Heat dissipation assembly and energy storage inversion device

Abstract

The utility model provides a heat dissipation assembly and an energy storage inversion device. The heat dissipation assembly comprises a main heat dissipation device, the main heat dissipation device comprises a first base body, and the first base body is provided with an installation opening penetrating in the thickness direction of the first base body; the first heat dissipation piece is provided with a first groove, the first heat dissipation piece is connected with the first base body, the installation opening and the first groove are oppositely arranged, and the first groove and the installation opening are configured to be used for containing a first electronic element; the second heat dissipation piece is provided with a second groove, the second groove is used for containing a second electronic element, and the heating value of the second electronic element is smaller than that of the first electronic element. According to the heat dissipation assembly, the heat with the high heat production amount can be subjected to key heat dissipation work.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of new energy, in particular to a heat dissipation assembly and an energy storage inverter. BACKGROUND

[0002] The energy storage inverter is widely used in distributed energy systems (such as photovoltaic power stations, wind power plants), grid peak regulation energy storage systems, and electric vehicle charging stations. The core function of the energy storage inverter is to convert the direct current output by the energy storage battery into alternating current and exchange energy with the power grid or load. The energy storage inverter needs to achieve efficient heat dissipation under high load conditions. During the working process of the energy storage inverter, some parts (especially the transformer and inductor in the inverter) generate more heat than other electronic components.

[0003] In the prior art, when the energy storage inverter is cooled, it is difficult to focus on cooling the parts that generate more heat. CONTENT OF THE INVENTION

[0004] In view of the above problems, the present application provides a heat dissipation assembly and an energy storage inverter for specifically conducting heat from parts that generate more heat, so as to facilitate targeted cooling of parts that generate more heat.

[0005] In one aspect, the present application provides a heat dissipation assembly, comprising: a main heat sink, the main heat sink comprising a first base body, the first base body being provided with a mounting opening penetrating in the thickness direction thereof; a first heat dissipation member provided with a first groove, the first heat dissipation member being connected with the first base body, the mounting opening being oppositely arranged with the first groove, and the first groove and the mounting opening being configured to accommodate a first electronic component; and a second heat dissipation member provided with a second groove, the second groove being configured to accommodate a second electronic component, the second electronic component generating less heat than the first electronic component.

[0006] In some embodiments, the main heat sink further comprises: a plurality of first fins, the plurality of first fins being arranged on the first base body, the first fins and the second heat dissipation member being located on the same side of the thickness direction of the first base body, and the first fins avoiding the mounting opening.

[0007] In some embodiments, the cross sections of the first groove and the second groove are both in U shape, and the first groove extends to both ends of the first heat dissipation member in the length direction, and the second groove extends to both ends of the second heat dissipation member in the length direction.

[0008] In some embodiments, the first heat dissipation member comprises: a first cover plate, the first cover plate being connected with the first base body and defining the first groove together; and a second fin, the second fin being arranged on the side of the first cover plate away from the first groove.

[0009] In some embodiments, the second heat dissipating member comprises a second cover plate and a third fin, the second cover plate defines the second recess, and the third fin is arranged on a side of the second cover plate opposite to the second recess.

[0010] In some embodiments, the heat dissipating assembly further comprises a box body having a receiving cavity, an air inlet and an air outlet communicating with the receiving cavity; the main heat dissipating device, the first heat dissipating member and the second heat dissipating member are arranged in the receiving cavity and define an air flow space with the box body; and an air flow driving member is arranged in the box body and is adapted to drive air flow from the air inlet to the air outlet through the air flow space.

[0011] In some embodiments, the box body comprises a first side plate and a second side plate opposite to each other along the first direction, the air inlet is arranged on the first side plate, and the air outlet is arranged on the second side plate; and the air flow driving member is arranged on the air inlet.

[0012] In some embodiments, the box body comprises a main box body and a sub-box body connected to a side of the main box body; the receiving cavity comprises a main cavity formed in the main box body and a sub-cavity formed in the sub-box body; the main heat dissipating device, the first heat dissipating member and the second heat dissipating member are arranged in the sub-cavity; and the air inlet and the air outlet are arranged on the sub-box body and communicate with the sub-cavity.

[0013] In some embodiments, the box body comprises a connecting plate formed on adjacent sides of the main cavity and the sub-cavity, the connecting plate has a first passage opening and a second passage opening; the first base body and the second heat dissipating member are connected to the connecting plate, the first base body covers the first passage opening, and the second heat dissipating member covers the second passage opening.

[0014] In some embodiments, the air flow driving member comprises a first fan opposite to the first heat dissipating member along a first direction, a second fan opposite to the second heat dissipating member along the first direction, and a third fan opposite to the main heat dissipating device in a region between the first heat dissipating member and the second heat dissipating member along the first direction; and the first direction is perpendicular to a thickness direction of the first base body.

[0015] In some embodiments, the heat dissipating assembly further comprises a wind collecting cover arranged on an outer periphery of the first heat dissipating member, and an over-flow gap is defined between the wind collecting cover and the first heat dissipating member.

[0016] The heat dissipation assembly provided in the application is provided with a main heat radiator, a first heat dissipation member and a second heat dissipation member, and a first recess is defined by the first heat dissipation member and a second recess is defined by the second heat dissipation member. In use, a part of the position with high heat production (i.e. the first electronic component) can be accommodated in the first recess, and another part of the position with high heat production (i.e. the second electronic component) can be accommodated in the second recess, so that the heat of the position with high heat production can be conducted out through the first heat dissipation member and the second heat dissipation member, thereby facilitating the work of focusing on the heat dissipation of the position with high heat production. In addition, a larger coverage area can be formed by the first base body, so as to facilitate the heat conduction out of the area covered thereby and the heat dissipation work of the coverage area.

