Pressure measuring equipment

Abstract

The embodiment of the utility model discloses a pressure measuring device which is used for being connected with an adsorption device, the adsorption device is provided with a wafer bearing table used for bearing wafers, and the wafer bearing table is provided with a plurality of adsorption holes. The pressure measuring equipment comprises a supporting seat and a detection device. The supporting base is provided with a first face and a second face, the first face is attached to the wafer bearing table, and a plurality of through pressure measuring holes are formed in the supporting base. The pressure measuring hole is communicated with the adsorption hole, and in the thickness direction of the supporting seat, the projections of the communicated pressure measuring hole and the adsorption hole are overlapped. The detection devices are in one-to-one correspondence with the pressure measuring holes, each detection device comprises a substrate and a pressure measuring chip, the substrate is provided with a third surface, a fourth surface and a vent hole penetrating through the third surface and the fourth surface, the pressure measuring chips are arranged opposite to the vent holes, and the corresponding vent holes are communicated with the corresponding pressure measuring holes. According to the invention, the measurement point of the air pressure of the adsorption hole is moved to the port position of the adsorption hole, so that the measurement path is shortened, and the problem of pressure loss caused by pipeline transmission is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a pressure measuring equipment. BACKGROUND

[0002] In the semiconductor processing technology, the wafer needs to be fixed on the wafer support table to complete the process steps such as photoetching, etching and testing. The prior art usually uses vacuum adsorption to fix the wafer. The current adsorption equipment usually disperses the vacuum adsorption holes on the wafer support table, and realizes accurate adsorption control by respectively controlling the air pressure of these air holes. However, since the wafer itself may be warped or deformed (i.e. the surface of the wafer is not completely flat), if the adsorption holes in each area use the same adsorption pressure, it may cause the wafer to be unable to be firmly fixed on the wafer support table. Therefore, accurately detecting and adjusting the air pressure of each adsorption hole on the wafer support table of the adsorption equipment is the key to ensuring the stable adsorption of the wafer.

[0003] The current common way to detect the air pressure at the adsorption hole is to install a pressure measuring equipment on the pressure supply pipeline for the adsorption hole, and indirectly detect the pressure of the adsorption hole by measuring the air pressure in the pipeline. However, since there is a certain distance between the pressure measuring equipment and the outlet of the adsorption hole, the pressure in the vacuum pipeline may be lost due to resistance, leakage or other factors during transmission, so that there is a certain deviation between the air pressure value measured by the pressure measuring equipment and the adsorption pressure actually acting on the wafer. This deviation makes the measured value unable to accurately reflect the actual adsorption condition of the wafer, which may affect the stability of the subsequent wafer fixation. SUMMARY

[0004] Embodiments of the utility model provide a pressure measuring equipment, which aims to improve the air pressure measurement accuracy of the adsorption hole and ensure that the wafer can be firmly fixed on the wafer support table.

[0005] In order to solve the above technical problems, embodiments of the utility model disclose the following technical solutions:

[0006] Specifically, a pressure measuring equipment is provided, which comprises: a support seat having a first surface and a second surface arranged opposite to each other, the first surface being used to be attached to the wafer support table of the adsorption equipment, a plurality of pressure measuring holes being formed in the support seat, the pressure measuring holes penetrating through the first surface and the second surface, the plurality of pressure measuring holes being used to be communicated with different adsorption holes, and the projection of the communicated pressure measuring holes and the adsorption holes overlapping in the thickness direction of the support seat after the pressure measuring equipment is connected with the adsorption equipment.

[0007] The support seat has a first surface and a second surface arranged opposite to each other, the first surface being used to be attached to the wafer support table of the adsorption equipment, a plurality of pressure measuring holes being formed in the support seat, the pressure measuring holes penetrating through the first surface and the second surface, the plurality of pressure measuring holes being used to be communicated with different adsorption holes, and the projection of the communicated pressure measuring holes and the adsorption holes overlapping in the thickness direction of the support seat after the pressure measuring equipment is connected with the adsorption equipment.

