Heat-conducting adhesive film sticking machine

Abstract

The utility model relates to a heat-conducting adhesive film sticking machine, and belongs to the technical field of film sticking. The device comprises a shell which is provided with sliding grooves formed in the two sides; the movable plate is movably arranged in the sliding groove and can be used for placing an object to be subjected to film pasting; the positioning assemblies are arranged on the two sides of the movable plate and used for limiting the object to be subjected to film pasting; the heating plate is installed on one side of the shell and used for heating an object to be subjected to film pasting; the roller is movably installed on the shell and can assist in attaching the adhesive film to the surface of an object to be pasted with the film. According to the heat-conducting adhesive film sticking machine provided by the utility model, a plurality of components such as the movable rod, the transverse plate and the spring are matched, so that the pressing rod is propped against a plastic sheet, the plastic sheet is limited and fixed, the plastic sheet and a wafer are prevented from moving in a film sticking process, and the film sticking quality is ensured.

Description

TECHNICAL FIELD

[0001] The utility model relates to a film pasting technical field, especially a kind of heat-conducting adhesive film pasting machine. BACKGROUND

[0002] Heat-conducting adhesive film pasting machine is a kind of automation equipment specially used for accurately pasting heat-conducting adhesive film to product surface, it is widely applied to electronic, semiconductor, photoelectricity etc., especially in the occasion needing to efficiently and accurately apply heat-conducting material to improve product heat dissipation performance, for example, wafer can be pasted by pasting machine, can protect its surface from pollution, oxidation or other damage, or endow it with specific function (such as improving optical property, enhancing electronic performance etc.), a layer of film will be attached to its surface.

[0003] When pasting film to wafer, wafer is placed on plastic sheet, then plastic sheet is placed on stage, stage is moved to drive wafer to approach roller on one side, one end of a film can be manually placed on plastic sheet on the side close to roller, stage is also moved to move film, film is gradually attached to wafer surface in the process of moving due to the pressure of roller, in actual operation, plastic sheet can be fixed on stage by vacuum adsorption, but this will increase considerable cost, usually plastic sheet can be moved along the surface of stage, so that stage drives plastic sheet and wafer to move to the direction close to roller, and plastic sheet moves relative to stage in the process of making film attached to wafer surface, thereby driving wafer to move, so as to affect wafer pasting. UTILITY MODEL CONTENTS

[0004] Therefore, it is necessary to provide a kind of heat-conducting adhesive film pasting machine for the above technical problems.

[0005] The utility model provides a kind of heat-conducting adhesive film pasting machine, including:

[0006] Shell, with the chute being arranged at both sides;

[0007] Movable plate, movably arranged in the chute, can be used to place the article to be pasted;

[0008] Positioning assembly, arranged at both sides of the movable plate, for limiting the article to be pasted;

[0009] Heating plate, installed on one side of the shell, for heating the article to be pasted;

[0010] Roller, movably installed on the shell, can assist the film to be attached to the surface of the article to be pasted.

[0011] In one embodiment, the positioning component includes a positioning plate, which is fixedly connected to the movable plate. The positioning plate has a slot, and a horizontal plate is movably disposed in the slot. A movable rod is fixedly disposed on the top of the horizontal plate, and the end of the movable rod away from the horizontal plate moves through the top of the positioning plate. A plurality of springs are fixedly disposed between the horizontal plate and the top of the slot, and a pressure rod is fixedly disposed on the bottom of the horizontal plate.

[0012] In one embodiment, a limiting plate is fixedly provided on one side of the roller in the housing, and notches are symmetrically opened on both sides of the limiting plate. The end of the movable rod away from the horizontal plate is movably abutted against the notch.

[0013] In one embodiment, a vertical groove is provided on one of the limiting plates, the vertical groove passing through the limiting plate and one side of the housing, a lifting plate is movably arranged in the vertical groove, a scraper is fixedly provided at one end of the lifting plate, and the scraper movably abuts against the object to be covered with film.