[0017] In another aspect, the embodiment of the application further provides an energy storage inverter device, comprising: a circuit board; an inverter device connected with the circuit board; the inverter device comprising a transformer and an inductor module; the heat dissipation assembly described above, the first base body and the circuit board being oppositely arranged along the thickness direction of the circuit board and jointly defining a heat dissipation gap, the mounting port being opposite to the heat dissipation gap, the transformer extending into the first recess through the mounting port; and the inductor module being arranged in the second recess.

[0018] In some embodiments, the energy storage inverter device further comprises an adapter arranged in the heat dissipation gap and opposite to the mounting port, and the circuit board and the transformer are connected through the adapter.

[0019] In some embodiments, the energy storage inverter device further comprises a connecting wire, and the inductor module is connected with the circuit board through the connecting wire.

[0020] In some embodiments, the heat dissipation assembly comprises a box body having a receiving cavity, an air inlet and an air outlet communicating with the receiving cavity; the box body comprises a main box body and a sub-box body connected to one side of the main box body; the receiving cavity comprises a main cavity in the main box body and a sub-cavity in the sub-box body; the air inlet and the air outlet communicate with the sub-cavity, and the main heat radiator, the first heat dissipation member and the second heat dissipation member are arranged in the sub-cavity, and the circuit board is arranged in the main cavity.

[0021] In some embodiments, the main heat radiator comprises first fins; the first heat dissipation member comprises second fins; the second heat dissipation member comprises third fins; the length direction of the first fins, the length direction of the second fins and the length direction of the third fins are parallel to each other.

[0022] The energy storage inverter device provided by the application, by extending the transformer into the first groove, setting the inductance module in the second groove, leading out the heat of the transformer through the first heat dissipation member, leading out the heat of the inductance module through the second heat dissipation member, so as to facilitate the heat dissipation of the two types of components with large heat generation, i.e. the transformer and the inductance module. In addition, through the first base body, the heat dissipated by the circuit board can be led out, so as to facilitate the heat dissipation of the circuit board; and through the heat dissipation gap, the heat dissipation assembly can avoid interfering with the circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0024] Figure 1 The structural diagram of the heat dissipation assembly provided by the embodiment of the present application.

[0025] Figure 2 The top view of the heat dissipation assembly in Figure 1

[0026] Figure 3 The sectional view of the A-A section of Figure 2

[0027] Figure 4 The schematic diagram of another view of the heat dissipation assembly in Figure 1

[0028] Figure 5 The structural schematic diagram of the main heat radiator provided by the embodiment of the present application.

[0029] Figure 6 The exploded structural schematic diagram of the first heat dissipation member provided by the embodiment of the present application.

[0030] Figure 7 The exploded structural schematic diagram of the second heat dissipation member provided by the embodiment of the present application.

[0031] Figure 8 The partial structural schematic diagram of the main box body provided by the embodiment of the present application.

[0032] Figure 9 The partial structural schematic diagram of the auxiliary box body provided by the embodiment of the present application.

[0033] Figure 10 The sectional view of the energy storage inverter device provided by the embodiment of the present application.

[0034] Figure 11 ​​​An internal structure diagram of the energy storage inverter device provided by the embodiment of the present application is shown.

[0035] Label explanation: 10-heat dissipation assembly; 20-circuit board; 30-inverter device; 31-transformer; 32-inductor module; 40-heat dissipation gap; 50-adapter; 60-connection wire; 100-main heat sink; 110-first base body; 111-mounting port; 112-first through-hole; 120-first fin; 200-first heat dissipation piece; 201-first groove; 210-first cover plate; 220-second fin; 230-first threaded hole; 240-second threaded hole; 250-first blocking plate; 300-second heat dissipation piece; 301-second groove; 310-second cover plate; 320-third fin; 330-third threaded hole; 340-fourth threaded hole; 350-second blocking plate; 400-box body; 401-receiving cavity; 4011-main cavity; 4012-secondary cavity; 402-air inlet; 403-air outlet; 404-first side plate; 405-second side plate; 410-main box body; 411-bottom cover; 420-secondary box body; 421-top cover; 430-connection plate; 431-first passage port; 432-second passage port; 440-supporting plate; 441-supporting piece; 450-bracket; 500-airflow driving piece; 510-first fan; 520-second fan; 530-third fan; 600-air collecting cover; 601-flow gap. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more apparent and easy to understand, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0037] The energy storage inverter device is widely used in distributed energy systems (such as photovoltaic power stations, wind power plants), grid peak regulation energy storage systems, and electric vehicle charging stations. The core function of the energy storage inverter device is to convert the direct current output by the energy storage battery into alternating current and interact with the grid or load. The energy storage inverter device needs to achieve efficient heat dissipation under high load conditions. During the working process of the energy storage inverter device, some parts (especially the transformer and inductor in the inverter device) generate more heat than other electronic components.

[0038] In the prior art, when the energy storage inverter device is cooled, it is difficult to focus on cooling the parts that generate more heat.

[0039] Exemplarily, taking the containing cavity of the energy storage inverter device as an example, in the prior art, when the energy storage inverter device is cooled, the airflow is driven to flow through the entire containing cavity by the fan, so that the airflow can cover as many components of the energy storage inverter device as possible to cool them. This scheme, on the one hand, greatly increases the demand for the fan; on the other hand, either the components with high heat production are not cooled enough, or the heat of the components with high heat production is easily blown to the adjacent components with low heat production, affecting the safe operation of the components with low heat production.

[0040] In view of the above problems, the present application provides a heat dissipation assembly and an energy storage inverter device for specifically leading out the heat of the parts with high heat production to facilitate the specific cooling of the parts with high heat production.

