Copper-clad plate and circuit board
By covering the surface of the thin film layer with a conductive plating layer, the problem of conductive layer displacement caused by temperature changes in the adhesive is solved, thereby improving the connection stability and reliability of the copper clad laminate.
Patent Information
- Application Number
- CN202520390452.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-06
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-06
AI Technical Summary
The adhesive used in existing copper-clad laminates can cause displacement of the conductive layer and electronic components due to temperature changes, affecting the stability of the connection.
A conductive coating is applied to the surface of the thin film layer to prevent displacement caused by the expansion and contraction of the adhesive medium due to temperature changes.
It improves the stability and reliability of the connection between the conductive coating and electronic components, and enhances the overall performance of the copper clad laminate.
Smart Images
Figure CN223859328U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field, especially a kind of copper-clad plate and circuit board. BACKGROUND
[0002] With the development of science and technology, in order to reduce the weight of electronic products, improve the user's experience, light and thin electronic products have become a development trend, especially some small electronic products, such as mobile phones, notebook computers, tablet computers, digital cameras, etc., in order to meet the needs of light and thin, the internal electronic products need to be more compact to meet the needs of light and thin.
[0003] Circuit board is an indispensable electronic component in electronic products, which plays a role in connecting electronic components, and copper-clad plate is a basic material of printed circuit board. The existing copper-clad plate usually includes substrate, adhesive and conductive layer. The conductive layer is hot-sticked to the substrate by the adhesive. Since the conductive layer is hot-sticked to the substrate by the adhesive, the adhesive is easily affected by temperature. When the temperature changes, the adhesive expands and shrinks with the change of temperature, thereby affecting the connection between the conductive layer and the electronic components. SUMMARY
[0004] The main purpose of the utility model is to provide a kind of copper-clad plate and circuit board, to solve the technical problem that the adhesive of existing copper-clad plate causes displacement of conductive layer and electronic components due to temperature change.
[0005] To achieve the above purpose, the copper-clad plate provided by the utility model comprises:
[0006] The thin film layer has a plurality of micro-bubbles inside, the thickness of the thin film layer is greater than or equal to 100 μm and less than or equal to 3000 μm, and the thin film layer has a first surface and a second surface arranged oppositely.
[0007] The conductive plating layer covers the first surface and / or the second surface.
[0008] Optionally, the conductive plating layer is a copper layer, a zinc layer, an indium layer, a tin layer, a silver layer, a gold layer, an aluminum layer, a titanium layer, an iron layer, a magnesium layer, a lead layer, any one or more of them.
[0009] Optionally, the conductive plating layer comprises a first plating layer and a second plating layer, the first plating layer covers the first surface and / or the second surface, and the second plating layer covers one side of the first plating layer away from the thin film layer.
[0010] Optionally, the first plating layer is a vacuum sputtering plating layer.
[0011] Optionally, the thickness of the first plating layer is greater than or equal to 0.01 um and less than or equal to 2 μm.
[0012] Optionally, the second plating layer is a water plating layer.
[0013] Optionally, the thickness of the second plating layer is greater than or equal to 0.1 um and less than or equal to 35 um.
[0014] Optionally, the film layer comprises one of polypropylene film, polyvinyl chloride film, polyethylene film and ethylene-vinyl acetate copolymer film.
[0015] The utility model also proposes a copper clad plate, the copper clad plate includes:
[0016] The film layer has first surface and second surface which are oppositely arranged, and the thickness of the film layer is greater than or equal to 6 um and less than or equal to 300 um;
[0017] The conductive plating layer comprises first plating layer and second plating layer, the first plating layer is vacuum sputtering plating layer, and the first plating layer covers the first surface and / or the second surface;
[0018] The second plating layer covers one side of the first plating layer away from the film layer, and the second plating layer is a water plating layer.
[0019] The utility model also proposes a circuit board, and the circuit board comprises the copper clad plate.
