Controller device and operation equipment
By using soldered components and a removable functional board design in the controller, the problems of increased installation difficulty and low heat dissipation efficiency caused by the increased number of circuit boards are solved, achieving lightweight and efficient heat dissipation of the controller and improving the user experience.
Patent Information
- Application Number
- CN202423240996.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-26
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-26
AI Technical Summary
The increased number of circuit boards in existing controllers leads to increased installation difficulty and weight, and the low heat dissipation efficiency of power devices affects the operating efficiency of the controller.
Power components are mounted on the substrate using welded components, heat is transferred using highly thermally conductive materials, and space is planned through detachable functional boards to reduce the number of parts and weight.
It improves heat dissipation efficiency, reduces the size and weight of the controller, and enhances the user experience and operating efficiency.
Smart Images
Figure CN223859306U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of electrical equipment, in particular to a controller device and a running equipment. BACKGROUND
[0002] In the prior art, with the increase of the functions of the controller, the number of circuit boards contained in the controller also increases, and in order to reasonably plan the arrangement of the circuit boards in the controller, a support plate is generally added to the controller to plan the space, and then the circuit boards are installed on the support plate. This increases the number of parts in the controller, increases the installation difficulty, increases the weight of the controller, and affects the convenience of the controller. In the controller, the power device and the substrate are connected in the form of a thermal paste sheet, a ceramic sheet, and a thermal conductive silicone grease, the thermal resistance is high, the heat dissipation efficiency of the power device is affected, and the running efficiency of the controller is affected. CONTENT OF THE UTILITY MODEL
[0003] In order to solve the above technical problems, the present application provides a controller device, comprising:
[0004] a substrate and a welding piece;
[0005] a power assembly arranged on the substrate through the welding piece, and heat generated by the power assembly is transmitted to the substrate through the welding piece;
[0006] at least one function board, each of which is provided with a corresponding function assembly, and each of which is detachably arranged on the substrate;
[0007] Among them, one of the function boards of the at least one function board is arranged in parallel with the substrate to form a first accommodating space, and the power assembly is located in the first accommodating space.
[0008] Among them, the at least one function board includes a first function board, and the controller device further includes at least one support column, the first function board is arranged in parallel with the substrate through the support column, and the first function board is arranged in parallel with the substrate to form the first accommodating space.
[0009] Among them, the at least one function board further includes a second function board, a third function board and a fourth function board, the second function board, the third function board and the fourth function board are detachably installed on the first function board, and the second function board, the third function board and the fourth function board are all arranged perpendicularly to the first function board.
[0010] The second functional plate is arranged perpendicularly to the third functional plate, the third functional plate is arranged perpendicularly to the fourth functional plate, and the second functional plate and the fourth functional plate are located on the same side of the third functional plate.
[0011] The fifth functional plate is detachably connected to one end of the second functional plate away from the first functional plate, one end of the third functional plate away from the first functional plate, and one end of the fourth functional plate away from the first functional plate.
[0012] The first functional plate, the second functional plate, the third functional plate, the fourth functional plate, and the fifth functional plate form a second accommodation space.
[0013] The sixth functional plate is located in the second accommodation space, and the sixth functional plate is detachably connected to the first functional plate through the support column.
[0014] The first functional plate and the fifth functional plate are provided with a plurality of clamping grooves, the second functional plate, the third functional plate, and the fourth functional plate are provided with protrusions corresponding to the clamping grooves, the second functional plate, the third functional plate, and the fourth functional plate are detachably connected to the first functional plate through cooperation of the protrusions and the clamping grooves, and the second functional plate, the third functional plate, and the fourth functional plate are detachably connected to the fifth functional plate through cooperation of the protrusions and the clamping grooves.
[0015] The substrate is an aluminum-silicon-carbon plate.
[0016] To solve the above technical problems, the application further provides a running device comprising the controller device and a running device, wherein the controller device is connected to the running device to control the running of the running device.
[0017] The running device further comprises a heat dissipation device, the controller device is arranged on the heat dissipation device, the substrate of the controller device is attached to the heat dissipation device, heat generated in the controller device is transmitted to the heat dissipation device through the substrate, and the heat dissipation device is used for dissipating heat for the controller device.
