Composite solder preform and welding assembly

Abstract

The utility model provides a composite solder preform and a solder assembly. The composite solder preform provided by the utility model is used for welding a first welding part and a second welding part; the composite solder preform comprises a polymer supporting structure and a solder preform, the polymer support structure surrounds the solder preform; wherein the melting point of the polymer supporting structure is greater than that of the solder preform, and the polymer supporting structure has a specified thickness; when the first welding piece and the second welding piece are welded, the composite welding flux preformed piece is contained between the first welding piece and the second welding piece and used for forming a supporting space between the first welding piece and the second welding piece in the welding process, so that the first welding piece and the second welding piece are always kept parallel in the welding process. And the molten solder preformed part forms a bonding layer with the uniform thickness between the first welding part and the second welding part by filling the supporting space, so that the first welding part and the second welding part are welded together through the bonding layer.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor, and in particular to a composite solder preform and a soldering assembly. BACKGROUND

[0002] In order to improve the efficiency and reliability of the soldering process, the solder preform is widely used in high-performance electronic products. For example, the solder preform is used to realize the soldering of a chip and a substrate, or the solder preform is used to realize the soldering of a chip and a heat sink, etc.

[0003] However, due to a series of reasons, the chip and the substrate may be tilted during the soldering process, and then the thickness of the bonding line between the two is inconsistent, thereby causing a series of problems such as mechanical stress, warping or joint cracking. SUMMARY

[0004] Therefore, the present application provides a composite solder preform and a soldering assembly to ensure the consistency of the bonding line thickness during soldering, thereby improving the soldering quality.

[0005] Specifically, the present application is realized by the following technical solutions:

[0006] The first aspect of the present application provides a composite solder preform, which is used to solder a first soldering member and a second soldering member; the composite solder preform comprises a polymer support structure and a solder preform; the polymer support structure surrounds the solder preform; wherein,

[0007] The melting point of the polymer support structure is greater than the melting point of the solder preform, and the polymer support structure has a specified thickness; wherein, during the soldering of the first soldering member and the second soldering member, the composite solder preform is accommodated between the first soldering member and the second soldering member, the polymer support structure is used to form a support space between the first soldering member and the second soldering member during the soldering process, so that the first soldering member and the second soldering member always remain parallel during the soldering process, and the molten solder preform forms a bonding layer with uniform thickness between the first soldering member and the second soldering member by filling the support space, so as to solder the first soldering member and the second soldering member together through the bonding layer;

[0008] The polymer support structure is made of any one of the following materials: polyphenylene sulfide, polyether ether ketone, silicon resin, perfluoroalkoxy polymer, polyformaldehyde, polypropylene and polyethylene terephthalate.

[0009] The second aspect of the present application provides a welding assembly, which comprises a first welding member, a second welding member and any composite solder preform provided by the first aspect of the present application, wherein,

[0010] The composite solder preform is arranged between the first welding member and the second welding member to form a supporting space between the first welding member and the second welding member during welding, so that the first welding member and the second welding member are always kept parallel during welding, and the molten solder preform forms a uniform thickness bonding layer between the first welding member and the second welding member by filling the supporting space, so that the first welding member and the second welding member are welded together through the bonding layer.

[0011] The composite solder preform and the welding assembly provided by the present application can keep the first welding member and the second welding member always parallel during welding by arranging the polymer supporting structure and the solder preform, surrounding the solder preform with the polymer supporting structure, and selecting a material with a melting point higher than that of the solder preform and a specified thickness for the polymer supporting structure, so that the polymer supporting structure accommodated between the first welding member and the second welding member can form a supporting space between the first welding member and the second welding member during welding, so that the first welding member and the second welding member are always kept parallel during welding, and the molten solder preform forms a uniform thickness bonding layer between the first welding member and the second welding member by filling the supporting space, so that the first welding member and the second welding member are welded together through the bonding layer. In this way, the composite solder preform can stably exist during welding in the first welding member and the second welding member, effectively keeping the first welding member and the second welding member always parallel, preventing tilting caused by thermal expansion or contraction, forming a uniform bonding layer, and enhancing the quality and strength of the welding. In addition, the polymer supporting structure made of different materials can not only meet the needs of different scenarios and improve the applicability of the composite solder preform, but also improve the high temperature resistance, mechanical strength and chemical resistance of the polymer supporting structure. BRIEF DESCRIPTION OF DRAWINGS

[0012] Figure 1 A schematic diagram of the composite solder preform provided by the first embodiment of the present application is shown in the figure.

