Heat dissipation device and vehicle-mounted controller
By using a uniformly distributed heat dissipation column and a large surface area heat sink design in the radiator, the problems of local heat accumulation and uneven heat dissipation in the prior art are solved, achieving uniform heat distribution and rapid heat dissipation, and improving heat dissipation efficiency.
Patent Information
- Application Number
- CN202423287496.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Existing radiators, due to their shape and layout, cause heat to accumulate rapidly in localized areas, forming hot spots, resulting in poor and uneven heat dissipation.
The design combines heat dissipation columns and heat sinks. The heat dissipation columns are evenly distributed in the first heat dissipation area. Heat is introduced through the heat dissipation columns and then transferred to the second heat dissipation area by the heat sinks. The large surface area of the heat sinks is used for heat exchange.
It achieves uniform heat distribution and rapid dissipation, improves heat dissipation efficiency, reduces the formation of hot spots, and ensures efficient heat dissipation.
Smart Images
Figure CN223859469U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to vehicle-mounted heat dissipation technical field especially relates to a heat dissipation device and vehicle-mounted controller. BACKGROUND
[0002] With the rapid development of automobile electronic technology, the vehicle-mounted control domain function is increasingly complex, the number and power consumption of electronic components increase significantly, a large amount of heat is generated in the running process, and the heat dissipation problem becomes a key factor affecting system performance and reliability.
[0003] The existing radiator usually adopts sheet-shaped radiating fins or fins, due to the flat sheet shape, the cross-sectional area is small, when the heat is conducted from the equipment to the radiating fin, the heat flux density (heat flow per unit area) will increase, which leads to the rapid accumulation of local heat in the contact area, the temperature rises sharply, and a hot spot is formed, so that the heat dissipation effect is poor.
[0004] In addition, since the radiating fins can only be arranged horizontally on the surface of the equipment, the heat mainly diffuses in the horizontal plane direction, and in the contact area with small cross-sectional area, the heat flow may be concentrated on some paths, and these paths may not be able to well dissipate the heat due to the horizontal arrangement of the radiating fins and air convection, etc., resulting in local high temperature and uneven heat dissipation. SUMMARY
[0005] In order to overcome at least one of the defects of the prior art, the utility model provides a heat dissipation device and vehicle-mounted controller, which combines the heat dissipation column and the radiating fin, reduces the generation of hot spots, and improves the heat dissipation effect.
[0006] The utility model adopts the technical scheme that:
[0007] A heat dissipation device, comprising:
[0008] A heat dissipation main body, a first heat dissipation area and a second heat dissipation area are arranged on the heat dissipation main body, and the second heat dissipation area is through with the first heat dissipation area;
[0009] A plurality of heat dissipation columns are arranged in the first heat dissipation area, and the plurality of heat dissipation columns are used for guiding the heat to enter the first heat dissipation area;
[0010] A plurality of radiating fins are arranged in the second heat dissipation area, and the plurality of radiating fins are used for guiding the heat of the first heat dissipation area to the second heat dissipation area.
[0011] Further, the plurality of heat dissipation columns are uniformly spaced and arranged in the first heat dissipation area, and a first heat dissipation channel is formed between two adjacent heat dissipation columns; and the plurality of heat dissipation fins are spaced and arranged in the second heat dissipation area, and a second heat dissipation channel is formed between two adjacent heat dissipation fins, and the second heat dissipation channel is through the first heat dissipation channel.
[0012] Further, the first heat dissipation area is arranged with a plurality of heat dissipation column groups in a first direction, and the second heat dissipation area is arranged with a plurality of heat dissipation column groups in a second direction; a first heat dissipation interval is formed between two adjacent heat dissipation column groups in the first direction, and a second heat dissipation interval is formed between two adjacent heat dissipation column groups in the second direction, and the first heat dissipation interval and the second heat dissipation interval are jointly formed into the first heat dissipation channel; and the first direction and the second direction form an angle.
[0013] Further, the first direction and the second direction are both inclined directions; and the first direction is perpendicular to the second direction.
[0014] Further, the heat dissipation column comprises a first column segment and a second column segment, the first column segment and the second column segment are connected to each other, and the outer diameter of the first column segment is smaller than that of the second column segment.
