Anti-electromagnetic interference shielding structure of mobile phone mainboard

Abstract

The utility model provides an anti-electromagnetic interference shielding structure of a mobile phone mainboard, which comprises an electromagnetic shielding structure, the electromagnetic shielding structure comprises a shielding shell, a cooling groove is arranged in the middle of the shielding shell, side strips are arranged on the two sides of the inner wall of the cooling groove, an auxiliary shielding plate is arranged in the middle of the shielding shell, and the auxiliary shielding plate is arranged in the middle of the shielding shell. Clamping strips are arranged on the two sides of the auxiliary shielding plate, the clamping strips are connected with the side strips in a clamped mode, and separation strips are arranged at the bottoms of the clamping strips. The processor chip can be subjected to electromagnetic shielding by arranging the electromagnetic shielding structure, meanwhile, the auxiliary shielding plate is further arranged at the top of the electromagnetic shielding structure, the separation strip is arranged at the bottom of the auxiliary shielding plate, and the heat dissipation silicone grease is arranged in the separation strip; the heat dissipation silicone grease is attached to the top of the processor chip to guide heat in the running process of the processor chip, and the heat is prevented from being accumulated in the electromagnetic shielding structure.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of mobile phone mainboard, and specifically relates to an electromagnetic interference shielding structure of a mobile phone mainboard. BACKGROUND

[0002] The mobile phone mainboard is a core component inside the mobile phone, is similar to the brain and nervous system of the human body, is responsible for coordinating and controlling the operation of all hardware and functions, is the carrier and connection hub of all electronic elements of the mobile phone, and almost all key components are integrated on the mainboard.

[0003] The shielding structure is mainly a shielding cover and a structure level shielding method.

[0004] However, after the shielding cover is installed on the outer wall of the mobile phone mainboard, the contact surface of the mobile phone mainboard with air is reduced, the heat dissipation effect inside the mobile phone mainboard is affected, and the heat generated in the operation process of the mobile phone mainboard is increased. UTILITY MODEL CONTENTS

[0005] PURPOSE OF THE UTILITY MODEL

[0006] In view of the above technical problems, the utility model provides an electromagnetic interference shielding structure of a mobile phone mainboard to solve the technical problems mentioned in the background.

[0007] TECHNICAL SCHEME

[0008] In order to achieve the above purpose, the utility model provides an electromagnetic interference shielding structure of a mobile phone mainboard, which comprises a mainboard structure, an electromagnetic shielding structure is arranged at the top of the mainboard structure, and a flow guide structure is arranged at the four corners of the mainboard structure.

[0009] The electromagnetic shielding structure comprises a shielding shell, a cooling groove is formed in the middle of the shielding shell, side strips are arranged on the two sides of the inner wall of the cooling groove, an auxiliary shielding plate is arranged in the middle of the shielding shell, clamping strips are arranged on the two sides of the auxiliary shielding plate, the clamping strips are connected with the side strips in a clamping mode, a partition strip is arranged at the bottom of the clamping strip, the number of the partition strips is multiple, two partition strips support a cavity, and heat dissipation silicone grease is arranged in the cavity.

[0010] Preferably, the mainboard structure comprises a mainboard body, a sealing cover is arranged in the mainboard body, connecting holes are formed at the four corners of the mainboard body, and auxiliary grooves are formed on the two sides of the inner wall of the connecting holes.

[0011] Preferably, a placing groove is formed in one side of the mainboard body, threaded grooves are formed at the four corners of the inner wall of the placing groove, a processor chip is arranged on the other side of the mainboard body, and the processor chip is arranged on the inner wall of the shielding shell.

[0012] Preferably, the bottom of the mainboard body is provided with a vertical plate, the bottom of the vertical plate is provided with a sealing strip, and the inside of the mainboard body outside the processor chip is provided with a jack.

[0013] Preferably, the flow guide structure comprises a conductive ring, the conductive ring is arranged on the inner wall of the connecting hole, the top and bottom of the conductive ring are provided with limiting strips, and the outer side of the conductive ring is provided with a limiting ring.

[0014] Preferably, the two sides of the inner wall of the shielding shell are provided with vertical rods, the outer wall of the vertical rod is provided with a spring rod, one end of the spring rod is provided with a clamping ring, and the clamping ring is clamped and connected with the jack.