[0018] The beneficial effects of the present application: Different from the prior art, the controller device provided by the present application comprises a substrate, a welding part, a power component and at least one functional plate. The power component is arranged on the substrate through the welding part, and then the heat generated by the power component is transmitted to the substrate through the welding part, without the need to additionally arrange a material with high thermal resistance to connect the power component and the substrate, thereby improving the heat dissipation efficiency of the power component. Each of the at least one functional plate is provided with a corresponding functional component, and the functional plate is detachably arranged on the substrate, wherein one of the at least one functional plate is arranged in parallel with the substrate to form a first accommodating space, and the power component is located in the first accommodating space, thereby realizing reasonable planning of the space in the controller device, realizing the reduction of the volume of the controller device, directly using the functional plate to detachably connect the substrate, without the need to additionally arrange a support plate for support, reducing the number of parts in the controller device, reducing the weight of the controller device, and improving the user experience of the controller device. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0020] Among them:
[0021] Figure 1 is a structural schematic diagram of an embodiment of the controller device of the present application;
[0022] Figure 2 is Figure 1 is an exploded structural schematic diagram of the controller device in
[0023] Figure 3 is a structural schematic diagram of another embodiment of the controller device of the present application.
[0024] Drawing reference: controller device 1; substrate 11; welding part 12; power component 13; functional plate 14; first functional plate 141; second functional plate 142; third functional plate 143; fourth functional plate 144; fifth functional plate 145; sixth functional plate 146; support column 15; clamping groove 16; male part 17. DETAILED DESCRIPTION
[0025] The schemes of the embodiments of the present application will be described in detail below in combination with the drawings of the specification.
[0026] In the following description, specific details such as specific system structures, interfaces, techniques, etc. are presented in order to thoroughly understand the present application, but not for limitation.
[0027] Reference within this application to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase "in an embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily mutually exclusive of one another. It is expressly understood that any of the embodiments described herein can be incorporated in to another embodiment.
[0028] The term "and / or" in this application merely describes an associated relationship between associated objects, which means that there can be three relationships, for example, A and / or B can represent the following three cases: A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in this application generally represents an "or" relationship between the associated objects. In addition, "multiple" in this application means two or more than two. In addition, the term "at least one" in this application means any one of the multiple or any combination of at least two of the multiple, for example, including at least one of A, B and C can mean including any one or more elements selected from the set consisting of A, B and C. In addition, the terms "first", "second", "third" in this application are only for description purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features.
[0029] When the number of PCBs (Printed Circuit Boards) in the existing controller is more than 3, each PCB needs a support plate to be fixed inside the controller, which increases the number of parts in the controller, and in turn increases the weight of the controller, and the volume of the controller, and occupies space. The power device of the controller is usually connected to the substrate in the form of a silicone sheet, a ceramic sheet, and a heat-conducting silicone grease, which has a high thermal resistance and affects the heat dissipation efficiency of the controller.
[0030] To solve the above technical problems, please refer to Figure 1 and Figure 2 , Figure 1 is a structural schematic diagram of an embodiment of the controller device of the application, Figure 2 is Figure 1 an exploded structural schematic diagram of the controller device. The controller device 1 provided by the embodiment of the application includes a substrate 11, a welding part 12, a power component 13 and at least one functional board 14. The power component 13 can be a power element such as a MOS tube and a diode.
[0031] In this embodiment, the power component 13 can be mounted on the substrate 11 via a solder joint 12, and the heat generated by the power component 13 is transferred to the substrate 11 through the solder joint 12. For example, the solder joint 12 can be a DBC (Direct Bonding Copper) soldering board, and the user can create a space on the DBC soldering board to accommodate the power component 13, thereby mounting the power component 13 on the substrate 11 via the DBC soldering board. Since the DBC soldering board has high thermal conductivity, it solves the problem of high thermal resistance between the power component 13 and the substrate 11 in the prior art, which affects the heat dissipation efficiency of the power component 13. This embodiment improves the heat dissipation efficiency of the power component 13 by using the solder joint 12 to mount the power component 13 on the substrate 11, and the heat generated by the power component 13 is transferred to the substrate 11 through the solder joint 12, thereby improving the heat dissipation efficiency of the controller device 1, enhancing the practicality of the controller device 1, and improving the user experience of the controller device 1.