[0015] Further, the first column segment is a cylindrical segment, and the second column segment is a conical cylindrical segment; and the outer diameter of the conical cylindrical segment gradually increases from top to bottom.
[0016] Further, the heat dissipation fin comprises a first heat dissipation fin segment and a second heat dissipation fin segment, and the first heat dissipation fin segment is connected to the second heat dissipation fin segment and the arc segment.
[0017] Further, at least one of the heat dissipation fins is provided with a connecting column, and the connecting column is provided with a connecting hole.
[0018] Further, the middle part of the heat dissipation main body is recessed to form a mounting groove, the mounting groove forms the first heat dissipation area, and the two sides of the mounting groove form the second heat dissipation area.
[0019] A vehicle-mounted controller comprises a chip and the heat dissipation device, and the chip is arranged corresponding to the first heat dissipation area to abut against a plurality of heat dissipation columns.
[0020] In summary, the heat dissipation device and the vehicle-mounted controller have the following technical effects: in specific use, the chip is arranged at the first heat dissipation area, so that the chip is in abutment with the plurality of heat dissipation columns, due to the relatively regular and uniform distribution of the geometric shape of the cylindrical heat dissipation columns, the heat released by the chip will not be concentrated locally in the transmission process, and each cylindrical heat dissipation column can be regarded as an independent heat dissipation unit, which jointly undertakes the heat dissipation task, so that the heat is uniformly distributed through the plurality of uniformly spaced heat dissipation columns, the formation of hot spots is reduced, and high heat dissipation effect is ensured;
[0021] In addition, since the second heat dissipation area is in communication with the first heat dissipation area and is provided with a plurality of sheet-shaped heat dissipation fins, the heat can be transmitted to the second heat dissipation area through the sheet-shaped heat dissipation fins after being introduced into the first heat dissipation area, due to the large surface area of the sheet-shaped heat dissipation fins, the larger the surface area of the heat dissipation fins, the larger the area in contact with the air, and the more opportunities for heat exchange, so that the heat dissipation fins can more effectively utilize natural convection or weak air cooling for heat dissipation, because more surfaces can transmit heat to the surrounding air, so that the heat can be more quickly conducted to the outside, and the heat dissipation efficiency is further improved. BRIEF DESCRIPTION OF DRAWINGS
[0022] Fig. 1 It is a structural schematic view of the utility model;
[0023] Fig. 2 It is another perspective view of the structure of the utility model;
[0024] In the drawings, the meanings of the reference signs are as follows:
[0025] 10, heat dissipation main body; 11, heat dissipation column; 111, first column section; 112, second column section; 12, heat dissipation fin; 121, first heat dissipation fin section; 122, second heat dissipation fin section; 123, circular arc section; 13, first heat dissipation channel; 14, second heat dissipation channel; 15, mounting groove; 16, connecting hole. DETAILED DESCRIPTION
[0026] In order to better understand and implement, the technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model.
[0027] In the description of the utility model, it should be explained that the directions or position relations indicated by the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are the directions or position relations shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and cannot be understood as limiting the utility model. The device or element must have a specific direction, a specific direction and operation, therefore, it cannot be understood as a limitation of the utility model.
[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for describing particular embodiments only and is not intended to be limiting of the application.
[0029] Embodiment 1,
[0030] Referring to Figs. 1-2 The application discloses a heat dissipation device, which comprises a heat dissipation main body 10, a plurality of heat dissipation columns 11 and a plurality of heat dissipation fins 12. The heat dissipation columns 11 and the heat dissipation fins 12 are both provided with a plurality of heat dissipation columns 11 and heat dissipation fins 12. A first heat dissipation area and a second heat dissipation area are arranged on the heat dissipation main body 10, and the second heat dissipation area is through the first heat dissipation area. The plurality of heat dissipation columns 11 are distributed in the first heat dissipation area and are used for guiding heat to the first heat dissipation area. The plurality of heat dissipation fins 12 are arranged in the second heat dissipation area and are used for guiding the heat of the first heat dissipation area to the second heat dissipation area.
