Electroplating bath for improving interface consistency of plating layer

Abstract

The utility model relates to the technical field of electroplating baths, in particular to an electroplating bath for improving the interface consistency of a plating layer. According to the technical scheme, a gathering hopper is arranged at the bottom end of a tank body, a blow-off pipe is arranged on the gathering hopper, a guide plate is arranged at the position, above the gathering hopper, in the tank body, an electroplating area is arranged at the position, above the guide plate, in the tank body, a partition plate is arranged at the position, above the tail end of the guide plate, in the tank body, and the interior of the tank body is divided into two parts through the partition plate; the partition plate is located in the middle inside the tank body, the tank body is provided with an overflow opening above the partition plate, and a slag discharging opening is formed between the partition plate and the guide plate. By means of the unique structure, the problem of impurity and waste residue treatment of a traditional electroplating bath is solved. When the electroplating liquid overflows, large-particle impurities are intercepted through the filter screen, and the impurities and waste residues slide down along the polishing guide plate at the angle of 30-60 degrees under the action of gravity, enter the gathering hopper through the residue discharging opening and then are discharged through the blow-off pipe. And the supporting plate outside the groove supports the guide plate, and the tool storage cavity improves the operation convenience and the coating quality.

Description

TECHNICAL FIELD

[0001] The utility model relates to electroplating tank technical field, concretely relates to a kind of electroplating tank for improving coating interface consistency. BACKGROUND

[0002] Electroplating tank is the most basic equipment in electroplating equipment, and its main function is to hold solution. The use of plating tank can be arranged in a straight line according to the process flow production line by manual operation, or arranged according to the site space by adapting to local conditions, or arranged according to the process flow by mechanical automatic production line.

[0003] According to the search, the patent with the patent publication number CN222160430U discloses an electroplating tank structure for integrated circuit manufacturing. Although the device can achieve uniform mixing of the electroplating solution circulating in the electroplating tank by setting the flow guide cylinder, rotating rod, spiral blade and filter screen, and can also filter impurities in the electrolyte, the device does not have a special collection and efficient discharge structure for impurities and waste residues generated during the electroplating process, which makes it difficult to ensure the clean environment in the electroplating tank and may affect the electroplating quality. SUMMARY

[0004] To overcome the shortcomings of the prior art, the utility model provides an electroplating tank for improving coating interface consistency, which solves the problems raised in the background art.

[0005] The utility model solves the above technical problems by the following scheme:

[0006] An electroplating tank for improving coating interface consistency includes a tank body, an accumulation hopper is arranged at the bottom end of the tank body, and a blowdown pipe is arranged in the accumulation hopper.

[0007] A guide plate is arranged above the accumulation hopper in the interior of the tank body, an electroplating area is arranged above the guide plate in the interior of the tank body, a partition plate is arranged above the end of the guide plate in the interior of the tank body, and the interior of the tank body is divided into two parts by the partition plate.

[0008] The partition plate is arranged in the middle of the interior of the tank body, an overflow port is arranged above the partition plate in the tank body, and a residue discharge port is arranged between the partition plate and the guide plate.

[0009] Based on the above technical solution, the utility model can also be improved as follows.

[0010] Further, the blowdown pipe is arranged at the lowest end of the accumulation hopper, and a groove is arranged at the lowest part of the blowdown pipe in the accumulation hopper.

[0011] The beneficial effects of the above further scheme are as follows:

[0012] The pollution discharge pipe is arranged at the lowest end of the collecting hopper, in line with the principle of gravity, so that the impurities and waste residues collected in the collecting hopper can flow to the pollution discharge pipe under the action of gravity, facilitating discharge. The groove arranged at the lowest end of the collecting hopper can further guide the impurities and waste residues into the pollution discharge pipe, reduce residual dead angles, ensure that the impurities and waste residues are discharged from the electroplating tank more completely, avoid the accumulation of pollutants in the collecting hopper, thus ensuring a clean environment in the electroplating tank, reducing adverse effects on subsequent electroplating processes, and improving electroplating quality.

[0013] Further, the outer side of the groove body is provided with a support plate between the guide plate and the collecting hopper, and the support plate supports the inclined guide plate from the outside.

[0014] The beneficial effects of the above further scheme are:

[0015] The support plate supports the inclined guide plate from the outside, which can effectively enhance the stability of the guide plate, ensure that it always maintains at a suitable inclination angle and position, and ensure that the impurities and waste residues generated during electroplating can smoothly slide down the guide plate to the residue discharge port and then enter the collecting hopper for collection, ensuring normal operation of the residue discharge function. At the same time, the tool storage cavity provided between the support plates provides a convenient tool storage space for the operator. During the electroplating operation, the operator can store commonly used small tools or accessories in this space, avoiding the inconvenience of finding tools due to random placement, improving the operator's efficiency in accessing tools, and thus improving overall work efficiency.