[0013] Figure 2 A schematic diagram of the composite solder preform provided by the second embodiment of the present application is shown in the figure. Figure 1 An application scenario diagram of the composite solder preform shown in the figure is shown in the figure.

[0014] Figure 3 A schematic diagram of the composite solder preform provided by the second embodiment of the present application is shown in the figure.

[0015] Figure 4A schematic diagram of Embodiment 3 of the composite solder preform provided in this application;

[0016] Figure 5 A schematic diagram of Embodiment 4 of the composite solder preform provided in this application;

[0017] Figure 6 A schematic diagram of Embodiment 5 of the composite solder preform provided in this application;

[0018] Figure 7 A schematic diagram of Embodiment Six of the composite solder preform provided in this application;

[0019] Figure 8 A schematic diagram of Embodiment Seven of the composite solder preform provided in this application;

[0020] Figure 9 This is a schematic diagram of Embodiment 8 of the composite solder preform provided in this application.

[0021] Figure label:

[0022] 1: Composite solder preforms;

[0023] 11: Polymer support structure;

[0024] 111: Support column;

[0025] 112: Positioning post;

[0026] 12: Solder preforms;

[0027] 2: First welded component;

[0028] 3: Second welded component;

[0029] 31: Positioning groove. Detailed Implementation

[0030] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0031] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0032] It should be understood that, although the terms first, second, third, etc. can be used herein to describe various information, the information should not be limited to these terms. These terms are only used to differentiate one piece of information from another piece of information. For example, without departing from the scope of the present application, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information. Depending on the context, the word "if" as used herein can be interpreted as "when" or "upon determination" or "in response to a determination".

[0033] The specific embodiments are given below to introduce the technical solutions of the present application in detail.

[0034] Figure 1 The schematic diagram of the composite solder preform embodiment one provided by the present application. Figure 2 The application scenario diagram of the composite solder preform shown in the present embodiment (it should be noted that, Figure 1 the application scenario diagram is a cross-sectional view). Please refer to Figure 2 and Figure 1 and Figure 2 The composite solder preform 1 provided by the present embodiment is used for welding the first welding piece 2 and the second welding piece 3.

[0035] Further, the composite solder preform 1 comprises a polymer support structure 11 and a solder preform 12; the polymer support structure 11 surrounds the solder preform 12; wherein,

[0036] the melting point of the polymer support structure 11 is greater than the melting point of the solder preform 12, and the polymer support structure 11 has a specified thickness; wherein, during welding the first welding piece 2 and the second welding piece 3, the composite solder preform 1 is accommodated between the first welding piece 2 and the second welding piece 3, the polymer support structure 11 is used to form a support space between the first welding piece 2 and the second welding piece 3 during welding, so that the first welding piece 2 and the second welding piece 3 always remain parallel during welding, and the molten solder preform 12 forms a uniform-thickness bonding layer between the first welding piece 2 and the second welding piece 3 by filling the support space, so as to weld the first welding piece 2 and the second welding piece 3 together through the bonding layer;

[0037] wherein, the polymer support structure 11 is made of any one of the following materials: polyphenylene sulfide, polyether ether ketone, silicone resin, perfluoroalkoxy polymer, polyformaldehyde, polypropylene and polyethylene terephthalate.

[0038] Specifically, please refer to Figure 2The composite solder preform 1 provided in the application is used for welding a first solder member 2 and a second solder member 3, and the first solder member, the composite solder preform 1 and the second solder member together constitute a three-layer structure, wherein the uppermost layer is the first solder member 2, the bottommost layer is the second solder member 3, and the composite solder preform 1 is located in the middle position and is used for welding the first solder member 2 and the second solder member 3.

[0039] Specifically, please refer to Figure 1 The composite solder preform 1 comprises a solder preform 12 and a polymer support structure 11 surrounding the solder preform 12 in the circumferential direction. The polymer support structure 11 can be used to support the second solder member 3. Further, due to the support of the polymer support structure 11 between the two solder members, a support space is formed between the two solder members.

