Gas adsorption type chip test fixture
By designing a closed negative pressure adsorption structure for a gas adsorption chip testing fixture, the problem of poor adsorption stability of large-size chips in multi-channel and multi-station testing was solved, achieving stable adsorption and efficient testing.
Patent Information
- Application Number
- CN202520032756.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-07
AI Technical Summary
In the existing technology, as the chip size increases and the number of contact points increases, the traditionally configured micro-sized suction nozzles cannot guarantee the stable adsorption of the chip. This results in poor adsorption stability during multi-channel and multi-station testing, which can easily lead to chip falling off or jamming, affecting testing efficiency and chip damage.
A gas adsorption-type chip testing fixture was designed, which adopts a closed negative pressure adsorption structure composed of a limiting needle carrier, a sealing needle carrier, a foam sealing ring, and a spring probe. The sealing needle carrier and the limiting needle carrier cooperate to form a closed negative pressure adsorption structure, and the foam sealing ring and the chip are used to establish a stable adsorption effect, thus overcoming the problem of insufficient vacuum.
It significantly improves the chip adsorption performance, ensures the stability of multi-channel and multi-station testing, avoids chip falling and jamming, and improves testing efficiency and chip safety.
Smart Images
Figure CN223857246U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor packaging technical field, specifically, relate to a kind of air suction formula chip test fixture. BACKGROUND
[0002] At present, in the testing process of stacked chip, rubber suction nozzle is generally used to perform suction, displacement and shifting operation on chip, when the upper surface area of chip is large enough, rubber suction nozzle can guarantee sufficient vacuum degree by suction, so that chip can be stably adsorbed, thereby meeting the chip testing demand of multiple air ducts and multiple stations.
[0003] However, with the continuous increase of chip size design, the contact point increases, which leads to the gradual increase of chip weight, at the same time, the adsorption area reserved on the upper surface of chip gradually decreases, and the air duct in the corresponding test fixture is also more narrow. Under this condition, only the small suction nozzle of traditional configuration cannot guarantee the stable adsorption of chip, which leads to the situation that chip cannot be sucked up, chip falls off or chip is clamped and edge collapses due to adsorption inclination often occurs in actual testing operation. Generally, normal adsorption testing can be maintained to a certain extent during single-channel adsorption, but the above-mentioned low adsorption stability problem often occurs during the cooperative multiple air duct and multiple station testing. SUMMARY
[0004] Therefore, the utility model provides a kind of air suction formula chip test fixture to solve the poor adsorption stability of chip testing in prior art, which leads to the problems of affecting testing efficiency and easily damaging chip.
[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0006] A kind of air suction formula chip test fixture, comprising:
[0007] Limiting needle carrier, provided with negative pressure aggregation channel;
[0008] Covered needle carrier, provided with suction port, and the covered needle carrier is matched with the limiting needle carrier to form closed negative pressure adsorption structure, the suction port and the negative pressure aggregation channel are connected through the closed negative pressure adsorption structure;
[0009] Foam sealing ring, fixedly connected to the limiting needle carrier, and the foam sealing ring is peripherally arranged on the outer side of the negative pressure aggregation channel;
[0010] Spring probe, based on the covered needle carrier, extends through the protrusion of the limiting needle carrier, and the protruding part of the limiting needle carrier is located on the inner side of the foam sealing ring. Based on the above technical scheme, the utility model is further described as follows:
[0011] As a further scheme of the utility model,
[0012] The limiting needle loading carrier comprises a limiting main body;
[0013] The negative pressure gathering channel is arranged at the center position of the limiting main body.
[0014] As a further scheme of the utility model,
[0015] The seal cover needle loading carrier comprises a seal cover main body;
[0016] The seal cover main body is arranged as a cover structure with a single opening, and the outer edge part of the opening side of the seal cover main body is detachably and fixedly connected with the outer edge part of the limiting main body.
[0017] The air extraction port is arranged at the side of the seal cover main body opposite to the opening, and the air extraction port is connected with the negative pressure gathering channel.
[0018] As a further scheme of the utility model,
[0019] The seal cover needle loading carrier further comprises an air guide channel arranged in the seal cover main body;
[0020] The air guide channel is arranged at the side position of the air extraction port, and the two ends of the air guide channel are respectively and correspondingly connected with the air extraction port and the negative pressure gathering channel.
