Electric control assembly and gas water heating equipment

Abstract

The utility model discloses an electric control assembly and gas water heating equipment, and relates to the technical field of water heating equipment, the electric control assembly comprises a heat dissipation structure and at least two circuit boards, and the at least two circuit boards are arranged at intervals; the heat dissipation structure is arranged on one circuit board; and / or one circuit board is connected with at least one of the other circuit boards through the heat dissipation structure, so that heat dissipation is carried out through the heat dissipation structure and the connected circuit board. According to the technical scheme, the heat dissipation effect of the electric control assembly can be improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to hot water equipment technical field, especially a kind of electric control assembly and gas hot water equipment. BACKGROUND

[0002] At present, water heater generally uses fan, water pump and other motor, IGBT, MOS, IPM and other heat power devices on motor drive board will have certain resistance when conducting, and joule heat is generated when current passes, thereby generating heat, and there is off voltage when off, and the higher the off voltage, the greater the heat generated. Even, some heat power devices also need high-frequency switch to conduct or off, and high-frequency switch also generates certain heat when switching, and the higher the switching frequency, the greater the heat generated, if not timely heat dissipation, it is easy to affect the normal work of device on motor drive board, and even seriously damage device, even can bring safety hazard. SUMMARY

[0003] The utility model discloses a kind of electric control assembly and gas hot water equipment, to improve the heat dissipation effect of electric control assembly.

[0004] To achieve the above object, the electric control assembly provided by the utility model comprises:

[0005] At least two circuit boards, at least two the circuit boards are arranged at intervals between them;

[0006] Heat dissipation structure, is arranged on one of the circuit boards;

[0007] And / or, one of the circuit boards is connected to the remaining at least one circuit board by the heat dissipation structure, to dissipate heat with the connected circuit board by the heat dissipation structure.

[0008] In an embodiment, the heat dissipation structure comprises:

[0009] Heat dissipation medium, the heat dissipation medium is arranged between at least two the circuit boards.

[0010] In an embodiment, the heat dissipation structure comprises:

[0011] Heat sink, the heat sink is arranged on one of the circuit boards, and the side away from another circuit board.

[0012] In an embodiment, the heat dissipation structure further comprises:

[0013] Thermal conductive medium, is arranged between the heat sink and the circuit board.

[0014] In an embodiment, the heat dissipation structure further comprises:

[0015] A first fixing buckle is arranged on the circuit board for fixing the heat sink to the circuit board.

[0016] In an embodiment, the heat dissipation structure comprises:

[0017] A pin seat is arranged on one of the circuit boards.

[0018] A pin is arranged on the pin seat, and the other end of the pin is fixed to the corresponding circuit board through a pin hole arranged on the other circuit board.

[0019] In an embodiment, the circuit board has a first side surface and a second side surface arranged opposite to each other, and the circuit board is provided with a heat dissipation via hole.

[0020] The electric control assembly further comprises:

[0021] A heat generating power device is arranged on the first side surface of the circuit board.

[0022] A heat dissipation layer is arranged on the first side surface and the second side surface, and the heat dissipation layer is connected through the heat dissipation via hole.

[0023] In an embodiment, the heat dissipation structure further comprises:

[0024] A second fixing buckle is arranged on the circuit board for connecting at least two circuit boards.

[0025] In an embodiment, the number of the circuit boards is two, one of which is a driving board, and the other is a main control board.

[0026] Alternatively, the number of the circuit boards is three, two of which are driving boards, and the other is a main control board, and the two driving boards are connected through the heat dissipation structure.

[0027] Alternatively, the number of the circuit boards is three, two of which are main control boards, and the other is a driving board, and the driving board is arranged between the two main control boards.

[0028] In an embodiment, the main control board is provided with a functional module, and the functional module comprises at least one of a switching power supply module, a flame sensing needle module, an ignition module, a gas valve control module, a gas proportional valve module, a sensor module, a temperature controller module, and a display module.

[0029] The utility model also provides a gas hot water equipment, the gas hot water equipment includes the electric control assembly as described above.

[0030] The present invention provides an electronic control component solution by spacing at least two circuit boards apart, which facilitates airflow between the different circuit boards and promotes natural cooling of the circuit boards. At least one circuit board is provided with a heat dissipation structure, which is used to absorb and dissipate heat from the circuit board, reducing the high temperature generated by the heat-generating power devices on the circuit board due to high power output, thereby maintaining the operating temperature of the circuit board and its heat-generating power devices within a safe range and ensuring the working efficiency and stability of the heat-generating power devices. And / or, the heat dissipation structure can serve as a connecting element, connecting one of the circuit boards to at least one other circuit board to form a more efficient heat dissipation path. Heat can be conducted between the connected circuit boards through the heat dissipation structure, thereby achieving a more uniform temperature distribution and more efficient heat dissipation, and thus improving the stability and reliability of the electronic control component. Attached Figure Description

[0031] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1 A schematic diagram of the structure of an embodiment of the electronic control component provided by this utility model;

[0034] Figure 2 for Figure 1 A schematic diagram of the floor plan;

[0035] Figure 3 A schematic diagram of another embodiment of the electronic control component provided by this utility model;

[0036] Figure 4 for Figure 3 A schematic diagram of the floor plan;

[0037] Figure 5 A schematic diagram of another embodiment of the electronic control component provided by this utility model;

[0038] Figure 6 A schematic diagram of another embodiment of the electronic control component provided by this utility model;

[0039] Figure 7 A schematic diagram of the planar layout structure of another embodiment of the electronic control component provided by this utility model;

[0040] Figure 8 The plane layout structure schematic diagram of the electric control assembly is shown in another embodiment of the utility model.

[0041] Explanation of reference numerals:

[0042] 100, electric control assembly;1, circuit board;S1, first side surface;S2, second side surface;101, heat dissipation via;11, first circuit board;12, second circuit board;13, third circuit board;14, fourth circuit board;15, fifth circuit board;16, sixth circuit board;17, seventh circuit board;18, eighth circuit board;2, heat dissipation structure;21, heat dissipation medium;22, heat sink;23, heat conduction medium;24, first fixed buckle;25, pin header;26, pin;27, pin hole;28, second fixed buckle;29, heat dissipation layer;3, heating power device;4, main control circuit;5, motor drive circuit;6, motor;61, fan;62, water pump;7, function module;71, switching power supply module;72, flame sensing needle module;73, ignition module;74, gas valve control module;75, gas proportional valve module;76, sensor module;77, temperature controller module;78, display module;8, communication circuit;9, connecting piece.