[0040] It should be noted that the specific shape of the solder preform 12 is set according to actual needs, and in the present application, it is not limited. For example, it can be a regular shape or an irregular shape. Specifically, for example, in an embodiment, the solder preform 12 can be square or rectangular; in another embodiment, the solder preform 12 can also be circular, polygonal, etc. It should be noted that the polymer support structure 11 surrounds the solder preform 12. For example, in a possible implementation, the shape of the polymer support structure matches the shape of the solder preform 12 and surrounds the solder preform 12 in the circumferential direction.

[0041] It should be noted that the polymer support structure 11 has a specified thickness. The thickness of the polymer support structure 11 is set according to actual needs, and in the present embodiment, it is not limited.

[0042] As can be understood from the foregoing description, the height of the polymer support structure 11 is uniform and equal everywhere, and the melting point thereof is greater than that of the solder preform. In this way, during the welding process, when the solder preform 12 melts, the polymer support structure 11 does not melt and is always supported between the first solder member 2 and the second solder member 3, forming a support space between the first solder member 2 and the second solder member 3 during the welding process, so that the first solder member 2 and the second solder member 3 are always in a parallel state during the welding process.

[0043] In this way, the molten solder preform 12 (for the convenience of distinction, the molten solder preform 12 is denoted as solder) is filled into the support space between the first solder member 2 and the second solder member 3. Since the first solder member 2 and the second solder member 3 are always in a parallel state, the solder filled into the support space forms a uniform-thickness bonding layer, which firmly welds the first solder member 2 and the second solder member 3 together.

[0044] Optionally, the polymer support structure 11 is made of any one of the following materials: polyphenylene sulfide, polyether ether ketone, silicone, perfluoroalkoxy polymer, polyformaldehyde, polypropylene and polyethylene terephthalate.

[0045] It should be noted that the polymer support structure 11 can be made of different materials to have different properties and be suitable for different application scenarios. For example, in an embodiment, polyphenylene sulfide can be used as the material for making the polymer support structure 11, so that the polymer support structure 11 made of polyphenylene sulfide has excellent heat resistance, flame retardance and chemical stability, and can still maintain the stability of supporting the first solder member 2 and the second solder member 3 in a high-temperature environment; for another example, in another embodiment, polyether ether ketone can be used as the material for making the polymer support structure 11, so that the polymer support structure 11 made of polyether ether ketone has good heat resistance and strong mechanical strength, and can be used in a scenario where the first solder member 2 and the second solder member 3 have a large weight. It should be noted that the specific material for making the polymer support structure 11 can be selected according to the actual needs of the actual application scenario, which is not limited in the present embodiment.

[0046] The composite solder preform provided in the present embodiment is provided by arranging a polymer support structure and a solder preform, surrounding the solder preform with the polymer support structure, and setting the melting point of the polymer support structure to be greater than the melting point of the solder preform and the polymer support structure to have a specified thickness. In this way, during the welding of the first solder member and the second solder member, the polymer support structure accommodated between the first solder member and the second solder member can form a support space between the first solder member and the second solder member during the welding process, so that the first solder member and the second solder member always remain parallel during the welding process, and the molten solder preform forms a uniform thickness bonding layer between the first solder member and the second solder member by filling the support space, so as to weld the first solder member and the second solder member together through the bonding layer. In this way, the composite solder preform can stably exist during the welding process in the first solder member and the second solder member, effectively keep the first solder member and the second solder member in a parallel state at all times, prevent tilting due to thermal expansion or contraction, form a uniform bonding layer, and enhance the quality and strength of the welding. In addition, the polymer support structure can be made of different materials, which not only meets the needs of different scenarios and improves the applicability of the composite solder preform, but also improves the high-temperature resistance, mechanical strength and chemical resistance of the polymer support structure.

[0047] The following gives several more specific embodiments to illustrate the composite solder preform 1 provided in the present application in detail.

