Heat dissipation structure and electronic equipment

Abstract

A heat radiation structure and an electronic device, the heat radiation structure comprises: a housing and a heat radiator, the housing encloses a cavity, the heat radiator is located in the cavity, the heat radiator comprises a substrate and a fin group arranged on the substrate, the fin group comprises a plurality of fins arranged at intervals, an air channel is formed between two adjacent fins, the extension direction of the air channel is defined as a first direction, and the extension direction of the air channel is defined as a second direction; in the first direction, the shell comprises a first shell body and a second shell body which are oppositely arranged, a first opening is formed in at least one of the first shell body and / or the second shell body, and the end of the fin set is embedded into the first opening. The electronic equipment is provided with the novel heat dissipation structure, the end of the fin set on the heat dissipation device is embedded in the first opening, the fin set can make direct contact with the outside world, the air channel is directly communicated with the outside world and is not blocked by the shell, heat brought to the end of the air channel can be directly conducted to the outside world, and the heat dissipation efficiency is improved. And the heat dissipation effect is effectively improved.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation structure and electronic device. Background Technology

[0002] A scientific-grade CMOS camera is a device primarily used in scientific research, life sciences, and computer vision to replace the human eye in measurement and judgment, converting captured targets into image signals. In gene sequencing, a scientific-grade CMOS camera is a crucial component of the data acquisition system, responsible for detecting fluorescently labeled nucleotides and converting the acquired fluorescence signals into digital signals, thereby recording DNA sequence information.

[0003] The performance of the camera in a gene sequencer directly affects the accuracy and reliability of sequencing data. Camera heat dissipation is one of the key factors influencing camera performance. The motherboard and chips within the camera generate a significant amount of heat during operation, but existing scientific-grade CMOS cameras have poor heat dissipation. Inadequate heat dissipation leads to increased internal camera temperature, which in turn increases noise, reduces image quality, and may even damage the camera's electronic components. Therefore, improving the heat dissipation performance of scientific-grade CMOS cameras is of paramount importance. Utility Model Content

[0004] In view of this, it is necessary to propose a heat dissipation structure in order to solve at least one of the above defects.

[0005] In addition, this application also provides an electronic device that utilizes the aforementioned heat dissipation structure.

[0006] In a first aspect, embodiments of this application provide a heat dissipation structure, including: a housing and a heat sink, the housing forming a cavity, the heat sink being located within the cavity, the heat sink including a substrate and a fin group disposed on the substrate, the fin group including a plurality of spaced-apart fins, an air duct being formed between adjacent two fins, wherein the extending direction of the air duct is defined as a first direction, along the first direction, the housing including a first shell and a second shell disposed opposite to each other, at least one of the first shell and / or the second shell having a first opening, the end of the fin group being embedded in the first opening.

[0007] In some possible embodiments, the outermost fin in the fin group contacts the sidewall corresponding to the first opening.

[0008] In some possible embodiments, along the first direction, the length of the fin is less than or equal to the length of the substrate, and the end of the substrate is embedded in the first opening and in contact with the sidewall corresponding to the first opening.

[0009] In some possible embodiments, a thermally conductive medium layer is provided between the outermost fin and the sidewall, and between the substrate and the sidewall.

[0010] In some possible embodiments, along the thickness direction of the substrate, the end of the substrate near the first opening includes a first portion and a second portion connected to each other, the fin is located on the surface of the second portion away from the first portion, wherein, along the first direction, the length of the first portion is less than the length of the second portion, and the ends of the first portion and the second portion near the first opening form a step, the step engaging with the bottom sidewall of the first opening.

[0011] In some possible embodiments, the end of the first portion abuts against the inner surface of the first housing and / or the second housing, and the second portion extends into the first opening and contacts the bottom sidewall of the first opening.

[0012] In some possible embodiments, the end face of the fin assembly embedded in the first opening is flush with the outer surface of the first housing and / or the second housing.

[0013] In some possible embodiments, the heat dissipation structure further includes a fan located within the cavity, the fan being located on the side of the fin assembly away from the substrate, and the housing having a plurality of third openings corresponding to the fan.

