Microsatellite heat conduction structural member

Abstract

The utility model relates to a microsatellite heat conduction structural member comprising a structural layer, the shape of which is matched with the shape of a PCDH control unit heat radiation part; a heat-conducting insulating layer is arranged on one side, facing the heat dissipation component, of the structural layer; and an anti-radiation layer is also arranged between the structural layer and the heat-conducting insulating layer. The heat-conducting structural member provided by the utility model has the advantages of compact structure, unique appearance, light structure, high reliability, good structural strength and the like, is convenient to assemble, can effectively lead out the heat of the components, improves the working efficiency of the components, and prolongs the service life of the components.

Description

TECHNICAL FIELD

[0001] The utility model relates to heat conduction control technical field, especially a kind of microsatellite heat conduction structural member. BACKGROUND

[0002] With the continuous development of aerospace technology, the working environment of microsatellite in space is increasingly complex. During the operation of the satellite, electronic devices will generate a large amount of heat. If this heat cannot be effectively dissipated in time, it will cause the temperature of the electronic devices to be too high, thereby affecting their performance and reliability, and even possibly causing malfunctions, shortening the working time and service life of the satellite. Currently, the existing satellite heat conduction structure has certain limitations in terms of heat dissipation efficiency, structural compactness, and compatibility with other components of the satellite, and cannot meet the growing demand for high-performance satellite thermal control. SUMMARY

[0003] Therefore, it is necessary to provide a microsatellite heat conduction structural member that can improve the heat dissipation efficiency of the satellite, is compact in structure, and has good compatibility.

[0004] A microsatellite heat conduction structural member includes a structural layer that is shaped to match the shape of a heat dissipation part of a PCDH control unit.

[0005] On the structural layer, the side facing the heat dissipation component is provided with a heat-conducting insulating layer. An anti-radiation layer is also provided between the structural layer and the heat-conducting insulating layer.

[0006] In one embodiment, the position on the structural layer where no heat-conducting insulating layer is provided and the side away from the heat dissipation component is provided with a weight-reducing part.

[0007] In one embodiment, the weight-reducing part is a groove or a hollowed-out part.

[0008] In one embodiment, a reinforcing rib is provided at the hollowed-out part to increase the strength of the structural layer.

[0009] In one embodiment, the structural layer, the weight-reducing part, and the reinforcing rib are integrally formed.

[0010] In one embodiment, a mounting groove is also provided on the structural layer. The height of the mounting groove is less than or equal to the thickness of the heat-conducting insulating layer and the anti-radiation layer.

[0011] In one embodiment, the side of the structural layer where the heat-conducting insulating layer is provided is also provided with a stepped avoidance structure. The stepped avoidance structure is a step formed according to the different heights of the heat dissipation components.

[0012] In one embodiment, the structure layer is made of a high-thermal-conductivity, light-weight metal material as a base material, and a black anodic oxidation surface treatment process is used to increase the thermal conductivity.

[0013] In one embodiment, the anti-radiation layer is made of tantalum or polyethylene or synthetic fiber.

[0014] In one embodiment, the thermal insulation layer is made of a material that has both insulation and thermal conductivity.

[0015] Compared with the prior art, the micro-satellite heat-conducting structure provided by the utility model has the following effects:

[0016] 1. The shape of the structure layer matches the shape of the heat dissipation part of the PCDH control unit, which can ensure close contact with the device, facilitate quick installation and integration, and has good compatibility.

[0017] 2. The thermal insulation layer can provide electrical insulation while dissipating heat from the heat dissipation components, preventing short circuits or electric leakage, and ensuring the safe operation of electronic equipment.

[0018] 3. The anti-radiation layer can resist high-energy particle radiation in space, protect electronic components from radiation damage, and prolong the service life of the equipment.

[0019] 4. By only setting the thermal insulation layer and the anti-radiation layer at the position of the heat dissipation components, the structure is compact, which meets the heat dissipation performance while avoiding the use of excess material, reducing unnecessary weight, and achieving lightweight design. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained from the structures shown in these drawings without creative labor.