[0043] The realization, functional features and advantages of the utility model will be further described in combination with embodiments and with reference to the drawings. DETAILED DESCRIPTION

[0044] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0045] At present, water heaters commonly use motors such as fans and water pumps, circulate water flow through the water pump, adjust water flow, and discharge flue gas through the fan. As is known to all, whether it is a fan or a water pump, the IGBT, MOS, IPM and other heating power devices on the motor drive board will have a certain resistance when turned on, and will generate Joule heat when the current passes through, thereby generating heat. When turned off, there is an off voltage, the higher the off voltage, the more heat generated. Even some heating power devices need high-frequency switches to turn on or off, and the high-frequency switches will also generate some heat when switching, the higher the switching frequency, the more heat generated. If not promptly cooled, it is easy to affect the normal work of the devices on the motor drive board, and in severe cases, it may even damage the devices and even cause safety hazards.

[0046] The utility model provides a kind of electric control assembly 100, to improve the heat dissipation effect of electric control assembly 100.

[0047] In an embodiment of the utility model, refer to Figures 1 to 4 The electric control assembly 100 includes heat dissipation structure 2 and at least two circuit boards 1, at least two described circuit boards 1 are spaced apart;Heat dissipation structure 2 is arranged on at least one described circuit board 1;And / or, wherein one of the circuit boards 1 is connected to the remaining at least one circuit board 1 by the heat dissipation structure 2, to dissipate heat by the heat dissipation structure 2 and the connected circuit board 1.

[0048] The electric control assembly 100 is applied to gas water heating equipment, and the gas water heating equipment includes but is not limited to gas water heater, wall-hanging stove and the like. Take gas water heater as an example, the gas water heater can be the strong drum type gas water heater with fan 61 under, and also can be the strong suction type gas water heater with fan 61 upper;The gas water heater can be the positive burning type gas water heater with burner under, and also can be the inverted burning type gas water heater with burner upper, and specific model is not limited here. In the embodiment, the gas water heating equipment includes equipment main body, and equipment main body is used as the main component for realizing combustion and heat exchange of gas water heating equipment, and can include fan 61, burner and heat exchanger arranged from bottom to top. When gas water heating equipment works, high-temperature flue gas generated by combustion of burner flows to heat exchanger from top to bottom under the drive of fan 61. Equipment main body further includes water pump 62, and under the drive of water pump 62, external cold water is first transported to heat exchanger for heating via water inlet pipe, and hot water generated in heat exchanger is output to user water end via water outlet pipe.

[0049] The gas water heating device further comprises an electric control assembly 100, which is the control center of the gas water heating device and is mainly responsible for managing and regulating the operation of the gas water heating device. Specifically, the electric control assembly 100 is electrically connected with the fan 61, the burner, the heat exchanger and the water pump 62. When the gas water heating device is working, the electric control assembly 100 controls the burner to burn, controls the fan 61 to drive the high-temperature flue gas generated by the burning of the burner to the heat exchanger, controls the water pump 62 to transport external cold water to the heat exchanger through the water inlet end, and controls the heat exchanger to heat the external cold water. The electric control assembly 100 can include a main control circuit 4, a motor driving circuit 5 and a functional module 7 and other heat power devices 3. The main control circuit 4 can be implemented by using a microprocessor or a microcontroller, which is responsible for controlling the work of the burner and other devices according to a preset program; the motor driving circuit 5 is electrically connected with the main control circuit 4, the motor driving circuit 5 can be connected with the motor 6 through the connecting piece 9, wherein the motor 6 can be the fan 61 and / or the water pump 62, the motor driving circuit 5 is used for receiving the control signal output by the main control circuit 4, and driving the fan 61 and / or the water pump 62 to work according to the received control signal, wherein the selection of the connecting piece 9 should consider factors such as conductivity, temperature resistance and anti-interference ability, so as to ensure the normal operation of the electric control assembly 100. In actual application, plug-in parts can be arranged on the motor driving circuit 5 and the motor 6, for example, a male head is arranged on the motor driving circuit 5 and a female head is arranged on the motor 6. When it is needed to assemble and establish electrical connection between the motor driving circuit 5 and the motor 6, the two ends of the connecting piece 9 are respectively connected with the male head of the motor driving circuit 5 and the female head of the motor 6, so that the electrical connection between the two can be quickly completed, which can simplify the assembly process of the motor driving circuit 5 and the motor 6, and also can ensure the stability and convenience of the connection. The functional module 7 can include a sensor module 76, a switching power supply module 71 and the like, wherein the sensor module 76 can be a temperature sensor module 76, which is used for monitoring the water temperature or the environmental temperature, so as to ensure that the output temperature of the gas water heating device meets the user's setting value, and common types include NTC thermistors and the like; the switching power supply module 71 provides stable working voltage for the entire electric control assembly 100, which can include transformers, rectifiers, filters and voltage stabilizing circuits and the like, so as to ensure that the input alternating current is converted into direct current suitable for the use of internal electronic components.

[0050] In order to realize the installation of the above-mentioned modules, the electric control assembly 100 can further include at least two circuit boards 1, and the main control circuit 4, the motor driving circuit 5 and the functional module 7 and other heat power devices 3 can be arranged on the at least two circuit boards 1 according to actual needs. The at least two circuit boards 1 are arranged at intervals, for example, referring to Figure 2When the electric control assembly 100 includes two circuit boards 1, the two circuit boards 1 are respectively a first circuit board 11 and a second circuit board 12, the first circuit board 11 is spaced apart from the second circuit board 12, a part of the heat-generating power devices 3 (the main control circuit 4) can be arranged on the first circuit board 11, and another part of the heat-generating power devices 3 (the motor driving circuit 5) can be arranged on the second circuit board 12. Alternatively, referring to Figure 4 When the electric control assembly 100 includes three circuit boards 1, the three circuit boards 1 are respectively a third circuit board 13, a fourth circuit board 14 and a fifth circuit board 15, the third circuit board 13 is arranged between the fourth circuit board 14 and the fifth circuit board 15 and is spaced apart from the fourth circuit board 14 and the fifth circuit board 15, a part of the heat-generating power devices 3 (the main control circuit 4) can be arranged on the third circuit board 13, another part of the heat-generating power devices 3 (the motor driving circuit 5) can be arranged on the fourth circuit board 14, and still another part of the heat-generating power devices 3 (the function module 7) can be arranged on the fifth circuit board 15. As can be seen, when the number of the circuit boards 1 is other than the above, the positions of the circuit boards 1 and the layout modes of the heat-generating power devices 3 are similar to the above, and thus are not repeated here. By limiting that the electric control assembly 100 includes a plurality of circuit boards 1 and the circuit boards 1 are not in close contact but maintain a certain distance, this design can avoid the heat conduction directly between different circuit boards 1, and at the same time provide more space for each circuit board 1 to perform natural or forced convection cooling, thereby improving the heat dissipation capacity of the circuit boards 1 and the heat-generating power devices 3 thereon.

