Cooling buffer device for PCB (Printed Circuit Board)

Abstract

The utility model provides a cooling buffer device for a PCB (Printed Circuit Board). The rack is provided with a cooling cavity, and the cooling assembly is arranged in the cooling cavity. And the plate inlet and the plate outlet are both communicated with the cooling cavity. The lifting driving piece is arranged in the cooling cavity, and the lifting frame is arranged at the lifting end of the lifting driving piece. The first material frame and the second material frame are both arranged on the lifting frame, the first material frame is provided with a plurality of first supporting platforms, the second material frame is provided with a plurality of second supporting platforms, each first supporting platform and the corresponding second supporting platform jointly form a board body storage area used for supporting PCBs, and therefore a plurality of board body storage areas are formed. The air outlet end of the cooling assembly faces the multiple plate body storage areas. The first board conveying part is arranged adjacent to the first material frame, the second board conveying part is arranged adjacent to the second material frame, and the first board conveying part and the second board conveying part are jointly used for conveying PCBs input from the board inlet to the board body storage area and conveying the PCBs cooled in the board body storage area to the board outlet.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of PCB production and processing, in particular to a cooling and buffering device for PCBs. BACKGROUND

[0002] PCB, which is also known as printed wiring board, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. It is called "printed" circuit board because it is made by electronic printing. During the processing of PCBs, high-temperature treatment is sometimes required. After the treatment of PCBs is completed, the PCBs need to be cooled first, and then the next process can be processed. Therefore, a cooling and buffering machine appears, which can cool a batch of PCBs. For example, the prior art of patent application No. CN202123042094.3 - a cooling and buffering machine.

[0003] The technical solution of the above-mentioned patent can cool a batch of PCBs, but it also has the following problems: the cooling and buffering machine only has a feeding assembly, which can realize automatic plate feeding, but this means that the PCBs to be cooled need to be placed on the lifting platform of the cooling and buffering machine by manual feeding, that is, manual feeding is required, which not only reduces the production efficiency of PCBs, but also increases the labor cost.

[0004] Therefore, there is an urgent need for a cooling and buffering machine that can automatically feed and discharge PCBs and cool a batch of PCBs. Content of the utility model

[0005] The purpose of the present disclosure is to overcome the shortcomings of the prior art and provide a cooling and buffering device for PCBs that can automatically feed and discharge PCBs and cool a batch of PCBs.

[0006] The purpose of the present disclosure is achieved by the following technical solutions:

[0007] A cooling and buffering device for PCBs, comprising a rack and a cooling assembly, the rack is provided with a cooling cavity, and the cooling assembly is arranged in the cooling cavity;

[0008] The rack is provided with an inlet and an outlet, and the inlet and the outlet are in communication with the cooling cavity;

[0009] The cooling and buffering device further comprises a lifting assembly, a plate storage assembly and a plate conveying assembly;

[0010] The lifting assembly comprises a lifting drive and a lifting frame, the lifting drive is arranged in the cooling cavity, and the lifting frame is arranged on the lifting end of the lifting drive;

[0011] The board storage assembly comprises a first material frame and a second material frame, the first material frame and the second material frame are both arranged on the lifting frame, the first material frame is provided with a plurality of first support platforms, and the second material frame is provided with a plurality of second support platforms, each first support platform and the corresponding second support platform jointly form a board storage area for supporting a PCB board, and a plurality of board storage areas are formed in this way;

[0012] The air outlet end of the cooling assembly is arranged towards the plurality of board storage areas;

[0013] The board conveying assembly comprises a first board conveying member and a second board conveying member, the first board conveying member is arranged adjacent to the first material frame, the second board conveying member is arranged adjacent to the second material frame, and the first board conveying member and the second board conveying member are used jointly to convey the PCB boards input by the board inlet to the board storage areas and convey the PCB boards cooled in the board storage areas to the board outlet.

[0014] In one of the embodiments, the first material frame comprises a plurality of first support rods arranged at intervals, each first support rod is provided with a plurality of first support protrusions arranged at equal distances in the vertical direction, and the plurality of first support protrusions jointly form the first support platform in the horizontal direction;

[0015] Two adjacent first support rods are formed with a first hollow opening.