[0021] Figure 1 It is a structural diagram of the micro-satellite heat-conducting structure in one embodiment.

[0022] Figure 2 It is a first surface structure diagram of the structure layer in one embodiment.

[0023] Figure 3 It is a second surface structure diagram of the structure layer in one embodiment.

[0024] Explanation of reference signs:

[0025] Structure layer 1, first surface 11, second surface 12, groove 13, hollow 14, connecting beam 141, reinforcing rib 15, mounting groove 16, stepped avoiding structure 17, mounting hole 18, heat-conducting insulation layer 2, anti-radiation layer 3.

[0026] The purposes, functional features and advantages of the utility model will be further described in combination with embodiments and with reference to the drawings. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0028] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the utility model are only used to explain the relative positional relationship, movement condition, etc. between components in a certain specific posture (as shown in the drawings), and if the specific posture changes, the directional indications also change accordingly.

[0029] In addition, the description of "first", "second" and the like in the utility model is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0030] In the utility model, unless otherwise specifically defined and limited, the terms "connection", "fixing" and the like should be understood broadly, for example, "fixing" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection, or physical connection or wireless communication connection; can be directly connected, or indirectly connected through intermediate medium, or the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific situation.

[0031] In addition, the detachable connection mentioned in the utility model includes but is not limited to buckle connection, threaded connection, pin connection, magnetic connection, plug-in connection, etc., which can be adaptively selected according to the situation. The specific detachable connection mode appearing in the following embodiments is one of the implementable modes, and is not the only limitation.

[0032] It can be understood that the technical solutions of various embodiments of the utility model can be combined with each other, but it must be based on that a person skilled in the art can realize, when the combination of technical solutions appears mutual contradiction or cannot be realized, it should be considered that the combination of technical solutions does not exist, also not within the protection scope required by the utility model.

[0033] The utility model is applied to commercial microsatellite, can heat conduction to the heat dissipation component that needs heat dissipation in the satellite working process, and then prolongs component working time, obtains more data.Compact structure, unique appearance, lightweight structure, high reliability, good structural strength and other advantages are designed, while realizing convenient assembly, can also effectively export component heat, improve component working efficiency, prolong component service life.

[0034] The utility model embodiments will be described in detail below with reference to the drawings in the utility model embodiments.

[0035] The utility model discloses a microsatellite heat conduction structural member, comprising: structural layer 1, the shape of structural layer 1 is adapted to the shape of PCDH control unit heat dissipation part, can ensure the close contact with device, facilitate quick installation and integration, and good compatibility is provided.In structural layer 1, the side towards heat dissipation component is provided with heat conduction insulating layer 2, can provide electrical insulation while heat dissipation heat dissipation component, prevent short circuit or electric leakage, guarantee the safe operation of electronic equipment.In the heat conduction insulating layer 2 between structural layer 1, still be provided with radiation resistance layer 3, radiation resistance layer 3 can resist the high-energy particle radiation in space, protect electronic component from radiation damage, prolong the life of equipment.In addition, since microsatellite is sensitive to weight, by only setting up heat conduction insulating layer and radiation resistance layer in heat dissipation component position, guarantee function while realizing lightweight design as far as possible.Combination design of structural layer 1, heat conduction insulating layer 2 and radiation resistance layer 3 optimizes heat management, ensures that electronic component works at suitable temperature, improves reliability.

[0036] Specifically, structural layer 1 is the plate-shaped structure with certain thickness, adopts high thermal conductivity, light metal material as base material preparation, for example, can adopt 6063-T6 series aluminum alloy or titanium alloy or carbon fiber composite material as base material, and increases heat conduction through black anodic oxidation surface treatment process.The overall shape is designed according to the shape of one side of PCDH control unit heat dissipation part, it can be seen that the shape of structural layer 1 is special-shaped.