[0048] Figure 3Figure 2 is a schematic view of a composite solder preform according to a second embodiment of the present application. This embodiment is mainly used to illustrate the positional relationship and thickness relationship between the polymer support structure 11 and the solder preform 12. Please refer to Figure 3 On the basis of the above-mentioned embodiment, the composite solder preform 1 provided in this embodiment is characterized in that the polymer support structure 11 is a frame structure fixed around the solder preform 12; wherein,

[0049] The thickness of the frame structure is greater than the thickness of the solder preform 12, or the thickness of the frame structure is less than the thickness of the solder preform 12, or the thickness of the frame structure is equal to the thickness of the solder preform 12.

[0050] Further, Figure 4 Figure 3 is a schematic view of a composite solder preform according to a third embodiment of the present application. Please refer to Figure 4 When the polymer support structure 11 is a frame structure fixed around the solder preform 12, the frame structure is a closed frame, or the frame structure is composed of a plurality of sub-supports uniformly distributed around the solder preform 12.

[0051] For example, in the example shown in Figure A of Figure 4 , the polymer support structure 11 is a closed structure; for another example, in the example shown in Figure B of Figure 4 , the polymer support structure 11 is composed of a plurality of sub-supports uniformly distributed around the solder preform 12.

[0052] It should be noted that the closed structure specifically refers to a frame form that is completely enclosed or closed, which can effectively limit the loss or leakage of solder and also provide higher compressive strength under external force.

[0053] Further, when the polymer support structure 11 is composed of a plurality of sub-supports uniformly distributed around the solder preform 12, the specific number and arrangement position of the plurality of sub-supports are set according to actual needs, which are not limited in the present embodiment. For example, when the solder preform 12 is rectangular, at this time, the plurality of sub-supports include four sub-supports fixed at the four corners of the solder preform 12; for another example, when the solder preform 12 is circular, at this time, the plurality of sub-supports can include eight sub-supports uniformly distributed around the solder preform 12.

[0054] Further, please continue to refer to Figure 3 , in the example shown in Figure A of Figure 3 , the thickness of the polymer support structure 11 is greater than the thickness of the solder preform 12; in the example shown in Figure B of Figure 3In the example shown in Figure B, the thickness of the polymer support structure 11 is less than the thickness of the solder preform 12; Figure 3 In the example shown in Figure C, the thickness of the polymer support structure 11 is equal to the thickness of the solder preform 12.

[0055] As described above, it is understood that the thickness of the polymer support structure 11 is set according to actual needs, and is not limited in this application. For example, when the thickness of the polymer support structure 11 is greater than the thickness of the solder preform 12, the frame structure can provide strong support, which is suitable for welding large mechanical parts; when the thickness of the polymer support structure 11 is less than the thickness of the solder preform 12, the frame structure requires only a small space, which is suitable for precision welding of small electronic devices; when the thickness of the polymer support structure 11 is equal to the thickness of the solder preform 12, the overall structure of the composite solder preform 1 composed of the polymer support structure 11 and the solder preform 12 is relatively regular, which is suitable for welding precision electronic products.

[0056] Figure 5 This is a schematic diagram of Embodiment 4 of the composite solder preform provided in this application. Please refer to... Figure 5 In one possible implementation, the frame structure has a groove into which the solder preform 12 is inserted;

[0057] or,

[0058] The solder preform 12 has a circumferential groove, and the frame structure is inserted into the groove;

[0059] or,

[0060] The frame structure has a groove, and the solder preform 12 has a circumferential protrusion that is inserted into the groove.

[0061] or,

[0062] The solder preform 12 has a circumferential groove, and the frame structure has a protrusion that is inserted into the groove.

[0063] For details, please refer to Figure 5 ,exist Figure 5 In the example shown in Figure A, the frame structure has grooves, and solder preforms are inserted into the grooves to achieve a fixed connection between the two; Figure 5 In the example shown in Figure B, the solder preform has a circumferential groove, and the frame structure is inserted into the groove to achieve a fixed connection between the two; Figure 5 In the example shown in Figure C, the frame structure has a groove, and the solder preform has a circumferential protrusion. The protrusion is inserted into the groove to achieve a fixed connection between the two; Figure 5In the example shown in Figure D, the solder preform has a groove in its circumference, and the frame structure has a protrusion. The protrusion is inserted into the groove to achieve a fixed connection between the two.