[0051] To further improve the heat dissipation capacity of the circuit boards 1 and the heat-generating power devices 3 thereon, at least one of the circuit boards 1 is provided with a heat dissipation structure 2. The heat dissipation structure 2 can be any design that is helpful to improve the heat dissipation efficiency, such as a heat dissipation fin, a heat pipe, a uniform temperature plate, etc., or a material layer with high thermal conductivity. Taking the case that only the first circuit board 11 is provided with the heat dissipation structure 2 as an example, the presence of the heat dissipation structure 2 can quickly conduct the heat on the first circuit board 11 away, maintain the working temperature of the first circuit board 11 and the heat-generating power devices 3 thereon within a safe range, reduce the risk of performance degradation or failure of the heat-generating power devices 3 due to excessively high temperature, and enhance the working stability and reliability of the electric control assembly 100.

[0052] In addition, one of the circuit boards 1 can be connected with the rest of the at least one circuit board 1 through the heat dissipation structure 2. For example, only the first circuit board 11 is provided with the heat dissipation structure 2, and the first circuit board 11 can be connected with the second circuit board 12 through the heat dissipation structure 2 thereon; or, only the second circuit board 12 is provided with the heat dissipation structure 2, and the second circuit board 12 can be connected with the first circuit board 11 through the heat dissipation structure 2 thereon; or, the first circuit board 11 and the second circuit board 12 are respectively provided with the heat dissipation structure 2, and the first circuit board 11 can be connected with the second circuit board 12 through the heat dissipation structure 2 thereon, and the second circuit board 12 can be connected with the first circuit board 11 through the heat dissipation structure 2 thereon. In this case, the areas of the first circuit board 11 and the second circuit board 12 are not equal, and if the first circuit board 11 is a driving board and the second circuit board 12 is a main control board, generally, the area of the main control board is larger than that of the driving board. The first circuit board 11 and the second circuit board 12 are connected through the heat dissipation structure 2 to form a more efficient heat dissipation path, so that heat can be transferred from the first circuit board 11 with a smaller area to the second circuit board 12 with a larger area, that is, the first circuit board is cooled through the second circuit board 12. This mode can be regarded as an application of heat coupling or heat bridging technology, which helps to achieve more uniform temperature distribution in the entire electric control assembly 100, and thus improves the stability and reliability of the gas water heating equipment. In addition, the heat dissipation structure 2 is used as a connecting structure between the circuit boards 1, so that better heat dissipation effect can be achieved without significantly increasing the volume, which is beneficial to the miniaturization and integration of the gas water heating equipment.

[0053] The electric control assembly 100 of the utility model discloses technical scheme, through the interval arrangement between at least two circuit boards 1, so as to help the air circulation between different circuit boards 1, promote the natural cooling of circuit board 1;At least one circuit board 1 is provided with heat dissipation structure 2, and heat dissipation structure 2 is used to absorb and dissipate the heat from circuit board 1, reduce the high temperature generated by the high-power output of the heating power device 3 on circuit board 1, so as to maintain the working temperature of circuit board 1 and its heating power device 3 within a safe range, guarantee the working efficiency and stability of heating power device 3;And / or, heat dissipation structure 2 can be used as a connecting element, connect one of the circuit boards 1 with the rest of the at least one circuit board 1, form a more efficient heat dissipation path, and heat can be conducted between the connected circuit boards 1 through heat dissipation structure 2, so as to realize more uniform temperature distribution and more efficient heat dissipation, and thus improve the stability and reliability of electric control assembly 100.

[0054] In an embodiment of the utility model, refer to Figure 1 , Figure 3 and Figure 5 , the heat dissipation structure 2 includes:

[0055] A heat dissipation medium 21 is arranged between at least two of the circuit boards 1.

[0056] In the present embodiment, the heat dissipation medium 21 can be a heat-conductive pad, a heat-conductive sheet, a heat-conductive paste, a liquid metal, a phase-change material, a heat pipe, or a vapor chamber, etc., depending on the application requirements and environmental conditions. The heat dissipation medium 21 is designed to be placed between at least two of the circuit boards 1, aiming to improve the efficiency of heat conduction from one circuit board 1 to another circuit board 1. For example, when the electric control assembly 100 includes two circuit boards 1, which are the first circuit board 11 and the second circuit board 12, the heat dissipation medium 21 can be placed between the first circuit board 11 and the second circuit board 12. Alternatively, when the electric control assembly 100 includes a third circuit board 13, which is arranged between a fourth circuit board 14 and a fifth circuit board 15, the heat dissipation medium 21 can be placed between the third circuit board 13 and the fourth circuit board 14, and / or between the third circuit board 13 and the fifth circuit board 15. As can be seen, when the number of the circuit boards 1 is other than the above, the positions of the circuit boards 1 and the layout of the heat dissipation medium 21 are similar to the above, which will not be repeated here. By introducing the efficient heat dissipation medium 21, the heat conduction between the multiple circuit boards 1 can be significantly improved, and thus the heat dissipation capacity of the entire electric control assembly 100 is improved. In addition, the efficient heat management between the circuit boards 1 by the heat dissipation medium 21 makes the product design of the gas water heater more compact, which is suitable for the trend of miniaturization and integration.

[0057] In an embodiment of the present application, referring to Figure 6 , the heat dissipation structure 2 includes:

[0058] A heat sink 22 is arranged on one of the circuit boards 1, facing away from the other circuit board 1.