[0041] On the one hand, the heat dissipation assembly provided by the present application is provided by arranging the main heat sink, the first heat dissipation member and the second heat dissipation member, and defining the first recess by the first heat dissipation member and the second recess by the second heat dissipation member. In use, a part of the parts with high heat production (i.e. the first electronic element) can be accommodated in the first recess, and another part of the parts with high heat production (i.e. the second electronic element) can be accommodated in the second recess, so that the heat of the parts with high heat production can be led out through the first heat dissipation member and the second heat dissipation member to facilitate the specific cooling of the parts with high heat production. In addition, a larger coverage area can be formed by the first base body to facilitate the leading out of the heat of the area covered thereby to facilitate the heat dissipation of the coverage area.

[0042] Referring to Figures 1 to 11 In the process described in the present application, the direction of the Y axis is the first direction, or the front-back direction, wherein the positive direction of the Y axis is forward and the negative direction of the Y axis is backward. The direction of the X axis is the second direction, or the left-right direction, wherein the positive direction of the X axis is right and the negative direction of the X axis is left. The direction of the Z axis is the thickness direction of the first base body 110, or the up-down direction, wherein the positive direction of the Z axis is upward and the negative direction of the Z axis is downward. It should be noted that "front", "back", "left" and "right" are orientation descriptions based on the drawings and do not limit the direction in the use state.

[0043] Referring to Figures 1 to 9 As shown in the figure, the heat dissipation assembly provided by the embodiment of the present application comprises a main heat sink 100, a first heat dissipation member 200 and a second heat dissipation member 300.

[0044] Exemplarily, the main heat sink 100, the first heat dissipation member 200 and the second heat dissipation member 300 are made of a material conducive to heat conduction, such as aluminum, aluminum alloy, copper, copper alloy or stainless steel, etc. The material of the main heat sink 100, the first heat dissipation member 200 and the second heat dissipation member 300 is not specifically limited by the present application, as long as it is conducive to heat conduction.

[0045] The main heat sink 100 comprises a first base 110. The first base 110 is provided with a mounting hole 111 extending through the thickness of the first base 110. The first heat sink 200 is connected to the first base 110. The first heat sink 200 is provided with a first recess 201. The mounting hole 111 is arranged opposite to the first recess 201. The first recess 201 and the mounting hole 111 are configured to accommodate the first electronic component. For example, the first base 110 can be formed in a plate shape so as to have a large surface area in the first direction and the second direction.

[0046] For example, the specific shape of the first recess 201 and the mounting hole 111 can be flexibly selected according to requirements. In the embodiment, the cross section of the first recess 201 is in a U shape. It can be understood that the "U shape" includes an arc segment and two opposite segments, which are opposite and parallel to each other. One of the two opposite segments is located on one side of the corresponding arc segment, and the other opposite segment is located on the other side of the corresponding arc segment. The first recess 201 is suitable for accommodating the first electronic component which needs to be cooled. The mounting hole 111 is suitable for the first electronic component to enter the first recess 201 or the lead-out of the lead of the first electronic component located in the first recess 201.

[0047] For example, the side of the first heat sink 200 opposite to the first recess 201 can have a large surface area so as to facilitate the heat dissipation of the first heat sink 200 to the outside.

[0048] For example, the first heat sink 200 and the first base 110 can be fixedly connected by welding. Alternatively, the two can be detachably connected by a fastener such as a screw. Alternatively, the two can be formed in an integrated structure, for example, by an integrated molding process such as casting or 3D printing.

[0049] The second heat sink 300 is arranged on one side of the first heat sink 200 along the second direction. The second heat sink 300 is provided with a second recess 301 for accommodating the second electronic component.

[0050] In the embodiment, the heat dissipation of the second electronic component is less than that of the first electronic component. The second heat sink 300 cools the second electronic component. In the embodiment, the first electronic component is a transformer, which can be one or more. The second electronic component is an inductor, which can be one or more.

[0051] For example, the second heat sink 300 and the first base 110 can be indirectly connected through an intermediate structural member. Alternatively, in some possible embodiments, the second heat sink 300 can be directly connected to the first base 110, which can be welding or detachable connection.

[0052] Exemplarily, the shape of the second recess 301 can be flexibly selected according to requirements, and the second recess 301 is suitable for accommodating a part that needs targeted heat dissipation.

[0053] Exemplarily, the side of the second heat dissipation member 300 away from the second recess 301 can have a larger surface area, so as to facilitate the second heat dissipation member 300 to dissipate heat to the outside. In the embodiment, the cross section of the second recess 301 is in a U shape.

[0054] Referring to Figures 1 to 9 As shown in the figures, the heat dissipation assembly provided by the embodiment of the present application comprises the main heat sink 100, the first heat dissipation member 200 and the second heat dissipation member 300, and the first recess 201 is defined by the first heat dissipation member 200 and the second recess 301 is defined by the second heat dissipation member 300. In use, a part (i.e. the first electronic component) with a relatively high heat generation can be accommodated by the first recess 201, and another part (i.e. the second electronic component) with a relatively high heat generation can be accommodated by the second recess 301, so as to guide the heat of the parts with a relatively high heat generation out through the first heat dissipation member 200 and the second heat dissipation member 300, thereby facilitating the work of focusing on the heat dissipation of the parts with a relatively high heat generation. In addition, a larger coverage area can be formed by the first base body 110, so as to guide the heat of the area covered thereby out, thereby facilitating the heat dissipation work of the coverage area thereof.

[0055] Referring to Figure 3 and Figure 5 As shown in the figures, the main heat sink 100 further comprises a plurality of first fins 120. The plurality of first fins 120 are arranged on the first base body 110, the first fins 120 and the second heat dissipation member 300 are located on the same side of the thickness direction of the first base body 110, and the first fins 120 avoid the mounting opening 111. In this way, the plurality of first fins 120 facilitate the increase of the heat dissipation area of the main heat sink 100, thereby facilitating the heat dissipation of the main heat sink 100.