[0021] As a further scheme of the utility model,
[0022] The limiting needle loading carrier further comprises a needle measuring channel;
[0023] The needle measuring channel is arranged in groups, and the groups of the needle measuring channel are evenly arranged in the limiting main body, and the groups of the needle measuring channel are arranged at the peripheral side of the negative pressure gathering channel.
[0024] The seal cover needle loading carrier further comprises a limiting groove;
[0025] The limiting groove is arranged in groups, and the groups of the limiting groove are evenly arranged in the seal cover main body, and the groups of the limiting groove and the groups of the needle measuring channel are respectively and correspondingly arranged.
[0026] The spring needle is arranged in groups, and the groups of the spring needle are respectively and correspondingly arranged based on the groups of the limiting groove and extend through the groups of the needle measuring channel.
[0027] As a further scheme of the utility model,
[0028] The tail ends of several sets of spring probes are respectively oriented and limited in several sets of limiting grooves, and the several sets of spring probes extend through several sets of probe channels respectively, and the head ends of several sets of spring probes protrude from the end face of the limiting body away from the cover body.
[0029] As a further embodiment of this utility model,
[0030] The protrusion distance of the tip of the spring probe relative to the end face of the limiting body is no more than 50 μm.
[0031] As a further embodiment of this utility model,
[0032] Several sets of probe channels are connected to the air guide channel.
[0033] As a further embodiment of this utility model,
[0034] The limiting body has a sealing mounting groove on the side opposite to the cover body;
[0035] One side of the foam sealing ring is provided with an adhesive backing surface, and one side of the foam sealing ring is bonded and fixed to the sealing mounting groove of the limiting body through the adhesive backing surface.
[0036] The outer surface of the foam sealing ring is coated with an antistatic coating.
[0037] As a further aspect of this utility model, it also includes:
[0038] A guide base includes a base body and a guide groove formed in the base body, used as a mounting base for testing a chip contacted by the foam sealing ring via the base body, and the guide groove guides and positions the chip contacted by the foam sealing ring based on the mounting base.
[0039] This utility model has the following beneficial effects:
[0040] This test fixture can effectively serve as a guiding and positioning structure for chip testing via a guide base. It also utilizes a sealed needle carrier, a limiting needle carrier, and an external vacuum mechanism to effectively form a closed negative pressure adsorption structure. By sequentially assembling spring probes onto the sealed needle carrier and the limiting needle carrier, the closed negative pressure adsorption structure effectively overcomes the drawback of insufficient vacuum caused by the movement gaps of the spring probes, significantly improving overall adsorption performance. Furthermore, a foam sealing ring can be used to enclose the outer side of the port corresponding to the closed negative pressure adsorption structure, ensuring a stable adsorption effect between the closed negative pressure adsorption structure and the chip, thus enhancing its functionality and practicality. Attached Figure Description
[0041] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. The structure, proportion, size, etc. shown in the specification are only used to cooperate with the content disclosed in the specification, so as to be understood and read by those skilled in the art. Any modification of the structure, change of the proportion relationship or adjustment of the size, which does not affect the effects and purposes of the present application, should still fall within the scope of the technical content disclosed in the present application.
[0042] Figure 1 The overall cross-sectional structure schematic diagram of the air suction type chip test fixture provided by the embodiment of the present application is shown.
[0043] Figure 2 The overall exploded structure schematic diagram of the air suction type chip test fixture provided by the embodiment of the present application is shown.
[0044] In the drawings, the component list represented by each reference numeral is as follows:
[0045] Guide base 1: base body 11, guide groove 12;
[0046] Covered needle carrier 2: cover body 21, air extraction port 22, air guide channel 23, limiting groove 24;
[0047] Limiting needle carrier 3: limiting body 31, negative pressure aggregation channel 32, measuring needle channel 33;
[0048] Foam sealing ring 4; spring measuring needle 5;
[0049] Chip a. DETAILED DESCRIPTION
[0050] The embodiments of the present application will be described below by specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in the specification. Obviously, the described embodiments are only a part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.
[0051] The terms such as "upper", "lower", "left", "right", "middle" and the like cited in the specification are only for the convenience of clear description, not to limit the scope of the present application which can be implemented. The change or adjustment of the relative relationship without substantial change of the technical content is also regarded as the scope of the present application which can be implemented.