[0020] The copper clad plate of the utility model, by covering the conductive plating layer on the first surface and / or the second surface of the film layer, so that the copper clad plate can conduct electricity through the conductive plating layer, and since the conductive plating layer is arranged on the film layer by plating, compared with the existing conductive plating layer which needs to be arranged on the film layer through adhesive medium, the utility model avoids the displacement of the conductive plating layer caused by the expansion and contraction of the adhesive medium due to temperature change, so that the stability and reliability of the connection between the conductive plating layer and the electronic component are improved. BRIEF DESCRIPTION OF DRAWINGS
[0021] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structure shown in the drawings without creative labor.
[0022] Figure 1 It is an embodiment structure schematic view of the copper clad plate and the circuit board of the utility model;
[0023] Figure 2 It is another embodiment structure schematic view of the copper clad plate and the circuit board of the utility model;
[0024] Figure 3 Figure 6 is a structural schematic view of another embodiment of the copper-clad plate and circuit board of the present application.
[0025] Brief Description of the Drawings
[0026] Reference Name Reference Name 1 Thin film layer 21 First plating layer 2 Conductive plating layer 22 Second plating layer
[0027] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION
[0028] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0029] It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directional indications also change accordingly.
[0030] In addition, if the embodiments of the present application involve descriptions of "first", "second", etc., the descriptions of "first", "second", etc. are only for description purposes, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features with "first" and "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is that it includes three parallel schemes. For example, "A and / or B" includes A scheme, or B scheme, or A and B schemes. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of the ordinary skilled in the art. When the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the scope of protection required by the present application.
[0031] The present application provides a copper-clad plate, which is mainly applied to a copper-clad plate in a circuit board.
[0032] The specific structure of the copper-clad plate will be mainly described below.
[0033] Reference Figures 1 to 3 In the embodiments of the present application, the copper-clad plate comprises:
[0034] a film layer 1, the film layer 1 has a plurality of micro-bubbles inside, the thickness of the film layer 1 is greater than or equal to 100 μm and less than or equal to 3000 μm, and the film layer 1 has a first surface and a second surface arranged oppositely;
[0035] a conductive plating layer 2, the conductive plating layer 2 covers the first surface and / or the second surface.
[0036] The film layer 1 is the substrate of the copper-clad plate, the film layer 1 is the foamed PP (polypropylene) and PE (polyethylene), so that the film layer 1 has a plurality of micro-bubbles inside. The film layer 1 is the foamed material, so that the closed cell structure of the film layer 1 contains gas (such as nitrogen or carbon dioxide), the macroscopic average dielectric constant can be reduced to about 1.4, and the dielectric loss is low during high-frequency signal transmission; at the same time, the density of the film layer 1 can be as low as 0.03 g / cm 3 , the copper-clad plate is lightened, and the vibration energy can be absorbed through the bubble hole. Compared with the film layer 1 without micro-bubbles, the film layer 1 with micro-bubbles has better insulation protection in a dynamic environment (such as a new energy automobile wire harness). In addition, the thermal conductivity of the closed cell structure of the film layer 1 with micro-bubbles is low, and the film layer 1 has the functions of insulation and heat insulation. The thickness of the film layer 1 needs to be greater than or equal to 100 μm and less than or equal to 3000 μm. When the thickness of the film layer 1 is less than 100 μm, the insulation is not good, when the thickness of the film layer 1 is greater than 3000 μm, the material is wasted, and the flexibility is reduced, which is not conducive to use. The conductive plating layer 2 is used for conduction, and the conductive plating layer 2 can be formed by electroplating, water plating or vacuum degree.
[0037] The copper-clad plate of the utility model, through the conductive plating layer 2 covers the first surface and / or the second surface of the film layer 1, so that the copper-clad plate can conduct electricity through the conductive plating layer 2. Since the conductive plating layer 2 is arranged on the film layer 1 by plating, compared with the existing conductive plating layer 2 which needs to be arranged on the film layer 1 by adhesive medium, the technical scheme avoids the displacement of the conductive plating layer 2 caused by the expansion and contraction of the adhesive medium due to temperature change of the copper-clad plate, so that the stability and reliability of the connection between the conductive plating layer 2 and the electronic component are improved.
