Thin film capacitor
By setting a support structure between the insulating shell and the outer shell, the problem of uneven potting of film capacitors is solved, and uniform filling of sealant and improvement of electrical performance are achieved.
Patent Information
- Application Number
- CN202520029672.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-01-07
AI Technical Summary
Existing film capacitors are prone to unevenness or voids during the encapsulation process, which affects their electrical performance.
A support structure is set between the insulating shell and the outer shell to form a gap so that the sealant can be filled evenly. The support structure can be a ring or multiple support columns, evenly distributed on the end face of the insulating shell, with a height of 1/2 to 1 of the thickness of the insulating shell.
Ensuring uniform filling of the sealant improves the electrical performance and protective effect of the film capacitor, avoiding problems such as voids and low filling rate.
Smart Images
Figure CN223858021U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of capacitor especially, relates to a film capacitor. BACKGROUND
[0002] The organic film capacitor is also commonly called as a film capacitor, is a capacitor prepared based on organic film material as medium, and the basic structure is that capacitor core is installed in the plastic shell and is filled with sealing glue, the sealing glue is generally epoxy resin, and electrodes are led out from both ends of the capacitor core and located outside the plastic shell. The organic film capacitor has the advantages of small size, light weight and low cost, and is widely used in the fields of civil power electronic devices such as aerospace and new energy.
[0003] In the preparation process of the film capacitor, the capacitor core is placed in the shell, and the capacitor core is protected by setting an insulating shell outside the capacitor core, and then the sealing glue is filled. When the sealing glue is filled, the capacitor core is located in the insulating shell, therefore, the capacitor core and the insulating shell will press on the shell, and the gap between the insulating shell and the shell is small or even no gap, which leads to the uneven filling of the sealing glue when the sealing glue is filled, and even the gap between the insulating shell and the shell is not filled with the sealing glue, which leads to the low filling rate of the sealing glue and greatly affects the performance of the film capacitor. UTILITY MODEL CONTENTS
[0004] In view of the above defects or deficiencies in the prior art, it is desirable to provide a film capacitor.
[0005] In a first aspect, a film capacitor is provided, comprising:
[0006] A shell is provided with an opening.
[0007] A capacitor core is installed in the accommodating cavity of the shell.
[0008] An insulating shell is wrapped around the capacitor core, and the insulating shell and the shell have a space for filling the sealing glue, and the end face of the insulating shell away from the opening is provided with a support structure, which is uniformly distributed on the end face of the insulating shell and used to provide a gap between the end face of the insulating shell away from the opening and the shell.
[0009] As a realizable way, the height of the support structure is 1 / 2-1 of the thickness of the insulating shell.
[0010] As a realizable way, the support structure is a continuous ring.
[0011] As a realizable way, the outer diameter of the support structure is 1 / 2-1 / 3 of the diameter of the insulating shell.
[0012] As a realizable manner, the support structure is a plurality of support columns regularly distributed, and the support columns are circular in cross section.
[0013] As a realizable manner, the plurality of support columns are distributed in an array or in a ring.
[0014] As a realizable manner, each of the support columns is identical in structure.
[0015] As a realizable manner, the support structure is integrally formed with the insulating shell.
[0016] According to the technical scheme provided in the embodiments of the present application, by arranging the support structure on the end surface of the insulating shell close to the shell, when the insulating shell wrapping the capacitor core is placed in the shell, and then the glue filling process is performed, the support structure on the end surface of the insulating shell forms a gap between the insulating shell and the shell. In the glue filling process, the glue can fill between the insulating shell and the shell through the gap, and is fully filled between the end surface of the insulating shell and the shell. The filled glue is fully and uniformly distributed in the gap, and in this structure, the glue filling does not have the problem of voids or low filling rate. The glue fully wraps the insulating shell, protects the film capacitor to a certain extent, and accordingly ensures the electrical performance of the film capacitor. BRIEF DESCRIPTION OF DRAWINGS
[0017] Other features, objects, and advantages of the present application will become more apparent from the following detailed description of non-limiting embodiments with reference to the attached drawings:
[0018] Figure 1 FIG. 1 is a schematic view of an insulating shell in a film capacitor in the present embodiment;
[0019] Figure 2 FIG. 2 is a sectional view of FIG. 1; Figure 1
[0020] Figure 3 FIG. 3 is another schematic view of an end surface of the insulating shell in the present embodiment;
[0021] Figure 4 FIG. 4 is a schematic view of a structure of a film capacitor in the present embodiment.
[0022] BRIEF DESCRIPTION OF DRAWINGS
[0023] DETAILED DESCRIPTION
[0024] The application will be described in further detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the application, and not to limit the application. In addition, it should be noted that only parts related to the application are shown in the drawings for ease of description.
[0025] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and embodiments.
[0026] Please refer to Figure 1 and Figure 2 The present embodiment provides a film capacitor, comprising:
[0027] A shell 20 is provided with an opening;
[0028] A capacitor core is mounted in the accommodating cavity of the shell 20;
[0029] An insulating shell 10 is wrapped on the capacitor core, and a space for filling sealant is provided between the insulating shell 10 and the shell 20. An end surface 11 of the insulating shell 10 away from the opening is provided with a support structure 12, which is uniformly distributed on the end surface 11 of the insulating shell 10, and is used to provide a gap 30 between the end surface 11 of the insulating shell 10 and the shell 20.