[0016] Further, the bottom end of the collecting hopper is provided with a support column, and the support columns are arrayed at four corners of the collecting hopper.

[0017] The beneficial effects of the above further scheme are:

[0018] The collecting hopper needs to bear the weight of the electroplating liquid, impurities and waste residues from above during electroplating, and may also be affected by external environmental factors. Arraying the support columns at the four corners of the collecting hopper can provide uniform and stable support force for the collecting hopper. This support method can keep the collecting hopper balanced and stable when bearing a large weight, prevent the collecting hopper from tilting, deforming or even being damaged due to uneven stress, ensure that the collecting hopper can normally play the function of collecting impurities and waste residues, and prolong the service life of the electroplating tank.

[0019] Further, the guide plate is arranged in an inclined manner, and the inclination angle ranges from 30° to 60°, the arrangement of the inclination angle can ensure that the impurities and waste residues generated in the electroplating process can smoothly slide along the guide plate to the residue discharge port under the action of gravity and enter the collecting hopper through the residue discharge port for collection; at the same time, the surface of the guide plate is polished, and the surface roughness Ra is not greater than 0.8 μm, so as to reduce the friction between the impurities and waste residues and the surface of the guide plate, and further improve the residue discharge efficiency.

[0020] The beneficial effects of the above further scheme are:

[0021] The guide plate is arranged at an inclination angle of 30° to 60°, which is the result of scientific consideration. This angle range can ensure that the impurities and waste residues have enough sliding power under the action of gravity, so that they can smoothly slide along the guide plate to the residue discharge port, and at the same time, the inclination angle is not too large to cause the electroplating solution to flow out quickly, affecting the normal progress of the electroplating process. At the same time, the surface of the guide plate is polished, so that the surface roughness Ra is not greater than 0.8 μm, which greatly reduces the friction between the impurities and waste residues and the surface of the guide plate. Smaller friction makes the impurities and waste residues have less resistance during sliding, and can more smoothly slide to the residue discharge port, effectively improving the residue discharge efficiency, reducing the residence time of the impurities and waste residues on the guide plate, avoiding secondary pollution of the electroplating solution, and thus ensuring the clean environment and electroplating quality in the electroplating tank.

[0022] Further, the overflow port is provided with a filter screen made of stainless steel, and the mesh diameter of the filter screen is 0.5-2 mm; the filter screen is detachably installed in the overflow port through a clamping groove structure, when the electroplating solution overflows from the overflow port to the upper side of the guide plate, the filter screen can intercept the large-particle impurities in the electroplating solution, preventing the impurities from flowing out with the electroplating solution and affecting the subsequent electroplating process.

[0023] The beneficial effects of the above further scheme are:

[0024] In the electroplating process, when the electroplating liquid level reaches a certain height, it will overflow from the overflow port. The overflowed electroplating liquid may carry some large particle impurities, if these impurities flow out with the electroplating liquid, it may have a negative impact on the subsequent electroplating process, such as affecting the quality of the plated layer, etc. A filter screen is arranged at the overflow port, and the mesh diameter is 0.5-2mm, which can effectively intercept the large particle impurities in the electroplating liquid, so that the filtered electroplating liquid flows above the guide plate, ensuring the purity of the electroplating liquid entering the subsequent link, and improving the stability and reliability of the electroplating process. The filter screen is made of stainless steel material, which has the advantages of corrosion resistance, high strength, long service life, etc., can adapt to the chemical properties of the electroplating liquid, and ensure the stable performance of the filter screen in the long-term use. And the filter screen is detachably installed in the overflow port through the clamping groove structure, which is convenient for the operator to regularly clean or replace the filter screen to maintain its filtering effect, and further ensures the normal operation of the electroplating process.

[0025] The utility model provides a kind of improve plating layer interface consistency electroplating tank.

[0026] Electroplating tank body inside is provided with the guide plate of inclination angle 30 °-60 °, can ensure that the impurities and waste residue generated in electroplating process under gravity along guide plate slide to slag discharge port, and enter collection hopper and are collected, and slagging efficiency is high.Guide plate surface is polished, and surface roughness Ra is not more than 0.8 μm, reduce the friction force of impurities and waste residue and guide plate surface, further improve slagging efficiency, it is favorable to keep the cleanness of electroplating area, reduce the influence of impurities on plating layer interface consistency.