[0015] Beneficial effects

[0016] Compared with the prior art, the technical scheme of the utility model has the following beneficial effects:

[0017] The electromagnetic shielding structure is arranged, the processor chip can be electromagnetically shielded, the auxiliary shielding plate is further arranged at the top of the electromagnetic shielding structure, the auxiliary shielding plate is provided with a separation strip at the bottom, the inside of the separation strip is provided with heat dissipation silicone grease, the heat dissipation silicone grease is attached to the top of the processor chip to guide the heat generated during the operation of the processor chip, and the heat is prevented from accumulating in the inside of the electromagnetic shielding structure.

[0018] When the mainboard structure is installed in the inside of the mobile phone shell, the sealing strip at the bottom of the vertical plate is attached to the inside of the mobile phone shell, then conductive foam or conductive glue is injected into the inside of the vertical plate to fill the gap, and the mainboard body and the mobile phone shell can be made to conduct electricity, so that the anti-electromagnetic interference performance is improved. DRAWINGS

[0019] Figure 1 It is a perspective view of the utility model;

[0020] Figure 2 It is a perspective sectional view of the mainboard structure of the utility model;

[0021] Figure 3 It is a perspective development view of the electromagnetic shielding structure of the utility model;

[0022] Figure 4 It is a perspective view of the flow guide structure of the utility model.

[0023] Reference signs

[0024] 1. Mainboard structure; 101, mainboard body; 102, sealing cover; 103, connecting hole; 104, auxiliary groove; 105, placing groove; 106, threaded groove; 107, processor chip; 108, vertical plate; 109, sealing strip; 110, jack; 2, electromagnetic shielding structure; 201, shielding shell; 202, cooling groove; 203, side strip; 204, auxiliary shielding plate; 205, clamping strip; 206, partition strip; 207, vertical rod; 208, spring rod; 209, clamping ring; 3, flow guide structure; 301, conductive ring; 302, limiting strip; 303, limiting ring. DETAILED DESCRIPTION

[0025] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "the other end", "one side", "front", "both ends", "both sides" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0026] In addition, the terms "first" and "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0027] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connection", "connection", "fixing", "provided with" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] Reference will now be made to the drawings wherein like numerals refer to like parts throughout the several views. The drawings are not necessarily to scale, the emphasis instead being placed upon the principles of the application. In the drawings:

[0029] With reference to Figures 1-4 The mobile phone mainboard electromagnetic interference shielding structure shown comprises a mainboard structure 1, an electromagnetic shielding structure 2 is arranged on the top of the mainboard structure 1, and flow guide structures 3 are arranged at the four corners of the mainboard structure 1.

[0030] The electromagnetic shielding structure 2 comprises a shielding shell 201, a cooling groove 202 is arranged in the middle of the shielding shell 201, side strips 203 are arranged on the inner walls of the cooling groove 202, an auxiliary shielding plate 204 is arranged in the middle of the shielding shell 201, clamping strips 205 are arranged on the two sides of the auxiliary shielding plate 204, the clamping strips 205 are clamped and connected with the side strips 203, a partition strip 206 is arranged at the bottom of the clamping strip 205, a plurality of partition strips 206 are arranged, two partition strips 206 support a cavity, heat dissipation silicone grease is arranged in the cavity, vertical rods 207 are arranged on the inner walls of the shielding shell 201, spring rods 208 are arranged on the outer walls of the vertical rods 207, clamping rings 209 are arranged at one end of the spring rods 208, the clamping rings 209 are clamped and connected with the insertion holes 110, when it is necessary to install the electromagnetic shielding structure 2 on the outer wall of the processor chip 107 on the top of the mainboard body 101, the clamping rings 209 on the outer walls of the vertical rods 207 at the bottom of the shielding shell 201 are clamped with the insertion holes 110, the shielding shell 201 is fixed, then the clamping strips 205 on the two sides of the auxiliary shielding plate 204 are clamped with the side strips 203, the heat dissipation silicone grease in the partition strip 206 is in contact with the top of the processor chip 107 to dissipate heat of the processor chip 107, the shielding shell 201 and the auxiliary shielding plate 204 can be made of high-conductivity metal copper, aluminum plated with nickel into a box-shaped structure, covering radio frequency modules, CPUs and other high-frequency components, reflecting / absorbing electromagnetic waves.