[0064] Figure 6 A schematic diagram of Embodiment 5 of the composite solder preform provided in this application; wherein, Figure 6 Figure A in the diagram is a 3D view of the composite solder preform. Figure 6 Figure B shows a cross-sectional view of the composite solder preform. Please refer to it. Figure 6 ,exist Figure 6 In the example shown, the polymer support structure 11 includes a closed frame; the area of ​​the hollow region inside the closed frame is smaller than the area of ​​the solder preform 12, and the overall area of ​​the closed frame is larger than the area of ​​the solder preform 12; the solder preform 12 is disposed on the closed frame in such a way as to cover the hollow region inside the closed frame, so that the molten solder preform 12 flows into the hollow region during the welding process.

[0065] Please continue to refer to Figure 6 Understandably, in Figure 6 In the illustrated embodiment, the polymer support structure 11 is a closed frame that covers the solder preform 12. The area of ​​the hollow region inside the closed frame is smaller than the area of ​​the solder preform 12, and the overall area of ​​the closed frame is larger than the area of ​​the solder preform 12. Thus, during the welding process, the closed frame can not only form a support space between the first solder part and the second welded part, but also form a flow space for the solder through the closed frame, and restrict the flow of the solder through the closed frame so that the solder does not flow out of the hollow region.

[0066] It should be noted that, see Figure 6 ,exist Figure 6 In the embodiment shown, the polymer support structure 11 is a closed frame with a hollow interior. The area of ​​the hollow interior is smaller than the area of ​​the solder preform, and the overall area is larger than the area of ​​the solder preform.

[0067] The composite solder preform provided in this embodiment uses a polymer support structure as a closed frame. The area of ​​the hollow region inside the closed frame is smaller than the area of ​​the solder preform, while the overall area is larger than the area of ​​the solder preform. This allows the solder preform to be stably placed on the closed frame and cover the hollow region inside the closed frame. In this way, during the welding process, it can be effectively ensured that the solder preform can naturally flow into the hollow region after melting, maintaining the shape and dimensional accuracy of the composite solder preform.

[0068] Figure 7FIG. 7 is a schematic view of a composite solder preform according to an embodiment of the present application. Please refer to Figure 7 The polymer support structure comprises a plurality of external support columns surrounding the solder preform 12, which are arranged around the circumference of the solder preform 12 in a manner close to the solder preform 12 and separated from the solder preform 12.

[0069] Specifically, the polymer support structure 11 is composed of a plurality of external support columns surrounding the periphery of the solder preform 12 without contacting it. In this way, the molten solder preform 12 will not adhere to the polymer support structure 11 during welding, ensuring that the solder can smoothly fill the welding site to form a uniform bonding layer.

[0070] It should be noted that in this case, the distance between the external support columns and the composite solder preform 1 is set according to actual needs, which is not limited in the present embodiment.

[0071] Figure 8 FIG. 8 is a schematic view of a composite solder preform according to an embodiment of the present application. Please refer to Figure 8 .

[0072] Please continue to refer to Figure 8 , in Figure 8 the example shown, the polymer support structure comprises a plurality of external support columns surrounding the solder preform 12; the plurality of external support columns are arranged around the circumference of the solder preform 12 in a manner close to the solder preform 12 and separated from the solder preform 12.

[0073] Further, please continue to refer to Figure 8 , in Figure 8 the example shown in Figure A, the polymer support structure is composed of a plurality of external support columns with the same length.

[0074] Further, please continue to refer to Figure 8 , in Figure 8 the example shown in Figure B, when the polymer support structure is composed of a plurality of external support columns, the plurality of external support columns comprises at least one positioning column 112; please continue to refer to Figure 8The length of the positioning column 112 is greater than the length of the rest of the external support columns 111. The second welding piece 3 has a positioning groove 31 on the side facing the first welding piece 2. The positioning column 112 is accommodated in the positioning groove 31 to determine the position of the positioning column 112 on the second welding piece 3 through the positioning groove 31. The position of the composite solder preform 1 on the second welding piece 3 is determined by the position of the positioning column 112 on the second welding piece 3. After the positioning column 112 is accommodated in the positioning groove 31, the length of the part of the positioning column 112 above the second welding piece 3 is equal to the length of the rest of the external support columns 111.