[0014] In some possible embodiments, the outermost fin in the fin group has a greater thickness than the other fins.

[0015] Secondly, embodiments of this application provide an electronic device, including a heat source and a heat dissipation structure as described above, wherein the heat source is located inside the housing and on the side of the substrate away from the fin assembly.

[0016] Compared to existing technologies, the electronic device provided in this application has a novel heat dissipation structure. This structure, by creating a first opening in the outer casing and embedding the ends of the fin assembly on the heat sink within the first opening, allows the fin assembly to directly contact the outside environment. The airflow channel is directly connected to the outside without being obstructed by the outer casing, allowing heat carried to the end of the airflow channel to be directly conducted to the outside, effectively improving the heat dissipation effect. Furthermore, the heat sink embedded in the first opening can achieve close contact with the outer casing, combining the two and directly conducting some of the heat from the heat sink to the outer casing. This makes the outer casing itself a heat dissipation device, adding a new path for heat dissipation from the heat sink, effectively sharing the heat dissipation task and significantly enhancing the heat dissipation effect. Additionally, the main consideration in designing the first opening is to ensure that the ends of the fin assembly can be smoothly embedded, resulting in a low design complexity. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of an electronic device.

[0019] Figure 2 for Figure 1 Sectional view along II-II.

[0020] Figure 3 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application.

[0021] Figure 4 for Figure 3 A schematic diagram of the structure on the other side of the electronic device.

[0022] Figure 5 for Figure 3 A cross-sectional view along VV.

[0023] Figure 6 for Figure 3 Enlarged view of part A in the middle.

[0024] Figure 7 This is a partial structural diagram of the heat sink end embedded in the first opening in another embodiment of this application.

[0025] Figure 8 for Figure 3 A schematic diagram of the structure of the heat sink.

[0026] Explanation of main component symbols

[0027]

[0028] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0029] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments.

[0030] It should be noted that when a component is described as "fixed to" or "mounted to" another component, it can be directly on the other component or may be interspersed with an intermediate component. When a component is described as "set to" another component, it can be directly set on the other component or may be interspersed with an intermediate component. The term "and / or" as used herein includes all and any combination of one or more of the associated listed items.

[0031] like Figure 1 and Figure 2 The diagram shows a structural schematic of an electronic device 100a, which mainly includes: a housing 1a, and a heat source 20, a heat sink 2a, and a fan 3a located within the housing 1a. The heat sink 2a includes a substrate 21a and a plurality of spaced-apart fins 22a on the substrate 21a, with an air duct 23a formed between adjacent fins 22a. The heat source 20 is positioned close to the substrate 21a, the fins 22a are positioned close to the fan 3a, and the opening of the air duct 23a faces the fan 3a. The extending direction of the air duct 23a is defined as a first direction X. Along the first direction X, the housing 1a includes two opposing sidewalls 11a, with a plurality of ventilation holes 12a provided on the sidewalls 11a. The heat generated by the heat source 20 is transferred to the heat sink 2a and blown by the fan 3a into the air duct 23a of the heat sink 2a. The heat is carried along the air duct 23a to the ventilation hole 12a of the side wall 11a and then conducted to the outside through the ventilation hole 12a, thus achieving heat dissipation of the electronic device 100a.

[0032] In electronic device 100a, the outer casing 1a and the heat sink 2a are separate structures. The outer casing 1a, as an external structural component, primarily protects and supports internal components, effectively preventing impacts, shocks, and dust. Heat dissipation of the outer casing 1a is achieved through ventilation holes 12a on the side wall 11a, allowing airflow between the heat sink 2a's air duct 23a and the outside air, creating thermal convection and carrying away heat. Due to the structural limitations of the heat sink 2a and the outer casing 1a, the outer casing 1a around the ventilation holes 12a obstructs airflow during airflow, limiting the heat dissipation effect. Furthermore, the design of the ventilation holes 12a requires consideration of numerous factors, such as their shape, size, and number, increasing the complexity of the design.