[0052] As Figures 1 to 2The utility model discloses a kind of air adsorption type chip test fixtures, including guide base 1, cover needle carrier 2, limit needle carrier 3, bubble sealing ring 4 and spring probe 5, to effectively serve as the guide positioning arrangement structure when chip a is tested by guide base 1, simultaneously can utilize cover needle carrier 2 and limit needle carrier 3 and external suction mechanism cooperation effectively form closed negative pressure adsorption structure, and spring probe 5 can be sequentially assembled and arranged in cover needle carrier 2 and limit needle carrier 3, to effectively overcome the drawback of the activity aperture of spring probe 5 resulting in vacuum degree shortage by closed negative pressure adsorption structure, significantly improve overall adsorption performance, besides bubble sealing ring 4 can be enclosed to the peripheral side corresponding to closed negative pressure adsorption structure port, so that closed negative pressure adsorption structure can be matched closed with chip a between and establish stable adsorption effect. Specific setting is as follows:
[0053] Please refer to Figure 1 And Figure 2 The guide base 1 includes a base body 11 and a guide groove 12 opened in the base body 11, which effectively serves as the installation base when chip a is tested by the base body 11, and can effectively guide and position chip a based on the installation base by the guide groove 12.
[0054] The limit needle carrier 3 includes a limit body 31, a negative pressure aggregation channel 32 and a probe channel 33. The negative pressure aggregation channel 32 is opened at the center position of the limit body 31. The probe channel 33 is provided with several groups, and the several groups of probe channels 33 are evenly opened in the limit body 31, and the several groups of probe channels 33 correspond to the peripheral side of the negative pressure aggregation channel 32.
[0055] Please continue to refer to Figure 1The cover needle carrier 2 comprises a cover body 21, an air extraction port 22, an air guide channel 23 and a limiting groove 24. The cover body 21 is arranged as a single-side opening cover structure, and the outer edge of the cover body 21 corresponding to the opening side is detachably connected to the outer edge of the limiting body 31. The air extraction port 22 is arranged on the side of the cover body 21 opposite to the opening side, and the air extraction port 22 is connected to the negative pressure accumulation channel 32, so as to close the external air extraction mechanism through the air extraction port 22, and the air extraction effect is directly extended to the negative pressure accumulation channel 32. The air guide channel 23 is arranged in at least one group, and the air guide channel 23 is arranged in the cover body 21 and corresponds to the side of the air extraction port 22. The two ends of the air guide channel 23 are respectively connected to the air extraction port 22 and the negative pressure accumulation channel 32, so as to further improve the air extraction negative pressure adsorption performance of the negative pressure accumulation channel 32. The limiting groove 24 is arranged in several groups, and the limiting groove 24 is arranged in the cover body 21 and corresponds to the needle channel 33, so as to effectively act as a directional limiting structure of the spring needle 5.
[0056] Please continue to refer to Figure 1 The bubble sealing ring 4 is arranged on the side of the limiting body 31 away from the cover body 21, and the bubble sealing ring 4 is arranged around the outer side of the negative pressure accumulation channel 32, so as to utilize the compressible property of the bubble sealing ring 4 to achieve airtight sealing when the bubble sealing ring 4 is in contact with the chip a, thereby establishing stable adsorption.
[0057] Specifically, the limiting body 31 is provided with a sealing installation groove on the side away from the cover body 21, and the bubble sealing ring 4 is provided with a back adhesive surface on one side, and the bubble sealing ring 4 is fixed to the sealing installation groove of the limiting body 31 through the back adhesive surface.
[0058] Further specifically, the outer surface of the bubble sealing ring 4 is coated with an anti-static coating, so as to effectively reduce the static electricity transmission when the bubble sealing ring 4 is in contact with the chip a.
[0059] Please continue to refer to Figure 1The spring probes 5 are provided in several groups, tail ends of the spring probes 5 in the several groups are respectively and one by one correspondingly positioned and limited inside the several groups of the limiting grooves 24, and the several groups of the spring probes 5 respectively and one by one correspondingly extend through the several groups of the probe channels 33, head ends of the several groups of the spring probes 5 protrude from one side end face of the limiting body 31 away from the cover body 21, and the protruding distance of the head ends of the several groups of the spring probes 5 based on the end face of the limiting body 31 is not greater than 50 um, so that the several groups of the spring probes 5 can effectively contact the chip a to complete the functional test process when the bubble sealing ring 4 and the chip a are in contact and compressed based on the adsorption effect.
