Fixture for testing electronic device and testing equipment
By combining clip-on probes with multi-faceted contact and turbulence-structured dielectric channels, the power supply and heat dissipation problems of pin-type pin devices in high-current testing are solved, resulting in more efficient test equipment performance and higher accuracy.
Patent Information
- Application Number
- CN202520138580.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing test fixtures cannot withstand high current testing on power semiconductor devices with pin-type leads, and have poor heat dissipation, thus failing to meet the testing requirements under actual working conditions.
A fixture structure was designed to allow for multi-faceted contact between a clip-type probe and a needle-type connecting terminal. A medium channel with a turbulence structure was set in the lower fixture to improve heat dissipation efficiency. The clip-type probe achieves multi-faceted contact through elastic deformation, and the turbulence structure promotes turbulent flow of the heat exchange medium to enhance the heat dissipation effect.
It improves the power supply and heat dissipation capabilities of the testing equipment, ensures the stability of high-current testing and the accuracy of test results, and enhances the uniformity and efficiency of heat dissipation of the device.
Smart Images
Figure CN223857341U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to electronic device testing technical field especially a tool for electronic device testing and testing equipment. BACKGROUND
[0002] When the power semiconductor device (hereinafter referred to as "device") is carried out no -function aging detection, the power terminal of device is usually needed with the connecting copper row of test fixture close contact and is carried out no -function aging test to device power end to apply current to device, when carrying out no -function aging test, to simulate the use condition of device under actual working condition, usually, device is applied to big current, big voltage and carries out test, and device is fixed on water cooling plate, and water flow in water cooling plate is set temperature, and different temperature is applied to device, simulates the temperature in actual use process, and takes away the heat generated in the process of device test.
[0003] For the device of needle type (i.e. needle type pin) power terminal, when big current test is needed according to test requirement in no -function aging test, the spring probe connected with needle type pin on test fixture cannot bear transmission larger current, and the bottom plate of this kind of device is mostly plane type bottom plate, and the heat dissipation effect is poor, and the existing water cooling plate cannot satisfy the heat dissipation effect.
[0004] In order to improve the current size of test use, the device of test is better carried out heat dissipation, and a test fixture for needle type terminal device to pass large current and improve device heat dissipation effect needs to be designed. Utility model content
[0005] The applicant provides a tool for electronic device testing and testing equipment to improve the power supply capacity of test equipment and the heat dissipation capacity of test equipment, improve the test capacity of test equipment and the accuracy of test result in view of the defects in the prior art.
[0006] The technical scheme adopted by the utility model is as follows:
[0007] A tool for electronic device testing, the connecting terminal of the device is needle type, and the test fixture comprises,
[0008] The upper tool is provided with the probe matched with the connecting terminal, the probe comprises a plurality of clamping pieces, each clamping piece is provided with the contact surface matched with the outer peripheral surface of the connecting terminal, and the contact surface extends along the length direction of the probe.
[0009] The lower tool is used for placing the device.
[0010] The upper fixture and the lower fixture move towards each other, the probe is inserted into the connecting terminal, the clamping piece is elastically deformed, each contact surface is in surface contact with the outer peripheral surface of the connecting terminal, and the fixture is electrically connected with the device.
[0011] As a further improvement of the above technical solution:
[0012] The cross section of the connecting terminal is rectangular, and the contact surface is a plane.
[0013] The cross section of the connecting terminal is circular, and the contact surface is a cylindrical surface.
[0014] The upper fixture further comprises an input terminal for connecting an external power supply and a probe plate for mounting the probe, the probe plate is provided with a test terminal, the test terminal is electrically connected with the input terminal, and the test terminal is electrically connected with the probe through a large-current conductor.
[0015] The input terminal and the large-current conductor are both copper bars.
[0016] The lower fixture comprises a heat exchange plate, the heat exchange plate is provided with a medium channel for flowing through a heat exchange medium, the heat exchange plate is provided with an opening penetrating the medium channel and the outside, when the opening is in sealing connection with the bottom plate of the device, the medium channel is closed in the middle, the inner wall of the medium channel is provided with a turbulence structure, and the turbulence structure is used to block the heat exchange medium flowing through the bottom plate, so that the heat exchange medium is in full contact with the bottom plate in the medium channel.
