Semiconductor chip test structure

Abstract

The utility model discloses a semiconductor chip test structure, comprising a test PCB, the surface of the test PCB is provided with a test fixture, the inside of the test fixture is provided with a test space, the top of the test fixture is provided with a flexible clamping mechanism, the flexible clamping mechanism comprises a guide column, the bottom of the guide column is fixedly connected to the surface of the test fixture, and the bottom of the guide column is fixedly connected to the surface of the test fixture. A connecting piece is fixedly connected to the top of the guide column, a mounting piece is fixedly arranged on the inner wall of the connecting piece, a driving cylinder is screwed to the mounting piece, and a driving piece is screwed to the end of a piston rod of the driving cylinder. According to the semiconductor chip test structure, a hand does not need to apply force, and the chip on the test fixture can be rapidly clamped; the driving cylinder is preferably a micro servo electric cylinder, so that accurate position control can be realized, the clamping position of the chip can be accurately controlled, repeated positioning can be realized, time and labor are saved, and more chips can be tested in unit time.

Description

TECHNICAL FIELD

[0001] The utility model relates to the chip test field, concretely to a semiconductor chip test structure. BACKGROUND

[0002] The test fixture belongs to a category below the fixture, is a kind of fixture specially for testing, testing the function, power calibration, life, performance of product;Because it is mainly used for the testing of various indexes of product on production line, it is called test fixture;And the existing clamping fixture suitable for semiconductor packaging radio frequency high frequency signal test mostly single structure, limited test occasion, not high practicality;

[0003] To solve the above problems, through the retrieval, the announcement No.CN215641661U discloses a kind of clamping fixture suitable for semiconductor packaging radio frequency high frequency signal test, in the text, including manual rotation twist cover, can make the whole of screw piece, connecting block, pressure block in the upper cover occurs rotation, further adjust the height of pressure block in vertical direction, can adapt to chip of different thickness size;

[0004] The above device can complete the clamping and fixing of chip by rotating twist cover, but the number of rotations in the process of rotating twist cover is different, and the chip is prone to looseness during testing if the rotation is not in place, and the twist cover also needs to be rotated when the chip is placed in the fixture for testing, which is cumbersome to operate, reduces the number of tested chips per unit time, but in actual use, the angle of rotation is inconsistent when different test personnel rotate the twist cover, so that the chip cannot be stably clamped when the twist cover is not rotated to the target angle, and the hand needs to be forced when rotating the twist cover, which causes hand fatigue after a long time, reducing the number of chip tests per unit time. UTILITY MODEL CONTENTS

[0005] The utility model aims at providing a kind of semiconductor chip test structure to solve the defects mentioned in the above background art.

[0006] To achieve the above object, a kind of semiconductor chip test structure is provided, including test PCB board, test PCB board's surface is equipped with test fixture, test fixture is internally provided with test space, while the top of test fixture is equipped with flexible clamping mechanism, flexible clamping mechanism includes guide column, guide column bottom is fixedly connected in test fixture surface, guide column top is fixedly connected with connecting piece, connecting piece's inner wall is fixedly provided with mounting piece, mounting piece is screw-connected and installed with drive cylinder, the piston rod end of drive cylinder is screw-connected and installed with driving piece, and the bottom of driving piece is provided with butt joint piece, and the bottom of butt joint piece is bonded with soft pad.

[0007] Preferably, the test space inside the test fixture is provided with a taking and placing channel on both sides, the taking and placing channel is provided in a "U" shape, and the bottom of the taking and placing channel is flush with the bottom of the test space.

[0008] Preferably, the surface of the test fixture is uniformly provided with four groups of guide columns, the connecting plate at the top of the guide column is provided in a rectangular shape, the mounting plate on the inner wall of the connecting plate is provided in a trapezoidal shape on both sides, and the mounting plate is provided in a circular shape in the middle.

[0009] Preferably, the area of the driving piece, the butt joint piece and the soft pad is consistent, the driving piece, the butt joint piece and the soft pad are sequentially provided in a layered manner from top to bottom, and the driving piece, the butt joint piece and the soft pad are vertically lifted by the driving cylinder.