[0059] In the embodiment, the heat sink 22 can be made of a metal with high thermal conductivity, such as aluminum or copper, etc., and the contact area with air is increased through the large-area fin structure to quickly dissipate heat. Forced convection devices such as fans can be combined to further improve the heat dissipation efficiency and ensure that the circuit board 1 and the heat-generating power device 3 thereon work at an appropriate temperature. The heat sink 22 is placed on the side of one of the circuit boards 1 away from the other circuit board 1, and the electric control assembly 100 includes two circuit boards 1, which are the first circuit board 11 and the second circuit board 12. The first circuit board 11 has a first side surface S1 and a second side surface S2 arranged opposite to each other, the first side surface S1 is arranged towards the second circuit board 12, and the second side surface S2 is arranged away from the second circuit board 12. The heat-generating power device 3 is arranged on the first side surface S1, and the heat sink 22 is arranged on the second side surface S2. In this way, the heat generated by the heat-generating power device 3 can be transmitted to the heat sink 22 through the first circuit board 11, and dissipated to the external environment by the heat sink 22, thereby achieving heat dissipation of the heat-generating power device 3. Since the heat sink 22 is located on the side of the first circuit board 11 away from the second circuit board 12, not only can it effectively block the heat from being transmitted to the second circuit board 12, reducing the heat accumulation of the entire electric control assembly 100, but also can avoid direct contact between the heat sink 22 and the heat-generating power device 3 on the second circuit board 12, reducing the potential short circuit risk or other mechanical interference.

[0060] Of course, in another embodiment, in combination with the above-mentioned embodiment, in the case where the heat dissipation medium 21 is arranged between the first circuit board 11 and the second circuit board 12, the heat generated by the heat-generating power device 3 can not only be transmitted to the heat sink 22 through the first circuit board 11, but also be transmitted to the second circuit board 12 through the first circuit board 11 and the heat dissipation medium 21. If the first circuit board 11 is a drive board and the second circuit board 12 is a master control board, since the master control board has a larger area than the drive board, heat dissipation by the larger master control board can improve the heat dissipation efficiency of the electric control assembly 100 while realizing two heat dissipation paths.

[0061] In an embodiment of the present application, referring to Figure 6 , the heat dissipation structure 2 further comprises:

[0062] The heat-conducting medium 23 is arranged between the heat sink 22 and the circuit board 1.

[0063] In the embodiment, the heat-conducting medium 23 can be made of a material with high thermal conductivity, such as a heat-conducting paste, a heat-conducting pad, a liquid metal, etc. The heat-conducting medium 23 is used to fill the tiny gaps or uneven surfaces between the heat sink 22 and the circuit board 1, to ensure good contact between the two, thereby improving the high thermal conduction efficiency. In combination with the above embodiment, the heat-conducting medium 23 is arranged between the heat sink 22 and the first circuit board 11, which can effectively transfer the heat generated by the heat-generating power device 3 from the first circuit board 11 to the heat sink 22, reduce the thermal resistance, and thereby significantly improve the working efficiency of the heat sink 22, ensuring that the heat-generating power device 3 on the first circuit board 11 operates within a safe temperature range. It is worth noting that the heat-conducting medium 23 is also a medium layer with high thermal conductivity and low electrical conductivity, which can reduce the probability of short circuit of the first circuit board 11 and improve the reliability of its operation.

[0064] In an embodiment of the utility model, refer to Figure 6 , the heat dissipation structure 2 further comprises:

[0065] The first fixing buckle 24 is used for fixing the heat sink 22 to the circuit board 1.

[0066] In the embodiment, the first fixing buckle 24 can be arranged on the first circuit board 11 and / or the heat sink 22. Taking the case that the first fixing buckle 24 is arranged on the heat sink 22 as an example, the first circuit board 11 is provided with a first buckle hole, and the first fixing buckle 24 of the heat sink 22 is arranged in the first buckle hole of the first circuit board 11 to fix the heat sink 22 to the first circuit board 11. The first fixing buckle 24 can maximize the reduction of thermal resistance by ensuring the sustained good contact between the heat sink 22 and the first circuit board 11, thereby improving the thermal conduction efficiency. The first fixing buckle 24 can also prevent the heat sink 22 from loosening or shifting under vibration or impact, ensuring that it is always tightly mounted on the first circuit board 11 and ensuring the thermal conduction effect.

[0067] In addition, compared with the traditional fixing method such as screw, the first fixing buckle 24 is usually easier to operate, and can be quickly installed without additional tools, thereby improving the production efficiency and maintenance convenience of the electric control assembly 100, and when the heat sink 22 is damaged and needs to be disassembled, the heat sink 22 can be disassembled alone through the first fixing buckle 24 without the need to disassemble the entire electric control assembly 100.

[0068] In an embodiment of the utility model, refer to Figure 5 and Figure 6 , the heat dissipation structure 2 comprises:

[0069] The pin seat 25 is arranged on one of the circuit boards 1.

[0070] A pin 26 is fixed at one end of the pin seat 25, and the other end of the pin 26 is fixedly connected with the corresponding circuit board 1 through a pin hole 27 provided on the other at least one circuit board 1.

[0071] In the embodiment, the electric control assembly 100 includes two circuit boards 1, which are a first circuit board 11 and a second circuit board 12. With the pin seat 25 arranged on the first circuit board 11, the second circuit board 12 is provided with the pin hole 27 for the pin 26 to pass through.

[0072] Optionally, if the pin 26 is made of a material with good thermal conductivity (such as copper or aluminum), it can not only transmit electrical signals but also serve as an additional heat dissipation channel to conduct heat from the first circuit board 11 to the second circuit board 12.

[0073] Optionally, the number of pins 26 is not limited and can be one or more than two. In the embodiment, the number of pins 26 is four, and the four pins 26 are arranged on the pin seat 25 along the length direction of the pin seat 25.

[0074] In an embodiment of the utility model, refer to Figure 5 and Figure 6 The circuit board 1 has a first side surface S1 and a second side surface S2 arranged oppositely, and the circuit board 1 is provided with a heat dissipation via hole 101.

[0075] The electric control assembly 100 further includes

[0076] a heat generating power device 3 disposed on the first side surface S1 of the circuit board 1;

[0077] a heat dissipation layer 29 disposed on the first side surface S1 and the second side surface S2, and the heat dissipation layer 29 is connected through the heat dissipation via hole 101.

