Grinding disc structure

Abstract

The utility model relates to a grinding disc structure which comprises a machine body, a cavity is formed in the machine body, a rotary table capable of rotating is arranged in the cavity, a grinding unit is arranged on the rotary table, the grinding unit comprises an iron plate and a soft cushion, the iron plate is arranged on the rotary table, the soft cushion is adsorbed on the iron plate, the soft cushion comprises a base material and a silica gel cushion, and the silica gel cushion is arranged on the base material. And the silica gel pad is fixed on the bottom surface of the base material and is adsorbed on the iron plate. According to the grinding disc structure, the iron plate is arranged in a magnetic attraction mode, and the soft cushion is arranged in an adsorption mode, so that the installation process is convenient and rapid, the installation efficiency of the grinding unit is greatly improved, and an operator can rapidly replace different types of soft cushions to meet the processing requirements of different semiconductor materials; due to the flexibility and convenience, the adaptability of equipment is improved, the downtime is shortened, and the production efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of grinding equipment, specifically to a grinding disc structure. BACKGROUND

[0002] The semiconductor material grinding equipment is an important tool for grinding processing of semiconductor materials (such as silicon wafer, gallium arsenide, gallium nitride, etc.), which is usually used to improve the surface quality and thickness control of the material to meet the needs of subsequent processing technology. The semiconductor material grinding equipment plays an important role in the semiconductor manufacturing process. Selecting the appropriate equipment can significantly improve the processing quality and production efficiency of the material. In the semiconductor manufacturing process, the grinding process is a key step to achieve material surface flatness and smoothness. Effective grinding not only depends on the action of mechanical force, but also is closely related to the performance of the grinding liquid.

[0003] In the prior art, the grinding disc of the grinding equipment is usually mechanically fastened on the turntable. However, in actual use, different grinding discs are required for different semiconductor materials, so the prior art installs the grinding disc by mechanical fastening, which requires a lot of time and effort in operation.

[0004] Therefore, the present application provides a grinding disc structure to solve the problem of the mechanical fastening installation of the grinding disc. SUMMARY

[0005] In view of the shortcomings of the prior art, the utility model provides a grinding disc structure, which has the advantages of convenient and fast installation of the grinding disc, and solves the problem of the mechanical fastening installation of the grinding disc.

[0006] To achieve the above purpose, the utility model provides the following technical scheme: a grinding disc structure, comprising a machine body, a cavity is formed in the machine body, a rotatable turntable is arranged in the cavity, a grinding unit is arranged on the turntable, the grinding unit comprises an iron plate and a soft pad, the iron plate is arranged on the turntable, the soft pad is adsorbed on the iron plate, the soft pad comprises a base material and a silica gel pad, the silica gel pad is fixed on the bottom surface of the base material, and the silica gel pad is adsorbed on the iron plate.

[0007] Preferably, the turntable comprises a base and a magnetic block, the base rotates in the cavity through a driving member, the magnetic block is fixed on the top surface of the base, and the iron plate is magnetically attracted to the magnetic block.

[0008] Preferably, the top surface of the iron plate is formed with a smooth surface, and the silica gel pad is adsorbed on the smooth surface.

[0009] Preferably, the top surface of the substrate is provided with a grinding layer, the top surface of the substrate is equidistantly provided with a plurality of grooves for accommodating grinding liquid, the plurality of grooves are distributed in the warp and weft directions, and four adjacent grooves enclose a grinding area on the soft pad.

[0010] Preferably, the depth of the grooves is one third of the height of the soft pad, and the length of the plurality of grooves gradually decreases outward from the center of the soft pad.

[0011] Compared with the prior art, the technical scheme has the following beneficial effects:

[0012] 1. The grinding disc structure is provided with an iron plate in a magnetic attraction mode and a soft pad in an adsorption mode, so that the installation process is convenient and fast, the installation efficiency of the grinding unit is greatly improved, the operator can quickly replace different types of soft pads to adapt to different semiconductor material processing requirements, the flexibility and convenience improve the adaptability of the equipment, reduce downtime, and improve production efficiency.

[0013] 2. The grinding disc structure is provided with grooves distributed in the warp and weft directions on the soft pad, which can more uniformly accommodate and distribute the grinding liquid, the uniform lubrication effect reduces the local dry grinding phenomenon, and ensures uniform penetration of the liquid in the entire grinding area. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a three-dimensional structure schematic diagram of the utility model;

[0015] Figure 2 It is a split structure schematic diagram of the transfer table and the iron plate in the utility model;

[0016] Figure 3 It is a connection structure schematic diagram of the base and the magnetic block in the utility model;

[0017] Figure 4 It is a sectional structure schematic diagram of the soft pad in the utility model;

[0018] Figure 5 It is the utility model Figure 2 A structure enlarged schematic diagram in the utility model;

[0019] Among them, the reference signs are: 100, machine body; 110, cavity; 200, grinding unit; 210, iron plate; 220, soft pad; 221, groove; 222, grinding area; 223, silica gel pad; 224, substrate; 225, grinding layer; 300, rotary table; 310, base; 320, magnetic block; 400, driving assembly; 500, rotary disc. DETAILED DESCRIPTION

[0020] With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described, obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application.

[0021] Embodiment 1

[0022] Please refer to Figures 1-5 The grinding disc structure in the embodiment comprises a machine body 100, a cavity 110 is formed in the machine body 100, a rotatable rotating table 300 is arranged in the cavity 110, a grinding unit 200 is arranged on the rotating table 300, the grinding unit 200 comprises an iron plate 210 and a soft pad 220, the iron plate 210 is arranged on the rotating table 300, the soft pad 220 is adsorbed on the iron plate 210, the soft pad 220 comprises a base material 224 and a silica gel pad 223, the silica gel pad 223 is fixed on the bottom surface of the base material 224, and the silica gel pad 223 is adsorbed on the iron plate 210.