[0017] The turbulence structure is a plurality of columns arranged in the inner wall of the medium channel in a staggered manner, the plurality of columns are opposite to the bottom plate, and the distribution range of the plurality of columns is adapted to the area of the bottom plate.
[0018] The medium channel comprises a first buffer cavity and a second buffer cavity on both sides of the opening, the first buffer cavity and the second buffer cavity are respectively provided with a medium inlet and a medium outlet, and further comprises a first communication passage, a second communication passage and a heat exchange cavity corresponding to the opening, the turbulence structure is arranged in the heat exchange cavity, the first communication passage communicates the first buffer cavity with the heat exchange cavity, the second communication passage communicates the second buffer cavity with the heat exchange cavity, the first communication passage and the second communication passage are located on the same side of the heat exchange cavity and are inclined towards the bottom plate.
[0019] The cross section of the first communication passage is smaller than the cross section of the first buffer cavity, the cross section of the second communication passage is smaller than the cross section of the second buffer cavity, and the cross sections of the first communication passage and the second communication passage are greater than or equal to the cross section of the heat exchange cavity.
[0020] A test apparatus comprising the fixture for electronic device testing as claimed in any one of the preceding claims.
[0021] The utility model discloses the beneficial effects are as follows:
[0022] The utility model discloses compact, reasonable, convenient operation, through the adoption of the probe of clamping piece type through the elastic force and keep the clamping piece and the outer peripheral surface of connecting terminal realize the contact of many sides, make full use of the side space of connecting terminal, improve the ability of power supply and test ability of test equipment.
[0023] The disturbance structure is arranged in the medium channel of the circulating heat exchange medium, blocks the flow of the heat exchange medium through the bottom plate, makes the heat exchange medium turbulent flow, makes the part of the bottom plate in the medium channel and the heat exchange medium evenly contact, improves the uniformity of device heat dissipation, improves the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0024] Figure 1 It is the structural diagram of test equipment of the utility model.
[0025] Figure 2 It is the structural diagram of device and connecting terminal of the utility model.
[0026] Figure 3 It is the structural diagram of the upper fixture of the utility model.
[0027] Figure 4 It is the structural diagram of the probe of the utility model.
[0028] Figure 5 It is the structural diagram of the lower fixture of the utility model.
[0029] Figure 6 It is the sectional view of the lower fixture of the utility model.
[0030] Figure 7 It is the explosion drawing of the lower fixture of the utility model.
[0031] Figure 8 It is the sectional view of the heat exchange plate of the utility model.
[0032] Among them:
[0033] 1, input terminal;2, hall sensor;
[0034] 3, upper fixture;31, large current electric conductor;
[0035] 32, probe;321, clamping piece;322, contact surface;
[0036] 33, probe plate;34, test terminal;35, hard limit top block;36, pressure block;
[0037] 4, device; 41, connecting terminal; 42, bottom plate;
[0038] 5, light curtain;
[0039] 6, lower fixture; 61, limiting block; 62, spoiler structure; 63, fixed plate;
[0040] 64, heat exchange plate; 641, first communication passage; 642, second communication passage; 643, first buffer cavity; 644, second buffer cavity;
[0041] 66, heat insulation plate; 68, heat exchange cavity;
[0042] 7, driving mechanism. DETAILED DESCRIPTION
[0043] The specific implementation of the utility model will be described below in combination with the drawings.
[0044] Example 1:
[0045] As Figures 1-4 shown, the fixture for electronic device testing of the embodiment, the connecting terminal 41 of the device 4 is needle type, the test fixture includes the upper fixture 3 and the lower fixture 6.
[0046] The upper fixture 3 is provided with the probe 32 matched with the connecting terminal 41, the probe 32 includes a plurality of clamping pieces 321, each clamping piece 321 is provided with the contact surface 322 matched with the outer peripheral surface of the connecting terminal 41, and the contact surface 322 extends along the length direction of the probe 32.