[0078] In the embodiment, the electric control assembly 100 includes two circuit boards 1, and the two circuit boards 1 are respectively a first circuit board 11 and a second circuit board 12. The first circuit board 11 and / or the second circuit board 12 has a first side surface S1 and a second side surface S2 oppositely arranged, and the first side surface S1 and the second side surface S2 are simultaneously provided with a heat dissipation layer 29. The heat dissipation layer 29 can be a copper layer laid on the first side surface S1 and / or the second side surface S2. The first circuit board 11 and / or the second circuit board 12 is provided with a heat dissipation via hole 101. The heat dissipation layer 29 on the first side surface S1 of the first circuit board 11 and / or the second circuit board 12 is connected with the heat dissipation layer 29 on the second side surface S2 of the first circuit board 11 and / or the second circuit board 12 through the heat dissipation via hole 101. The heat dissipation via hole 101 refers to a small hole penetrating through the thickness of the first circuit board 11 and / or the second circuit board 12, which is usually filled with a heat conductive material (such as a metal via hole, a heat conductive paste, etc.) to provide an efficient heat conduction path from one side of the first circuit board 11 and / or the second circuit board 12 to the other side. That is, these heat dissipation via holes 101 can transfer the heat from the first side surface S1 of the circuit board 1 where the heat generating power device 3 is located to the second side surface S2, thereby increasing the heat dissipation area and promoting heat dissipation. In the following, the first circuit board 11 and the second circuit board 12 respectively have a first side surface S1 and a second side surface S2 oppositely arranged, the first circuit board 11 and the second circuit board 12 are respectively provided with a heat dissipation via hole 101, the first side surface S1 and the second side surface S2 are simultaneously provided with a heat dissipation layer 29, the heat dissipation layer 29 on the first side surface S1 of the first circuit board 11 is connected with the heat dissipation layer 29 on the second side surface S2 of the first circuit board 11 through the heat dissipation via hole 101 of the first circuit board 11, the heat dissipation layer 29 on the first side surface S1 of the second circuit board 12 is connected with the heat dissipation layer 29 on the second side surface S2 of the second circuit board 12 through the heat dissipation via hole 101 of the second circuit board 12, and the copper layer on the first side surface S1 of the first circuit board 11 is provided with the heat generating power device 3.

[0079] Referring to Figure 1In the first example, in the case that the first circuit board 11 and the second circuit board 12 are connected through the pin seat 25 and the pin 26, in this scheme, heat dissipation can be performed through the pin 26, the pin 26 simultaneously plays the roles of electrical connection, heat conduction and fixation, and the number of the pin 26 can be set to be relatively large. In actual application, the heat generated by the heat-generating power device 3 can be transmitted to the copper layer of the first side surface S1 of the first circuit board 11, on one hand, transmitted to the pin seat 25 through the copper layer of the first side surface S1 of the first circuit board 11, transmitted to the pin 26 through the pin seat 25, and then transmitted to the copper layer of the second side surface S2 of the second circuit board 12 through the pin 26, and finally transmitted to the copper layer of the second side surface S1 of the second circuit board 12 through the heat dissipation via hole 101 of the second circuit board 12, the heat generated by the heat-generating power device 3 is dissipated by the two heat dissipation layers 29 of the pin 26 and the second circuit board 12, on the other hand, transmitted to the copper layer of the second side surface S2 of the first circuit board 11 through the heat dissipation via hole 101 of the first circuit board 11, and then the heat generated by the heat-generating power device 3 is dissipated by the two heat dissipation layers 29 of the first circuit board 11, thereby greatly improving the heat dissipation efficiency of the heat-generating power device 3;

[0080] Referring to Figure 5 In the second example, in the case that the first circuit board 11 and the second circuit board 12 are connected through the pin seat 25 and the pin 26, and the heat dissipation medium 21 is arranged between the first circuit board 11 and the second circuit board 12, in this scheme, heat dissipation is performed through the heat dissipation medium 21, in this scheme, the pin 26 can only play the role of electrical connection, at this time, the number of the pin 26 can be set to be smaller than that in the first example, for example, the number of the pin 26 in the first example is 8, the number in this example can be reduced from 8 to 4 or even 2, which is specifically set according to the demand of electrical connection between the two circuit boards, which is not limited herein. In actual application, the heat generated by the heat-generating power device 3 can be transmitted to the copper layer of the first side surface S1 of the first circuit board 11, on one hand, transmitted to the heat dissipation medium 21 through the copper layer of the first side surface S1 of the first circuit board 11, transmitted to the copper layer of the second side surface S2 of the second circuit board 12 through the heat dissipation medium 21, and finally transmitted to the copper layer of the first side surface S1 of the second circuit board 12 through the heat dissipation via hole 101 of the second circuit board 12, the heat generated by the heat-generating power device 3 is dissipated by the heat dissipation medium 21 and the two heat dissipation layers 29 of the second circuit board 12, on the other hand, transmitted to the copper layer of the second side surface S2 of the first circuit board 11 through the heat dissipation via hole 101 of the first circuit board 11, and then the heat generated by the heat-generating power device 3 is dissipated by the two heat dissipation layers 29 of the first circuit board 11, thereby greatly improving the heat dissipation efficiency of the heat-generating power device 3;

[0081] Referring to Figure 6In the third example, when the first circuit board 11 and the second circuit board 12 are connected through the pin seat 25 and the pin 26, and the first circuit board 11 is provided with the heat sink 22 on the side away from the second circuit board 12, and the heat-conducting medium 23 is arranged between the first circuit board 11 and the heat sink 22, in this scheme, heat dissipation is performed through the heat sink 22 and the heat-conducting medium 23, and the pin 26 in this scheme only plays an electrical connection role, so the number of the pin 26 can be set to be smaller than that in the first example, for example, when the number of the pin 26 in the first example is 8, the number in this example can be reduced from 8 to 4 or even 2, which is not limited in particular. In actual application, the heat generated by the heat-generating power device 3 can be transmitted to the copper layer on the first side surface S1 of the first circuit board 11, which is transmitted to the copper layer on the second side surface S2 of the second circuit board 12 through air, and finally transmitted to the copper layer on the first side surface S1 of the second circuit board 12 through the heat dissipation via hole 101 of the second circuit board 12, so that the heat generated by the heat-generating power device 3 is dissipated by the two heat dissipation layers 29 of the second circuit board 12, and the heat is also transmitted to the copper layer on the second side surface S2 of the first circuit board 11 through the heat dissipation via hole 101 of the first circuit board 11, and then transmitted to the heat-conducting medium 23 through the copper layer on the second side surface S2 of the first circuit board 11, and finally transmitted to the heat sink 22 through the heat-conducting medium 23, so that the heat generated by the heat-generating power device 3 is dissipated by the heat-conducting medium 23, the heat sink 22 and the two heat dissipation layers 29 of the first circuit board 11, thereby greatly improving the heat dissipation efficiency of the heat-generating power device 3.