[0016] In one of the embodiments, the second material frame comprises a plurality of second support rods arranged at intervals, each second support rod is provided with a plurality of second support protrusions arranged at equal distances in the vertical direction, and the plurality of second support protrusions jointly form the second support platform in the horizontal direction;

[0017] Two adjacent second support rods are formed with a second hollow opening.

[0018] In one of the embodiments, the first board conveying member comprises a first board conveying frame, a first board conveying driving member, a first board feeding belt conveying member and a first board discharging belt conveying member, the first board conveying frame is arranged in the cooling cavity, the first board conveying driving member is mounted on the first board conveying frame, the first board feeding belt conveying member is arranged on one end of the first board conveying frame adjacent to the board inlet, the first board discharging belt conveying member is arranged on the other end of the first board conveying frame adjacent to the board outlet, and the first board feeding belt conveying member and the first board discharging belt conveying member are both connected with the power output end of the first board conveying driving member.

[0019] In one of the embodiments, the second plate conveying member comprises a second plate conveying frame, a second plate conveying drive, a second plate feeding belt conveyor and a second plate discharging belt conveyor, the second plate conveying frame is arranged in the cooling cavity, the second plate conveying drive is installed on the second plate conveying frame, the second plate feeding belt conveyor is arranged on one end of the second plate conveying frame adjacent to the plate feeding port, the second plate discharging belt conveyor is arranged on the other end of the second plate conveying frame adjacent to the plate discharging port, and the second plate feeding belt conveyor and the second plate discharging belt conveyor are connected with the power output end of the second plate conveying drive.

[0020] In one of the embodiments, the first plate conveying member comprises a plurality of first belt wheel conveyors, the plurality of first belt wheel conveyors are installed on the first plate conveying frame, the plurality of first belt wheel conveyors are connected with the power output end of the first plate conveying drive, and each first belt wheel conveyor is arranged in the corresponding first hollow port.

[0021] In one of the embodiments, the first plate conveying member further comprises a first telescopic drive, the first telescopic drive is arranged in the cooling cavity, and the telescopic pushing end of the first telescopic drive is connected with the first plate conveying frame.

[0022] A plurality of first limiting grooves are arranged on the first plate conveying frame, and each first supporting rod is movably abutted in the corresponding first limiting groove.

[0023] A plurality of first sliding rail members are arranged on the frame, and the first plate conveying frame is slidably connected with the plurality of first sliding rail members.

[0024] In one of the embodiments, the second plate conveying member comprises a plurality of second belt wheel conveyors, the plurality of second belt wheel conveyors are installed on the second plate conveying frame, the plurality of second belt wheel conveyors are connected with the power output end of the second plate conveying drive, and each second belt wheel conveyor is arranged in the corresponding second hollow port.

[0025] In one of the embodiments, the second plate conveying member further comprises a second telescopic drive, the second telescopic drive is arranged in the cooling cavity, and the telescopic pushing end of the second telescopic drive is connected with the second plate conveying frame.

[0026] A plurality of second limiting grooves are arranged on the second plate conveying frame, and each second supporting rod is movably abutted in the corresponding second limiting groove.

[0027] A plurality of second sliding rail members are arranged on the frame, and the second plate conveying frame is slidably connected with the plurality of second sliding rail members.

[0028] In one of the embodiments, the cooling assembly comprises a plurality of cooling fan members, the plurality of cooling fan members are arranged on the rack, and the air outlet end of each cooling fan member is arranged towards the cooling cavity.

[0029] Compared with the prior art, the present disclosure has at least the following advantages:

[0030] 1. By arranging the first and second conveying plate members, the PCB boards input through the plate input port can be conveyed to the plate body storage area, and the PCB boards cooled in the plate body storage area can be conveyed to the plate output port, thereby realizing the automatic plate feeding and discharging functions of the cooling buffer device, saving the labor cost, and improving the production efficiency of the PCB boards.