[0037] The structural layer 1 has a first surface 11 and a second surface 12. On the first surface 11, one or more heat-conducting insulation layers 2 are arranged, the number of which is determined according to the number of heat-dissipating components that need to be cooled, and the position of which corresponds to the position of the heat-dissipating components. In this embodiment, the heat-conducting insulation layers 2 are arranged in three areas A, B and C, and an anti-radiation layer 3 is arranged between the structural layer 1 and the heat-conducting insulation layers 2.

[0038] On the first surface 11, the positions where no heat-conducting insulation layer 2 is arranged and the second surface away from the heat-dissipating components are provided with weight-reducing components. The weight-reducing components are grooves 13 or hollows 14, as shown. The grooves 13 are arranged in positions where the gap or space is small, and the hollows 14 are arranged in positions where the space is large. Figure 1 At the positions of the hollows 14, the structures on both sides are connected by connecting beams 141, and cross-shaped reinforcing ribs 15 are arranged between the two connecting beams 141 to increase the strength of the structural layer 1 and enhance heat dissipation. It should be noted that, in order to ensure that the structural layer 1 has sufficient strength, the diameter of the connecting beams 141 is greater than the diameter of the reinforcing ribs 15, so that the structural strength is satisfied.

[0039] In addition, in order to ensure the overall strength of the structural layer 1, the positions where the space is small at both ends of the structural layer 1 are preferentially provided with grooves 13. The structural layer 1, the weight-reducing components and the reinforcing ribs 15 can be milled from a whole piece of material to form an integral structure, which reduces the weight while further ensuring the structural strength. When milling and forming, the grooves are kept a certain wall thickness to ensure that the structure has sufficient strength, and the four corners of the reinforcing ribs 15 are appropriately chamfered to enhance the aesthetics of the structure.

[0040] The heat-conducting insulation layers 2 are regular rectangles for easy installation, one side of which faces the heat-dissipating components, and the other side of which is attached to the anti-radiation layer 3. The heat-conducting insulation layers 2 are made of materials that have both insulation and heat-conducting properties, such as heat-conducting silicone pads or polyurethane heat-conducting pads.

[0041] The anti-radiation layer 3 is also a regular rectangle for easy installation, the shape of which is adapted to the heat-conducting insulation layers 2, and the length and width of which are greater than or equal to the length and width of the heat-conducting insulation layers 2. One side of the anti-radiation layer 3 is attached to the heat-conducting insulation layers 2, and the other side is attached to the first surface 11 of the structural layer 1. The anti-radiation layer 3 is made of materials that have anti-radiation properties, such as tantalum, polyethylene or synthetic fibers.

[0042] To prevent the heat-conducting insulation layer 2 and the anti-radiation layer 3 from falling off, a mounting groove 16 is further arranged on the first surface of the structural layer 1, and the height of the mounting groove 16 is less than or equal to the superimposed thickness of the heat-conducting insulation layer 2 and the anti-radiation layer 3. The number of the mounting grooves 16 is determined according to the situation, and the mounting groove 16 can be arranged at each position where the heat-conducting insulation layer 2 and the anti-radiation layer 3 are arranged, or only in the area where the heat-conducting insulation layer 2 and the anti-radiation layer 3 are arranged. In the embodiment, the mounting groove 16 is arranged only in the area B. By embedding the heat-conducting insulation layer 2 and the anti-radiation layer 3 in the mounting groove 16, the heat dissipation can be effectively achieved while preventing the heat-conducting insulation layer 2 and the anti-radiation layer 3 from falling off.

[0043] Since the heights of the heat dissipation components on the PCDH control unit are different, a stepped avoiding structure 17 is further arranged on the first surface of the structural layer 1. The stepped avoiding structure 17 is a step formed according to the different heights of the heat dissipation components, and the number of the steps is more than one, which is determined according to the heights of the heat dissipation components. At the same time, the stepped design of the stepped avoiding structure 17 can avoid other components, so that the heat-conducting structural member maintains a proper distance above the components which do not need heat conduction.

[0044] A mounting hole 18 is further arranged on the side surface of the structural layer 1, and the mounting hole 18 is a threaded mounting hole. By means of threaded connection, the micro-satellite heat-conducting structural member in the embodiment can be integrated into other structural frames, and then the micro-satellite heat-conducting structural member is firmly and stably installed by means of screws, which has strong adaptability and good compatibility.