[0031] On the basis of the above structure, the first heat dissipation area can be the area where the heat dissipation main body 10 is connected with external equipment, and the second heat dissipation area is the area around the side of the first heat dissipation area. In this way, when the heat dissipation main body 10 is assembled with external equipment (such as a chip, a power module or a processor that needs to be cooled), the external equipment can abut against the plurality of heat dissipation columns 11 in the first heat dissipation area, and the heat of the external equipment can be guided into the first heat dissipation area through the plurality of heat dissipation columns 11. Since the geometric shape of the cylindrical heat dissipation columns 11 is relatively regular and uniformly distributed, the heat released by the external equipment will not be concentrated locally during the transmission process. Each cylindrical heat dissipation column 11 can be regarded as an independent heat dissipation unit, and they jointly undertake the heat dissipation task to uniformly distribute and transmit the heat to the first heat dissipation area through the plurality of uniformly distributed heat dissipation columns 11, thereby reducing the formation of hot spots and ensuring high heat dissipation effect.
[0032] In addition, since the second heat dissipation area is through the first heat dissipation area and is provided with a plurality of sheet-shaped heat dissipation fins 12, the heat can be transmitted to the second heat dissipation area through the sheet-shaped heat dissipation fins 12 after being guided into the first heat dissipation area. Since the sheet-shaped heat dissipation fins 12 have a large surface area, the larger the surface area of the heat dissipation fins 12, the larger the area in contact with the air, and the more opportunities for heat exchange. This makes the heat dissipation fins 12 more effectively utilize natural convection or weak air cooling for heat dissipation, because more surfaces can transfer heat to the surrounding air to make the heat be more quickly guided to the outside, thereby further improving the heat dissipation efficiency.
[0033] More specifically, since the heat dissipation column 11 is in a columnar structure, when in contact with the heat dissipation device, the bottom thereof contacts the surface of the device in a point or small area manner, which can be closely attached to the heat dissipation surface, and this contact manner is more flexible than the large area planar contact of the sheet-shaped heat dissipation fin 12, which makes it better adapt to heat dissipation devices of different shapes and structures, while the sheet-shaped heat dissipation fin 12 may be difficult to achieve such close fitting due to its own planar shape limitation, therefore, when the heat dissipation surface is fixed, the number of heat dissipation fins 12 that can be set is limited due to the limitation of its own material, while the heat dissipation column 11 can be set more and can be in full contact with the heat dissipation surface of the device to achieve rapid heat dissipation.
[0034] Therefore, when the heat dissipation device in the embodiment is applied to a vehicle-mounted controller or a processor and the like, high-power electronic modules in the device, such as power amplifiers, motor controllers and the like, which generate a large amount of heat during operation, can be correspondingly arranged in the first heat dissipation area to uniformly distribute the heat through the plurality of heat dissipation columns 11 arranged in the first heat dissipation area, reduce the formation of hot spots, ensure high heat dissipation effect, and at the same time, the heat is transferred to the surrounding air by the plurality of heat dissipation fins 12 in the second heat dissipation area, so that the heat can be more quickly conducted to the outside, further improving the heat dissipation efficiency, and improving the heat dissipation effect of the entire heat dissipation device.
[0035] It should be noted that the first heat dissipation area in the embodiment is a position on the heat dissipation main body 10 for connecting with an external device, and the second heat dissipation area can be located on both sides or one side of the first heat dissipation area, and both are connected to make the heat of the first heat dissipation area flow to the second heat dissipation area and be conducted out.
[0036] Further, the plurality of heat dissipation columns 11 are uniformly and spacedly arranged in the first heat dissipation area, and the first heat dissipation channels 13 are formed between every two adjacent heat dissipation columns 11, and the plurality of heat dissipation fins 12 are spacedly arranged in the second heat dissipation area, and the second heat dissipation channels 14 are formed between every two adjacent heat dissipation fins 12, and the second heat dissipation channels 14 are through the first heat dissipation channels 13.