[0023] In application, the iron plate 210 is first fixed on the rotating table 300, then water is sprinkled on the top surface of the iron plate 210, the soft pad 220 is then attached to the iron plate 210 and laid flat, and finally the soft pad 220 is extruded to expel air between the soft pad 220 and the iron plate 210, so as to improve the adsorption effect; during the attachment process, the silica gel pad 223 is in contact with the iron plate 210, the contact surface of the silica gel pad 223 will form a certain interfacial tension due to the presence of moisture, thereby enhancing the contact area with the iron plate 210 and improving the adhesion; the soft pad 220 is installed conveniently and quickly through the above-mentioned mode, so that the grinding equipment can more conveniently replace different soft pads 220 when grinding different semiconductor materials, thereby improving the adaptability and meeting different grinding requirements, and the installation efficiency is improved compared with the traditional mechanical fastening installation mode.

[0024] In a specific embodiment, please refer to Figures 2-4The turntable 300 in the embodiment includes a base table 310 and magnetic blocks 320. The base table 310 rotates in the cavity 110 by a driving member. The magnetic blocks 320 are fixed on the top surface of the base table 310. The iron plate 210 is magnetically attracted to the magnetic blocks 320. The top surface of the iron plate 210 is formed with a smooth surface. The silica gel pad 223 is adsorbed on the smooth surface. When the iron plate 210 is connected to the turntable 300, the magnetic blocks 320 are magnetically attracted to the iron plate 210, so that the iron plate 210 is fixed on the turntable 300. The installation efficiency is further improved. The smooth surface of the iron plate 210 in contact with the silica gel pad 223 can provide a more uniform and continuous contact surface, so that the contact area between the silica gel pad 223 and the iron plate 210 is increased, thereby improving the adsorption force. The smooth surface reduces the influence of the micro concave-convex structure, so that the silica gel pad 223 can better fit the surface of the iron plate 210, thereby enhancing the adhesion.

[0025] Specifically, the machine body 100 is provided with a driving assembly 400 and a rotating disc 500, which are used to cooperate with the grinding unit 200 to grind the semiconductor material.

[0026] Embodiment 3

[0027] The basic content is the same as that in Embodiment 1, except that:

[0028] Please refer to Figures 4-5 In the embodiment, the top surface of the base material 224 is provided with a grinding layer 225. The top surface of the base material 224 is provided with a plurality of grooves 221 at equal intervals. The grooves 221 are used to accommodate grinding liquid. The plurality of grooves 221 are distributed in the warp and weft directions. Four adjacent grooves 221 form a grinding area 222 on the soft pad 220. The depth of the groove 221 is one third of the height of the soft pad 220. The length of the plurality of grooves 221 gradually decreases along the center of the soft pad 220.

[0029] In use, after the soft pad 220 is installed, the grinding liquid and the semiconductor material are delivered to the soft pad 220, the grinding liquid is contained in the grooves 221, the semiconductor material is located on the soft pad 220, and then the grinding work can be carried out, and the semiconductor material is ground under the cooperation of the grinding area 222 and the grinding layer 225; in the grinding process, the uniformly distributed grooves 221 can more evenly contain and distribute the grinding liquid, ensure that the liquid can be uniformly infiltrated in the whole grinding area 222, and this uniformity helps to reduce the local dry grinding phenomenon and improve the overall lubrication effect, at the same time, the uniformly distributed grooves 221 can also increase the contact area between the grinding soft pad 220 and the workpiece, and then improve the uniformity of the application of the grinding force, and the increase of the contact area helps to improve the grinding efficiency and the machining quality, and the grooves 221 with the depth of one third of the height of the soft pad 220 can ensure the lubrication effect and protect the grinding effect, avoid the excessive wear and the heat accumulation due to the too shallow depth of the grooves 221, and affect the grinding effect, and avoid the reduction of the uniformity of the application of the grinding force due to the too deep depth.

[0030] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the present application.

Claims

1. A grinding disc structure comprising a body (100), characterized in that: The body (100) is internally formed with a cavity (110), the cavity (110) is provided with a rotatable turntable (300), the turntable (300) is provided with a grinding unit (200), the grinding unit (200) comprises an iron plate (210) and a soft pad (220), the iron plate (210) is arranged on the turntable (300), the soft pad (220) is adsorbed on the iron plate (210), the soft pad (220) comprises a base material (224) and a silica gel pad (223), the silica gel pad (223) is fixed on the bottom surface of the base material (224), and the silica gel pad (223) is adsorbed on the iron plate (210).

2. The abrasive disc structure of claim 1 wherein: The turntable (300) comprises a base (310) and a magnetic block (320), the base (310) rotates in the cavity (110) through a driving piece, and the magnetic block (320) is fixed on the top surface of the base (310); the iron plate (210) and the magnetic block (320) are magnetically attracted.

3. The abrasive disc structure of claim 2 wherein: The top surface of the iron plate (210) is formed with a smooth surface, and the silica gel pad (223) is adsorbed on the smooth surface.

4. The abrasive disc structure of claim 1 wherein: The top surface of the base material (224) is provided with a grinding layer (225), the top surface of the base material (224) is provided with a plurality of grooves (221) at equal intervals, the grooves (221) are used for containing grinding liquid, a plurality of the grooves (221) are distributed in warp and weft, and four adjacent grooves (221) circumscribe the grinding area (222) on the soft pad (220).

5. The abrasive disc structure of claim 4 wherein: The depth of the groove (221) is one third of the height of the soft pad (220), and the length of a plurality of the grooves (221) gradually decreases outward along the center of the soft pad (220).

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