[0030] In the film capacitor of the present embodiment, the insulating shell 10 is wrapped on the capacitor core, and the gap between the insulating shell 10 and the shell 20 is used to fill the sealant. By providing the support structure 12 on the end surface 11 of the insulating shell 10 close to the shell 20, when the insulating shell 10 wrapped on the capacitor core is placed inside the shell 20, and the subsequent filling process is carried out, the support structure 12 on the end surface 11 of the insulating shell 10 forms a certain gap 30 between the insulating shell 10 and the shell 20. In the filling process, the sealant can fill between the insulating shell 10 and the shell 20 through the gap, and can be fully filled between the end surface 11 of the insulating shell 10 and the shell 20. The filled sealant can be fully and uniformly distributed in the gap, and under this structure, the filling of the sealant will not have voids or low filling rate. The sealant fully wraps the insulating shell 10, which protects the film capacitor to some extent, and accordingly ensures the electrical performance of the film capacitor.
[0031] Figure 1 and Figure 2 Only the structure of the insulating shell 10 is given, Figure 4 The basic structure of the capacitor is given, and the capacitor in the present embodiment includes a capacitor core ( Figure 4The capacitor core is placed inside the shell 20, and the capacitor core is protected by wrapping the capacitor core with the insulating shell 10, and the gap 30 between the insulating shell 10 and the shell 20 is filled by the opening on the shell 20, so that the end surface 11 of the insulating shell 10 is close to or attached to the shell 20 during the filling of the glue. The present embodiment provides a support structure 12 on the end surface 11 of the insulating shell 10, which has a certain height, so that a small gap is formed between the end surface 11 of the insulating shell 10 and the shell 20. The gap can accommodate the filling glue, so that the filling glue can be evenly distributed between the end surface 11 of the insulating shell 10 and the shell 20. In this way, the filling glue between the insulating shell 10 and the shell 20 can be evenly distributed, and the filling glue can be evenly distributed to protect the capacitor core in multiple directions.
[0032] The support structure 12 provided on the end surface 11 of the insulating shell 10 in the present embodiment can have various forms. For example, the insulating shell 10 is made of plastic material, and PP (Polypropylene) plastic is preferably used. The support structure 12 can also be made of plastic material or other materials, which is connected to other parts of the insulating shell 10 according to actual needs.
[0033] As shown in Figure 2 The support structure 12 in the present embodiment is mainly used to support the end surface 11 of the insulating shell 10, so that a gap is formed between the end surface 11 of the insulating shell 10 and the shell 20, so that the filling glue can fill the gap. The gap between the insulating shell 10 and the shell 20 will not have a gap due to the gravity of the insulating shell 10 and the capacitor core. In order to make the filling glue more uniform and better flow in the gap during filling, the support structure 12 needs to be evenly arranged on the end surface 11 of the insulating shell 10 to evenly support the insulating shell 10, so that the gap between the insulating shell 10 and the shell 20 is balanced everywhere, and the filling glue flows better in the gap, and then the gap is filled.
[0034] Optionally, the height of the support structure 12 is 1 / 2-1 of the thickness of the insulating shell 10.
[0035] As shown in Figure 1 The height of the support structure 12 in the present embodiment can be determined according to the thickness of the insulating shell 10. Preferably, the height of the support structure 12 is greater than half the thickness of the insulating shell 10, so as to support the insulating shell 10. For example, the height of the support structure 12 is preferably set to be between 1.2mm and 1.5mm, which can adapt to the structure of most film capacitors.
[0036] Optionally, the support structure 12 is a continuous ring.
[0037] like Figure 2 As shown, in this embodiment, the support structure 12 is preferably arranged in the form of a ring. The ring structure provides uniform support for the insulating shell 10, effectively supporting the insulating shell 10 and forming a gap between the end face 11 of the insulating shell 10 and the outer shell 20. In this embodiment, the top surface of the ring support mechanism, that is, the surface near the outer shell 20, can be set as a plane, i.e. Figure 1 and Figure 2 The structure shown can also have its top surface of the annular support structure 12 set as an arc shape, so that the support structure 12 not only has the ability to support the insulating shell 10, but also has a smaller contact area with the outer shell 20. Thus, when the filler is injected, the filler can be quickly and evenly filled between the insulating shell 10 and the outer shell 20, including the position of the end face 11 of the insulating shell 10, so that the filling effect of the filler is better.
[0038] Optionally, the outer diameter of the support structure 12 is 1 / 2 to 1 / 3 of the diameter of the insulating shell 10.
[0039] In this embodiment, the dimensions of the support structure 12 are also related to the dimensions of the insulating shell 10. The larger the insulating shell 10, the larger the diameter of the support structure 12. This support structure 12 provides sufficient support for the insulating shell 10, preventing the edge of the large insulating shell 10 from still contacting the outer shell 20, thus ensuring smooth and uniform filling of the adhesive. The width of the support structure 12 is selected according to actual needs, and the width is positively correlated with the dimensions of the insulating shell 10. The larger the size of the insulating shell 10, the larger the width of the support structure 12.