[0037] Specifically, since every two adjacent heat dissipation columns 11 are spacedly arranged, the gap between every two adjacent heat dissipation columns 11 can form a channel for heat flow, so that the circumferential direction of each heat dissipation column 11 is distributed with first heat dissipation channels 13 of different flow directions, and then when the heat is introduced into the first heat dissipation area through the heat dissipation column 11, the heat can be introduced into the second heat dissipation channel 14 through the first heat dissipation channels 13 in multiple directions, and then taken away through the second heat dissipation channel 14, so that the heat dissipation is faster.
[0038] More specifically, since the interval gap between each two adjacent fins 12 provides another flow channel for heat, a plurality of second heat dissipation channels 14 are also formed on the second heat dissipation area, so that when the heat of the first heat dissipation area is introduced into the second heat dissipation area through the plurality of first heat dissipation channels 13, it can be simultaneously introduced out through the plurality of second heat dissipation channels 14, further improving the heat dissipation efficiency.
[0039] In addition, when each two fins 12 are arranged at intervals, each fin 12 has more surface exposed to the air, increasing the heat dissipation area and the opportunity to contact the air, so that the surface area of the fin 12 can be more effectively utilized, thereby improving the heat exchange efficiency between the air and the fin 12, and indirectly improving the heat dissipation effect.
[0040] Further, the first heat dissipation area is arranged with a plurality of heat dissipation column groups in a first direction, the second heat dissipation area is arranged with a plurality of heat dissipation column groups in a second direction, adjacent two heat dissipation column groups in the first direction form a first heat dissipation interval, adjacent two heat dissipation column groups in the second direction form a second heat dissipation interval, the first heat dissipation interval and the second heat dissipation interval together form the first heat dissipation channel 13, the first direction and the second direction form an angle, and the specific first direction and the second direction are described with reference to Figs. 1-2 the drawings.
[0041] Specifically, since the heat dissipation column group itself has a certain surface area, these surface areas can effectively absorb heat, and since there are a plurality of heat dissipation column groups and they are staggered in different directions, the overall heat dissipation area of the heat dissipation main body 10 is significantly increased. The larger the heat dissipation area, the more heat can be absorbed from the heat source and dissipated. In this way, the heat on the device can be quickly transferred to the first heat dissipation area, and the heat introduced in different directions can be quickly transferred to the second heat dissipation area through the first heat dissipation interval and the second heat dissipation interval in different directions, further improving the heat dissipation efficiency.
[0042] More specifically, the first direction and the second direction in the embodiment are both two directions inclined towards the second heat dissipation area, and the first direction is perpendicular to the second direction.
[0043] Compared with arranging the heat dissipation column groups in a horizontal or single direction, there may be a situation that part of the surface is blocked or the air flow is not sufficient. The design of the vertical inclined direction allows each part of the first heat dissipation column group and the second heat dissipation column group to have the opportunity to fully contact the flowing cold air. Just like putting each "heat dissipation puzzle" in the most effective position, the heat dissipation effect is further improved.
[0044] Further, the heat dissipation column 11 includes a first column segment 111 and a second column segment 112, and when specifically arranged, the first column segment 111 and the second column segment 112 are connected to each other, and the outer diameter of the first column segment 111 is smaller than the outer diameter of the second column segment 112.
[0045] Specifically, since the heat dissipation column 11 is composed of the first column segment 111 and the second column segment 112, and the outer diameter of the first column segment 111 is smaller than that of the second column segment 112, this stepped design can increase the contact area of the heat dissipation column 11 with the air. In the same space, a larger contact area means more opportunities for heat exchange. When the heat of the external electronic device is transferred to the heat dissipation column 11, the second column segment 112 with a larger outer diameter can more effectively dissipate heat to the surrounding air, thereby improving the heat dissipation efficiency.
[0046] More specifically, the first column segment 111 is a cylindrical segment, and the second column segment 112 is a conical column segment, and the outer diameter of the conical column segment gradually increases from top to bottom. In actual use, the conical column segment is used to abut and connect with the external device. Since the outer diameter of the conical column segment gradually increases from top to bottom, that is, the end of the heat dissipation column 11 used to abut with the heat source gradually increases towards the end of the heat dissipation main body 10. With the increase of the outer diameter, the space inside the heat dissipation column 11 gradually increases during the conduction of heat towards the first heat dissipation area. This allows heat to be more smoothly transferred towards the first heat dissipation area. The propagation of heat in the heat dissipation column 11 is similar to flowing in a gradually expanding channel, reducing the accumulation and blockage of heat, and improving the efficiency of heat conduction.