[0014] In one embodiment, the housing has a movable groove above one of the sliding grooves, and the movable grooves are interconnected. A fixed plate is fixedly installed on the top of one side of the movable plate, and the fixed plate is slidably connected to the movable groove. A limiting groove is opened on the fixed plate, and the limiting groove consists of inclined grooves on both sides and a straight groove in the middle. The end of the lifting plate away from the scraper is located in the vertical groove opened in the housing, and a limiting rod is fixedly installed at its end. The limiting rod is slidably connected to the limiting groove.

[0015] In one embodiment, the scraper is positioned between the two notches.

[0016] The aforementioned thermal conductive adhesive film applicator uses the cooperation of multiple components such as a movable rod, a horizontal plate, and a spring to achieve the contact between the pressure rod and the plastic sheet, thereby limiting and fixing the plastic sheet and ensuring that the plastic sheet and the wafer will not move during the application process, thus ensuring the quality of the application. The scraper can further make the adhesive film adhere more tightly to the wafer. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 forFigure 1 Enlarged view of part A;

[0020] Figure 3 Structure diagram of the positioning assembly in the utility model;

[0021] Figure 4 Structure diagram of another view of the utility model as a whole;

[0022] Figure 5 Figure 4 Enlarged view of part B;

[0023] Figure 6 Position relationship diagram of the limiting groove and the limiting rod in the utility model.

[0024] Reference signs:

[0025] 1, shell; 101, sliding groove; 102, moving groove; 2, movable plate; 3, positioning assembly; 31, positioning plate; 32, notch; 33, horizontal plate; 34, movable rod; 35, spring; 36, pressing rod; 4, heating plate; 5, roller; 6, limiting plate; 61, notch; 62, vertical groove; 7, lifting plate; 8, scraper; 9, fixed plate; 91, limiting groove; 10, limiting rod. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely explained in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0027] It should be noted that when a component is referred to as "fixed to" or "disposed on" another component, it can be directly on the other component or there can be a middle component. When a component is referred to as "connected to" another component, it can be directly connected to the other component or there can be a middle component. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the specification of the utility model are only for the purpose of illustration, and do not indicate the only implementation.

[0028] ​In addition, the terms "first", "second", "third", etc. are used only for descriptive purposes and are not to be construed as indicating or implying relative importance or an ordered ranking of the indicated technical features. Thus, features defined with "first", "second" or "third" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified.

[0029] In the present application, unless otherwise explicitly specified and limited, the "upper", "lower", "above", "over" and "on" of the first feature to the second feature can be that the first feature directly contacts the second feature, or the first feature indirectly contacts the second feature through an intermediate medium. Moreover, the "upper", "above" and "on" of the first feature to the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The "lower", "below" and "under" of the first feature to the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0030] Unless otherwise defined, all technical and scientific terms used in the specification of the present application have the same meaning as commonly understood by a person skilled in the art to which the present application belongs. The terms used in the specification of the present application are only for the purpose of describing the specific embodiments, and are not intended to limit the present application. The term "and / or" used in the specification of the present application includes any and all combinations of one or more related listed items.

[0031] The present application will be described below in conjunction with Figures 1-6 A heat-conducting adhesive film laminating machine is described in the present application, comprising:

[0032] The shell 1 has a chute 101 arranged on both sides;

[0033] The movable plate 2 is movably arranged in the chute 101 and can be used to place the object to be laminated;

[0034] The positioning assembly 3 is arranged on both sides of the movable plate 2 and is used to limit the object to be laminated;

[0035] The heating plate 4 is installed on one side of the shell 1 and is used to heat the object to be laminated;

[0036] The roller 5 is movably installed on the shell 1 and can assist in attaching the adhesive film to the surface of the object to be laminated.