[0031] 2. By arranging the first and second material frames, the first and second material frames are arranged on the lifting frame, and each first support platform and the corresponding second support platform jointly form a plate body storage area for supporting the PCB boards, i.e., by arranging a plurality of plate body storage areas, a plurality of PCB boards can be stored in the cooling cavity, and then the lifting drive member is driven to output to drive the lifting frame to perform the lifting operation, so as to convey the first and second material frames to the position adjacent to the air outlet end of the cooling assembly, and drive the cooling assembly to cool and blow the PCB boards in the plurality of plate body storage areas, thereby realizing the cooling treatment of the batch of PCB boards by the cooling buffer device, and further improving the production efficiency of the PCB boards. BRIEF DESCRIPTION OF DRAWINGS

[0032] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present disclosure, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0033] Figure 1 FIG. 1 is a structural schematic view of a cooling buffer device for PCB boards in an embodiment;

[0034] Figure 2 FIG. 2 is another view of the cooling buffer device for PCB boards shown in FIG. 1; Figure 1

[0035] Figure 3 FIG. 3 is a partial structural schematic view of the cooling buffer device for PCB boards shown in FIG. 1; Figure 1

[0036] Figure 4 FIG. 4 is another partial structural schematic view of the cooling buffer device for PCB boards shown in FIG. 1; Figure 3

[0037] ​​​Figure 5 for Figure 4 A schematic diagram of the cooling buffer device used on the PCB board from another perspective;

[0038] Figure 6 for Figure 4 A partial structural schematic diagram of the cooling buffer device used on the PCB board shown.

[0039] Figure 7 for Figure 4 A partial structural schematic diagram of the cooling buffer device used on the PCB board shown.

[0040] Figure 8 for Figure 4 A partial structural schematic diagram of the cooling buffer device used on the PCB board shown.

[0041] Figure 9 for Figure 8 A schematic diagram of the cooling buffer device used on the PCB board from another perspective;

[0042] Figure 10 for Figure 4 A partial structural schematic diagram of the cooling buffer device used on the PCB board shown.

[0043] Figure 11 for Figure 10 A schematic diagram of the cooling buffer device used on the PCB board from another perspective. Detailed Implementation

[0044] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0045] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] The present disclosure provides a cooling buffer device for PCB board, comprising a rack and a cooling assembly, the rack is provided with a cooling cavity, and the cooling assembly is arranged in the cooling cavity. The rack is provided with a board inlet and a board outlet, and the board inlet and the board outlet are communicated with the cooling cavity. The cooling buffer device further comprises a lifting assembly, a board storage assembly and a board conveying assembly. The lifting assembly comprises a lifting drive and a lifting frame, the lifting drive is arranged in the cooling cavity, and the lifting frame is arranged on the lifting end of the lifting drive. The board storage assembly comprises a first material frame and a second material frame, and the first material frame and the second material frame are arranged on the lifting frame. The first material frame is provided with a plurality of first support platforms, and the second material frame is provided with a plurality of second support platforms. Each first support platform and the corresponding second support platform jointly form a board storage area for supporting the PCB board, so as to form a plurality of board storage areas. The air outlet end of the cooling assembly is arranged towards the plurality of board storage areas. The board conveying assembly comprises a first board conveying member and a second board conveying member, the first board conveying member is arranged adjacent to the first material frame, and the second board conveying member is arranged adjacent to the second material frame. The first board conveying member and the second board conveying member are used for conveying the PCB board input from the board inlet to the board storage area, and conveying the PCB board cooled in the board storage area to the board outlet.

[0048] Please refer to Figures 1 to 11 In order to better understand the cooling buffer device 10 for PCB board of the present disclosure, the cooling buffer device 10 for PCB board is further explained as follows:

[0049] The cooling buffer device 10 for PCB in an embodiment comprises a rack 100 and a cooling assembly 200, the rack 100 is provided with a cooling cavity 102, and the cooling assembly 200 is arranged in the cooling cavity 102. The rack 100 is provided with a plate inlet 104 and a plate outlet 106, and the plate inlet 104 and the plate outlet 106 are communicated with the cooling cavity 102. The cooling buffer device 10 further comprises a lifting assembly 300, a plate storage assembly 400 and a plate conveying assembly 500. The lifting assembly 300 comprises a lifting drive 310 and a lifting frame 320, the lifting drive 310 is arranged in the cooling cavity 102, and the lifting frame 320 is arranged on the lifting end of the lifting drive 310. The plate storage assembly 400 comprises a first material frame 410 and a second material frame 420, and the first material frame 410 and the second material frame 420 are arranged on the lifting frame 320. The first material frame 410 is provided with a plurality of first support platforms 412, and the second material frame 420 is provided with a plurality of second support platforms 422. Each first support platform 412 and the corresponding second support platform 422 jointly form a plate body storage area for supporting the PCB, and a plurality of plate body storage areas are formed in this way. The air outlet end of the cooling assembly 200 is arranged towards the plurality of plate body storage areas. The plate conveying assembly 500 comprises a first plate conveying member 510 and a second plate conveying member 520, the first plate conveying member 510 is arranged adjacent to the first material frame 410, the second plate conveying member 520 is arranged adjacent to the second material frame 420, and the first plate conveying member 510 and the second plate conveying member 520 are used together to convey the PCB input by the plate inlet 104 to the plate body storage area, and convey the PCB cooled in the plate body storage area to the plate outlet 106.