[0008] A plurality of detection devices corresponding to the plurality of pressure measuring holes, the detection device comprising a substrate and a pressure measuring chip, the substrate having a third surface and a fourth surface opposite to each other, the substrate being provided with a ventilation hole penetrating through the third surface and the fourth surface, the third surface being opposite to the second surface, the pressure measuring chip being opposite to the ventilation hole, and the corresponding ventilation hole and pressure measuring hole being in communication.

[0009] In addition to one or more of the features described above, or as an alternative, the detection device and the support seat are connected by a support ring, the support ring being located between the second surface and the third surface, the ventilation hole of the detection device being located in an area enclosed by the support ring, and the port of the corresponding pressure measuring hole being located in the area enclosed by the support ring.

[0010] In addition to one or more of the features described above, or as an alternative, in the thickness direction of the support seat, the projection of the corresponding ventilation hole and the projection of the pressure measuring hole overlap.

[0011] In addition to one or more of the features described above, or as an alternative, the support seat is a wafer or a mask plate.

[0012] In addition to one or more of the features described above, or as an alternative, a plurality of grooves are provided on the second surface of the support seat, the plurality of grooves corresponding to the plurality of pressure measuring holes, the pressure measuring hole being provided at the bottom of the corresponding groove, and the detection device being embedded in the groove so that the corresponding ventilation hole and pressure measuring hole are in direct communication.

[0013] In addition to one or more of the features described above, or as an alternative, the detection device further comprises a housing and a signal processing chip, the housing being provided on the fourth surface of the substrate and being enclosed with the substrate to form a receiving cavity, the signal processing chip and the pressure measuring chip being located in the receiving cavity, and the signal processing chip and the pressure measuring chip being electrically connected.

[0014] In addition to one or more of the features described above, or as an alternative, the inside of the housing is filled with sealant, the sealant covering the signal processing chip and the pressure measuring chip, and the sealant being of a flexible material.

[0015] In addition to one or more of the features described above, or as an alternative, the housing has a top wall opposite to the pressure measuring chip, a gap being formed between the side of the sealant away from the pressure measuring chip and the top wall, and the top wall being provided with an air pressure hole penetrating through itself, the air pressure hole being in communication with the gap and the outside of the housing.

[0016] In addition to one or more of the above disclosed features, or as an alternative, the signal transmission device is configured to transmit signals via a wire or wirelessly.

[0017] In addition to one or more of the above disclosed features, or as an alternative, the signal transmission device is configured to transmit signals via a wire or wirelessly.

[0018] When the signal transmission device transmits signals wirelessly, the signal transmission device is disposed on the support seat.

[0019] One of the above technical solutions has the following advantages or beneficial effects: the pressure measuring device disclosed in the present application has a support seat with pressure measuring holes corresponding to the adsorption holes of the support table, and each pressure measuring hole is equipped with an independent detection device. The support seat is attached to the support table of the adsorption device, and the position of the pressure measuring hole is directly set on the port of the adsorption hole. Through the direct communication of the adsorption hole-pressure measuring hole-ventilation hole, the measurement point of the air pressure of the adsorption hole is moved to the port position of the adsorption hole, the measurement path is shortened, and the pressure chip can directly sense the actual pressure in the adsorption hole, avoiding the problem of pressure loss introduced by pipeline transmission. The pressure change of the adsorption hole to be measured is detected independently by the respective detection device, which can provide data basis for accurately adjusting the pressure of the adsorption hole to ensure that the air pressure output by the subsequent adsorption hole can stably adsorb the wafer. It should be noted that the above technical solutions disclosed in the present application can also be replaced by support seats of different sizes to adapt the pressure measuring device to wafers of different sizes, and the detection devices connected to the support seat can be reused. BRIEF DESCRIPTION OF DRAWINGS

[0020] The technical solutions and other beneficial effects of the present application will be apparent from the following detailed description of the specific embodiments of the present application, combined with the accompanying drawings.