[0082] In summary, the above three examples can be implemented alone or in combination. When each of the three examples is implemented, for example, when the first example is implemented, since the first example mainly utilizes the pin 26 for heat dissipation, the number of the pin 26 is generally set to be larger, and when the second example or the third example is implemented, since the second example mainly utilizes the heat dissipation medium 21 for heat dissipation, and the third example mainly utilizes the heat sink 22 and the heat-conducting medium 23 for heat dissipation, the pin 26 plays an electrical connection role, so the number of the pin 26 is smaller than that in the first example. When the three examples are combined, for example, when the first example and the second example are combined, since the pin 26 plays a combined role of electrical connection, heat conduction and fixation, the number of the pin 26 can be set to be larger or smaller, which is set according to actual needs.

[0083] In an embodiment of the present application, referring to Figure 5 and Figure 6 , the heat dissipation structure 2 further comprises:

[0084] A second fixing buckle 28 connects at least two circuit boards 1.

[0085] In the present embodiment, taking the example that the electric control assembly 100 includes two circuit boards 1, the two circuit boards 1 are respectively a first circuit board 11 and a second circuit board 12, the first circuit board 11 is provided with a second buckle hole, the second circuit board 12 is provided with a second buckle hole, and the second fixing buckle 28 is arranged in the second buckle hole of the first circuit board 11 and the third buckle hole of the second circuit board 12, so as to firmly connect the at least two circuit boards 1 together, which can enhance the structural integrity of the entire electric control assembly 100 and improve the reliability thereof in various working environments. The second fixing buckle 28 can also ensure that the first circuit board 11 and the second circuit board 12 maintain a fixed relative position, avoiding displacement or loosening caused by vibration or impact.

[0086] In combination with the above-mentioned embodiments, in the case that the heat dissipation medium 21 is arranged between the first circuit board 11 and the second circuit board 12, if the second fixing buckle 28 is designed reasonably, uniform pressure can be applied between the first circuit board 11 and the second circuit board 12, so as to ensure that the heat dissipation medium 21 (such as a heat-conducting pad or heat-conducting paste) has good contact with the first circuit board 11 and the second circuit board 12, improve the heat conduction efficiency of the heat dissipation medium 21, and the close connection of the heat dissipation medium 21 with the first circuit board 11 and the second circuit board 12 helps to reduce the air gap between the heat dissipation medium 21 and the first circuit board 11 and the second circuit board 12, reduce the thermal resistance, so that heat can be effectively transferred from the first circuit board 11 to the second circuit board 12, or from the second circuit board 12 to the first circuit board 11.

[0087] In addition, compared with the traditional fixing mode such as a screw, the second fixing buckle 28 is generally easier to operate, and the installation can be quickly completed without additional tools, which improves the production efficiency and maintenance convenience of the electric control assembly 100, and when the first circuit board 11 and / or the second circuit board 12 is damaged and needs to be disassembled, the first circuit board 11 and the second circuit board 12 can be separated through the second fixing buckle 28 without the need to disassemble the entire electric control assembly 100.

[0088] It can be understood that the current water heater is generally used with a fan 61, a water pump 62 and the like motor 6, and the motor 6 drives the water pump 62 to circulate the water flow, adjusts the water flow and the like, and discharges the flue gas through the fan 61. The motor 6 drive board of the water pump 62 is usually installed in the body of the water pump 62 and is arranged close to the motor 6 of the water pump 62, and the motor 6 drive board of the fan 61 is installed in the body of the fan 61 and is arranged close to the motor 6 of the fan 61. As known, whether the motor 6 of the water pump 62 or the motor 6 of the fan 61 is a heat source, a large amount of heat is generated during operation, and the heat comes from the following aspects: 1. Core loss: the core of the motor 6 will generate energy loss during magnetization and demagnetization, and the energy loss will be converted into heat, resulting in temperature rise of the motor 6; 2. Bearing friction: the friction between the rotor and the stator of the motor 6 will also cause energy loss, which will also be converted into heat, resulting in temperature rise of the motor 6; 3. Winding temperature rise: when the winding inside the motor 6 passes through the current, a certain amount of energy loss will also be generated, which will also be converted into heat, resulting in temperature rise of the motor 6.

[0089] Since the motor 6 (fan 61, water pump 62 and the like) needs to be waterproof, the motor 6 of the water pump 62 and / or the motor 6 of the fan 61 and the corresponding motor 6 drive board are generally sealed in the corresponding motor 6, which means that the motor 6 drive board will be heated all the time when the motor 6 is running, and the heat has a great influence on the drive chip integrated in the motor 6 drive board and the heat power device 3 inside the drive chip. The influence mainly has the following aspects: 1. High temperature will cause the heat power device 3 inside the drive chip, such as transistors, diodes and the like, to age, and the performance of these devices will decrease or even fail; 2. High temperature will cause the heat power device 3 inside the drive chip to burn out, and when the device is damaged to a certain extent, the entire drive chip will fail and cannot work normally; 3. High temperature will cause the performance of the internal circuit of the drive chip to decrease, such as slow signal transmission speed, increased power consumption and the like, which will affect the working efficiency and stability of the drive chip.

[0090] In an embodiment of the present application, referring to Figures 1 to 6 , the number of the circuit boards 1 is two, one of which is a drive board and the other is a main control board;

[0091] Alternatively, the number of the circuit boards 1 is three, two of which are drive boards and the other is a main control board, and the two drive boards are connected through the heat dissipation structure 2;

[0092] Alternatively, the number of the circuit boards 1 is three, two of which are main control boards and the other is a drive board, and the drive board is arranged between the two main control boards.

[0093] In the embodiment, referring toFigure 1 , Figure 2 and Figure 7 When there are two circuit boards 1, namely the first circuit board 11 and the second circuit board 12, one of the first circuit board 11 and the second circuit board 12 is the driver board, and the other of the first circuit board 11 and the second circuit board 12 is the main control board. The main control circuit 4 of the electronic control component 100 can be set on the main control board, and the motor drive circuit 5 of the electronic control component 100 can be set on the driver board. By separating the driver board, which generates more heat, from the main control board, heat can be better managed and distributed, and the heat generated by the driver board can be prevented from damaging the main control circuit 4 on the main control board. Even if the driver board fails, it will not directly affect the core control logic on the main control board, thereby improving the fault tolerance of the electronic control component 100.