[0033] For this purpose, please refer to Figures 3 to 5As shown in the figure, this application embodiment provides an electronic device 100, which may include a heat dissipation structure 10 and a heat source 20. The heat source 20 is the source of heat for the electronic device 100 and is capable of generating heat. Specifically, it may include a motherboard, electronic components, etc. These components generate a large amount of heat during operation, forming the heat source 20 in the electronic device 100. The heat dissipation structure 10 can conduct the heat generated by the heat source 20 to the outside to achieve heat dissipation of the electronic device 100. As can be seen from the foregoing, the specific structure of the heat dissipation structure 10 is one of the important factors affecting the heat dissipation effect.

[0034] Therefore, such as Figures 3 to 5 As shown, the heat dissipation structure 10 provided in this application embodiment has novel structural features and can effectively improve the heat dissipation effect of the electronic device 100. Specifically, the heat dissipation structure 10 includes: a shell 1 and a heat sink 2, wherein the shell 1 forms a cavity 3, and the heat sink 2 is located inside the cavity 3. The heat sink 2 includes a substrate 21 and a fin group 22 disposed on the substrate 21. The fin group 22 includes a plurality of spaced fins 23, and an air duct 24 is formed between two adjacent fins 23. The extension direction of the air duct 24 is defined as a first direction X. Along the first direction X, the shell 1 includes a first housing 11 and a second housing 12 disposed opposite to each other. At least one of the first housing 11 and / or the second housing 12 has a first opening 13 formed therein, and the end of the fin group 22 is embedded in the first opening 13. In some embodiments, both the first housing 11 and the second housing 12 are provided with the first opening 13, and the two first openings 13 are symmetrically arranged, which allows heat to be conducted to the outside from the opposite ends of the air duct 24 at the same time, further enhancing the heat dissipation effect.

[0035] Specifically, the substrate 21 is positioned close to the heat source 20, allowing heat generated by the heat source 20 to be conducted to the fin assembly 22 via the substrate 21. Additionally, the heat dissipation structure 10 includes a fan 4 located within the cavity 3, on the side of the fin assembly 22 furthest from the substrate 21. The outer casing 1 has multiple second openings 14 corresponding to the fan 4. The fins 23 extend towards the fan 4, causing the opening of the air duct 24 to face the fan 4, allowing the airflow from the fan 4 to directly enter the air duct 24.

[0036] The specific heat dissipation process is as follows: the heat generated by the heat source 20 is conducted to the heat sink 2, and then blown by the fan 4 into the air duct 24 of the heat sink 2. The heat is carried along the air duct 24 to its end and further conducted to the outside, thus achieving heat dissipation for the electronic device 100. Since the end of the fin assembly 22 is embedded in the first opening 13, the fin assembly 22 is in direct contact with the outside, and the air duct 24 is directly connected to the outside without being blocked by the outer casing 1. The heat carried to the end of the air duct 24 can be directly conducted to the outside, effectively improving the heat dissipation effect. Moreover, the main consideration in the design of the first opening 13 is to ensure that the end of the fin assembly 22 can be smoothly embedded, resulting in low design complexity.

[0037] Please see Figure 6 and Figure 7 As shown, please refer to the following: Figure 3 and Figure 5 The outermost fin 23 of the fin assembly 22 contacts the sidewall corresponding to the first opening 13. When the end of the fin assembly 22 is embedded in the first opening 13, the outermost fin 23 contacts the sidewall of the first opening 13. The heat sink 2, through the fin 23, is in close contact with the outer casing 1, allowing some of the heat in the heat sink 2 to be directly and quickly conducted to the outer casing 1 for heat dissipation. This allows the outer casing 1 to directly participate in heat dissipation, making it a heat dissipation device and adding another heat dissipation path. Because the outer casing 1 has a large surface area and high heat exchange efficiency with air, heat dissipation is further enhanced. Furthermore, the contact between the outermost fin 23 and the sidewall of the first opening 13 also prevents dust and contaminants from entering the cavity 3 of the outer casing 1, thereby extending the service life of the electronic device 100.