[0027] Overflow port is equipped with the filter screen of stainless steel material, and mesh diameter is 0.5-2mm, can intercept the large particle impurities in the electroplating liquid, prevent impurities from flowing out with the electroplating liquid and affect subsequent electroplating process, help to improve electroplating quality, ensure the consistency of plating layer interface.Filter screen is detachably installed by clamping groove structure, and it is convenient to regularly clean and replace, guarantee the stability of filtering effect.

[0028] Supporting plate is arranged between guide plate and collection hopper outside the tank body, can support inclined guide plate from outside, enhance the stability of guide plate, ensure that it can maintain correct inclination angle and position in long-term use, continuously and effectively play the role of slagging.

[0029] The bottom end of the tank body is provided with a collection hopper, and the bottom end of the collection hopper is provided with a blowdown pipe, and the blowdown pipe is located at the lowest part of the collection hopper, which facilitates the discharge of the collected impurities and waste residues and other pollutants from the electroplating tank, and maintains the cleanliness of the electroplating tank. The blowdown pipe located at the lowest part of the collection hopper is also provided with a groove, which further optimizes the blowdown function and is conducive to completely discharging the impurities and waste residues to prevent residue.

[0030] The tool storage cavities are arranged between the support plates and can be used to store some small tools or accessories required in the electroplating process, so as to facilitate the operator to take and use the tools, improve the work efficiency, and make the electroplating tank have the function of tool storage, and space is reasonably utilized. BRIEF DESCRIPTION OF DRAWINGS

[0031] The accompanying drawings, which are included to provide a further understanding of the present application and constitute a part of this application, illustrate the illustrative embodiments of the present application and together with the general description of the present application given above and the detailed description of the present application given below, serve to explain the present application.

[0032] In the drawings:

[0033] Fig. 1 is a front appearance schematic view of the present application;

[0034] Fig. 2 is a rear appearance schematic view of the present application;

[0035] Fig. 3 is a sectional structure schematic view of the present application.

[0036] In the drawings, the component list represented by each reference sign is as follows:

[0037] 1, tank body; 2, partition plate; 201, overflow port; 202, deslagging port; 3, guide plate; 4, support plate; 401, tool storage cavity; 5, blowdown pipe; 501, groove; 6, collecting hopper; 7, support column. DETAILED DESCRIPTION

[0038] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0039] Please refer to Figs. 1-3 The embodiments provided by the present application are as follows:

[0040] Embodiment one

[0041] The application discloses an electroplating tank capable of improving the interface consistency of a plating layer, which comprises a tank body 1, wherein the bottom end of the tank body 1 is provided with a collecting hopper 6, the bottom end of the collecting hopper 6 is provided with supporting columns 7, the supporting columns 7 are arrayed at four corners of the collecting hopper 6, and the collecting hopper 6 needs to bear the weight of electroplating liquid, impurities and waste residues from above during the electroplating process and may be affected by external environmental factors. The supporting columns 7 are arrayed at the four corners of the collecting hopper 6, so that uniform and stable supporting force can be provided for the collecting hopper 6. The supporting mode can make the collecting hopper 6 keep balance and stability when bearing a large weight, prevent the collecting hopper 6 from tilting, deforming or even being damaged due to uneven force, ensure that the collecting hopper 6 can normally play the function of collecting impurities and waste residues, prolong the service life of the electroplating tank, the collecting hopper 6 is provided with a sewage discharge pipe 5, the sewage discharge pipe 5 is located at the lowest end of the collecting hopper 6, and the lowest end of the sewage discharge pipe 5 located at the lowest part of the collecting hopper 6 is provided with a groove 501, the sewage discharge pipe 5 is arranged at the lowest end of the collecting hopper 6, which conforms to the principle of gravity, so that the impurities and waste residues accumulated in the collecting hopper 6 can flow to the sewage discharge pipe 5 under the action of gravity, and the impurities and waste residues can be conveniently discharged. The groove 501 arranged at the lowest part of the sewage discharge pipe 5 located at the lowest part of the collecting hopper 6 can further guide the impurities and waste residues into the sewage discharge pipe 5, reduce residual dead angles, ensure that the impurities and waste residues are more completely discharged from the electroplating tank, avoid the accumulation of pollutants in the collecting hopper 6, so as to ensure the clean environment in the electroplating tank, reduce the adverse effect on the subsequent electroplating process, improve the electroplating quality, the inside of the tank body 1 located above the collecting hopper 6 is provided with a guide plate 3, the guide plate 3 is arranged in an inclined mode, and the inclination angle ranges from 30 DEG to 60 DEG. The inclination angle can ensure that the impurities and waste residues generated during the electroplating process can smoothly slide to the residue discharge port 202 along the guide plate 3 under the action of gravity and then enter the collecting hopper 6 through the residue discharge port 202 to be collected. Meanwhile, the surface of the guide plate 3 is subjected to polishing treatment, and the surface roughness Ra is not greater than 0.8 microns, so as to reduce the friction force between the impurities and waste residues and the surface of the guide plate 3 and further improve the residue discharge efficiency. The guide plate 3 is arranged at an inclination angle ranging from 30 DEG to 60 DEG, which is the result of scientific consideration. The angle range can ensure that the impurities and waste residues have enough sliding power under the action of gravity, so that the impurities and waste residues can smoothly slide to the residue discharge port 202 along the guide plate 3, and the electroplating liquid will not be quickly lost due to the too large inclination angle, so as to ensure the normal progress of the electroplating process. Meanwhile, the surface of the guide plate 3 is subjected to polishing treatment, so that the surface roughness Ra is not greater than 0.8 microns, and the friction force between the impurities and waste residues and the surface of the guide plate 3 is greatly reduced.The smaller friction makes the impurities and waste residues less hindered in the sliding process, and can more smoothly slide to the slag outlet 202, effectively improving the slagging efficiency, reducing the residence time of impurities and waste residues on the guide plate 3, avoiding secondary pollution to the electroplating solution, thereby ensuring the clean environment and electroplating quality in the electroplating tank. The inside of the tank body 1 above the guide plate 3 is the electroplating area. A partition plate 2 is arranged above the end of the guide plate 3 in the tank body 1. The inside of the tank body 1 is divided into two parts by the partition plate 2. A support plate 4 is arranged between the guide plate 3 and the collecting hopper 6 on the outside of the tank body 1. The support plate 4 supports the inclined guide plate 3 from the outside. Tool storage cavities 401 are arranged between the support plates 4. The support plate 4 supports the inclined guide plate 3 from the outside, which can effectively enhance the stability of the guide plate 3, ensure that it always maintains at a suitable inclination angle and position, and ensure that the impurities and waste residues generated during electroplating can smoothly slide along the guide plate 3 to the slag outlet 202, and then enter the collecting hopper 6 for collection, ensuring the normal operation of the slagging function. At the same time, the tool storage cavities 401 arranged between the support plates 4 provide a convenient tool storage space for the operator. During the electroplating operation, the operator can store commonly used small tools or accessories here, avoiding the inconvenience of finding due to random placement of tools, improving the efficiency of the operator in using tools, and thus improving the overall work efficiency.

[0042] Example two

[0043] In order to facilitate the centralized treatment of waste residues generated during electroplating, for example, Figs. 1-3As shown, the utility model further includes: the baffle 2 is located in the middle part of the inside of groove 1, the overflow port 201 is equipped with the filter screen at the overflow port 201 of the baffle 2, the filter screen is made of stainless steel material, the mesh diameter is 0.5-2mm, the filter screen is detachably installed in the overflow port 201 through the clamping groove structure, when the electroplating solution overflows from the overflow port 201 to the upper of the guide plate 3, the filter screen can intercept the large particle impurities in the electroplating solution, prevents the impurities from flowing out with the electroplating solution and influences the subsequent electroplating process, when the electroplating solution level reaches a certain height in the electroplating process, will overflow from the overflow port 201. The electroplating solution that overflows may carry some large particle impurities, if these impurities flow out with the electroplating solution, can have negative influence on the subsequent electroplating process, for example, influences the quality of plating layer etc. The filter screen is arranged at the overflow port 201, and the mesh diameter is 0.5-2mm, can effectively intercept the large particle impurities in the electroplating solution, makes the electroplating solution that filters flows to the upper of the guide plate 3, guarantees the purity of the electroplating solution that enters subsequent link, improves the stability and reliability of the electroplating process. The filter screen is made of stainless steel material, has the advantages such as corrosion resistance, high strength, long service life etc., can adapt to the chemical nature of the electroplating solution, guarantees the stable performance of the filter screen in the long-term use. And the filter screen is detachably installed in the overflow port 201 through the clamping groove structure, facilitates the regular cleaning or replacement of the filter screen by the operator, to maintain its filtering effect, further guarantees the normal progress of the electroplating process, the baffle 2 and the guide plate 3 are equipped with the residue discharge port 202.