[0094] Reference Figure 3 , Figure 4 and Figure 8 There are three circuit boards 1, namely the third circuit board 13, the fourth circuit board 14, and the fifth circuit board 15. Two of the third circuit board 13, the fourth circuit board 14, and the fifth circuit board 15 are driving boards, namely the first driving board and the second driving board. The first driving board and the second driving board are connected by the heat dissipation structure 2. The other of the third circuit board 13, the fourth circuit board 14, and the fifth circuit board 15 is the main control board. The main control circuit 4 of the electrical control component 100 can be set on the main control board. When the gas water heating equipment includes a fan 61 and a water pump 62, the motor drive circuit 5 of the fan 61 is set on one of the first driving board and the second driving board, and the motor drive circuit 5 of the water pump 62 is set on the other of the first driving board and the second driving board. This design can not only reduce the impact of the first driving board and the second driving board, which generate more heat, on the main control board, but also effectively manage and dissipate the heat generated by the fan 61 and the water pump 62, and avoid the local overheating of the first driving board and the second driving board from affecting the performance of the heat-generating power devices 3 on them. Furthermore, since the first and second drive boards are connected through the heat dissipation structure 2, this creates a more efficient heat dissipation path. Heat can be transferred from the hotter drive board to the relatively cooler drive board or dissipated directly from the heat dissipation structure 2, contributing to a more uniform temperature distribution throughout the entire electrical control assembly 100, thereby improving the stability and reliability of the gas-fired water heater. In addition, the first and second drive boards can separate the operation of the fan 61 and the water pump 62. Even if one drive board fails, the other can still operate normally, improving the fault tolerance of the gas-fired water heater. If either the first or second drive board fails, it can be replaced or repaired individually without affecting the operation of the entire gas-fired water heater, reducing the risk of downtime.

[0095] ReferenceFigure 3 , Figure 4 and Figure 8 There are three circuit boards 1: a sixth circuit board 16, a seventh circuit board 17, and an eighth circuit board 18. Two of these three circuit boards are main control boards, namely a first main control board and a second main control board. The first and second main control boards are connected by a heat dissipation structure 2. The third circuit board is a driver board, which can house a portion of the main control circuit 4 of the electronic control component 100 on one of the first and second main control boards. Another part of the main control circuit 4 of the electronic control component 100 is located on the other of the first and second main control boards. Alternatively, the main control circuit 4 of the electronic control component 100 can be located on one of the first and second main control boards, while the functional module 7 of the electronic control component 100 can be located on the other of the first and second main control boards. The specific location is not limited here. The motor drive circuit 5 of the electronic control component 100 is located on the drive board. By separating the heat-generating drive board from the first and second main control boards, heat can be better managed and distributed, preventing damage to the first main control board from the heat generated by the drive board. Even if the drive board malfunctions, it will not directly affect the core control logic on the main control board, thereby improving the fault tolerance of the electronic control component 100. Furthermore, the drive board is located between the first and second main control boards. This layout allows for closer communication between the main control boards, while using the drive board as a physical barrier to reduce electromagnetic interference.

[0096] In one embodiment of this utility model, reference is made to Figure 7 and Figure 8 The main control board is provided with a functional module 7, which includes at least one of the following: a switching power supply module 71, a flame sensing needle module 72, an ignition module 73, a gas valve control module 74, a gas proportional valve module 75, a sensor module 76, a thermostat module 77, and a display module 78.

[0097] It can be understood that the function modules 7 such as the switching power supply module 71, the flame sensing needle module 72, the ignition module 73, the gas valve control module 74, the gas proportional valve module 75, the sensor module 76, the temperature controller module 77, and the display module 78 can be arranged on the main control board and / or the drive board according to actual design requirements. By reasonably distributing different function modules 7 to the main control board and the drive board, the load on a single board can be reduced, the overall operation efficiency of the gas water heating equipment can be improved, and the separation design of different function modules 7 reduces the mutual influence between modules, which can improve the stability and fault tolerance of the gas water heating equipment. In the embodiment, the switching power supply module 71 is arranged on the main control board, and the switching power supply module 71 is used to provide stable and reliable power supply for the entire electric control assembly 100, so that each circuit and component can work normally. The flame sensing module can be arranged on the main control board and / or arranged close to the burner, and the flame sensing module is used to detect the combustion state of the burner, ensure normal combustion of the flame, and timely feedback to the main control circuit 4 when the burner is extinguished, so that the main control circuit 4 starts the safety protection mechanism. The ignition module 73 is arranged on the main control board, and the ignition module 73 is used to generate a high-voltage electric spark to ignite the gas, which is a key part of starting the gas water heating equipment. The gas valve control module 74 is arranged on the main control board, and is used to accurately control the gas flow according to the control signal output by the main control circuit 4, so as to ensure the combustion efficiency and safety. The gas proportional valve module 75 is arranged on the main control board and cooperates with the gas valve control module 74, and is used to adjust the gas supply amount to adapt to different heating requirements and optimize the combustion process. The sensor module 76 is arranged on the main control board and can include a water temperature sensor, a water flow sensor and the like, and is electrically connected to the main control circuit 4 on the main control board through a signal line, and is used to monitor water temperature, water flow, temperature and the like in real time to provide a basis for decision-making for the main control circuit 4. The temperature controller module 77 is arranged on the main control board, is used to receive and process the detection signal from the sensor module 76, and automatically adjusts the heating function according to the set temperature range to keep the water temperature of the gas water heating equipment constant. The display module 78 is arranged on the main control board and located on the operation panel of the gas water heating equipment, and is used to display the working state, temperature, fault information and the like of the gas water heating equipment to improve user experience.

[0098] In an embodiment of the present application, referring to Figure 7 and Figure 8 , the electric control assembly 100 further comprises:

[0099] The communication circuit 8 is connected in communication with the main control circuit 4 of the electric control assembly 100, a signal input end of the communication circuit 8 is used for accessing a control signal, a signal output end of the communication circuit 8 is connected with a signal input end of the motor driving circuit 5, a signal output end of the motor driving circuit 5 is connected with a motor 6 of the gas water heater, and the motor driving circuit 5 is used for receiving the control signal output by the main control circuit 4 through the communication circuit 8 and controlling the motor 6 to work according to the control signal.