[0038] In some examples, as Figure 1 shown, the conductive plating layer 2 is a copper layer, a zinc layer, an indium layer, a tin layer, a silver layer, a gold layer, an aluminum layer, a titanium layer, an iron layer, a magnesium layer, a lead layer, any one or more.
[0039] The copper layer, the zinc layer, the indium layer, the tin layer, the silver layer, the gold layer, the aluminum layer, the titanium layer, the iron layer, the magnesium layer, the lead layer and the like have good conductivity.
[0040] In some examples, as Figure 2 and Figure 3As shown, the conductive plating layer 2 includes a first plating layer 21 and a second plating layer 22. The first plating layer 21 covers the first surface and / or the second surface, and the second plating layer 22 covers the side of the first plating layer 21 that is away from the thin film layer 1.
[0041] The materials of the first plating layer 21 and the second plating layer 22 can be the same or different, and no specific restrictions are imposed here. The thickness of the first plating layer 21 is set to be less than the thickness of the second plating layer 22. The second plating layer 22 covers the side of the first plating layer 21 that is away from the thin film layer 1. Since the conductive plating layer 2 is plated in two stages, it is beneficial to reduce porosity. The superposition of the two plating layers can reduce single-stage plating solution penetration or crystallization defects. In addition, the fact that the second plating layer 22 covers the side of the first plating layer 21 that is away from the thin film layer 1 makes it easier to control the uniformity of the conductive plating layer 2 and reduce stress concentration and cracking risk.
[0042] In some examples, such as Figure 1 As shown, the first coating 21 is a vacuum sputtering coating.
[0043] Compared with other coating methods, vacuum sputtering deposition has higher sputtering energy of atoms. During deposition, it can activate the surface atoms of thin film layer 1 to form a dense and strongly adherent film layer, making the connection between the first coating layer 21 and the thin film layer 1 more reliable.
[0044] In some examples, such as Figure 2 and Figure 3 As shown, the thickness of the first coating 21 is greater than or equal to 0.01 μm and less than or equal to 2 μm. This helps to reduce coating costs.
[0045] In some examples, such as Figure 2 and Figure 3 As shown, the second coating 22 is an electroplated coating, and the thickness of the second coating 22 is greater than or equal to 0.1 μm and less than or equal to 35 μm. This is beneficial for further reducing coating costs.
[0046] In some examples, such as Figure 1 As shown, the thin film layer 1 includes one of a polypropylene film, a polyvinyl chloride film, a polyethylene film, and an ethylene-vinyl acetate copolymer film.
[0047] In some examples, such as Figures 1 to 3 As shown, the copper-clad laminate includes:
[0048] Thin film layer 1, the thickness of thin film layer 1 is greater than or equal to 6 μm and less than or equal to 300 μm, and thin film layer 1 has a first surface and a second surface disposed opposite to each other;
[0049] The conductive plating layer 2 comprises a first plating layer 21 and a second plating layer 22, the first plating layer 21 is a vacuum sputtering plating layer, and the first plating layer 21 covers the first surface and / or the second surface;
[0050] The second plating layer 22 covers the side of the first plating layer 21 away from the film layer 1, and the second plating layer 22 is a water electroplating layer.