[0056] Exemplarily, the length directions of the plurality of first fins 120 can be parallel to each other, so that the flow channels formed by the plurality of first fins 120 are parallel to each other, thereby facilitating the one-side arrangement of the airflow driving member for driving the airflow to flow.

[0057] Exemplarily, the first base body 110 and the first fins 120 can be formed in an integrated structure (such as being processed by 3D printing or casting, etc.); or the first base body 110 and the first fins 120 can be connected by welding; or the first base body 110 and the first fins 120 can be detachably connected.

[0058] Referring to Figure 3 and Figure 6As shown, in some embodiments, the first heat dissipation member 200 comprises a first cover plate 210 and a second fin 220. The first cover plate 210 is connected with the first base body 110 and cooperatively defines the first recess 201. The second fin 220 is arranged on a side of the first cover plate 210 which is away from the first recess 201. In this way, the second fin 220 facilitates increasing the surface area of the first heat dissipation member 200 which is away from the first recess 201, so as to facilitate the first heat dissipation member 200 to dissipate heat to the outside.

[0059] For example, the number of the second fins 220 can be flexibly selected according to requirements. It can be understood that the more the number of the second fins 220, the more the surface area of the first heat dissipation member 200 is increased.

[0060] For example, the second fin 220 and the first cover plate 210 can be formed in an integral structure. Alternatively, in some possible embodiments, the second fin 220 and the first cover plate 210 can be connected by welding. Alternatively, the second fin 220 and the first cover plate 210 can be connected in a detachable manner.

[0061] For example, the length direction of the second fin 220 can be parallel to the length direction of the first fin 120, such as the length directions of the two are parallel to the first direction. In this way, the airflow channels formed by the fins are parallel to each other, which facilitates the centralized arrangement of the driving members for driving the airflow.

[0062] The cross section of the first recess 201 and the cross section of the second recess 301 are both in a U shape. The first recess 201 extends to both ends of the length direction of the first heat dissipation member 200, and the second recess 301 extends to both ends of the length direction of the second heat dissipation member 300. In this way, the first recess 201 and the second recess 301 have a larger space, which can accommodate more first electronic elements and second electronic elements.

[0063] In the present embodiment, the cross section of the first recess 201 is the same as the cross section of the second recess 301, that is, the size and shape of the cross section of the first recess 201 are the same as the size and shape of the cross section of the second recess 301. In some embodiments, the size of the first recess 201 can be adaptively adjusted according to the size of the first electronic element, and the size of the second recess 301 can be adaptively adjusted according to the size of the second electronic element.

[0064] Exemplarily, the first cover plate 210 and the first base body 110 can be detachably connected; for example, the first cover plate 210 is provided with a second threaded hole 240 on a side facing the first base body 110, the first base body 110 is provided with a first through hole 112 alignable with the second threaded hole 240, a screw is passed through the first through hole 112 and is threadedly connected with the second threaded hole 240, so as to fasten the first cover plate 210 towards the first base body 110 by the screw, thereby realizing the detachable connection. It can be understood that the screw, the first through hole 112 and the second threaded hole 240 can be multiple in number, so as to realize the multi-point detachable connection.

[0065] Alternatively, in some possible embodiments, the first cover plate 210 and the first base body 110 can be connected by welding; or, the two can be formed into an integral structure.

[0066] Exemplarily, the first cover plate 210 can be provided with a first blocking plate 250 at each end along the second direction, so as to close the corresponding end of the first recess 201 by the corresponding first blocking plate 250. The first blocking plate 250 and the first cover plate 210 can be detachably connected, so as to facilitate the opening and closing of the first recess 201; for example, the first cover plate 210 is provided with a first threaded hole 230 at an end along the first direction, and the first blocking plate 250 and the first cover plate 210 are detachably connected by a screw cooperating with the first threaded hole 230.

[0067] Referring to FIGS. 1, 2, 3 and 4, Figure 3 and Figure 7 In some embodiments, the second heat dissipation member 300 includes a second cover plate 310 and third fins 320. The second cover plate 310 defines a second recess 301, and the third fins 320 are arranged on a side of the second cover plate 310 facing away from the second recess 301. In this way, the third fins 320 facilitate increasing the surface area of the second heat dissipation member 300 on the side facing away from the second recess 301, thereby facilitating the heat dissipation of the second heat dissipation member 300.

[0068] Exemplarily, the number of the third fins 320 can be flexibly selected according to requirements. It can be understood that the more the number of the third fins 320, the more the surface area of the second heat dissipation member 300 is increased.

[0069] Exemplarily, the third fins 320 and the second cover plate 310 can be formed into an integral structure; or, the two can be connected by welding; or, the two can be connected in a detachable manner.

[0070] Exemplarily, the length direction of the third fins 320, the length direction of the first fins 120 (if any), and the length direction of the second fins 220 (if any) can be parallel to each other in pairs; in this way, the flow channels formed by the fins are parallel to each other, facilitating the centralized arrangement of the driving members for driving the gas flow.

[0071] Exemplarily, the second cover plate 310 can be formed in a U shape, and the corresponding second groove 301 is also in a U shape. When the second cover plate 310 is in a U shape, the stability of the structure of the second heat dissipation member 300 is facilitated; when the second groove 301 is in a U shape, a larger volume is facilitated to be provided.