[0075] For example, in combination with Figure 7 For the convenience of description, refer to Figure 7 The four external support columns are respectively referred to as a first support column, a second support column, a third support column, and a fourth support column. The lengths of the first support column, the second support column, and the third support column are equal to a first length. The length of the fourth support column is equal to a second length. The second length is greater than the first length.

[0076] Further, the lower right corner of the second welding piece 3 has a groove 31. The difference between the second length and the depth of the groove is equal to the first length. Before welding, the fourth support column is inserted into the groove (the position of the lower right corner is shown) Figure 7 Further, after the fourth support column is inserted, the solder preform 12 can be placed in the appropriate position according to the position of the fourth support column. Further, after the solder preform 12 is placed, the rest of the support columns can be placed based on the position of the solder preform 12.

[0077] The composite solder preform provided in the embodiment can realize the positioning effect by matching the positioning column and the positioning groove, accurately position the composite solder preform on the second welding piece, ensure the stability of welding, make the assembly of the welding piece more convenient, and improve the production efficiency.

[0078] Figure 9 The schematic diagram of the composite solder preform provided in Embodiment Eight of the application is shown in Figure 9 In the example shown in Figure 9 The polymer support structure 11 includes a plurality of internal support columns arranged inside the solder preform 12. The plurality of internal support columns have a layout form capable of keeping the first welding piece 2 and the second welding piece 3 parallel.

[0079] Specifically, the specific layout form of the plurality of internal support columns is set according to actual needs, which is not limited in the embodiment. For example, in a possible implementation, the plurality of internal support columns are distributed along the periphery of the solder preform 12 to form a ring-shaped or multi-layer concentric ring layout to effectively support the edge region of the solder preform and prevent the soldered part from tilting during soldering, while facilitating the flow of internal solder. For another example, in another possible implementation, the plurality of internal support columns can be arranged symmetrically in a specific manner, for example, distributed in a rectangular or hexagonal lattice structure inside the solder preform, so as to balance between support and soldering stability and ensure that each region of the soldered part is uniformly supported. For another example, in another possible implementation, the plurality of internal support columns can form a cross-shaped support column layout inside the solder preform to form a longitudinal and transverse intersecting structure.

[0080] Specifically, the composite solder preform provided in the embodiment can support the first soldered part 2 and the second soldered part 3 from multiple positions through the internal support columns to form uniformly distributed support force, so as to effectively prevent the soldered part from tilting or mispositioning during soldering.

[0081] It should be noted that the internal support column 111 or the external support column 111 can be any of the following support columns 111: circular, rectangular, cross-shaped, pentagram, L-shaped, herringbone-shaped, and irregular-shaped. Specifically, the specific shape of the internal support column 111 and the external support column 111 is set according to actual needs, which is not limited in the embodiment.

[0082] On the basis of the above-mentioned embodiment, the application further provides a soldering assembly, which will be introduced below.

[0083] Specifically, please continue to refer to Figure 2 The soldering assembly provided in the embodiment includes the first soldered part 2, the second soldered part 3, and any composite solder preform 1 provided in the first aspect of the application, wherein,

[0084] The composite solder preform 1 is arranged between the first soldered part 2 and the second soldered part 3 to form a support space between the first soldered part 2 and the second soldered part 3 during soldering, so that the first soldered part 2 and the second soldered part 3 always remain parallel during soldering, and the molten solder preform 12 forms a uniform-thickness bonding layer between the first soldered part 2 and the second soldered part 3 by filling the support space, so as to weld the first soldered part 2 and the second soldered part 3 together through the bonding layer.

[0085] The welding assembly can be a welding assembly for different purposes, which can have different shapes to meet different application requirements, and is not limited in the embodiment.

[0086] The welding assembly provided in the embodiment can provide a support space for the first welding member and the second welding member during welding by placing the composite solder preform between the first welding member and the second welding member, so that the first welding member and the second welding member can always keep a balanced state, thereby ensuring that the welding parts of the two welding members are uniformly stressed during welding, and the strength and reliability of the welding can be enhanced; when the temperature rises during welding, the molten solder preform fills the support space formed by the polymer support structure to form a uniform-thickness bonding layer between the first welding member and the second welding member, which can firmly connect the two welding members together, so that the uniform-thickness bonding layer can ensure that the strength of each welding part is consistent, thereby improving the overall stability and durability of the welded structure.