[0037] Specifically, the plastic sheet and the wafer are placed on the heating plate 4 together for heating for a period of time, so that the wafer and the plastic sheet can be better attached to each other, then the plastic sheet is placed at the center of the movable plate 2, the wafer is placed on the plastic sheet, the roller 5 is started, the movable plate 2 is moved along the sliding groove 101, the movable plate 2 is moved towards the roller 5, an adhesive film is placed obliquely, one end of the adhesive film is aligned with one side of the plastic sheet, and the other end will abut against the roller 5 during the movement, the adhesive film will be gradually attached to the surface of the wafer and the plastic sheet under the pressure of the roller 5 during the movement, and the wafer is covered, so that the wafer can be protected to a certain extent, the plastic sheet can be fixed and limited by the positioning assembly 3 during the movement of the movable plate 2 towards the roller 5, so that the plastic sheet will not slide during the movement, so that the adhesive film can be tightly attached to the surface of the plastic sheet and the wafer during the film attaching process, and the housing 1 provides support.

[0038] Referring to Figure 2 and Figure 3 , in this embodiment, the positioning assembly 3 comprises a positioning plate 31, the positioning plate 31 is fixedly connected with the movable plate 2, a notch 32 is formed in the positioning plate 31, a horizontal plate 33 is movably arranged in the notch 32, an active rod 34 is fixedly arranged on the top of the horizontal plate 33, the active rod 34 movably penetrates through the top of the positioning plate 31 away from the horizontal plate 33, a plurality of springs 35 are fixedly arranged between the horizontal plate 33 and the top of the notch 32, and a pressing rod 36 is fixedly arranged on the bottom of the horizontal plate 33.

[0039] Specifically, the plastic sheet and the wafer are placed on the movable plate 2, when the movable plate 2 drives the plastic sheet and the wafer to move towards the roller 5, the active rod 34 is pressed downward, the active rod 34 drives the horizontal plate 33 to move downward along the notch 32, so as to drive the pressing rod 36 to move downward, thereby pressing the two sides of the plastic sheet, and the plastic sheet can be fixed and limited, the springs 35 are stretched in this process, the state is maintained, so that the bottom of the roller 5 passes through, and the adhesive film is attached to the surface of the wafer, and the positioning plate 31 provides support for the springs 35.

[0040] Referring to Figure 2 and Figure 5 , in this embodiment, the housing 1 is fixedly provided with a limiting plate 6 on one side of the roller 5, the limiting plate 6 is axially symmetrically provided with a notch 61 on both sides, and the end of the active rod 34 away from the horizontal plate 33 movably abuts against the notch 61.

[0041] Specifically, when the movable plate 2 drives the plastic sheet and the wafer to move towards the roller 5, the top of the movable rod 34 will abut against the notch 61 on one side of the limiting plate 6 before reaching the roller 5, so that the movable rod 34 moves downward to drive the pressing rod 36 to abut against the plastic sheet for limiting, and then the movable rod 34 moves along the low part of the notch 61, in this process, the pressing rod 36 always limits the plastic sheet, and the state is maintained until the bottom of the roller 5 passes through, after the adhesive film is attached to the surface of the wafer, the movable rod 34 reaches the notch 61 on the other side of the limiting plate 6, moves from the high part to the low part of the notch 61, and under the action of the spring 35, drives the movable rod 34, the horizontal plate 33 and the pressing rod 36 to return to the initial position, so as to release the limiting and fixing of the plastic sheet, and facilitate the removal of the plastic sheet and the wafer.

[0042] Referring to Figure 5 In the embodiment, a vertical groove 62 is formed in one of the limiting plates 6, the vertical groove 62 penetrates through the limiting plate 6 and one side of the shell 1, a lifting plate 7 is movably arranged in the vertical groove 62, one end of the lifting plate 7 is fixedly provided with a scraper 8, and the scraper 8 movably abuts against the object to be attached with the film.

[0043] Specifically, when the pressing rod 36 keeps abutting against the plastic sheet and passes through the bottom of the roller 5, a part of the adhesive film covers one side of the plastic sheet and the wafer, and continues to move in the same direction, the plastic sheet covered with the adhesive film will first abut against the scraper 8, the bottom of the scraper 8 can be made of flexible material to avoid damaging the plastic sheet or the wafer, and the movement of the scraper 8 along the surface of the plastic sheet will make the adhesive film more closely attached to the plastic sheet, when the scraper 8 is about to abut against the wafer, since the wafer has a certain thickness, if the height of the scraper 8 is not adjusted, the abutment between the scraper 8 and the wafer during the movement of the wafer will cause damage to the wafer, therefore, the lifting plate 7 can be moved upward along the vertical groove 62, the upward movement of the lifting plate 7 will drive the scraper 8 to move upward, so that the bottom of the scraper 8 is attached to the top of the wafer, so as to make the adhesive film more closely attached to the wafer, when the scraper 8 no longer abuts against the wafer, the lifting plate 7 can be moved downward to the initial position, so that the scraper 8 can make the adhesive film on the other side of the wafer more closely attached to the plastic sheet.