[0072] Exemplarily, the second cover plate 310 can be provided with a second blocking plate 350 at each end along the second direction, so as to close the corresponding end of the second groove 301 by means of the corresponding second blocking plate 350. The second blocking plate 350 and the second cover plate 310 can be detachably connected, so as to facilitate the opening and closing of the second groove 301; for example, the end of the second cover plate 310 along the first direction is provided with a third threaded hole 330, and the second blocking plate 350 and the second cover plate 310 are detachably connected by means of a screw cooperating with the third threaded hole 330.

[0073] Referring to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 8 and Figure 9 , in some embodiments, the heat dissipation assembly can further include a cabinet 400.

[0074] The cabinet 400 has a containing cavity 401, and an air inlet 402 and an air outlet 403 communicating with the containing cavity 401. The main heat dissipation device 100, the first heat dissipation member 200, and the second heat dissipation member 300 are arranged in the containing cavity 401. The main heat dissipation device 100, the first heat dissipation member 200, and the second heat dissipation member 300 and the cabinet 400 define an airflow space. The airflow driving member 500 is arranged in the cabinet 400, and the airflow driving member 500 is adapted to drive the gas flow from the air inlet 402 to the air outlet 403 through the airflow space.

[0075] In this way, the main heat dissipation device 100, the first heat dissipation member 200, and the second heat dissipation member 300 are concentrated in the airflow space, and the inflow and outflow of the gas in the airflow space are driven by the airflow driving member 500, which facilitates the concentration of the air volume in the airflow space to concentrate the heat dissipation of the main heat dissipation device 100, the first heat dissipation member 200, and the second heat dissipation member 300. It should be noted that the part of the containing cavity 401 facing away from the airflow space can be used to accommodate various electrical components such as circuit boards.

[0076] Exemplarily, the airflow driving member 500 can be a fan, and the number of fans can be flexibly selected according to requirements.

[0077] For example, the accommodating cavity 401 can have a structure plate for bearing the first substrate 110 and the second heat dissipating member 300, which divides the accommodating cavity 401 into two parts along the thickness direction of the first substrate 110, one part for accommodating the main heat dissipating device 100, the first heat dissipating member 200 and the second heat dissipating member 300, and the other part being the part facing the air flow space.

[0078] Referring to Figure 1 , Figure 3 , Figure 4 and Figure 9 , in some embodiments, the box 400 includes a first side plate 404 and a second side plate 405 opposite to each other along the first direction, the air inlet 402 is arranged on the first side plate 404, the air outlet 403 is arranged on the second side plate 405, and the air flow driving member 500 is arranged on the air inlet 402. In this way, the gas can flow along a straight line direction.

[0079] Referring to Figure 1 , Figure 3 , Figure 4 , Figure 8 and Figure 9 , in some embodiments, the box 400 includes a main box 410 and a sub-box 420 connected to one side of the main box 410. For example, the sub-box 420 and the main box 410 can be arranged along a direction parallel to the thickness direction of the first substrate 110. The accommodating cavity 401 includes a main cavity 4011 formed in the main box 410 and a sub-cavity 4012 formed in the sub-box 420. The main heat dissipating device 100, the first heat dissipating member 200 and the second heat dissipating member 300 are arranged in the sub-cavity 4012. The air inlet 402 and the air outlet 403 are arranged on the sub-box 420 and communicate with the sub-cavity 4012.

[0080] In use, the electrical components are accommodated in the main box 410, and the components for dissipating heat of the main heat dissipating device 100, the first heat dissipating member 200 and the second heat dissipating member 300 are accommodated in the sub-box 420. In this way, the two types of components are isolated from each other, which facilitates the concentrated installation and management of each type of component, and also facilitates the concentration of air flow and improves the heat dissipation efficiency.

[0081] For example, the main box 410 and the sub-box 420 can be detachably connected, for example, by fasteners such as screws.

[0082] For example, the lower end of the main box 410 has a detachable bottom cover 411, and the main cavity 4011 can be opened and closed by disassembling and assembling the bottom cover 411.

[0083] For example, the upper end of the sub-box 420 has a detachable top cover 421, and the sub-cavity 4012 can be opened and closed by disassembling and assembling the top cover 421.

[0084] Referring to Figure 1 Figure 3 and Figure 8 In some embodiments, the box 400 includes a connecting plate 430 formed on the adjacent sides of the main cavity 4011 and the auxiliary cavity 4012, the connecting plate 430 having a first passage opening 431 and a second passage opening 432. The first base 110 and the second heat sink 300 are connected to the connecting plate 430, the first base 110 covering the first passage opening 431, and the second heat sink 300 covering the second passage opening 432. In this way, through the first passage opening 431, on the one hand, the lower side of the first base 110 is directly oriented towards the main cavity 4011, facilitating the first base 110 to absorb heat in the main cavity 4011; on the other hand, it is convenient for the components that need to be targeted to extend to the first recess 201. Through the second passage opening 432, it is convenient to arrange wires between the second recess 301 and the main cavity 4011.

[0085] For example, the connecting plate 430 can be formed as a cover plate for covering the upper end of the main box 410. The auxiliary box 420 is detachably connected to the upper side of the connecting plate 430 by screws.

[0086] For example, the size of the first passage opening 431 in the first direction and the second direction can be smaller than the size of the first base 110 in the first direction and the second direction, so as to facilitate the connection of the first base 110 on the upper side of the connecting plate 430. For example, the first base 110 has a plurality of threaded holes, and the first base 110 is fastened to the connecting plate 430 by screws cooperating with the threaded holes for detachable connection.

[0087] For example, the size of the second passage opening 432 in the first direction and the second direction can be smaller than the size of the lower end of the second heat sink 300 on the connecting plate 430, so as to facilitate the connection of the second heat sink 300 on the connecting plate 430. For example, the second heat sink 300 has a plurality of fourth threaded holes 340, and the second heat sink 300 is fastened to the upper side of the connecting plate 430 by screws cooperating with the fourth threaded holes 340.