[0038] In some embodiments, the outermost fin 23 can be in direct contact with the sidewall of the first opening 13. This close contact between the fin 23 and the outer casing 1 enables rapid heat conduction while simultaneously preventing dust and contaminants from entering the cavity 3. It will be understood that in other embodiments, such as... Figure 6 As shown, the outermost fin 23 can also be in indirect contact with the sidewall of the first opening 13. A heat-conducting medium layer 5 can be provided between the outermost fin 23 and the sidewall of the first opening 13, which can also achieve rapid heat conduction and improve sealing.

[0039] Please see Figure 6 and Figure 7 As shown, please refer to the following: Figure 3 and Figure 5Along the first direction X, the length of the fin 23 is less than or equal to the length of the substrate 21. The end of the substrate 21 near the first opening 13 is embedded in the first opening 13 and contacts the sidewall corresponding to the first opening 13. The heat sink 2 further contacts the outer casing 1 through the substrate 21. Since the substrate 21 has a large area, it can further transfer some of the heat in the heat sink 2 directly to the outer casing 1, thereby further improving the heat dissipation effect.

[0040] In some embodiments, the substrate 21 and the sidewall of the first opening 13 can be in direct contact, or indirect contact can be achieved by providing a thermally conductive medium layer (not shown), which can also achieve the effect of rapid heat conduction and sealing.

[0041] The end face of the fin assembly 22, which is embedded in the first opening 13, is flush with the outer surface of the first housing 11 and / or the second housing 12. This allows the heat sink 2 to make full contact with the outer casing 1, further improving the heat dissipation effect, while preventing the heat sink 2 from protruding from the outer casing 1, making the overall electronic device 100 more aesthetically pleasing.

[0042] Please see Figure 5 and Figure 8 As shown, the outermost fin 23 in the fin group 22 is thicker than the other fins 23. By designing the thickness of the fin 23 in the middle to be thinner, more fins 23 can be placed on the limited surface of the substrate 21, thereby forming more air ducts 24 to enhance the heat dissipation effect. In addition, the outermost fin 23 is in contact with the sidewall of the first opening 13. Designing the outermost fin 23 to be thicker can store more heat, thereby conducting more heat to the outer casing 1 to further enhance the heat dissipation effect.

[0043] In addition, the substrate 21 is designed to be relatively thick, which serves two purposes: firstly, it can support the fins 23, preventing the heat sink 2 from deforming; secondly, since the substrate 21 can contact the sidewall of the first opening 13, the thicker substrate 21 can also store more heat, thereby conducting more heat to the outer casing 1 to further enhance the heat dissipation effect.

[0044] Please see Figures 6 to 8As shown, along the thickness direction Y of the substrate 21, the end of the substrate 21 near the first opening 13 may include a first portion 25 and a second portion 26 connected to each other, with the fins 23 located on the surface of the second portion 26 away from the first portion 25. Along the first direction X, the length of the first portion 25 is less than the length of the second portion 26, meaning that the end of the second portion 26 facing the first opening 13 extends beyond the first portion 25, forming a step 27 between the first portion 25 and the second portion 26. When the end of the fin assembly 22 is inserted into the first opening 13, the step 27 engages with the bottom sidewall of the first opening 13. By engaging the substrate 21 with the bottom sidewall of the first opening 13, the overall thickness limitation of the substrate 21 is reduced. Furthermore, engaging the substrate 21 at the first opening 13 improves the stability of the heat sink 2 after assembly with the housing 1.

[0045] In some embodiments, the end of the first portion 25 abuts against the inner surface of the first housing 11 and / or the second housing 12, and the second portion 26 extends into the first opening 13 and contacts the bottom sidewall of the first opening 13. This structural design can further increase the contact area between the substrate 21 and the housing 1, thereby improving the heat conduction efficiency.

[0046] Understandably, depending on the specific shape of the fin assembly 22, the first opening 13 can be configured in various shapes, specifically a rectangular structure. Furthermore, the size of the first opening 13 needs to be slightly larger than the size of the end of the heatsink 2 to facilitate the embedding of the end of the heatsink 2.