[0032] Furthermore, each functional board 14 is equipped with corresponding functional components, wherein the functional board 14 is the PCB mentioned above. The functional board 14 is directly and detachably mounted on the substrate 11 without the need for additional support plates for installation. This allows for reasonable planning of the internal space of the controller device 1, while eliminating the need for additional support plates to assist in the installation of the functional board 14. This reduces the number of internal parts of the controller device 1, decreases its weight, and reduces its size.
[0033] In one embodiment, the substrate 11 can be an aluminum silicon carbon plate, which has the advantages of low raw material cost, high thermal conductivity, low density and strong plasticity. When used as the substrate 11, it will not be deformed due to the setting of power components 13, etc., and has good stability. It can also easily transfer the heat generated by the power components 13, thereby improving the heat dissipation efficiency of the power components 13.
[0034] In other embodiments, the substrate 11 may also be made of copper or aluminum plates, but copper plates are too heavy and will affect the weight of the controller device 1, while aluminum plates are lightweight but are easily deformed under force. Therefore, in this application, the substrate 11 is preferably made of aluminum silicon carbon plate to improve the heat dissipation efficiency of the controller device 1.
[0035] Among them, such as Figure 2 As shown, one of the functional boards 14 is arranged parallel to the substrate 11 to form a first accommodating space, and the power component 13 is located in the first accommodating space. This achieves a reasonable division of the internal space of the controller device 1, reduces the size of the controller device 1, and improves the user experience of the controller device 1.
[0036] Optionally, at least one function board 14 includes a first function board 141, wherein the first function board 141 may be a power circuit board for power operation in the controller device 1.
[0037] The controller device 1 further includes a support column 15. The first functional board 141 can be spaced apart from the substrate 11 by the support column 15 and is arranged parallel to the substrate 11 to form a first accommodating space.
[0038] Specifically, the support column 15 can be placed between the substrate 11 and the first functional board 141, and then the support column 15 can be fixed to the substrate 11 and the first functional board 141 respectively with screws, so that the first functional board 141 and the substrate 11 are connected by the support column 15, and the support column 15 makes the first functional board 141 and the substrate 11 spaced apart, forming a first accommodating space between the first functional board 141 and the substrate 11 for the power component 13 to be installed, thus dividing the internal space of the controller device 1.
[0039] In one embodiment, the support column 15 may be disposed on the first functional plate 141, and the substrate 11 may be connected to the support column 15 by screws, thereby realizing the detachable connection between the first functional plate 141 and the substrate 11.
[0040] In another embodiment, countersunk holes can be made on the substrate 11, and countersunk bolts can be used to connect the substrate 11 to the support column 15 to ensure that there are no protrusions on the bottom surface of the substrate 11 and to ensure the stability of the substrate 11.
[0041] In other embodiments, other structures may be used to connect the first functional plate 141 to the support post 15 and the substrate 11 to the support post 15, such as snap-fit, etc. This application does not impose specific limitations on this.
[0042] Optionally, at least one function board 14 may further include a second function board 142, a third function board 143, and a fourth function board 144. The second function board 142 may be a power supply circuit board for supplying power to the controller device 1; the third function board 143 may be a driver circuit board for amplifying signals in the controller device 1; and the fourth function board 144 may be a conversion circuit board for converting circuits in the controller device 1.
[0043] The second function board 142, the third function board 143 and the fourth function board 144 are detachably installed on the first function board 141, and the second function board 142, the third function board 143 and the fourth function board 144 are all arranged perpendicularly to the first function board 141.