[0100] It can be understood that the signal input end of the communication circuit 8 is used for accessing an external or internal control signal, and the signal can be a user instruction, sensor data or an instruction sent by another control system. In the embodiment, the signal input end of the communication circuit 8 accesses the control signal output by the control circuit. The communication circuit 8 acts as an intermediary and is responsible for establishing a stable communication channel between the main control circuit 4 and the motor driving circuit 5, so as to ensure that the control signal can be accurately transmitted. The output end of the motor driving circuit 5 is directly connected with the motor 6 of the gas water heater, the received control signal is converted into an actual motor driving signal, so as to control the working state (such as starting, stopping, speed regulation, etc.) of the motor 6 (which can be a fan 61 and / or a water pump 62). Through centralized management of signal transmission by the communication circuit 8, the number of direct connections between the main control circuit 4 and the motor driving circuit 5 can be reduced, so that the wiring of the electric control assembly 100 is more simple and orderly.

[0101] It can be understood that the control system of the traditional water heater adopts a PWM duty cycle communication mode to communicate with the motor 6, and generally needs VDD, GND, PWM signal and speed feedback signal, that is, four wires are needed for electric control communication control. Compared with the integrated driving and main control scheme, only three wires U, V and W are needed to directly drive the motor 6, and the number of wires is large and the cost is high. In addition, for the PWM duty cycle communication mode, if there is an error in the main frequency of the chip in the main control circuit 4, the duty cycle of the transmitted and received signals may also have an error. Specifically, if the main frequency is too high, the duty cycle will be too small, and if the main frequency is too low, the duty cycle will be too large. The main frequency error will affect the counting accuracy of the timer in the main control circuit 4, thereby affecting the calculation of the PWM duty cycle and further affecting the starting target value of the motor 6 during control.

[0102] In an embodiment of the utility model, referring to Figure 7 and Figure 8 The communication circuit 8 includes at least one of a UART communication circuit, an I2C communication circuit and an SPI communication circuit.

[0103] In the embodiment, the communication circuit 8 is a UART communication circuit, and is not limited to an I2C communication circuit, an SPI communication circuit, or the like. By setting the communication circuit 8, the main control circuit 4 sends at least one of the driving mode, the driving target speed, the power, the voltage, and the current to the motor driving circuit 5 via the communication circuit 8, the motor 6 is driven by the motor driving circuit 5 to operate as required, and the operating state, the speed, the current, the power, the mode, operating faults (for example, start failure, temperature too high, short circuit, locked rotor, overvoltage, low voltage), and the like are reported to the main control circuit 4 via the communication circuit 8. Due to such communication, there is a check in the communication, there is higher data accuracy, the target speed of the control can be accurately informed to the target motor 6, and the motor 6 can accurately and precisely feed back the current speed to the main control circuit 4, the communication transmission error is generally 1%-3%, the precise speed or duty cycle precision can be further improved, and the control precision of the gas water heating equipment is improved. In addition, by using the communication circuit 8, the connecting piece 9 between the motor driving circuit 5 and the motor 6 can be changed from four wire harnesses in the prior art to three wire harnesses, the three wire harnesses form a three-phase wire harness, specifically a U-phase power supply connecting line, a V-phase power supply connecting line, and a W-phase power supply connecting line, and the cost is further reduced.

[0104] The utility model also proposes a kind of gas water heating equipment, and the gas water heating equipment includes electric control assembly 100, and the specific structure of the electric control assembly 100 refers to above-mentioned embodiment, since the gas water heating equipment of the present application adopts all technical solutions of above-mentioned embodiment, at least has all beneficial effects brought by the technical scheme of above-mentioned embodiment, here is not repeated.

[0105] The above is only preferred embodiment of the utility model, and not therefore limit the patent range of the utility model, any equivalent structural transformation made in the inventive concept of the utility model, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.

Claims

1. An electrically controlled assembly (100), characterized in that, The electric control assembly (100) comprises: at least two circuit boards (1), at least two of which are spaced apart; a heat dissipation structure (2) arranged on at least one of the circuit boards (1); and / or, one of the circuit boards (1) is connected to the remaining at least one circuit board (1) through the heat dissipation structure (2) to dissipate heat through the heat dissipation structure (2) and the connected circuit board (1).

2. The electrically controlled assembly (100) of claim 1, characterized in that The heat dissipation structure (2) comprises: a heat dissipation medium (21) arranged between at least two of the circuit boards (1).

3. The electrically controlled assembly (100) of claim 1, wherein, The heat dissipation structure (2) comprises: a heat sink (22) arranged on one of the circuit boards (1) and facing away from the other circuit board (1).

4. The electrically controlled assembly (100) of claim 3, characterized in that The heat dissipation structure (2) further comprises: a heat-conducting medium (23) arranged between the heat sink (22) and the circuit board (1).

5. The electrically controlled assembly (100) of claim 3, wherein, The heat dissipation structure (2) further comprises: a first fixing buckle (24) for fixing the heat sink (22) to the circuit board (1).

6. The electrically controlled assembly (100) according to any one of claims 2 to 5, characterized in that The heat dissipation structure (2) comprises: a pin seat (25) arranged on one of the circuit boards (1); a pin (26) having one end fixed to the pin seat (25) and the other end fixedly connected to the corresponding circuit board (1) through a pin hole (27) arranged on the remaining at least one circuit board (1).

7. The electrically controlled assembly (100) according to any one of claims 2 to 5, characterized in that The circuit board (1) has a first side surface (S1) and a second side surface (S2) arranged opposite to each other, and a heat dissipation via hole (101) is formed in the circuit board (1). The electric control assembly further comprises: a heat-generating power device (3) arranged on the first side surface (S1) of the circuit board (1); a heat dissipation layer (29) arranged on the first side surface (S1) and the second side surface (S2), and connected through the heat dissipation via hole (101).

8. The electrically controlled assembly (100) according to any one of claims 2 to 5, characterized in that The heat dissipation structure (2) further comprises: a second fixing buckle (28) connecting at least two of the circuit boards (1).

9. The electrically controlled assembly (100) according to any one of claims 1 to 5, characterized in that The number of the circuit boards (1) is two, one of which is a drive board and the other is a master control board; or, the number of the circuit boards (1) is three, two of which are drive boards and the other is a master control board, and the two drive boards are connected through the heat dissipation structure (2); or, the number of the circuit boards (1) is three, two of which are master control boards and the other is a drive board, and the drive board is arranged between the two master control boards.

10. The electrically controlled assembly (100) of claim 9, characterized in that The main control board is provided with a functional module (7), and the functional module (7) comprises at least one of a switching power module (71), a flame sensing needle module (72), an ignition module (73), a gas valve control module (74), a gas proportional valve module (75), a sensor module (76), a temperature controller module (77), and a display module (78).

11. A gas water heating apparatus, characterised in that, The gas water heating device comprises the electric control assembly (100) according to any one of claims 1 to 10.

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