[0050] In the embodiment, by arranging the first plate conveying member 510 and the second plate conveying member 520, the PCB input by the plate inlet 104 can be conveyed to the plate body storage area, and the PCB cooled in the plate body storage area can be conveyed to the plate outlet 106, so as to realize the automatic plate feeding and discharging function of the cooling buffer device 10, save the labor cost output, and improve the production efficiency of the PCB.

[0051] Further, by arranging the first material frame 410 and the second material frame 420, the first material frame 410 and the second material frame 420 are arranged on the lifting frame 320, and each first support platform 412 and the corresponding second support platform 422 jointly form a plate body storage area for supporting the PCB. That is, by arranging a plurality of plate body storage areas, a plurality of PCBs can be stored in the cooling cavity 102. Then, the lifting drive 310 is driven to output, so as to drive the lifting frame 320 to perform the lifting operation, convey the first material frame 410 and the second material frame 420 to the position adjacent to the air outlet end of the cooling assembly 200, and drive the cooling assembly 200 to perform the cooling and blowing process on the PCBs in the plurality of plate body storage areas, so as to realize the cooling process of the cooling buffer device 10 on the batch PCBs, and further improve the production efficiency of the PCB.

[0052] It should be noted that the driving of the lifting driving member 310 is to drive the lifting operation, and the positions of one of the first support platforms 412 and the corresponding second support platforms 422 in the first material frame 410 and the second material frame 420 are flush with the first conveying plate member 510 and the second conveying plate member 520, that is, flush with the plate inlet 104 or the plate outlet 106, so that the cooling cache device 10 can realize the automatic feeding and discharging of the PCB boards, so as to meet the cooling processing needs of batches of PCB boards and improve the production efficiency of the PCB boards.

[0053] It should be noted that the plate inlet 104 is used to communicate with the plate outlet of the previous process equipment, and the plate outlet 106 is used to communicate with the plate inlet of the next process equipment.

[0054] As shown in Figure 6 one of the embodiments, the first material frame 410 includes a plurality of first support rods 4110 arranged at intervals, each first support rod 4110 is provided with a plurality of first support blocks 4120 arranged at equal distances in the vertical direction, and the plurality of first support blocks 4120 collectively form a first support platform 412 in the horizontal direction, and adjacent two first support rods 4110 form a first hollow opening 414. It can be understood that the first support blocks 4120 of the plurality of first support rods 4110 in the horizontal direction collectively form the first support platform 412, that is, there are a plurality of first support platforms 412 on the first material frame 410, so that a plurality of PCB boards can be stored.

[0055] As shown in Figure 7 one of the embodiments, the second material frame 420 includes a plurality of second support rods 4210 arranged at intervals, each second support rod 4210 is provided with a plurality of second support blocks 4220 arranged at equal distances in the vertical direction, and the plurality of second support blocks 4220 collectively form a second support platform 422 in the horizontal direction, and adjacent two second support rods 4210 form a second hollow opening 424. It can be understood that the second support blocks 4220 of the plurality of second support rods 4210 in the horizontal direction collectively form the second support platform 422, that is, there are a plurality of second support platforms 422 on the second material frame 420, so that a plurality of PCB boards can be stored.