[0088] Referring to Figure 1 and Figure 3 In some embodiments, the airflow driving member 500 can include a first fan 510, a second fan 520, and a third fan 530. The first fan 510 is opposite to the first heat sink 200 along the first direction. The second fan 520 is opposite to the second heat sink 300 along the first direction.

[0089] ​The third fan 530 is opposite to the main heat sink 100 in the area between the first heat sink 200 and the second heat sink 300 along the first direction. The first direction, the second direction and the thickness direction of the first base 110 are perpendicular to each other. In this way, the main heat sink 100, the first heat sink 200 and the second heat sink 300 can be fully cooled, and the cooling effect can be ensured.

[0090] For example, when the heat dissipation assembly has the first fin 120, the second fin 220 and the third fin 320, the length direction of the first fin 120 is parallel to the first direction, the length direction of the second fin 220 is parallel to the first direction, and the length direction of the third fin 320 is parallel to the first direction. In this way, the airflow direction formed by the first fan 510, the second fan 520 and the third fan 530 is parallel to the flow channel direction formed by the fins, which facilitates smooth airflow and ensures the cooling efficiency.

[0091] For example, when the airflow driving member 500 includes the first fan 510, the second fan 520 and the third fan 530, the number of air inlets 402 can be one, and the first fan 510, the third fan 530 and the second fan 520 are arranged in the air inlet 402 along the second direction.

[0092] Alternatively, when the airflow driving member 500 includes the first fan 510, the second fan 520 and the third fan 530, the number of air inlets 402 can be three, and the three air inlets are arranged along the second direction. The first air inlet is used to install the first fan 510, the second air inlet is used to install the second fan 520, and the third air inlet is used to install the third fan 530.

[0093] Alternatively, when the airflow driving member 500 includes the first fan 510, the second fan 520 and the third fan 530, the number of air inlets 402 can be two; one air inlet is used to arrange two adjacent fans (for example, the first fan 510 and the third fan 530) among the first fan 510, the second fan 520 and the third fan 530, and the other air inlet is used to install the remaining fan (for example, the second fan 520) among the first fan 510, the second fan 520 and the third fan 530.

[0094] Referring to Figure 3As shown, in some embodiments, the heat dissipation assembly further comprises a wind collecting cover 600, which covers the outer periphery of the first heat dissipation member 200, and defines a flow gap 601 between the wind collecting cover 600 and the first heat dissipation member 200, through which the airflow for heat dissipation can flow through the outer periphery of the first heat dissipation member 200. In this way, the first heat dissipation member 200 is facilitated to be dustproof by the wind collecting cover 600, so as to avoid dust accumulation on the side of the first heat dissipation member 200 opposite to the first recess 201, and to maintain the heat dissipation performance of the first heat dissipation member 200.

[0095] With reference to Figures 1 to 11 As shown, the energy storage inverter device provided by another aspect of the embodiments of the present application comprises a circuit board 20, an inverter device 30 and the heat dissipation assembly 10 described above. The inverter device 30 is connected with the circuit board 20. The inverter device 30 comprises a transformer 31 and an inductor module 32. The transformer 31 is used for transforming voltage in inverter operation. The inductor module 32 can be an important component of filter function, for example, an LC filter comprising the inductor module 32 and a capacitor. The circuit board 20 is used for integrating related circuits required in inverter operation.

[0096] It can be understood that the inverter device can further comprise a switching device and a DC bus capacitor, etc. The switching device is used for converting DC into a series of square waves or pulsating waves. The DC bus capacitor is used for providing instantaneous large current for the switching device, absorbing pulsating current from the DC power supply, and can also be used for temperature input voltage.

[0097] The first base body 110 and the circuit board 20 are oppositely arranged along the thickness direction of the circuit board 20 and jointly define a heat dissipation gap 40. The mounting port 111 is opposite to the heat dissipation gap 40. The transformer 31 extends into the first recess 201 through the mounting port 111. The inductor module 32 is arranged in the second recess 301.

[0098] For example, if the first recess 201 has a surplus amount relative to the transformer 31 arranged therein, the surplus part can be filled with a filling material facilitating heat conduction.

[0099] For example, if the second recess 301 has a surplus amount relative to the inductor module 32 arranged therein, the surplus part can be filled with a filling material facilitating heat conduction.

[0100] The type of the filling material is not specifically limited in the embodiments of the present application, and can be flexibly selected according to requirements. For example, silicone filling glue, epoxy resin filling glue or polyurethane filling glue, etc.

[0101] The energy storage inverter device of the present application, by extending the transformer 31 into the first recess 201, and arranging the inductor module 32 in the second recess 301, to export the heat of the transformer 31 through the first heat sink 200, and export the heat of the inductor module 32 through the second heat sink 300, so as to facilitate the key heat dissipation of the two types of components with large heat generation, i.e. the transformer 31 and the inductor module 32. In addition, through the first base body 110, it is beneficial to export the heat dissipated by the circuit board 20, facilitating the heat dissipation of the circuit board 20; and through the heat dissipation gap 40, the heat dissipation assembly 10 can avoid interfering with the circuit board 20.

[0102] It should be noted that the interference of the heat dissipation assembly 10 to the circuit board 20 includes: forming a conductive contact to cause a short circuit; directly conducting the heat dissipated by the inductor module 32 or the transformer 31 to the circuit board 20, causing the circuit board 20 to overheat; forming heat conduction between the components on the circuit board 20, interfering with the operation of the related components, etc.

[0103] Referring to Figure 10 In some embodiments, the energy storage inverter device further includes an adapter 50 arranged in the heat dissipation gap 40 and opposite the mounting port 111, and the circuit board 20 and the transformer 31 are connected through the adapter 50.