[0044] Working principle:

[0045] When electroplating, the electroplating solution works in the electroplating area of the inside of groove 1 above the guide plate 3, provides the electroplating environment for the plating object. When the electroplating solution level reaches a certain height, will overflow from the overflow port 201. At this time, the stainless steel filter screen at the overflow port 201 plays a role, the mesh diameter is 0.5-2mm, can intercept the large particle impurities in the electroplating solution, makes the electroplating solution that filters flows to the upper of the guide plate 3.

[0046] The guide plate 3 is arranged in 30°-60° inclination, the impurities and waste residue generated in the electroplating process will slide down along the guide plate 3 under the action of gravity. The surface of the guide plate 3 is polished, and the surface roughness Ra is not greater than 0.8 μm, which makes the friction between the impurities and waste residue and the surface of the guide plate 3 very small, can slide down more smoothly, improves the residue discharge efficiency. The residue discharge port 202 is arranged between the guide plate 3 and the baffle 2, and the impurities and waste residue enter the collecting hopper 6 through the residue discharge port 202.

[0047] The support plates 4 between the guide plates 3 and the collecting hopper 6 on the outside of the tank body 1 support the inclined guide plates 3 from the outside, ensure that the guide plates 3 maintain a stable inclination angle and position during long-term use, and ensure that the functions of slag discharge and the like are normally performed. The collecting hopper 6 is provided with a drain pipe 5 at the bottom end, and the drain pipe 5 at the lowest part of the collecting hopper 6 can discharge the collected impurities and waste slag and other pollutants out of the electroplating tank. The grooves 501 on the drain pipe 5 are beneficial to more completely discharge the impurities and waste slag and prevent residues. The tool storage cavities 401 provided between the support plates 4 can be used to store small tools or accessories used in the electroplating process, provide convenient tool storage space, facilitate the operator to take the tools, and improve the work efficiency.

[0048] The basic principle and main features of the utility model and the advantages of the utility model are shown and described above, and it is obvious for those skilled in the art that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be realized in other specific forms without departing from the spirit or basic features of the utility model. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the utility model is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the utility model. Any reference signs in the claims should not be regarded as limiting the claims involved.

[0049] In addition, it should be understood that although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description manner of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

Claims

1. An electroplating tank for improving plating layer interface consistency, comprising a tank body (1), wherein a collecting hopper (6) is arranged at the bottom end of the tank body (1), and a sewage pipe (5) is arranged on the collecting hopper (6), characterized in that: a guide plate (3) is arranged above the collecting hopper (6) in the interior of the tank body (1), the electroplating area is arranged above the guide plate (3) in the interior of the tank body (1), a partition plate (2) is arranged above the end of the guide plate (3) in the tank body (1), and the interior of the tank body (1) is divided into two parts by the partition plate (2); the partition plate (2) is arranged at the middle part of the interior of the tank body (1), an overflow port (201) is arranged above the partition plate (2) in the tank body (1), and a residue discharging port (202) is arranged between the partition plate (2) and the guide plate (3). The sewage pipe (5) is arranged at the lowest end of the collecting hopper (6), and a groove (501) is arranged at the lowest part of the sewage pipe (5) in the collecting hopper (6). Support plates (4) are arranged between the guide plate (3) and the collecting hopper (6) on the outside of the tank body (1), the support plates (4) support the inclined guide plate (3) from the outside, and tool storage cavities (401) are arranged between the support plates (4).

2. The electroplating cell of claim 1, wherein: Support columns (7) are arranged at the four corners of the collecting hopper (6) at the bottom end of the collecting hopper (6).

3. The electroplating cell of claim 1, wherein: The guide plate (3) is arranged in an inclined manner, and the inclination angle ranges from 30° to 60°, which can ensure that the impurities and waste residues generated in the electroplating process smoothly slide along the guide plate (3) under the action of gravity to the residue discharging port (202) and then enter the collecting hopper (6) through the residue discharging port (202) for collection; meanwhile, the surface of the guide plate (3) is polished, and the surface roughness Ra is not greater than 0.8 μm, so as to reduce the friction between the impurities and waste residues and the surface of the guide plate (3) and further improve the residue discharging efficiency.

4. The electroplating cell of claim 1, wherein: A filter screen made of stainless steel is arranged at the overflow port (201), the mesh diameter of the filter screen is 0.5-2 mm, and the filter screen is detachably installed in the overflow port (201) through a clamping groove structure; when the electroplating solution overflows from the overflow port (201) to the upper part of the guide plate (3), the filter screen can intercept large-particle impurities in the electroplating solution, so as to prevent the impurities from flowing out with the electroplating solution and affecting the subsequent electroplating process.

5. The plating bath of claim 1, wherein: ​ 6. The electroplating cell of claim 1, wherein: ​

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