[0044] Referring to Figures 4-6 In the embodiment, a moving groove 102 is formed in the shell 1 above one of the sliding grooves 101, the moving groove 102 and the moving groove 102 are in communication with each other, a fixed plate 9 is fixedly arranged on one side of the movable plate 2, the fixed plate 9 is slidably connected with the moving groove 102, a limiting groove 91 is formed in the fixed plate 9, the limiting groove 91 is composed of two inclined grooves on two sides and a straight groove in the middle, one end of the lifting plate 7 away from the scraper 8 is located in the vertical groove 62 formed in the shell 1 and is fixedly provided with a limiting rod 10 at the terminal end, and the limiting rod 10 is slidably connected with the limiting groove 91.

[0045] Specifically, the movable plate 2 drives the plastic sheet and the wafer to move, and also drives the fixed plate 9 to move. When the movable plate 2 passes below the roller 5, the adhesive film is attached to the surface of the wafer. Then, the fixed plate 9 moves along the moving groove 102, so that the limiting rod 10 contacts with the limiting groove 91. The limiting rod 10 moves horizontally along the low part of the inclined groove on one side. In this process, the height of the limiting rod 10 does not change, and the height of the lifting plate 7 and the scraper 8 does not change. The adhesive film on one side of the wafer is attached to the plastic sheet more tightly. With the movement of the fixed plate 9, the limiting rod 10 moves upward along the inclined groove on one side, so that the lifting plate 7 and the scraper 8 move upward. In this way, the wafer and the adhesive film can be attached tightly. The limiting rod 10 moves along the high part of the inclined groove for a distance, reaches the inclined groove on the other side, and moves downward along the inclined groove, so that the lifting plate 7 and the scraper 8 return to the initial height. The adhesive film on the other side of the wafer is attached to the plastic sheet more tightly.

[0046] Referring to Figure 5 In the embodiment, the position of the scraper 8 is located between the two gaps 61.

[0047] Specifically, when the movable rod 34 abuts against one side of the gap 61, the pressing rod 36 limits and fixes the plastic sheet. When the movable rod 34 abuts against the other side of the gap 61, the limiting effect of the pressing rod 36 on the plastic sheet is released. The scraper 8 is located between the two gaps 61, so that when the scraper 8 abuts against the wafer and the plastic sheet, the plastic sheet does not slide, and the adhesive film can be better attached to the surface of the wafer.