[0047] The lower fixture 6 is used for placing the device 4.
[0048] During the relative movement of the upper fixture 3 and the lower fixture 6, the clamping piece 321 is elastically deformed when the probe 32 is inserted with the connecting terminal 41, and each contact surface 322 is in surface contact with the outer peripheral surface of the connecting terminal 41, thereby electrically connecting the fixture with the device 4.
[0049] The device 4 of the embodiment is a power semiconductor module, and the connecting terminal 41 is a power terminal.
[0050] Specifically, the fixture is the main component of the test equipment for performing reactive aging test, the upper fixture 3 and the lower fixture 6 are moved towards each other under the driving of the driving mechanism 7, the driving mechanism 7 can be a cylinder, generally the upper fixture 3 is located above the lower fixture 6, and the driving mechanism 7 drives the lower fixture 6 to move up and down. The upper fixture 3 and the lower fixture 6 are provided with the light curtain 5 on one side for monitoring the device 4 to enter and exit and playing a safety protection role.
[0051] The upper fixture 3 is provided with the hard limiting top block 35, and when the hard limiting top block 35 cooperates with the lower fixture 6, the probe 32 is inserted with the connecting terminal 41 in place.
[0052] The upper fixture 3 is the core component of the testing equipment. It connects to the connection terminal 41 on the device 4 via probe 32, providing the current required for testing. The end of the connection terminal 41 is equipped with a guide structure, such as... Figure 2 As shown, this facilitates the connection between terminal 41 and probe 32.
[0053] Traditional pin-type leads and spring-loaded probes are connected at the ends, resulting in a small contact area that cannot withstand large current transmissions.
[0054] In this embodiment, the fixture uses a clip-type probe 32 to maintain the clip 321 in multi-faceted contact with the outer peripheral surface of the connecting terminal 41 through elastic force, making full use of the side space of the connecting terminal 41 and improving the power supply and testing capabilities of the test equipment.
[0055] In this embodiment, the cross-section of the connecting terminal 41 is rectangular, and the contact surface 322 is planar. For example... Figure 4 As shown, there are four clips 321 arranged symmetrically, with two clips 321 facing the same direction.
[0056] In another embodiment, the cross-section of the connecting terminal 41 is circular, and the contact surface 322 is cylindrical.
[0057] like Figure 2 , Figure 3 As shown, there are multiple probes 32 and multiple connection terminals 41, with the probes 32 disposed on the probe plate 33.
[0058] Furthermore, to ensure high current transmission to probe 32, such as Figure 1 , Figure 3 As shown, the upper fixture 3 also includes an input terminal 1 for connecting to an external power source and a probe plate 33 for mounting a probe 32. The probe plate 33 is provided with a test terminal 34, which is electrically connected to the input terminal 1. The test terminal 34 is electrically connected to the probe 32 through a high-current conductor 31.
[0059] Input terminal 1 provides AC power to the testing equipment, and test terminal 34 is connected to input terminal 1 via a wire. A Hall sensor 2 is installed on input terminal 1.
[0060] There are multiple test terminals 34, including AC test terminals and DC test terminals, which provide the required current for testing device 4.
[0061] Furthermore, both the input terminal 1 and the high-current conductor 31 are copper busbars. The probe board 33 is a PCB board, and the high-current conductor 31 is soldered onto the probe board 33.
[0062] Example 2:
[0063] like Figures 5-8As shown, the lower fixture 6 comprises a heat exchange plate 64, the heat exchange plate 64 is provided with a medium channel for flowing a heat exchange medium, the heat exchange plate 64 is provided with an opening penetrating the medium channel and the outside, when the opening is sealingly connected with the bottom plate 42 of the device 4, the medium channel is closed in the middle, the inner wall of the medium channel is provided with a turbulence structure 62, the turbulence structure 62 is used to block the heat exchange medium flowing through the bottom plate 42, so that the heat exchange medium is fully contacted with the bottom plate 42 located in the medium channel.