[0056] As shown in Figure 3 , Figure 4 , Figure 5 , Figure 8 and Figure 9As shown in the drawings, in one embodiment, the first plate conveying member 510 includes a first plate conveying frame 5110, a first plate conveying drive member 5120, a first plate feeding belt conveying member 5130 and a first plate discharging belt conveying member 5140. The first plate conveying frame 5110 is arranged in the cooling cavity 102. The first plate conveying drive member 5120 is mounted on the first plate conveying frame 5110. The first plate feeding belt conveying member 5130 is arranged on one end of the first plate conveying frame 5110 adjacent to the plate feeding port 104. The first plate discharging belt conveying member 5140 is arranged on the other end of the first plate conveying frame 5110 adjacent to the plate discharging port 106. The first plate feeding belt conveying member 5130 and the first plate discharging belt conveying member 5140 are connected with the power output end of the first plate conveying drive member 5120. It should be noted that when the PCB is subjected to the plate feeding operation, the first plate conveying drive member 5120 is driven to drive the first plate feeding belt conveying member 5130 to output, so as to convey the PCB input from the plate feeding port 104 to the first supporting platform 412. When the PCB is subjected to the plate discharging operation, the first plate conveying drive member 5120 is driven to drive the first plate discharging belt conveying member 5140 to output, so as to convey the PCB in the plate body storage area to the plate discharging port 106.

[0057] As shown in the drawings, Figure 3 , Figure 4 , Figure 5 , Figure 10 and Figure 11 As shown in the drawings, in one embodiment, the second plate conveying member 520 includes a second plate conveying frame 5210, a second plate conveying drive member 5220, a second plate feeding belt conveying member 5230 and a second plate discharging belt conveying member 5240. The second plate conveying frame 5210 is arranged in the cooling cavity 102. The second plate conveying drive member 5220 is mounted on the second plate conveying frame 5210. The second plate feeding belt conveying member 5230 is arranged on one end of the second plate conveying frame 5210 adjacent to the plate feeding port 104. The second plate discharging belt conveying member 5240 is arranged on the other end of the second plate conveying frame 5210 adjacent to the plate discharging port 106. The second plate feeding belt conveying member 5230 and the second plate discharging belt conveying member 5240 are connected with the power output end of the second plate conveying drive member 5220. It should be noted that when the PCB is subjected to the plate feeding operation, the second plate conveying drive member 5220 is driven to drive the second plate feeding belt conveying member 5230 to output, so as to convey the PCB input from the plate feeding port 104 to the second supporting platform 422. When the PCB is subjected to the plate discharging operation, the first plate conveying drive member 5120 is driven to drive the second plate discharging belt conveying member 5240 to output, so as to convey the PCB on the plate body storage area to the plate discharging port 106.

[0058] As shown in the drawings, Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 andFigure 9 As shown in the drawings, in one embodiment, the first plate conveying member 510 comprises a plurality of first roller conveying members 5150, the plurality of first roller conveying members 5150 are mounted on the first plate frame 5110, the plurality of first roller conveying members 5150 are connected with the power output end of the first plate driving member 5120, and each first roller conveying member 5150 is arranged in the corresponding first hollow opening 414. It should be noted that by arranging the first roller conveying member 5150 in the corresponding first hollow opening 414, that is, by driving the first plate driving member 5120 to output, the plurality of first roller conveying members 5150 are output, so that the PCB board can move on the plate body storage area, thereby facilitating the up and down movement of the PCB board.

[0059] As shown in the drawings, Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 8 and Figure 9 As shown in the drawings, in one embodiment, the first plate conveying member 510 further comprises a first telescopic driving member 5160, the first telescopic driving member 5160 is arranged in the cooling cavity 102, and the telescopic pushing end of the first telescopic driving member 5160 is connected with the first plate frame 5110. The first plate frame 5110 is provided with a plurality of first limiting grooves 5112, and each first supporting rod 4110 is movably abutted in the corresponding first limiting groove 5112. The rack 100 is provided with a plurality of first slide rail members 110, and the first plate frame 5110 is slidably connected with the plurality of first slide rail members 110. It can be understood that by driving the first telescopic driving member 5160 to output, the first plate frame 5110 is driven to move close to or away from the first material frame 410, so as to avoid the interference of the first roller conveying member 5150 with the lifting operation of the first material frame 410 loaded with the PCB board, and at the same time, by movably abutting the first supporting rod 4110 in the corresponding first limiting groove 5112, the first roller conveying member 5150 is ensured to be located in the corresponding first hollow opening 414, so as to perform the conveying operation on the PCB board on the first supporting platform 412. At the same time, the first slide rail member 110 can improve the movement stability of the first plate frame 5110.