[0087] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A composite solder preform, characterized by, The composite solder preform is used for welding a first soldering member and a second soldering member; the composite solder preform comprises a polymer support structure and a solder preform; the polymer support structure surrounds the solder preform; wherein, The melting point of the polymer support structure is greater than the melting point of the solder preform, and the polymer support structure has a specified thickness; wherein, during welding of the first soldering member and the second soldering member, the composite solder preform is accommodated between the first soldering member and the second soldering member, the polymer support structure is used to form a support space between the first soldering member and the second soldering member during welding, so that the first soldering member and the second soldering member always remain parallel during welding, and the molten solder preform forms a uniform-thickness bonding layer between the first soldering member and the second soldering member by filling the support space, so as to weld the first soldering member and the second soldering member together through the bonding layer; The polymer support structure is made of any one of the following materials: polyphenylene sulfide, polyether ether ketone, silicon resin, perfluoroalkoxy polymer, polyformaldehyde, polypropylene and polyethylene terephthalate.

2. The composite solder preform of claim 1, wherein, The polymer support structure is a frame structure fixed in the circumferential direction of the solder preform; wherein, The thickness of the frame structure is greater than the thickness of the solder preform, or the thickness of the frame structure is less than the thickness of the solder preform, or the thickness of the frame structure is equal to the thickness of the solder preform.

3. The composite solder preform of claim 2, wherein, The frame structure is a closed frame, or the frame structure is composed of a plurality of sub-support structures uniformly distributed in the circumferential direction of the solder preform.

4. The composite solder preform of claim 2 or 3, wherein, The frame structure has a groove, and the solder preform is inserted into the groove; Or, The circumferential direction of the solder preform has a groove, and the frame structure is inserted into the groove; Or, The frame structure has a groove, and the circumferential direction of the solder preform has a protrusion, which is inserted into the groove; Or, The circumferential direction of the solder preform has a groove, and the frame structure has a protrusion, which is inserted into the groove.

5. The composite solder preform of claim 1, wherein, The polymer support structure comprises a closed frame; the area of the hollow region inside the closed frame is less than the area of the solder preform, and the overall area of the closed frame is greater than the area of the solder preform; the solder preform is arranged on the closed frame in a manner covering the hollow region inside the closed frame, so that the molten solder preform flows into the hollow region during welding.

6. The composite solder preform of claim 1, wherein, The polymer support structure comprises a plurality of external support columns surrounding the solder preform; the plurality of external support columns surround the solder preform in the circumferential direction of the solder preform in a manner close to the solder preform and separated from the solder preform.

7. The composite solder preform of claim 1, wherein, The polymer support structure comprises a plurality of internal support columns arranged inside the solder preform; the plurality of internal support columns have a layout form capable of keeping the first soldering member and the second soldering member parallel.

8. The composite solder preform of claim 6 or 7, wherein, The support columns are in any one of the following shapes: circular, rectangular, cross-shaped, pentagram, L-shaped, and herringbone-shaped.

9. The composite solder preform of claim 6, wherein, The plurality of external support columns comprises at least one positioning column, and the length of the positioning column is greater than the length of the remaining external support columns. The second welding member located below has a positioning groove matching the positioning column on the side facing the first welding member; the positioning column is accommodated in the positioning groove to determine the position of the positioning column on the second welding member through the positioning groove, and the position of the composite solder preform on the second welding member is determined through the position of the positioning column on the second welding member; after the positioning column is accommodated in the positioning groove, the length of the part of the positioning column above the second welding member is equal to the length of the remaining external support columns.

10. A welding assembly characterized by, The welding assembly comprises a first welding member, a second welding member, and the composite solder preform according to any one of claims 1-9, wherein, The composite solder preform is arranged between the first welding member and the second welding member to form a support space between the first welding member and the second welding member during welding, so that the first welding member and the second welding member always remain parallel during welding, and the molten solder preform forms a uniform-thickness bonding layer between the first welding member and the second welding member by filling the support space, so that the first welding member and the second welding member are welded together through the bonding layer.

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