[0021] Figure 1 is a connection diagram of a single detection device and a support seat provided by the embodiments of the present application;

[0022] Figure 2 is a structural diagram of a pressure measuring device provided by the embodiments of the present application;

[0023] Figure 3 is a structural diagram of another pressure measuring device provided by the embodiments of the present application;

[0024] Figure 4 is a position diagram of a signal transmission device provided by the embodiments of the present application.

[0025] BRIEF DESCRIPTION OF DRAWINGS:

[0026] 10. Support base; 11. First surface; 12. Second surface; 13. Pressure measuring hole; 14. Groove;

[0027] 20. Detection device; 21. Substrate; 211. Third side; 212. Fourth side; 213. Vent hole; 22. Pressure measuring chip; 23. Support ring; 24. Housing; 241. Top wall; 242. Pressure hole; 25. Signal processing chip; 26. Sealant; 27. Lead wire; 28. Terminal; 29. ​​Adhesive;

[0028] 30. Signal transmission device. Detailed Implementation

[0029] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described in this specification are merely for explaining the present utility model and are not intended to limit the present utility model.

[0030] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0031] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them. Moreover, first feature "on", "above" and "upper surface of" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature is higher than second feature in horizontal height. First feature "under", "below" and "under surface of" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature is lower than second feature in horizontal height.

[0033] The utility model discloses an embodiment discloses a kind of pressure measuring equipment, which is used to be connected with adsorption equipment. The adsorption equipment connected with pressure measuring equipment includes the wafer support for carrying wafer, multiple adsorption holes are opened on the wafer support, and pressure measuring equipment is used to detect the adsorption hole on wafer support. Refer to Figure 1 And Figure 2 The pressure measuring equipment includes support seat 10 and multiple detection devices 20. Support seat 10 has oppositely arranged first face 11 and second face 12, and first face 11 is used to be attached with the wafer support of adsorption equipment. Multiple pressure measuring holes 13 are opened on support seat 10, and pressure measuring holes 13 pass through first face 11 and second face 12. Multiple pressure measuring holes 13 are communicated with different adsorption holes (in other words, each pressure measuring hole 13 corresponds to and communicates with one of multiple adsorption holes). After pressure measuring equipment is connected with adsorption equipment, in the thickness direction of support seat 10, the projection of the connected pressure measuring hole 13 and adsorption hole overlaps. Multiple detection devices 20 correspond to multiple pressure measuring holes 13 one by one. Detection device 20 includes substrate 21 and pressure measuring chip 22, substrate 21 has oppositely arranged third face 211 and fourth face 212, and air hole 213 is opened on substrate 21 and passes through third face 211 and fourth face 212. Third face 211 of substrate 21 is oppositely arranged with second face 12 of support seat 10, fourth face 212 of substrate 21 is connected with pressure measuring chip 22, and pressure measuring chip 22 is oppositely arranged with the port of air hole 213 on fourth face 212. The air hole 213 of detection device 20 and the corresponding pressure measuring hole 13 are communicated.

[0034] The pressure measuring device disclosed in the application has a support base 10 with pressure measuring holes 13 corresponding to the adsorption holes of the wafer supporting table. Each pressure measuring hole 13 is equipped with an independent detection device 20. The support base 10 is attached to the wafer supporting table of the adsorption device, and the position of the pressure measuring hole 13 is directly set on the port of the adsorption hole. Through the direct connection of the adsorption hole-pressure measuring hole 13-vent hole 213, the measurement point of the air pressure of the adsorption hole is moved to the port position of the adsorption hole, the measurement path is shortened, and the pressure chip 22 can directly sense the actual pressure in the adsorption hole, avoiding the problem of pressure loss introduced by pipeline transmission. The pressure change of the adsorption hole to be measured is independently detected by the respective detection device 20, which can provide data basis for accurately adjusting the pressure of the adsorption hole to ensure that the air pressure output by the subsequent adsorption hole can stably adsorb the wafer. It should be noted that the above technical solutions disclosed in the application can also be replaced by support bases 10 of different sizes to adapt the pressure measuring device to different sizes of wafers to be measured. The detection device 20 connected to the support base 10 can be reused.