[0031] Further, in the above technical solution, the mainboard structure 1 comprises a mainboard body 101, a sealing cover 102 is arranged in the mainboard body 101, a connecting hole 103 is formed at each corner of the mainboard body 101, an auxiliary groove 104 is formed at both sides of the inner wall of the connecting hole 103, a placing groove 105 is formed at one side of the mainboard body 101, a threaded groove 106 is formed at each corner of the inner wall of the placing groove 105, a processor chip 107 is arranged at the other side of the mainboard body 101, the processor chip 107 is arranged on the inner wall of a shielding shell 201, a vertical plate 108 is arranged at the bottom of the mainboard body 101, a sealing strip 109 is arranged at the bottom of the vertical plate 108, a jack 110 is formed in the mainboard body 101 outside the processor chip 107, after the mainboard body 101 is installed in the inside of the mobile phone shell, the sealing strip 109 at the bottom of the mainboard body 101 is in contact with the mobile phone shell, and the cavity between the two vertical plates 108 is filled with conductive foam or conductive glue to increase the conductivity, and then the sealing cover 102 is installed in the inside of the mainboard body 101 to seal the vertical plate 108.

[0032] Further, in the above technical solution, the flow guide structure 3 comprises a conductive ring 301, the conductive ring 301 is arranged on the inner wall of the connecting hole 103, limit strips 302 are arranged at the top and bottom of the conductive ring 301, and limit rings 303 are arranged outside the conductive ring 301, after the electromagnetic shielding structure 2 is installed, the mainboard body 101 is installed in the inside of the mobile phone shell, the fixing bolt is inserted into the inside of the limit strip 302 and one end of the fixing bolt is inserted into the inside of the mobile phone shell for fixation, and the limit strip 302 can avoid the direct contact between the bolt and the mainboard body 101, thereby avoiding the damage of the bolt to the mainboard body 101.

[0033] The above-described embodiments only express some implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the present application; it should be pointed out that, for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application; therefore, the protection scope of the present application patent should be subject to the appended claims.

Claims

1. A mobile phone main board electromagnetic interference shielding structure, characterized in that, Comprising The top of the mainboard structure (1) is provided with an electromagnetic shielding structure (2), and the four corners of the mainboard structure (1) are provided with a flow guide structure (3); The electromagnetic shielding structure (2) comprises a shielding shell (201), a cooling groove (202) is opened in the middle of the shielding shell (201), side strips (203) are arranged on both sides of the inner wall of the cooling groove (202), an auxiliary shielding plate (204) is arranged in the middle of the shielding shell (201), clamping strips (205) are arranged on both sides of the auxiliary shielding plate (204), the clamping strips (205) are clamped and connected with the side strips (203), the bottom of the clamping strip (205) is provided with a partition strip (206), the number of the partition strips (206) is multiple, two partition strips (206) support to form a cavity, and the inside of the cavity is provided with heat dissipation silicone grease.

2. The mobile phone mainboard anti-electromagnetic interference shielding structure according to claim 1, characterized in that: The mainboard structure (1) comprises a mainboard body (101), a sealing cover (102) is arranged in the inside of the mainboard body (101), connecting holes (103) are opened at the four corners of the mainboard body (101), and auxiliary grooves (104) are opened at the two sides of the inner wall of the connecting hole (103).

3. The mobile phone main board electromagnetic interference shielding structure according to claim 2, wherein: A placing groove (105) is opened in one side of the inside of the mainboard body (101), thread grooves (106) are opened at the four corners of the inner wall of the placing groove (105), a processor chip (107) is arranged on the other side of the mainboard body (101), and the processor chip (107) is arranged on the inner wall of the shielding shell (201).

4. The mobile phone main board electromagnetic interference shielding structure of claim 3, wherein: A vertical plate (108) is arranged at the bottom of the mainboard body (101), a sealing strip (109) is arranged at the bottom of the vertical plate (108), and a jack (110) is opened in the inside of the mainboard body (101) outside the processor chip (107).

5. The mobile phone main board electromagnetic interference shielding structure of claim 1, wherein: The flow guide structure (3) comprises a conductive ring (301), the conductive ring (301) is arranged on the inner wall of the connecting hole (103), limit strips (302) are arranged at the top and bottom of the conductive ring (301), and a limit ring (303) is arranged outside the conductive ring (301).

6. The mobile phone main board electromagnetic interference shielding structure of claim 1, wherein: The two sides of the inner wall of the shielding shell (201) are provided with vertical rods (207), the outer wall of the vertical rod (207) is provided with a spring rod (208), one end of the spring rod (208) is provided with a clamping ring (209), and the clamping ring (209) is clamped and connected with the jack (110).

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