[0047] The electronic device 100 can be used in fields such as biology, chemistry, or medicine, for example, in gene sequencing systems, but is not limited thereto. Specifically, the electronic device 100 can be a scientific-grade CMOS camera in a gene sequencer. During gene sequencing, the electronic device 100 is an important component of the data acquisition system, responsible for detecting fluorescently labeled nucleotides and converting the acquired fluorescence signals into digital signals, thereby recording DNA sequence information. The electronic device 100 provided in this embodiment has good heat dissipation, which can effectively improve the accuracy and reliability of sequencing data obtained during gene sequencing.

[0048] It is understood that the heat dissipation structure 10 provided in this application embodiment can also be used in other systems or devices that require heat dissipation. For example, the electronic device 100 can also be a speaker, router, computer, or other devices.

[0049] Compared to existing technologies, the electronic device 100 provided in this application embodiment has a novel heat dissipation structure 10. This heat dissipation structure 10, by opening a first opening 13 on the outer casing 1 and embedding the end of the fin assembly 22 on the heat sink 2 within the first opening 13, allows the fin assembly 22 to directly contact the outside, and the air duct 24 to directly communicate with the outside. During heat dissipation and exhaust, the structure of the outer casing 1 does not obstruct the flow, and the heat carried to the end of the air duct 24 can be directly conducted to the outside, effectively improving the heat dissipation effect. Moreover, the heat sink 2 embedded in the first opening 13 can achieve close contact with the outer casing 1, making the outer casing 1 and the heat sink 2 a single unit. This allows some of the heat from the heat sink 2 to be directly conducted to the outer casing 1, making the outer casing 1 itself a heat dissipation device. This adds a new path for heat dissipation in the heat sink 2, effectively sharing the heat dissipation task and significantly enhancing the heat dissipation effect. In addition, the main consideration in the design of the first opening 13 is to ensure that the end of the fin assembly 22 can be smoothly embedded, resulting in low design complexity.

[0050] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A heat dissipating structure, characterized by comprising: include: An outer shell, which encloses a cavity; as well as A heat sink is located within the cavity. The heat sink includes a base plate and a fin assembly disposed on the base plate. The fin assembly includes multiple spaced-apart fins, and an air duct is formed between adjacent fins. Wherein, the extension direction of the air duct is defined as the first direction, and along the first direction, the outer shell includes a first shell and a second shell disposed opposite to each other, and at least one of the first shell and / or the second shell has a first opening formed therein, and the end of the fin assembly is embedded in the first opening.

2. The heat dissipating structure according to claim 1, wherein The outermost fin in the fin group contacts the sidewall corresponding to the first opening.

3. The heat dissipating structure according to claim 2, wherein Along the first direction, the length of the fin is less than or equal to the length of the substrate, and the end of the substrate is embedded in the first opening and in contact with the sidewall corresponding to the first opening.

4. The heat dissipating structure according to claim 3, wherein A thermally conductive medium layer is provided between the outermost fin and the sidewall, and between the substrate and the sidewall.

5. The heat dissipating structure according to claim 1, wherein Along the thickness direction of the substrate, the end of the substrate near the first opening includes a first part and a second part that are connected to each other. The fin is located on the surface of the second part away from the first part. Along the first direction, the length of the first part is less than the length of the second part. The ends of the first part and the second part near the first opening form a step, which engages with the bottom sidewall of the first opening.

6. The heat dissipating structure according to claim 5, wherein The end of the first portion abuts against the inner surface of the first housing and / or the second housing, and the second portion extends into the first opening and contacts the bottom sidewall of the first opening.

7. The heat dissipating structure according to claim 1, wherein The end face of the fin assembly that is embedded in the first opening is flush with the outer surface of the first housing and / or the second housing.

8. The heat dissipating structure of claim 1, wherein It also includes a fan located within the cavity, the fan being located on the side of the fin assembly away from the substrate, and the housing having a plurality of third openings corresponding to the fan.

9. The heat dissipating structure of claim 1, wherein The outermost fin in the fin group has a greater thickness than the other fins.

10. An electronic device, comprising: It includes a heat source and a heat dissipation structure as described in any one of claims 1-9, wherein the heat source is located inside the housing and on the side of the substrate away from the fin assembly.

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