[0104] It should be noted that the adapter 50 on the one hand supports the corresponding transformer 31 to support the transformer 31 away from the circuit board 20 by a certain distance, so as to reduce the influence of the heat generated by the transformer 31 on the circuit board 20; on the other hand, the adapter 50 is used for electrical connection between the transformer 31 and the circuit board 20. For example, the transformer 31 has a pin, and the adapter 50 has a pin seat for cooperating with the pin, and the pin seat can be used to support the transformer 31 away from the circuit board 20 by a certain distance and form an electrical connection between the transformer 31 and the circuit board 20. It should be noted that the pin seat has a conductive part for connecting the pin, and the conductive part is electrically connected to the circuit board 20.

[0105] Referring to Figure 10 In some embodiments, the energy storage inverter device can further include a connecting wire 60, and the inductor module 32 is connected to the circuit board 20 through the connecting wire 60. In this way, the inductor module 32 is avoided from being in direct and heat-conducting contact with the circuit board 20, so as to reduce the influence of the heat of the inductor module 32 on the circuit board 20, and make the circuit board 20 work normally at normal temperature.

[0106] For example, the second heat sink 300 is open on the side facing the circuit board 20, and the connecting wire 60 can be led to the circuit board 20 through the side opening.

[0107] Referring to Figures 1 to 11As shown in the energy storage inverter device in some embodiments, the heat dissipation assembly 10 includes a box body 400 having a receiving cavity 401 and air inlets 402 and air outlets 403 in communication with the receiving cavity 401, the box body 400 including a main box body 410 and a sub-box body 420 connected to one side of the main box body 410; the receiving cavity 401 including a main cavity 4011 formed in the main box body 410 and a sub-cavity 4012 formed in the sub-box body 420; the air inlets 402 and the air outlets 403 being in communication with the sub-cavity 4012, the main heat sink 100, the first heat dissipation member 200 and the second heat dissipation member 300 being arranged in the sub-cavity 4012. The circuit board 20 is arranged in the main cavity 4011.

[0108] In this way, the main heat sink 100, the first heat dissipation member 200 and the second heat dissipation member 300 separate the circuit board 20 and the inverter device 30, on the one hand, facilitating the concentration of driving air flow on the side of the sub-cavity 4012 for heat dissipation; on the other hand, it is beneficial to avoid the high heat emitted by the inverter device 30 from being blown from the sub-cavity 4012 to the main cavity 4011, so as to facilitate the protection of the circuit board and other devices in the main cavity 4011.

[0109] Referring to Figure 3 , Figure 10 and Figure 11 , for example, the box body 400 can be detachably provided with a support 450 in the main cavity 4011, the number of supports can be multiple, the support plate 440 is detachably connected to the support, the support member 441 is detachably arranged on the support plate 440, the number of support members 441 can be multiple, the support member 441 is used to lift the support circuit board 20, and the circuit board 20 is arranged in the main cavity 4011. Among them, the support member 441 can be an integrated circuit board, which integrates part of the circuit of the energy storage inverter device.

[0110] Referring to Figure 3 , the main heat sink 100 includes first fins 120; the first heat dissipation member 200 includes second fins 220; the second heat dissipation member 300 includes third fins 320; the length direction of the first fins 120, the length direction of the second fins 220 and the length direction of the third fins 320 are parallel to each other. In this way, it is beneficial to the smoothness of the heat dissipation air flow.

[0111] Each embodiment or implementation in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between the embodiments can be referred to each other.

[0112] It should be noted that the use of "one embodiment," "an embodiment," "certain embodiments," "some embodiments," "exemplary embodiment," "one specific embodiment," "certain specific embodiments," and the like, herein, does not necessarily refer to the same embodiment, although it may. In other words, the use of these phrases is not intended to imply that a feature, structure, or characteristic is in some way required in one embodiment or all embodiments, but rather that such a feature, structure, or characteristic can be present in one or more embodiments. Furthermore, the use of these phrases does not imply that a feature, structure, or characteristic is unimportant or necessary in every embodiment.

[0113] In general, terminology can be understood at least in part from usage in context. For example, the term "one or more" as used herein, depending at least in part upon context, can be used to describe any feature, structure, or characteristic in a singular sense or can be used to describe combinations of features, structures or characteristics in a plural sense. Similarly, terms, such as "a" and "the", as used herein, can be understood to convey a singular usage or to convey a plural usage, depending at least in part upon context.

[0114] It will be readily understood that the terms "on", "above", and "on top of", as used herein, should be interpreted in the broadest context, such that "on" means not only "directly on", but also includes the meaning of "on" with intervening features or layers therebetween, and "above" or "on top of" includes not only the meaning of "above" or "on top of", but also the meaning of "above" or "on top of" without intervening features or layers therebetween (i.e., directly on).

[0115] Finally, it should be noted that the above-described embodiments are merely intended to illustrate the technical solutions of the present application, but not to limit the same; although the present application has been described in detail with reference to the above embodiments, those skilled in the art should understand that they can still make modifications to the technical solutions recorded in the above embodiments, or make equivalent replacements to some or all of the technical features thereof; and these modifications or replacements do not cause the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat dissipating assembly, characterized by, The application relates to a main heat sink (100) comprising a first base body (110) provided with a mounting opening (111) penetrating through the thickness of the first base body (110); a first heat dissipation member (200) provided with a first recess (201), the first heat dissipation member (200) is connected with the first base body (110), the mounting opening (111) is arranged opposite to the first recess (201), and the first recess (201) and the mounting opening (111) are configured to accommodate a first electronic component; and a second heat dissipation member (300) provided with a second recess (301) for accommodating a second electronic component, the second electronic component has a smaller heat generation than the first electronic component. The main heat sink (100) further comprises a plurality of first fins (120) arranged on the first base body (110), the first fins (120) and the second heat dissipation member (300) are located on the same side of the thickness direction of the first base body (110), and the first fins (120) avoid the mounting opening (111). The first recess (201) and the second recess (301) are both in U-shaped cross section, the first recess (201) extends to both ends of the first heat dissipation member (200) in the length direction, and the second recess (301) extends to both ends of the second heat dissipation member (300) in the length direction. The first heat dissipation member (200) comprises a first cover plate (210) connected with the first base body (110) and defining the first recess (201) together; and a second fin (220) arranged on the side of the first cover plate (210) away from the first recess (201).