[0048] In implementation, first, the plastic sheet and the wafer are placed on the heating plate 4 together and heated for a period of time, so that the wafer can be better attached to the film, then the plastic sheet is placed in the center of the movable plate 2, the wafer is placed on the plastic sheet, the roller 5 is started, the movable plate 2 is moved along the sliding groove 101, the movable plate 2 is moved towards the roller 5, an adhesive film is placed obliquely, one end of the adhesive film is aligned with one side of the plastic sheet, the other end will abut against the roller 5 during movement, and the adhesive film will be gradually attached to the surface of the wafer and the plastic sheet under the pressure of the roller 5 during movement, covering the wafer, so as to protect the wafer to a certain extent, when the movable plate 2 drives the plastic sheet and the wafer to move towards the roller 5, before reaching the roller 5, the top of the movable rod 34 will abut against the notch 61 on one side of the limiting plate 6, so that the movable rod 34 moves downward to drive the pressing rod 36 to abut against and limit the plastic sheet, then the movable rod 34 moves along the low part of the notch 61, and the pressing rod 36 limits the plastic sheet at all times, maintaining this state so that the bottom of the roller 5 passes through, after the adhesive film is attached to the surface of the wafer, the movable rod 34 reaches the notch 61 on the other side of the limiting plate 6, and moves from the high part to the low part along the notch 61 on this side, and under the action of the spring 35, the movable rod 34, the horizontal plate 33 and the pressing rod 36 return to the initial position, releasing the limiting and fixing of the plastic sheet, facilitating the removal of the plastic sheet and the wafer, at the same time, the movable plate 2 drives the plastic sheet and the wafer to move, and also drives the fixed plate 9 to move, when the movable plate 2 passes through from below the roller 5, the adhesive film is attached to the surface of the wafer, then the fixed plate 9 moves along the moving groove 102 to make the limiting rod 10 contact with the limiting groove 91, the limiting rod 10 first moves horizontally along the low part of the inclined groove on one side, and the height of the limiting rod 10 does not change during this process, and the height of the lifting plate 7 and the scraper 8 does not change, so that the adhesive film on one side of the wafer is attached more tightly to the plastic sheet, with the movement of the fixed plate 9, the limiting rod 10 moves upward along the inclined groove on one side, so that the lifting plate 7 and the scraper 8 move upward, so that the wafer and the adhesive film are attached tightly, after the limiting rod 10 moves along the high part of the inclined groove for a distance, it reaches the inclined groove on the other side and moves downward along the inclined groove, so that the lifting plate 7 and the scraper 8 return to the initial height, making the adhesive film on the other side of the wafer attached more tightly to the plastic sheet.

[0049] The technical features of the above-described embodiments can be combined in any manner, and to make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist contradictions, they should be considered as the scope of the present disclosure.

[0050] The above-described embodiments only express several implementation manners of the present application, the description is relatively specific and detailed, but cannot be understood as the limitation of the scope of the present application. It should be pointed out that, for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A heat-conducting adhesive film pasting machine, characterized in that, Include: The shell has the chute set on both sides; The movable plate is movably arranged in the chute, which can be used to place the object to be pasted; The positioning assembly is arranged on both sides of the movable plate, which is used to limit the object to be pasted; The heating plate is installed on one side of the shell, which is used to heat the object to be pasted; The roller is movably installed on the shell, which can assist the adhesive film to be attached to the surface of the object to be pasted.

2. The heat-conducting adhesive film pasting machine according to claim 1, characterized in that, The positioning assembly includes a positioning plate, which is fixedly connected with the movable plate, and a notch is formed in the positioning plate, a horizontal plate is movably arranged in the notch, an activity rod is fixedly arranged on the top of the horizontal plate, the end of the activity rod away from the horizontal plate movably penetrates the top of the positioning plate, a plurality of springs are fixedly arranged between the horizontal plate and the top of the notch, and a pressing rod is fixedly arranged on the bottom of the horizontal plate.

3. The heat-conducting adhesive film pasting machine according to claim 2, characterized in that, The shell is fixedly arranged with a limiting plate on one side of the roller, and a notch is axially symmetrically formed on both sides of the limiting plate, and the end of the activity rod away from the horizontal plate movably abuts against the notch.

4. The heat-conducting adhesive film pasting machine according to claim 3, characterized in that, A vertical groove is formed in one of the limiting plates, which penetrates the limiting plate and one side of the shell, a lifting plate is movably arranged in the vertical groove, a scraper is fixedly arranged on one end of the lifting plate, and the scraper movably abuts against the object to be pasted.

5. The heat-conducting adhesive film pasting machine according to claim 4, characterized in that, The shell is arranged with a moving groove above one of the chutes, the moving groove is communicated with the moving groove, a fixed plate is fixedly arranged on one side and top of the movable plate, the fixed plate is slidably connected with the moving groove, a limiting groove is formed in the fixed plate, the limiting groove is composed of two inclined grooves on both sides and a straight groove in the middle, the end of the lifting plate away from the scraper is located in the vertical groove formed in the shell, and a limiting rod is fixedly arranged at the end of the lifting plate, the limiting rod is slidably connected with the limiting groove.

6. The heat-conducting adhesive film pasting machine according to claim 4, characterized in that, The position of the scraper is located between the two notches.

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