[0047] This structure helps to more evenly distribute heat on the heat dissipation column 11. Since the bottom contact area is large, heat can be quickly transferred to the bottom of the heat dissipation column 11, and then evenly spread to the first heat dissipation area as the outer diameter changes, avoiding heat concentration in a local area, thereby achieving more uniform heat dissipation effect.
[0048] Further, the heat dissipation fin 12 includes a first heat dissipation fin segment 121 and a second heat dissipation fin segment 122, and the first heat dissipation fin segment 121 is connected with the second heat dissipation fin segment 122 and the circular arc segment 123.
[0049] On the basis of this structure, the first heat dissipation fin segment 121 is arranged close to the first heat dissipation area, and the second heat dissipation fin segment 122 is in communication with the external environment. Since the first heat dissipation fin segment 121 and the second heat dissipation fin segment 122 are connected through the circular arc segment 123, when the heat of the first heat dissipation area flows through the first heat dissipation fin segment 121, it will change direction due to the guidance of the circular arc segment 123, continue to flow through the second heat dissipation fin segment 122, and then be guided out of the external environment. This change in air flow direction can increase the contact frequency and contact area of heat with the heat dissipation fin 12, indirectly increase the effective heat dissipation area, and make the heat dissipation effect better.
[0050] In addition, since the arc segment 123 plays a transition role in heat conduction, it can smoothly connect the first heat dissipation fin segment 121 and the second heat dissipation fin segment 122, so that the heat transfer between different segments is more smooth. Just like setting a smooth transition curve at the curve of the road, the heat will not be hindered by the structure mutation when passing through the arc segment 123, ensuring the continuity of the heat conduction path. The continuous heat conduction path can make the heat flow smoothly, reduce the loss of heat in the transmission process, so as to dissipate the heat to the surrounding environment more quickly and improve the heat dissipation efficiency.
[0051] Further, the mounting groove 15 is provided in the middle of the heat dissipation main body 10, and specifically, the mounting groove 15 is formed into a first heat dissipation area, and the two sides of the mounting groove 15 are formed into a second heat dissipation area.
[0052] Specifically, during assembly, the heat dissipation columns 11 can be distributed at intervals in the mounting groove 15, so that when the external device is connected against the multiple heat dissipation columns 11, the groove wall of the mounting groove 15 can abut against the outer periphery of the external device, assisting in fixing the outer periphery of the external device, so that the structure after connecting the heat dissipation main body 10 with the external device is more stable.
[0053] In addition, since the second heat dissipation area is formed on the two sides of the mounting groove 15, the heat inside the mounting groove 15 can be simultaneously conducted out through the two sides of the heat dissipation fins 12, and the heat conduction efficiency is higher.
[0054] More specifically, in order to facilitate the connection of the heat dissipation main body 10 with the external device, a connecting hole 16 is provided on at least one heat dissipation fin 12, which can be connected with the external device through the connecting hole 16 when the heat dissipation main body 10 is connected with the external device, so that the whole structure is more stable after assembly.
[0055] Embodiment 2,
[0056] Reference Figs. 1-2 A vehicle-mounted controller comprising a chip and the heat dissipation device in embodiment 1, the chip is arranged corresponding to the first heat dissipation area, and the multiple heat dissipation columns 11 are used to guide the heat generated by the chip into the first heat dissipation area.
[0057] On the basis of the structure, during assembly, a plurality of heat dissipation bosses are arranged on the end surface of the heat dissipation main body 10 away from the first heat dissipation area, the chip is in clearance fit with the plurality of heat dissipation bosses, and the heat-conductive silicone grease is filled in the clearance between the chip and the heat dissipation bosses, so that the chip abuts against the part of the heat dissipation main body 10 away from the first heat dissipation area. In this way, the heat released by the chip can be transmitted to the heat dissipation main body 10 through the heat dissipation bosses, and then quickly transmitted to the second heat dissipation area through the plurality of heat dissipation columns 11 in the first heat dissipation area of the heat dissipation main body 10. Since the geometric shape of the cylindrical heat dissipation columns 11 is relatively regular and uniformly distributed, the heat released by the external device will not be locally concentrated during transmission. Each cylindrical heat dissipation column 11 can be regarded as an independent heat dissipation unit, which collectively undertakes the heat dissipation task to uniformly distribute the heat through the plurality of uniformly spaced heat dissipation columns 11, reduce the formation of hot spots, and ensure high heat dissipation effect.