[0010] Preferably, the bottom of the driving piece is provided with a positioning groove on both sides, the surface of the butt joint piece is provided with a positioning strip on both sides, the size of the positioning strip and the positioning groove is matched, and the positioning strip is inserted into the two groups of positioning grooves.

[0011] Preferably, the cross section of the positioning strip and the positioning groove is provided in a dovetail shape, the driving piece and the butt joint piece are positioned and installed through the two groups of positioning strips and the positioning grooves; and the two ends of the driving piece are provided with two groups of guide pieces, and the guide column is inserted into the guide hole formed in the guide piece.

[0012] Preferably, the bottom of the soft pad is uniformly provided with a plurality of convex blocks, the convex blocks are provided in a semispherical shape, and the bottom of the soft pad is uniformly provided with a plurality of flow-through grooves, and the flow-through grooves are inserted between the plurality of convex blocks.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] 1. The piston rod of the driving cylinder drives the driving piece, the butt joint piece and the soft pad to move downward, so that the soft pad covers the surface of the chip, the chip can be stably tested in the test fixture, and the chip is not loose, which replaces the traditional method of fixing the chip by rotating the twist, and the chip on the test fixture can be quickly clamped without hand force in actual operation; the driving cylinder is preferably a micro servo electric cylinder, which can realize accurate position control, accurately control the clamping position of the chip, realize repeated positioning, save time and labor, and test more chips in unit time;

[0015] 2. The bottom of the soft pad is uniformly provided with a plurality of convex blocks, which can increase the contact friction force between the soft pad and the surface of the chip, so that the chip is more stable when being pressed and is not easy to slide or displace; meanwhile, the convex blocks can be elastically deformed when subjected to pressure, which can more effectively disperse the pressure and further protect the surface of the chip;

[0016] 3. The utility model discloses a plurality of groups of through grooves are evenly arranged at the bottom of the soft pad, and the through grooves are arranged among the plurality of groups of protrusions, the through grooves can balance the air pressure between the chip and the soft pad, prevent the air from being trapped and causing air pressure difference in the process of pressing, and cause the chip to be pressed by uneven pressure, the through grooves can also promote the circulation of air, help the heat dissipation and dehumidification of the chip, keep the surface of the chip dry and clean, and improve the stability and reliability of detection. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.

[0018] Figure 1 It is a front view of the structure of the utility model,

[0019] Figure 2 It is a bottom view of the utility model, Figure 1

[0020] Figure 3 It is a top view of the utility model, Figure 1

[0021] Figure 4 It is a rear view of the utility model, Figure 1

[0022] Figure 5 It is a schematic view of the soft pad and the surface structure thereof.

[0023] The reference numerals in the drawing are: 1, test PCB board; 2, test fixture; 3, test space; 31, take and put channel; 4, flexible clamping mechanism; 41, connecting sheet; 42, mounting sheet; 43, guide sheet; 44, drive cylinder; 45, guide column; 46, drive sheet; 461, positioning groove; 47, butt joint sheet; 471, positioning strip; 48, soft pad; 481, protrusion; 482, through groove. DETAILED DESCRIPTION

[0024] The technical scheme in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only some embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0025] ​​​It should be noted that if the embodiments of the utility model have directionality indication (such as up, down, left, right, front, back), the directionality indication is only used to explain the relative position relationship, movement condition and the like between components in a certain specific posture (as shown in the drawings), if the specific posture changes, then the directionality indication also changes accordingly.

[0026] In the utility model, unless another explicit provision and limitation, the terms "connection", "fixing" and the like should be understood broadly, for example, "fixing" can be fixed connection, also can be detachable connection, or integral, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirect connection through intermediate medium, can be the communication inside two elements or the interaction relationship of two elements, unless another explicit limitation. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to specific circumstances.

[0027] In addition, if the embodiments of the utility model have the description of "first", "second" and the like, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one feature. In addition, the meaning of "and / or" appearing throughout the text includes three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B simultaneously satisfy the scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on that ordinary skilled in the art can realize, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the utility model.