[0045] In the preparation, first, appropriate materials are selected according to the design requirements, such as the structural layer 1 is made of light alloy aluminum 6063-T6, and then the structural layer 1 is processed into the required shape by milling according to the shape of the heat dissipation part of the PCDH control unit. The heat-conducting insulation layer 2 is made of heat-conducting silicon pad, and is pasted on the surface of the heat dissipation component during installation. The anti-radiation layer 3 is made of tantalum sheet, and the two sides of the tantalum sheet are pasted with the heat-conducting silicon pad and the first surface of the structural layer 1 respectively to form a multi-layer structure. The tantalum sheet and the heat-conducting silicon pad are processed by shearing to form a regular square structure.

[0046] The processed structural layer 1, tantalum sheet and heat-conducting silicon pad are assembled according to the assembly process file to ensure that they are perfectly pasted on the surface of the component which needs heat dissipation and are fixed through the mounting hole 18. After the installation is completed, the overall heat-conducting structural member is debugged and tested to check whether the overall heat-conducting structural member meets the heat conduction requirements. If there is a problem, the adjustment and repair are timely carried out to ensure that the overall heat-conducting structural member can work normally and provide reliability and heat dissipation protection for the satellite electronic equipment.

[0047] During heat dissipation, the heat-conducting insulation layer 2 transmits the heat of the heat dissipation component to the anti-radiation layer 3, the anti-radiation layer 3 transmits the heat to the structural layer 1, and then the structural layer 1 transmits the heat to the outside.

[0048] The heat dissipation structure part can be matched with other components of the satellite, does not interfere with other systems of the satellite, has good compatibility, and is easy to install and maintain, thereby reducing the maintenance cost of the satellite.

[0049] The technical features of the above embodiments can be combined in any manner, and to make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not contradict, they should be considered as falling within the scope of the present application.

[0050] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all fall within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A microsatellite heat conducting structural member, characterized by, The application relates to a heat dissipation structure of a PCDH control unit, which comprises the following parts: a structure layer, the shape of which is matched with the shape of a heat dissipation part of a PCDH control unit; a heat-conducting insulating layer is arranged on the structure layer and faces a heat dissipation component; a radiation-resistant layer is further arranged between the structure layer and the heat-conducting insulating layer.

2. The micro-satellite heat conducting structural member according to claim 1, wherein a weight-reducing part is arranged on the structure layer and away from the heat dissipation component.

3. The micro-satellite heat conducting structure of claim 2, wherein, The weight-reducing part is a groove or a hollow part.

4. The micro-satellite heat conducting structure of claim 3, wherein, A reinforcing rib is arranged in the hollow part to increase the strength of the structure layer.

5. The micro-satellite heat conducting structure of claim 4, wherein, The structure layer, the weight-reducing part and the reinforcing rib are integrally formed.

6. The microsatellite heat conducting structure according to any one of claims 1 to 5, wherein A mounting groove is further arranged on the structure layer, and the height of the mounting groove is less than or equal to the thickness of the superposition of the heat-conducting insulating layer and the radiation-resistant layer.

7. The micro-satellite heat conducting structure of claim 6, wherein, A stepped avoiding structure is further arranged on the side of the structure layer where the heat-conducting insulating layer is arranged, and the stepped avoiding structure is a step formed according to the different heights of the heat dissipation component.

8. The micro-satellite heat conducting structure of claim 6, wherein, The structure layer is prepared by taking a metal material with high heat conductivity and light weight as a base material, and the heat conduction is increased through a black anode oxidation surface treatment process.

9. The microsatellite heat conducting structure of any one of claims 1 to 5, wherein The radiation-resistant layer is made of tantalum, polyethylene or synthetic fiber.

10. The microsatellite heat conducting structure of any one of claims 1 to 5, wherein The heat-conducting insulating layer is made of a material with both insulation and heat conduction properties.

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