[0060] As a preferred scheme of the embodiment, the several groups of the probe channels 33 and the air guide channels 23 are connected and arranged in communication, so that the negative pressure is further formed through the probe channels 33 by the air guide channels 23, thereby overcoming the disadvantage of insufficient vacuum degree caused by the probe channels 33, and significantly improving the overall adsorption performance.
[0061] It should be noted that the material of the bubble sealing ring 4 can be but is not limited to a high-temperature-resistant microporous silica gel bubble material; the materials of the cover needle loading carrier 2 and the limiting needle loading carrier 3 can both be but are not limited to engineering plastics and metal materials.
[0062] Although the utility model has been described in detail above by general description and specific embodiments, some modifications or improvements can be made on the basis of the utility model, which is obvious to those skilled in the art. Therefore, these modifications or improvements made on the basis of not deviating from the spirit of the utility model all belong to the scope of protection required by the utility model.
Claims
1. A gas-suction type chip testing fixture, characterized by comprising: It includes: The limit needle loading carrier is provided with a negative pressure gathering channel; The cover needle loading carrier is provided with an air exhaust port, and the cover needle loading carrier and the limit needle loading carrier form a closed negative pressure adsorption structure, and the air exhaust port and the negative pressure gathering channel are connected through the closed negative pressure adsorption structure. The bubble sealing ring is fixed to the limit needle loading carrier, and the bubble sealing ring is arranged around the peripheral side of the negative pressure gathering channel. The spring probe extends through the limit needle loading carrier based on the cover needle loading carrier, and the protruding part of the limit needle loading carrier is located on the inside of the bubble sealing ring.
2. The air adsorption type chip test fixture according to claim 1, wherein The limit needle loading carrier includes a limit main body; The negative pressure gathering channel is arranged at the center of the limit main body.
3. The air adsorption type chip test fixture according to claim 2, wherein The cover needle loading carrier includes a cover main body; The cover main body is arranged as a single-sided opening cover structure, and the outer edge of the cover main body corresponding to the opening side is detachably connected to the outer edge of the limit main body; The air exhaust port is arranged on the side of the cover main body opposite to the opening, and the air exhaust port and the negative pressure gathering channel are connected through the closed negative pressure adsorption structure.
4. The air adsorption type chip test fixture according to claim 3, wherein The cover needle loading carrier further includes a gas guide channel arranged inside the cover main body; The gas guide channel is arranged at the side of the air exhaust port, and the two ends of the gas guide channel are respectively connected to the air exhaust port and the negative pressure gathering channel.
5. The air adsorption type chip test fixture according to claim 4, wherein The limit needle loading carrier further includes a probe channel; The probe channel is arranged in several groups, and the probe channels are evenly arranged on the limit main body, and the probe channels are arranged around the negative pressure gathering channel; The cover needle loading carrier further includes a limit groove; The limit groove is arranged in several groups, and the limit grooves are evenly arranged on the cover main body, and the limit grooves and the probe channels are respectively arranged one by one; The spring probe is arranged in several groups, and the spring probes are respectively arranged one by one based on the limit grooves and protrude through the probe channels.
6. The air adsorption type chip test fixture according to claim 5, wherein The tail ends of the spring probes are respectively arranged one by one in the limit grooves, and the spring probes are respectively arranged one by one through the probe channels, and the head ends of the spring probes protrude from the side end face of the limit main body away from the cover main body.
7. The air adsorption type chip test fixture according to claim 6, wherein The protruding distance of the head end of the spring probe based on the limit main body end face is not greater than 50um. 8.The air-suction type chip testing fixture according to claim 5, wherein a plurality of groups of the probe channel are connected to the air guide channel. 9.The air-suction type chip testing fixture according to claim 3, wherein a sealing installation groove is formed on a side of the limiting body away from the cover body. A back adhesive surface is arranged on a side of the bubble sealing ring, and the bubble sealing ring is fixed to the sealing installation groove of the limiting body through the back adhesive surface. An anti-static coating is coated on an outer surface of the bubble sealing ring. Further comprising: a guide base including a base body and a guide groove formed in the base body, and used as a placement base for a chip to be tested by the bubble sealing ring, and the guide groove is used to guide and position the chip to be tested by the bubble sealing ring based on the placement base.
10. The air-suction type chip testing fixture according to claim 1, wherein