs heat through circulating coolant (such as water, antifreeze, etc.) and then dissipates the heat to the external environment through the heat sink 5. The air-cooled heat sink 5, on the other hand, uses a fan to force airflow and carry heat away from the heat sink 5 casing, thereby achieving the purpose of heat dissipation. In actual use, the heat sink 5 needs to be selected according to different usage scenarios. For example, if the power module generates a lot of heat and requires efficient heat dissipation, the liquid-cooled heat sink 5 may be a better choice, while if the equipment space is limited, the more compact air-cooled heat sink 5 is more suitable.

[0040] This utility model also provides an on-board charger, which includes a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since the on-board charger adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0041] This utility model also provides an electrical control device, which includes a power module heat dissipation module 100. The specific structure of the power module heat dissipation module 100 is as described in the above embodiments. Since the electrical control device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here.

[0042] The above are merely exemplary embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent structural transformations made based on the technical concept of this utility model and the contents of the specification and drawings of this utility model, or direct / indirect applications in other related technical fields, are included within the patent protection scope of this utility model.

Claims

1. A power module heat dissipation module, characterized in that, Includes power components, circuit boards, heat-conducting components, and heat sinks with heat-conducting grooves; The circuit board includes a heat-conducting area, and a plurality of vias are formed in the heat-conducting area. The vias are filled with a first heat-conducting medium. One side of the heat-conducting area is thermally connected to the heat dissipation surface of the power element, and the other side of the heat-conducting area is thermally connected to the heat-conducting component. The heat-conducting component is disposed in the heat-conducting groove, and the gap between the heat-conducting component and the heat-conducting groove is filled with a second heat-conducting medium; The heat generated by the power element is conducted to the heat-conducting component through the first thermally conductive medium filled in the vias on the circuit board, and then conducted to the heat sink for heat dissipation through the heat-conducting component, the second thermally conductive medium, and the thermally conductive groove.

2. The power module heat dissipation module as described in claim 1, characterized in that, The second thermally conductive medium is a thermally conductive gel, which fills the gap between the outer wall of the thermally conductive component and the wall of the thermally conductive groove.

3. The power module heat dissipation module as described in claim 1, characterized in that, The heat dissipation surfaces of the heat-conducting component and the power element have a projected area on the circuit board that covers the area where several of the vias are located on the circuit board.

4. The power module heat dissipation module as described in claim 3, characterized in that, The projected area of ​​the heat-conducting component on the circuit board is greater than or equal to the projected area of ​​the heat dissipation surface of the power element on the circuit board.

5. The power module heat dissipation module as described in claim 1, characterized in that, The first thermally conductive medium is tin. One side of the thermally conductive area is soldered to the heat dissipation surface of the power element through tin in a plurality of vias, and the other side of the thermally conductive area is soldered to the thermally conductive component through tin in a plurality of vias.

6. The power module heat dissipation module as described in claim 1, characterized in that, The heat-conducting component is made of copper or aluminum.

7. The power module heat dissipation module as described in claim 1, characterized in that, The heat-conducting groove is separately disposed from the heat sink, and the heat-conducting groove is welded to the heat sink; or, the heat-conducting groove and the heat sink are integrally formed.

8. The power module heat dissipation module as described in claim 7, characterized in that, The radiator is either a liquid-cooled radiator or an air-cooled radiator.

9. An on-board charger, characterized in that, Includes the power module heat dissipation module as described in any one of claims 1 to 8.

10. An electrical control device, characterized in that, Includes the power module heat dissipation module as described in any one of claims 1 to 8.

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