[0051] The film layer 1 is a non-foamed film layer 1, that is, the film layer 1 is a non-foamed polyimide (PI) layer or a non-foamed polyimide (CPI) layer. The use of the non-foamed polyimide (PI) layer or the non-foamed polyimide (CPI) layer has excellent electrical insulation capability, can effectively prevent the conduction of electric current, and can prevent problems such as current leakage and short circuit. At the same time, the non-foamed polyimide (PI) layer or the non-foamed polyimide (CPI) layer has the characteristics of low dielectric constant and low dielectric loss, and performs excellently in high-frequency circuits and high-speed signal transmission, can reduce signal attenuation and distortion, improve the quality and efficiency of signal transmission, and ensure the high-performance operation of electronic equipment. The thickness of the film layer 1 is greater than or equal to 6 μm and less than or equal to 300 μm, so as to avoid damage caused by being less than 6 μm, and to avoid waste of materials and insufficient flexibility caused by being greater than 300 μm. The conductive plating layer 2 can be formed by vacuum sputtering plating. The conductive plating layer 2 can comprise a first plating layer 21 and a second plating layer 22, the first plating layer 21 covers the first surface and / or the second surface, and the second plating layer 22 covers the side of the first plating layer 21 away from the film layer 1. The first plating layer 21 is a vacuum sputtering plating layer, and the thickness of the first plating layer 21 is greater than or equal to 0.01 um and less than or equal to 2 μm, the thickness of the first plating layer 21 is greater than or equal to 0.01 um and less than or equal to 2 μm, which is conducive to reducing the cost of plating film. The second plating layer 22 is a water electroplating layer, the thickness of the second plating layer 22 is greater than or equal to 0.1 um and less than or equal to 35 μm, and the second plating layer 22 is a water electroplating layer, which is conducive to further reducing the cost of plating film.
[0052] The utility model also proposes a kind of circuit board, and the specific structure of the copper-clad plate of this main circuit board refers to above-mentioned embodiment, since copper-clad plate has adopted all technical solutions of above-mentioned all embodiments, at least have all beneficial effects brought by the technical scheme of above-mentioned embodiment, here no longer repeat.
[0053] The above-mentioned is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structure transformation using the utility model specification and the content of drawing, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.
Claims
1. A copper clad plate characterized by, The copper-clad plate comprises: a film layer, the film layer having a plurality of micro-bubbles inside, the film layer having a thickness greater than or equal to 100 μm and less than or equal to 3000 μm, the film layer having a first surface and a second surface oppositely arranged; a conductive plating layer, the conductive plating layer covering the first surface and / or the second surface.
2. The copper-clad board according to claim 1, wherein The conductive plating layer is a copper layer, a zinc layer, an indium layer, a tin layer, a silver layer, a gold layer, an aluminum layer, a titanium layer, an iron layer, a magnesium layer, a lead layer, any one or more of the above.
3. The copper-clad board according to claim 1 or 2, wherein The conductive plating layer comprises a first plating layer and a second plating layer, the first plating layer covering the first surface and / or the second surface, the second plating layer covering a side of the first plating layer away from the film layer.
4. The copper-clad board according to claim 3, wherein The first plating layer is a vacuum sputtering plating layer.
5. The copper-clad board according to claim 4, wherein The first plating layer has a thickness greater than or equal to 0.01 μm and less than or equal to 2 μm.
6. The copper-clad board according to claim 3, wherein The second plating layer is a water electroplating layer.
7. The copper-clad board according to claim 6, wherein The second plating layer has a thickness greater than or equal to 0.1 μm and less than or equal to 35 μm.
8. The copper-clad board of claim 1, wherein, The film layer comprises one of a polypropylene film, a polyvinyl chloride film, a polyethylene film, and an ethylene-vinyl acetate copolymer film.
9. A copper clad plate characterized by, The copper-clad plate comprises: a film layer, the film layer having a thickness greater than or equal to 6 μm and less than or equal to 300 μm, the film layer having a first surface and a second surface oppositely arranged; a conductive plating layer, the conductive plating layer comprising a first plating layer and a second plating layer, the first plating layer being a vacuum sputtering plating layer, the first plating layer covering the first surface and / or the second surface; the second plating layer covering a side of the first plating layer away from the film layer, the second plating layer being a water electroplating layer.
10. A circuit board, characterized by The circuit board comprises the copper-clad plate according to any one of claims 1 to 8.