[0064] As shown in the figure, Figure 5 the upper surface of the heat exchange plate 64 at the opening is provided with a limiting block 61 and a positioning pin for positioning the device 4, and a sealing ring for sealingly connecting the opening with the bottom plate 42, and the bottom of the heat exchange plate 64 is provided with a heat insulation plate 66.
[0065] The bottom plate 42 of the embodiment is of a planar type, in other embodiments, the bottom plate 42 can also be of other structural forms which can be placed at the opening of the heat exchange plate 64, as long as it does not interfere with the turbulence structure 62 and ensures that the medium channel is unobstructed.
[0066] During testing, the driving mechanism 7 drives the lower fixture 6 to rise and tightly abut against the crimping block 36 in the upper fixture 3, so that the bottom plate 42 of the device 4 is sealingly connected with the sealing ring. The heat exchange medium can be a fluid such as water, after the turbulence structure 62 blocks the heat exchange medium flowing through the bottom plate 42, the heat exchange medium flows turbulently, so that the part of the bottom plate 42 located in the medium channel is uniformly contacted with the heat exchange medium, improving the uniformity of heat dissipation of the device 4 and improving the heat dissipation efficiency.
[0067] As shown in the figure, Figures 5-7 the turbulence structure 62 is a plurality of columns arranged in the inner wall of the medium channel in a staggered manner, the plurality of columns are opposite to the bottom plate 42, and the distribution range is adapted to the area of the bottom plate 42.
[0068] The heat exchange medium flows through the space between the columns and the inner wall of the medium channel, changes the flow direction of the heat exchange medium and the cross-sectional area of the medium channel, and makes the heat exchange medium flow turbulently.
[0069] In a specific embodiment, the lower fixture 6 further comprises a fixing plate 63, the columns are arranged on the fixing plate 63, and the fixing plate 63 is detachably mounted on the inner wall of the medium channel opposite to the bottom plate 42.
[0070] Further, as shown in the figure, Figures 6-8As shown, the medium channel includes a first buffer chamber 643 and a second buffer chamber 644 located on both sides of the opening. The first buffer chamber 643 and the second buffer chamber 644 are respectively provided with a medium inlet and a medium outlet. It also includes a first connecting passage 641, a second connecting passage 642, and a heat exchange chamber 68 corresponding to the opening. A turbulence structure 62 is provided in the heat exchange chamber 68. The first connecting passage 641 connects the first buffer chamber 643 and the heat exchange chamber 68, and the second connecting passage 642 connects the second buffer chamber 644 and the heat exchange chamber 68. The first connecting passage 641 and the second connecting passage 642 are located on the same side of the heat exchange chamber 68 and are both inclined towards the bottom plate 42.
[0071] Specifically, such as Figure 6 As shown, the flow path of the heat exchange medium in the first connecting passage 641 and the flow path of the heat exchange medium in the second connecting passage 642 form a figure-eight shape.
[0072] When the heat exchange medium flows through the heat exchange chamber 68, it enters the first buffer chamber 643 from the medium inlet and then flows sequentially through the first connecting passage 641, the heat exchange chamber 68, the second connecting passage 642, and the second buffer chamber 644 before exiting from the medium outlet. The inclined first connecting passage 641 and the second connecting passage 642 cause the heat exchange medium to flow toward the bottom plate 42, ensuring full contact with the bottom plate 42.
[0073] Furthermore, such as Figure 8 As shown, the cross-section of the first connecting passage 641 is smaller than the cross-section of the first buffer cavity 643, the cross-section of the second connecting passage 642 is smaller than the cross-section of the second buffer cavity 644, and the cross-sections of both the first connecting passage 641 and the second connecting passage 642 are greater than or equal to the cross-section of the heat exchange cavity 68.
[0074] The cross-section refers to the section perpendicular to the flow direction of the heat exchange medium. The design of the above cross-sectional dimensions ensures that the heat exchange medium completely fills the first connecting passage 641 and the second connecting passage 642 when it flows through the first connecting passage 641 and the second connecting passage 642, and further ensures that the heat exchange medium can completely fill the heat exchange cavity 68.