[0028] Please refer to Figures 1-5 The utility model provides a kind of semiconductor chip test structure, including test PCB 1, test PCB 1 is mounted with test fixture 2, test fixture 2 is internally provided with test space 3, while the top of test fixture 2 is installed with flexible clamping mechanism 4, flexible clamping mechanism 4 includes guide column 45, guide column 45 bottom is fixedly connected in test fixture 2 surface, guide column 45 top is fixedly connected with connecting sheet 41, connecting sheet 41 is fixedly provided with mounting sheet 42 on inner wall, mounting sheet 42 is screw-connected and installed with drive cylinder 44, the piston rod end of drive cylinder 44 is screw-connected and installed with driving piece 46, driving piece 46 bottom is provided with butt joint piece 47, butt joint piece 47 bottom is bonded with soft pad 48.

[0029] Working principle: during actual use, first place the semiconductor chip inside the test space 3, at this time start the start switch electrically connected with the driving cylinder 44 installed on the test PCB 1, the piston rod of the driving cylinder 44 drives the driving piece 46, the butt piece 47 and the soft pad 48 to move downward, so that the soft pad 48 covers the surface of the chip, so that the chip can be stably tested inside the test fixture 2 and will not be loose, replacing the traditional way of fixing the chip by using a knob, during actual operation, the chip on the test fixture 2 can be quickly clamped without the need for hand force; the driving cylinder 44 is preferably a micro servo electric cylinder, which can realize accurate position control, accurately control the clamping position of the chip, realize repeated positioning, save time and effort, and test more chips in unit time; compared with the knob fixing mode, it is difficult to ensure the height consistency of the fixed position each time, which is crucial for high-precision chip testing, can ensure that the chip and the test probe and other components are accurately connected, and reduces the test error; the soft pad 48 is a rubber pad, which is soft and covers the outside of the chip without causing wear to the chip; meanwhile, the bottom of the soft pad 48 is uniformly provided with a plurality of groups of protrusions 481, which can increase the contact friction between the soft pad and the surface of the chip, so that the chip is more stable when pressed and is not easy to slide or displace; meanwhile, the protrusions 481 will produce a certain elastic deformation when subjected to pressure, which can more effectively disperse the pressure and further protect the surface of the chip; the bottom of the soft pad 48 is uniformly provided with a plurality of groups of flow-through grooves 482, which are arranged between the plurality of groups of protrusions 481; the flow-through grooves 482 can balance the air pressure between the chip and the soft pad 48, prevent air from being trapped during the pressing process to cause air pressure difference, and cause the chip to be subjected to uneven pressure; the flow-through grooves 482 can also promote air circulation, which is helpful for heat dissipation and dehumidification of the chip, keeps the surface of the chip dry and clean, and improves the stability and reliability of detection.

[0030] As a preferred embodiment, the test space 3 inside the test fixture 2 is provided with a take-out channel 31 on both sides, the take-out channel 31 is arranged in a "U" shape, and the bottom of the take-out channel 31 is flush with the bottom of the test space 3.

[0031] The surface of the test fixture 2 is uniformly provided with four groups of guide columns 45, the top of the guide column 45 is provided with a rectangular connecting piece 41, the two sides of the mounting piece 42 on the inner wall of the connecting piece 41 are provided in a trapezoidal shape, and the middle of the mounting piece 42 is provided in a circular shape.

[0032] As a preferred embodiment, the areas of the driving piece 46, the butt piece 47 and the soft pad 48 are consistent, the driving piece 46, the butt piece 47 and the soft pad 48 are sequentially arranged in a layered manner from top to bottom, and the driving piece 46, the butt piece 47 and the soft pad 48 are vertically lifted by the driving cylinder 44.

[0033] The bottom of the driving piece 46 is provided with positioning grooves 461 on both sides, and the surface of the butt joint piece 47 is provided with positioning strips 471 on both sides, the positioning strips 471 are matched with the positioning grooves 461 in size, and the two groups of positioning grooves 461 are internally inserted with the positioning strips 471.