[0040] Optionally, the support structure 12 consists of a plurality of regularly spaced support columns, the cross-section of which is circular.
[0041] like Figure 3 As shown in the figure, this embodiment provides another way of setting the support structure 12. In this embodiment, the support structure 12 is configured as a plurality of dispersed support pillars. These pillars provide multi-position support for the insulating shell 10, forming a gap between the end face 11 of the insulating shell 10 and the outer shell 20, as described in the previous embodiment. Furthermore, the dispersed support pillar structure ensures that the resulting gap structure is interconnected. During the injection of filler adhesive, the adhesive can flow more smoothly within the gap, resulting in more uniform filling and a better injection effect.
[0042] The insulating shell 10 in the embodiment is generally made of plastic, and preferably the same plastic material is used for the support column. In order to facilitate the preparation of the insulating shell 10 and the support column, the cross section of the support column is preferably circular, and the preparation process of the insulating shell 10 is simpler, and the component is easy to obtain.
[0043] Optionally, the plurality of support columns are arranged in an array or a ring.
[0044] As shown in FIG. 1, Figure 3 one of the ways in which the plurality of support columns are arranged, Figure 3 the support columns are arranged in an array, which can be selected according to the preparation mold of the insulating shell 10 and other environmental factors. For example, the plurality of support columns are arranged in a ring to form the ring structure shown in FIG. 2, forming an intermittent support form. Figure 2
[0045] In addition, the number of support columns in the embodiment is determined according to the size of the single support column and the size of the insulating shell 10. The sum of the cross sections of the plurality of support columns can be set to about 20% of the area of the end surface 11 of the insulating shell 10, and the plurality of support columns are dispersed to support the insulating shell 10 and the capacitor core inside. Preferably, the structure of each support column is the same, so that the support effect of each support column on the insulating shell 10 is the same, and different support columns at different positions do not have different support capabilities, and thus the gap is not uniform. In this case, the filling glue can protect the capacitor structure in multiple directions, and the protection effect at each position is good.
[0046] Optionally, the support structure 12 is integrally formed with the insulating shell 10.
[0047] In the above embodiment, the insulating shell 10 and the support structure 12 are preferably made of plastic material, and the two are integrally formed. One mold is used for direct preparation, which saves the process steps. The preparation of the insulating shell 10 can simultaneously have the support structure 12, and the installation and use are more convenient.
[0048] In the embodiment, the support structure 12 is arranged on the insulating shell 10 in the film capacitor, and the modification forms a gap between the end surface 11 of the insulating shell 10 and the shell 20. When filling the filling glue of the film capacitor, the filling glue can be uniformly and fully filled between the insulating shell 10 and the shell 20, and the filling rate of the filling glue is high and the filling is uniform.
[0049] It should be understood that the above-mentioned terms "center", "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application; the orientation terms "inner" and "outer" refer to the inner and outer of the contour of each component itself. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features.
[0050] For the convenience of description, spatial relative terms such as "over", "above", "upper surface", "upper", etc. can be used herein to describe the spatial positional relationship of one device or feature with respect to other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the devices described in the drawings. For example, if the devices in the drawings are inverted, the device described as "above" or "over" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned 90 degrees or in other orientations in other different ways, and the spatial relative descriptions used herein are interpreted accordingly.
[0051] The above description is only the preferred embodiment of the present application and the explanation of the technical principles applied. Those skilled in the art should understand that the utility model range involved in the present application is not limited to the technical solutions formed by the specific combination of the above technical features, and should also cover other technical solutions formed by any combination of the above technical features or their equivalent features without departing from the utility model concept. For example, the technical solutions formed by mutually replacing the above features with the technical features disclosed in the present application (but not limited to) having similar functions.
Claims
1. A thin film capacitor, characterized by, The application relates to a capacitor, comprising: a shell provided with an opening; a capacitor core mounted in a containing cavity of the shell; an insulating shell wrapped on the capacitor core, and a space for filling sealant being arranged between the insulating shell and the shell; and an end surface of the insulating shell away from the opening being provided with support structures which are uniformly distributed on the end surface of the insulating shell and used for providing a gap between the end surface of the insulating shell away from the opening and the shell. The height of the support structures is 1 / 2-1 of the thickness of the insulating shell. The support structures are continuous annular structures. The outer diameter of the support structures is 1 / 2-1 / 3 of the diameter of the insulating shell.
2. The thin film capacitor of claim 1, wherein The support structures are regularly distributed support columns, and the cross sections of the support columns are circular.
3. The thin film capacitor of claim 2, wherein The support columns are arrayed or annularly distributed.
4. The thin film capacitor of claim 3, wherein Each of the support columns is of the same structure.
5. The thin film capacitor of claim 2, wherein The support structures are integrally formed with the insulating shell.
6. The thin film capacitor of claim 5, wherein 7. The thin film capacitor of claim 5, wherein 8. The thin film capacitor of claim 1 wherein,