[0060] As shown in the drawings, Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 11As shown, in one embodiment, the second conveyor 520 includes a plurality of second pulley conveyors 5250, all of which are mounted on the second conveyor frame 5210 and connected to the power output end of the second conveyor drive 5220. Each second pulley conveyor 5250 is disposed within a corresponding second cutout 424. It should be noted that by disposing the second pulley conveyors 5250 within the corresponding second cutout 424, i.e., by driving the second conveyor drive 5220 to output power, thereby driving the plurality of second pulley conveyors 5250, the PCB board can move on the board storage area, facilitating the loading and unloading of the PCB board.

[0061] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 10 and Figure 11 As shown, in one embodiment, the second conveying member 520 further includes a second telescopic drive member 5260, which is disposed within the cooling cavity 102. The telescopic pushing end of the second telescopic drive member 5260 is connected to the second conveying frame 5210. The second conveying frame 5210 has multiple second limiting grooves 5212, and each second support rod 4210 movably abuts against a corresponding second limiting groove 5212. The frame 100 has multiple second slide rail members 120, and the second conveying frame 5210 is slidably connected to each of the multiple second slide rail members 120. Understandably, by driving the second telescopic drive component 5260 to output, the second conveyor frame 5210 is moved closer to or further away from the second material frame 420, preventing the second pulley conveyor component 5250 from interfering with the lifting and lowering operation of the second material frame 420 containing the PCB board. Simultaneously, by allowing the second support rod 4210 to movably abut against the corresponding second limit groove 5212, the second pulley conveyor component 5250 is ensured to be positioned at the corresponding second cutout 424 for transporting the PCB board on the second support platform 422. At the same time, the second slide rail component 120 enhances the movement stability of the second conveyor frame 5210.

[0062] like Figure 3 Figure 4 Figure 5 Figure 6 Figure 10 Figure 11 Figure 3 As shown, in one embodiment, the cooling assembly 200 includes a plurality of cooling fan components 210, which are mounted on the frame 100, with the air outlet of each cooling fan component 210 facing the cooling chamber 102. It is understood that by providing multiple cooling fan components 210, a batch of PCBs can be simultaneously cooled by airflow, enabling the cooling buffer device 10 to cool a batch of PCBs, thereby improving PCB production efficiency.

[0063] Compared with the prior art, this disclosure has at least the following advantages:

[0064] 1、Through setting the first and second conveying plates, the PCB boards input from the input plate port can be conveyed to the plate body storage area, and the PCB boards cooled in the plate body storage area can be conveyed to the output plate port, realizing the automatic plate feeding and discharging function of the cooling buffer device, saving the labor cost of output, and improving the production efficiency of the PCB boards.

[0065] 2、Through setting the first and second material frames, the first and second material frames are arranged on the lifting frame, and each first support platform and the corresponding second support platform jointly form a plate body storage area for supporting the PCB boards, that is, through setting multiple plate body storage areas, multiple PCB boards can be stored in the cooling cavity, and then the lifting drive element is driven to output to drive the lifting frame to perform lifting operation, conveying the first and second material frames to the position adjacent to the air outlet end of the cooling assembly, and driving the cooling assembly to cool and blow the PCB boards in the multiple plate body storage areas, realizing the cooling treatment of the cooling buffer device on the batch PCB boards, and further improving the production efficiency of the PCB boards.

[0066] The above-described embodiments only express several embodiments of the present disclosure, and the description is relatively specific and detailed, but it cannot be understood as a limitation on the scope of the disclosed patent. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present disclosure, several modifications and improvements can be made, which belong to the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure patent should be subject to the appended claims.