[0035] Specifically, in some embodiments, referring to Figure 2 and Figure 4 , the support base 10 is a wafer, and the thickness of the wafer is uniform and the surface is flat, which can ensure that it is closely attached to the wafer supporting table. Moreover, the wafer processing technology is mature, and the pressure measuring hole 13 can be opened with micron or even nanometer precision, so that the position and diameter of the pressure measuring hole 13 can be accurately controlled, and the adsorption hole can be perfectly aligned. In some embodiments, referring to Figure 3 , the support base 10 is a mask plate, which is usually made of transparent base material (such as glass or quartz) to facilitate alignment of the pressure measuring hole 13 and the adsorption hole during installation. Moreover, compared with the wafer, the mask plate has a lower cost, and using the mask plate as the support base 10 can further reduce the manufacturing cost while maintaining the function. It is worth mentioning that the thickness of the mask plate is larger than that of the wafer, and when the mask plate is used as the support base 10, a groove 14 is usually opened in the area of the second surface 12 where the pressure measuring hole 13 is opened, and then the pressure measuring hole 13 is opened in the groove bottom of the groove 14. When the detection device 20 is installed at the pressure measuring hole 13, it is usually embedded in the groove 14.

[0036] Further, the detection device 20 and the support base 10 are connected through the support ring 23, which is interposed between the third surface 211 of the base plate 21 and the second surface 12 of the support base 10. The air vent 213 of the detection device 20 is located in the area enclosed by the support ring 23, and the port of the corresponding pressure measuring hole 13 is also located in the area enclosed by the support ring 23. It should be noted that the support ring 23 is usually made of adhesive tape, which is arranged between the detection device 20 and the support base 10 to effectively fix the detection device 20 on the support base 10. Through the support ring 23, the air tightness between the detection device 20 and the support base 10 is significantly improved, and the air leakage is effectively reduced. In some embodiments, when the detection device 20 is installed above the corresponding pressure measuring hole 13, the projection of the corresponding air vent 213 and the projection of the pressure measuring hole 13 overlap in the thickness direction of the support base 10. The overlapping design makes the path of the air flow through the pressure measuring hole 13 and the air vent 213 the shortest and most direct, reduces the resistance in the air flow transmission process, and improves the detection accuracy of the air pressure. It is worth mentioning that the support ring 23 can also make the detection device 20 and the support base 10 have a gap in the area enclosed by the support ring 23. Even if the pressure measuring hole 13 and the air vent 213 are not aligned and connected, the air vent 213 can still effectively detect the air pressure at the pressure measuring hole 13. This structural design ensures that even if there is an alignment error, the air pressure measurement can still be accurately performed, further improving the stability and reliability of the system. At the same time, it should be noted that if the support base 10 is a mask plate, the support ring 23 can also be arranged between the groove bottom of the groove 14 and the base plate 21 (to some extent, even if the support base 10 has a groove 14 on the second surface 12, the groove bottom can also be referred to as a part of the second surface 12).