[0044] Specifically, such as Figure 3 As shown, Figure 3is a structural schematic diagram of another embodiment of the controller device of the present application. The first function board 141 can be provided with a plurality of card slots 16. The second function board 142, the third function board 143 and the fourth function board 144 are provided with a plurality of protrusions 17 corresponding to the card slots 16 at the end of the first function board 141. The second function board 142, the third function board 143 and the fourth function board 144 can be detachably connected to the first function board 141 through the cooperation of the card slots 16 and the protrusions 17. In the case of connecting the second function board 142, the third function board 143 and the fourth function board 144 to the first function board 141, the cooperation of the card slots 16 and the protrusions 17 can realize the installation and positioning between the function boards 14, and also realize the mutual connection of the pins on the function boards 14, reduce the installation difficulty between the function boards 14, improve the installation efficiency between the function boards 14, and improve the user experience of the controller device 1.
[0045] In an embodiment, a protrusion or the like can be provided on the surface of the first function board 141. The second function board 142, the third function board 143 and the fourth function board 144 can be connected to the protrusion by screws or the like, so as to improve the stability of the connection between the second function board 142, the third function board 143, the fourth function board 144 and the first function board 141.
[0046] Among them, as shown in Figure 2 The second function board 142 can be arranged vertically with the third function board 143, the third function board 143 can be arranged vertically with the fourth function board 144, and the second function board 142 and the fourth function board 144 are located on the same side of the third function board 143. In order to divide the internal space of the controller device 1.
[0047] Further, the at least one function board 14 further comprises a fifth function board 145. The fifth function board 145 can be an interface circuit board, so that the external circuit can be electrically connected to the controller device 1 through the interface circuit board.
[0048] Among them, the fifth function board 145 can be detachably connected to the end of the second function board 142 away from the first function board 141, the end of the third function board 143 away from the first function board 141, and the end of the fourth function board 144 away from the first function board 141.
[0049] Specifically, the fifth function board 145 may also be provided with multiple slots 16, and the ends of the second function board 142, the third function board 143, and the fourth function board 144 near the fifth function board 145 may be provided with multiple protrusions 17 corresponding to the slots 16. Thus, the second function board 142, the third function board 143, and the fourth function board 144 can be detachably connected to the fifth function board 145 through the cooperation of the slots 16 and the protrusions 17. When the second function board 142, the third function board 143, the fourth function board 144 and the fifth function board 145 are connected, the cooperation of the slots 16 and the protrusions 17 enables proper positioning of each function board 14 during installation, reduces the installation difficulty of connecting the function boards 14, improves the installation efficiency of connecting the function boards 14, and enhances the user experience of the controller device 1.
[0050] In one embodiment, a protrusion or the like can be provided on the surface of the fifth functional plate 145, so that the second functional plate 142, the third functional plate 143 and the fourth functional plate 144 can be connected to the protrusion by screws or the like, so as to improve the stability of the connection between the second functional plate 142, the third functional plate 143 and the fourth functional plate 144 and the fifth functional plate 145.
[0051] Furthermore, the first functional board 141, the second functional board 142, the third functional board 143, the fourth functional board 144, and the fifth functional board 145 form a second accommodating space, which can accommodate other devices of the controller device 1, improve the division of the internal space of the controller device 1, realize the compactness of the functional board 14, and reduce the size of the controller device 1.
[0052] Optionally, at least one function board 14 may also include a sixth function board 146, which may be a capacitor circuit board used to filter and perform other processing on the internal circuit of the controller device 1 to improve the current quality inside the controller device 1.
[0053] Among them, such as Figure 3 As shown, the sixth function board 146 can have a large volume, so the sixth function board 146 can be placed in the second accommodating space. The sixth function board 146 can be detachably connected to the first function board 141 through the support column 15, separating the sixth function board 146 from the first function board 141. This prevents the sixth function board 146 from squeezing the functional components on the first function board 141 and causing damage to the functional components on the first function board 141, thereby improving the safety and stability of the controller device 1.
[0054] And by placing the sixth functional board 146 in the second accommodating space formed by the first functional board 141, the second functional board 142, the third functional board 143, the fourth functional board 144, and the fifth functional board 145, the utilization rate of the internal space of the controller device 1 is improved, the internal control of the controller device 1 is reasonably divided, the compactness of the arrangement of the functional boards 14 is realized, the setting volume of the controller device 1 is effectively reduced, and the user experience of the controller device 1 is improved.