[0034] As a preferred embodiment, the cross sections of the positioning strips 471 and the positioning grooves 461 are dovetail-shaped, the driving piece 46 and the butt joint piece 47 are positioned and installed through the two groups of positioning strips 471 and the positioning grooves 461, and the two ends of the driving piece 46 are provided with two groups of guide pieces 43, and the guide columns 45 are inserted into the guide holes formed in the guide pieces 43.

[0035] As a preferred embodiment, the bottom of the soft pad 48 is uniformly provided with a plurality of convex blocks 481, the convex blocks 481 are semi-spherical, and the bottom of the soft pad 48 is uniformly provided with a plurality of flow grooves 482, and the flow grooves 482 are inserted between the plurality of convex blocks 481.

[0036] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation, direct / indirect application in other related technical fields under the utility model concept of the utility model, and the contents of the utility model specification and the drawings are included in the patent protection range of the utility model.

Claims

1. A semiconductor chip test structure comprising a test PCB board (1), characterized in that: The surface of the test PCB (1) is mounted with a test fixture (2), the inside of the test fixture (2) is provided with a test space (3), and the top of the test fixture (2) is provided with a flexible clamping mechanism (4). The flexible clamping mechanism (4) comprises a guide column (45), the bottom of the guide column (45) is fixedly connected to the surface of the test fixture (2), the top of the guide column (45) is fixedly connected with a connecting plate (41), the inner wall of the connecting plate (41) is fixedly provided with a mounting plate (42), the mounting plate (42) is screwed and mounted with a driving cylinder (44), the end of the piston rod of the driving cylinder (44) is screwed and mounted with a driving plate (46), the bottom of the driving plate (46) is provided with a butt joint plate (47), and the bottom of the butt joint plate (47) is bonded with a soft pad (48).

2. The semiconductor chip test structure of claim 1, wherein: The test space (3) inside the test fixture (2) is provided with a taking and placing channel (31) on both sides, the taking and placing channel (31) is provided in a "U" shape, and the bottom of the taking and placing channel (31) is flush with the bottom of the test space (3).

3. The semiconductor chip test structure of claim 1, wherein: The surface of the test fixture (2) is uniformly provided with four guide columns (45), the connecting plate (41) at the top of the guide column (45) is provided in a rectangular shape, the mounting plate (42) on the inner wall of the connecting plate (41) is provided in a trapezoidal shape on both sides, and the mounting plate (42) is provided in a circular shape in the middle.

4. The semiconductor chip test structure of claim 1, wherein: The areas of the driving plate (46), the butt joint plate (47) and the soft pad (48) are consistent, the driving plate (46), the butt joint plate (47) and the soft pad (48) are sequentially provided in a layered manner from top to bottom, and the driving plate (46), the butt joint plate (47) and the soft pad (48) are vertically lifted by the driving cylinder (44).

5. A semiconductor chip test structure according to claim 4, wherein: The bottom of the driving plate (46) is provided with a positioning groove (461) on both sides, the surface of the butt joint plate (47) is provided with a positioning strip (471) on both sides, the size of the positioning strip (471) and the positioning groove (461) is matched, and the inside of the two positioning grooves (461) is inserted with the positioning strip (471).

6. A semiconductor chip test structure according to claim 5, wherein: The cross section of the positioning strip (471) and the positioning groove (461) is provided in a dovetail shape, the driving plate (46) and the butt joint plate (47) are positioned and installed through the two positioning strips (471) and the positioning grooves (461); the two ends of the driving plate (46) are provided with two guide plates (43), and the guide column (45) is inserted into the guide hole in the guide plate (43).

7. The semiconductor chip test structure of claim 4, wherein: The bottom of the soft pad (48) is uniformly provided with a plurality of convex blocks (481), the convex blocks (481) are provided in a semispherical shape, and the bottom of the soft pad (48) is uniformly provided with a plurality of flow-through grooves (482), and the flow-through grooves (482) are inserted between the plurality of convex blocks (481).

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