[0075] Example 3:
[0076] The testing equipment in this embodiment includes the fixture for testing electronic devices from any of the above embodiments.
[0077] The above description is an explanation of the present utility model and not a limitation thereof. The scope of the present utility model is defined by the claims. Within the protection scope of the present utility model, any form of modification may be made.
Claims
1. A fixture for electronic device testing, characterized by: The connecting terminal (41) of the device (4) is in the form of a needle, and the test fixture comprises, an upper fixture (3) provided with a probe (32) matched with the connecting terminal (41), the probe (32) comprising a plurality of clamping pieces (321), each clamping piece (321) being provided with a contact surface (322) matched with the outer peripheral surface of the connecting terminal (41), the contact surface (322) extending along the length direction of the probe (32); a lower fixture (6) for placing the device (4); During the approaching movement of the upper fixture (3) and the lower fixture (6), when the probe (32) is inserted into the connecting terminal (41), the clamping piece (321) is elastically deformed, and each contact surface (322) is in surface contact with the outer peripheral surface of the connecting terminal (41), thereby electrically connecting the fixture and the device (4).
2. The fixture for electronic device testing of claim 1, wherein: The cross section of the connecting terminal (41) is rectangular, and the contact surface (322) is a plane.
3. The fixture for electronic device testing of claim 1, wherein: The cross section of the connecting terminal (41) is circular, and the contact surface (322) is a cylindrical surface.
4. The fixture for electronic device testing of claim 1, wherein: The upper fixture (3) further comprises an input terminal (1) for connecting an external power supply and a probe plate (33) for mounting the probe (32), the probe plate (33) being provided with a test terminal (34), the test terminal (34) being electrically connected with the input terminal (1), and the test terminal (34) being electrically connected with the probe (32) through a large-current conductor (31).
5. The fixture for electronic device testing of claim 4, wherein: The input terminal (1) and the large-current conductor (31) are both copper bars.
6. The fixture for electronic device testing of claim 1, wherein: The lower fixture (6) comprises a heat exchange plate (64), the heat exchange plate (64) being provided with a medium channel for flowing a heat exchange medium, the heat exchange plate (64) being provided with an opening penetrating the medium channel and the outside, when the opening is in sealing connection with the bottom plate (42) of the device (4), the medium channel is closed in the middle, and the inner wall of the medium channel is provided with a turbulence structure (62) for blocking the heat exchange medium flowing through the bottom plate (42) and making the heat exchange medium fully contact with the bottom plate (42) in the medium channel.
7. The fixture for electronic device testing of claim 6, wherein: The turbulence structure (62) is a plurality of columns arranged in the inner wall of the medium channel in a staggered manner, the plurality of columns are opposite to the bottom plate (42) and are distributed in a range corresponding to the area of the bottom plate (42).
8. The fixture for electronic device testing of claim 6, wherein: The medium passage comprises a first buffer cavity (643) and a second buffer cavity (644) located on both sides of the opening, a medium inlet and a medium outlet are respectively arranged on the first buffer cavity (643) and the second buffer cavity (644), and the medium passage further comprises a first communication passage (641), a second communication passage (642) and a heat exchange cavity (68) corresponding to the opening, the heat exchange cavity (68) is provided with the turbulence structure (62), the first communication passage (641) communicates the first buffer cavity (643) with the heat exchange cavity (68), the second communication passage (642) communicates the second buffer cavity (644) with the heat exchange cavity (68), the first communication passage (641) and the second communication passage (642) are located on the same side of the heat exchange cavity (68) and are both inclined towards the bottom plate (42).
9. The fixture for electronic device testing of claim 8, wherein: The cross section of the first communication passage (641) is smaller than the cross section of the first buffer cavity (643), the cross section of the second communication passage (642) is smaller than the cross section of the second buffer cavity (644), and the cross sections of the first communication passage (641) and the second communication passage (642) are both greater than or equal to the cross section of the heat exchange cavity (68).
10. A test apparatus characterized by: A fixture for testing electronic devices, comprising any one of claims 1-9.