[0055] To sum up, in the controller device 1 of the present application, the power assembly 13 is installed on the substrate 11 by the welding member 12, the heat dissipation efficiency of the power assembly 13 is improved. And by the detachable connection between the functional boards 14, the internal space of the controller device 1 can be reasonably planned, the utilization rate of the internal space of the controller device 1 is improved, the compactness of the arrangement of the functional boards 14 is realized, the setting volume of the controller device 1 is effectively reduced, and the user experience of the controller device 1 is improved.
[0056] The present application also provides a running device (not shown in the figure), which comprises the controller device 1 and the running device as described above. The controller device 1 can be connected with the running device, and the controller device 1 can control the running device to control the running of the running device.
[0057] Optionally, the running device can further comprise a heat dissipation device, such as a radiator, etc. The controller device 1 is arranged on the heat dissipation device, and the substrate 11 of the controller device 1 is attached to the heat dissipation device. Thus, the heat generated in the controller device 1 can be transmitted to the heat dissipation device through the substrate 11, and the heat dissipation device is used for dissipating heat for the controller device 1, and the heat dissipation efficiency of the controller device 1 in the running device.
[0058] The above is only an embodiment of the present application, and does not limit the patent scope of the present application. Any equivalent structure or equivalent process transformation using the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the present application.
Claims
1. A controller device, characterized by The controller device comprises: a substrate and a soldering piece; a power assembly arranged on the substrate through the soldering piece, and heat generated by the power assembly is transferred to the substrate through the soldering piece; at least one functional board, each of which is arranged with a corresponding functional assembly, and each of which is detachably arranged on the substrate; wherein one of the functional boards is arranged in parallel with the substrate to form a first accommodating space, and the power assembly is located in the first accommodating space.
2. The controller device of claim 1, wherein, The at least one functional board comprises a first functional board, and the controller device further comprises at least one supporting column, the first functional board is arranged in parallel with the substrate through the supporting column, and the first functional board is arranged in parallel with the substrate to form the first accommodating space.
3. The controller device of claim 2, wherein, The at least one functional board further comprises a second functional board, a third functional board and a fourth functional board, the second functional board, the third functional board and the fourth functional board are detachably mounted on the first functional board, and the second functional board, the third functional board and the fourth functional board are arranged perpendicularly to the first functional board.
4. The controller device of claim 3, wherein, The second functional board is arranged perpendicularly to the third functional board, the third functional board is arranged perpendicularly to the fourth functional board, and the second functional board and the fourth functional board are located on the same side of the third functional board.
5. The controller device of claim 3, wherein, The at least one functional board further comprises a fifth functional board, the fifth functional board is detachably connected to an end of the second functional board, an end of the third functional board and an end of the fourth functional board away from the first functional board; wherein the first functional board, the second functional board, the third functional board, the fourth functional board and the fifth functional board form a second accommodating space.
6. The controller device of claim 5, wherein, The at least one functional board further comprises a sixth functional board, the sixth functional board is located in the second accommodating space, and the sixth functional board is detachably connected to the first functional board through the supporting column.
7. The controller device of claim 5, wherein, The first functional board and the fifth functional board are provided with a plurality of clamping grooves, and the second functional board, the third functional board and the fourth functional board are provided with protrusions corresponding to the clamping grooves, the second functional board, the third functional board and the fourth functional board are detachably connected to the first functional board through the cooperation of the protrusions and the clamping grooves, and the second functional board, the third functional board and the fourth functional board are detachably connected to the fifth functional board through the cooperation of the protrusions and the clamping grooves.
8. The controller device of claim 1, wherein, The substrate is an aluminum-silicon-carbon board.
9. An operating device characterized by comprising: The controller device comprises a controller device and a running device, the controller device is connected to the running device to control the running of the running device.
10. The operating device according to claim 9, characterized by The running device further comprises a heat dissipation device, the controller device is arranged on the heat dissipation device, and the substrate of the controller device is attached to the heat dissipation device, heat generated in the controller device is transferred to the heat dissipation device through the substrate, and the heat dissipation device is used for dissipating heat for the controller device.