[0058] In addition, since the second heat dissipation area is through with the first heat dissipation area and is provided with a plurality of sheet-shaped heat dissipation fins 12, the heat can be transmitted to the second heat dissipation area through the sheet-shaped heat dissipation fins 12 after being introduced into the first heat dissipation area. Since the sheet-shaped heat dissipation fins 12 have a large surface area, the larger the surface area of the heat dissipation fins 12, the larger the area in contact with the air, and the more opportunities for heat exchange. This enables the heat dissipation fins 12 to more effectively utilize natural convection or weak air cooling for heat dissipation, because more surfaces can transmit heat to the surrounding air to enable the heat to be more quickly conducted to the outside, further improving the heat dissipation efficiency.
[0059] The technical means disclosed in the utility model scheme are not limited to the technical means disclosed in the above-mentioned embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that for ordinary skilled persons in the technical field, without departing from the principle of the utility model, a number of improvements and refinements can be made, which are also considered within the protection scope of the utility model.
Claims
1. A heat dissipating device, characterized by, The application relates to a heat dissipation device. The heat dissipation device comprises a heat dissipation body, a plurality of heat dissipation columns and a plurality of heat dissipation fins. The heat dissipation body is provided with a first heat dissipation area and a second heat dissipation area, and the second heat dissipation area is through the first heat dissipation area. The plurality of heat dissipation columns are uniformly and intervally distributed in the first heat dissipation area, and the plurality of heat dissipation columns are used for guiding heat to the first heat dissipation area.
2. The heat dissipating device according to claim 1, wherein The plurality of heat dissipation fins are arranged in the second heat dissipation area, and the plurality of heat dissipation fins are used for guiding the heat of the first heat dissipation area to the second heat dissipation area.
3. The heat dissipating device according to claim 2, wherein The plurality of heat dissipation columns are uniformly and intervally distributed in the first heat dissipation area, and the first heat dissipation channels are formed between two adjacent heat dissipation columns.
4. The heat dissipating device according to claim 3, wherein The plurality of heat dissipation fins are intervally distributed in the second heat dissipation area, and the second heat dissipation channels are formed between two adjacent heat dissipation fins, and the second heat dissipation channels are through the first heat dissipation channels.
5. The heat dissipating device of claim 1, wherein The first heat dissipation area is arranged with a plurality of heat dissipation column groups in a first direction, and the second heat dissipation area is arranged with a plurality of heat dissipation column groups in a second direction.
6. The heat dissipating device according to claim 5, wherein The first direction and the second direction are both inclined directions, and the first direction is perpendicular to the second direction.
7. The heat dissipating device of claim 1, wherein The heat dissipation column comprises a first column segment and a second column segment, the first column segment and the second column segment are connected to each other, and the outer diameter of the first column segment is smaller than that of the second column segment.
8. The heat dissipating device of claim 1, wherein, The first column segment is a cylindrical segment, and the second column segment is a conical cylindrical segment.
9. The heat dissipating device of claim 1, wherein, The heat dissipation fin comprises a first heat dissipation fin segment and a second heat dissipation fin segment, and the first heat dissipation fin segment is connected to the second heat dissipation fin segment and an arc segment.
10. An in-vehicle controller characterized by comprising: At least one heat dissipation fin is provided with a connecting column, and the connecting column is provided with a connecting hole. The middle part of the heat dissipation body is recessed to form a mounting groove, the mounting groove forms the first heat dissipation area, and the two sides of the mounting groove form the second heat dissipation area. The heat dissipation device comprises a chip and the heat dissipation device according to any one of claims 1-9, the chip is arranged in correspondence with the first heat dissipation area, and the heat dissipation column is used for dissipating heat of the chip.