2. The heat dissipation assembly of claim 1, wherein, The second heat dissipation member (300) comprises a second cover plate (310) defining the second recess (301) and a third fin (320) arranged on the side of the second cover plate (310) away from the second recess (301).

3. The heat dissipation assembly of claim 1, wherein, The application further relates to a cabinet (400) provided with a receiving cavity (401), an air inlet (402) and an air outlet (403) communicating with the receiving cavity (401); the main heat sink (100), the first heat dissipation member (200) and the second heat dissipation member (300) are arranged in the receiving cavity (401) and define an air flow space together with the cabinet (400); and an air flow driving member (500) is arranged in the cabinet (400) and is adapted to drive air flow from the air inlet (402) to the air outlet (403) through the air flow space.

4. The heat dissipation assembly of claim 3, wherein, ​ ​ ​ 5. The heat dissipation assembly of claim 3, wherein, ​ 6. The heat dissipating assembly according to any one of claims 1 to 5, wherein, ​ ​ ​ ​ 7. The heat dissipating assembly of claim 6, wherein, The box (400) comprises a first side plate (404) and a second side plate (405) opposite in a first direction, the air inlet (402) is arranged on the first side plate (404), and the air outlet (403) is arranged on the second side plate (405); and the airflow driving member (500) is arranged on the air inlet (402).

8. The heat dissipating assembly of claim 6, wherein, The box (400) comprises a main box (410) and a sub-box (420) connected to one side of the main box (410); The accommodating cavity (401) comprises a main cavity (4011) formed in the main box (410) and a sub-cavity (4012) formed in the sub-box (420); The main heat sink (100), the first heat dissipation member (200) and the second heat dissipation member (300) are arranged in the sub-cavity (4012); The air inlet (402) and the air outlet (403) are arranged on the sub-box (420) and communicate with the sub-cavity (4012).

9. The heat dissipating assembly of claim 8, wherein, The box (400) comprises a connecting plate (430) formed on the adjacent sides of the main cavity (4011) and the sub-cavity (4012), and the connecting plate (430) has a first passage opening (431) and a second passage opening (432); The first base body (110) and the second heat dissipation member (300) are connected to the connecting plate (430), the first base body (110) covers the first passage opening (431), and the second heat dissipation member (300) covers the second passage opening (432).

10. The heat dissipating assembly of claim 7, wherein, The airflow driving member (500) comprises: A first fan (510) opposite to the first heat dissipation member (200) in the first direction; A second fan (520) opposite to the second heat dissipation member (300) in the first direction; A third fan (530) opposite to the main heat sink (100) in the region between the first heat dissipation member (200) and the second heat dissipation member (300) in the first direction; The first direction is perpendicular to the thickness direction of the first base body (110).

11. The heat dissipating assembly of claim 6, wherein, Further comprising a wind collecting cover (600) covering the outer periphery of the first heat dissipation member (200), and the wind collecting cover (600) and the first heat dissipation member (200) define a flow gap (601) therebetween.

12. An energy storage inverter apparatus, characterized by, Comprise: A circuit board (20); An inverter device (30) connected to the circuit board (20); the inverter device (30) comprises a transformer (31) and an inductive module (32); The heat dissipation assembly (10) according to any one of claims 1-11, wherein the first base (110) and the circuit board (20) are oppositely arranged along a thickness direction of the circuit board (20) and jointly define a heat dissipation gap (40), the mounting hole (111) is opposite to the heat dissipation gap (40), and the transformer (31) extends into the first recess (201) through the mounting hole (111); and the inductor module (32) is arranged in the second recess (301).

13. The energy storage inverter device of claim 12, wherein, Further comprising an adapter (50) arranged in the heat dissipation gap (40) and opposite to the mounting hole (111), and the circuit board (20) and the transformer (31) are connected through the adapter (50).

14. The energy storage inverter device of claim 12, wherein, Further comprising a connecting wire (60), and the inductor module (32) is connected to the circuit board (20) through the connecting wire (60).

15. The energy storage inverter device of claim 12, wherein, The heat dissipation assembly comprises a box body (400) having a receiving cavity (401) and an air inlet (402) and an air outlet (403) communicating with the receiving cavity (401) The box body (400) comprises a main box body (410) and a sub-box body (420) connected to one side of the main box body (410); The receiving cavity (401) comprises a main cavity (4011) formed in the main box body (410) and a sub-cavity (4012) formed in the sub-box body (420); The air inlet (402) and the air outlet (403) communicate with the sub-cavity (4012), the main heat sink (100), the first heat dissipation member (200) and the second heat dissipation member (300) are arranged in the sub-cavity (4012), and the circuit board (20) is arranged in the main cavity (4011).

16. The energy storage inverter device of claim 12, wherein, The main heat sink (100) comprises first fins (120), the first heat dissipation member (200) comprises second fins (220), the second heat dissipation member (300) comprises third fins (320), and the length direction of the first fins (120), the length direction of the second fins (220) and the length direction of the third fins (320) are parallel to each other.

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