Claims

1. A cooling buffer device for PCB board, comprising a rack and a cooling assembly, the rack is provided with a cooling cavity, and the cooling assembly is arranged in the cooling cavity, characterized in that, The rack is provided with a plate inlet and a plate outlet, and the plate inlet and the plate outlet are communicated with the cooling cavity; The cooling buffer device further comprises a lifting assembly, a plate storage assembly and a plate conveying assembly; The lifting assembly comprises a lifting drive and a lifting frame, the lifting drive is arranged in the cooling cavity, and the lifting frame is arranged on the lifting end of the lifting drive; The plate storage assembly comprises a first material frame and a second material frame, the first material frame and the second material frame are arranged on the lifting frame, the first material frame is provided with a plurality of first support platforms, the second material frame is provided with a plurality of second support platforms, each first support platform and the corresponding second support platform jointly form a plate body storage area for supporting a PCB, and a plurality of plate body storage areas are formed in this way; The air outlet end of the cooling assembly is arranged towards the plurality of plate body storage areas; The plate conveying assembly comprises a first plate conveying member and a second plate conveying member, the first plate conveying member is arranged adjacent to the first material frame, the second plate conveying member is arranged adjacent to the second material frame, and the first plate conveying member and the second plate conveying member are used for conveying the PCB input from the plate inlet to the plate body storage area and conveying the PCB cooled in the plate body storage area to the plate outlet.

2. The cooling cache device for a PCB board according to claim 1, wherein, The first material frame comprises a plurality of first support rods arranged at intervals, each first support rod is provided with a plurality of first support protrusions arranged at equal distances in the vertical direction, and the plurality of first support protrusions jointly form the first support platform in the horizontal direction; Adjacent two first support rods are formed with a first hollow opening.

3. The cooling cache device for PCB board according to claim 1, wherein, The second material frame comprises a plurality of second support rods arranged at intervals, each second support rod is provided with a plurality of second support protrusions arranged at equal distances in the vertical direction, and the plurality of second support protrusions jointly form the second support platform in the horizontal direction; Adjacent two second support rods are formed with a second hollow opening.

4. The cooling cache device for PCB board according to claim 2, characterized in that, The first plate conveying member comprises a first plate frame, a first plate drive, a first plate belt conveying member and a first plate belt conveying member, the first plate frame is arranged in the cooling cavity, the first plate drive is mounted on the first plate frame, the first plate belt conveying member is arranged on one end of the first plate frame adjacent to the plate inlet, the first plate belt conveying member is arranged on the other end of the first plate frame adjacent to the plate outlet, and the first plate belt conveying member and the first plate belt conveying member are connected with the power output end of the first plate drive.

5. The cooling cache device for PCB board according to claim 3, wherein, The second plate conveying member comprises a second plate frame, a second plate drive, a second plate belt conveying member and a second plate belt conveying member, the second plate frame is arranged in the cooling cavity, the second plate drive is mounted on the second plate frame, the second plate belt conveying member is arranged on one end of the second plate frame adjacent to the plate inlet, the second plate belt conveying member is arranged on the other end of the second plate frame adjacent to the plate outlet, and the second plate belt conveying member and the second plate belt conveying member are connected with the power output end of the second plate drive.

6. The cooling cache device for PCB board according to claim 4, wherein, The first conveying plate member comprises a plurality of first gear wheel conveying members, each of which is mounted on the first conveying plate frame and connected with the power output end of the first conveying plate driving member, and each of which is arranged in the corresponding first hollow opening.

7. The cooling cache device for PCB boards according to claim 6, characterized in that, The first conveying plate member further comprises a first telescopic driving member arranged in the cooling cavity, and the telescopic pushing end of the first telescopic driving member is connected with the first conveying plate frame. A plurality of first limiting grooves are formed on the first conveying plate frame, and each first supporting rod is movably arranged in the corresponding first limiting groove. A plurality of first sliding rail members are arranged on the rack, and the first conveying plate frame is slidably connected with the first sliding rail members.

8. The cooling cache device for PCB board of claim 5, wherein, The second conveying plate member comprises a plurality of second gear wheel conveying members, each of which is mounted on the second conveying plate frame and connected with the power output end of the second conveying plate driving member, and each of which is arranged in the corresponding second hollow opening.

9. The cooling cache device for PCB boards according to claim 8, characterized in that, The second conveying plate member further comprises a second telescopic driving member arranged in the cooling cavity, and the telescopic pushing end of the second telescopic driving member is connected with the second conveying plate frame. A plurality of second limiting grooves are formed on the second conveying plate frame, and each second supporting rod is movably arranged in the corresponding second limiting groove. A plurality of second sliding rail members are arranged on the rack, and the second conveying plate frame is slidably connected with the second sliding rail members.

10. The cooling cache device for PCB boards according to claim 1, characterized in that, The cooling assembly comprises a plurality of cooling fan members arranged on the rack, and the air outlet end of each cooling fan member is arranged towards the cooling cavity.

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