[0037] In some embodiments, the detection device 20 further comprises a shell 24 and a signal processing chip 25. The shell 24 is arranged on the fourth surface 212 of the substrate 21, and the shell 24 and the substrate 21 together form a receiving cavity. The signal processing chip 25 and the pressure measuring chip 22 are located in the receiving cavity, and the signal processing chip 25 and the pressure measuring chip 22 are electrically connected by the lead wire 27. The signal processing chip 25, the pressure measuring chip 22 and the shell 24 are connected to the fourth surface 212 of the substrate 21 by the adhesive 29. Further, in order to protect the signal processing chip 25 and the pressure measuring chip 22 from corrosion, in some embodiments, the shell 24 is filled with sealing glue 26, and the sealing glue 26 covers the signal processing chip 25 and the pressure measuring chip 22. The sealing glue 26 is flexible and does not affect the detection of the pressure measuring chip 22. Specifically, in some embodiments, the pressure measuring chip 22 detects the atmospheric pressure through the side away from the back plate, and senses the air pressure in the adsorption hole through the side opposite to the air hole 213. The pressure measuring chip 22 outputs the sensed pressure difference in the form of an electrical signal, and the adsorption force is directly related to the pressure difference inside and outside the adsorption hole. By measuring the pressure difference, the adsorption effect can be more intuitively reflected, and it can be judged whether the wafer can be stably fixed by the adsorption equipment, so that the adsorption parameters can be adjusted in time. Specifically, in an embodiment of the present application, the pressure difference is detected by the following structure. The shell 24 has a top wall 241 opposite to the pressure measuring chip 22. The side of the sealing glue 26 away from the pressure measuring chip 22 has a gap with the top wall 241. The top wall 241 is provided with an air pressure hole 242 penetrating through the top wall 241. The air pressure hole 242 communicates the gap with the outside of the shell 24. In other words, when the sealing glue 26 fills the inside of the shell 24, it only needs to cover the signal processing chip 25 and the pressure measuring chip 22 to achieve the purpose of protection, without completely filling the inside of the shell 24. A gap is left between the side of the sealing glue 26 away from the pressure measuring chip 22 and the part of the top wall 241 provided with the air pressure hole 242. The side of the pressure measuring chip 22 away from the substrate 21 can sense the atmospheric pressure. Specifically, the pressure measuring chip 22 can be a MEMS chip. The side of the MEMS chip away from the substrate 21 is a back plate, and the side of the MEMS chip opposite to the air hole 213 is a diaphragm. It is worth mentioning that the signal processing chip 25 can be an ASIC chip.

[0038] Further, the plurality of detection devices 20 usually need to output the measured pressure information in the form of an electrical signal. Therefore, in some embodiments, the pressure measuring device further comprises a signal transmission device 30. Each pressure measuring device is electrically connected to the signal transmission device 30, and the signal transmission device 30 is used to output the electrical signal output by the pressure measuring device. Specifically, a terminal 28 can be arranged on the substrate 21, and the terminal 28 and the signal transmission device 30 are electrically connected by the lead wire 27, so as to transmit the signal processed by the signal processing chip 25 to the signal transmission device 30. It is worth mentioning that the signal transmission device 30 transmits the signal through the lead wire 27 (refer to Figure 2 andFigure 3 ), or, transmitting signals by wireless communication (refer to Figure 4 ) When transmitting signals through the lead 27, the signal transmission device 30 can be directly connected to the signal receiving end of the signal receiver of other equipment. When transmitting signals by wireless communication, the signal transmission device 30 can be directly arranged on the support base 10, so that the excessively long lead 27 can be effectively avoided, and the signal transmission device 30 can be applied in the scene where frequent movement is required or the closed space needs to be measured.

[0039] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the description.

[0040] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A load measuring device, characterized by, The application relates to a pressure measuring device for connecting with an adsorption device, wherein the adsorption device is provided with a wafer supporting table for supporting a wafer, and a plurality of adsorption holes are formed in the wafer supporting table. The supporting seat (10) is provided with a first surface (11) and a second surface (12) arranged oppositely, the first surface (11) is used for abutting with the wafer supporting table of the adsorption device, a plurality of pressure measuring holes (13) are formed in the supporting seat (10), the pressure measuring holes (13) pass through the first surface (11) and the second surface (12), the plurality of pressure measuring holes (13) are used for communicating with different adsorption holes, and the projections of the pressure measuring holes (13) and the adsorption holes overlap in the thickness direction of the supporting seat (10) after the pressure measuring device is connected with the adsorption device. A plurality of detection devices (20) correspond to the plurality of pressure measuring holes (13) one by one, the detection device (20) comprises a substrate (21) and a pressure measuring chip (22), the substrate (21) is provided with a third surface (211) and a fourth surface (212) arranged oppositely, an air hole (213) passing through the third surface (211) and the fourth surface (212) is formed in the substrate (21), the third surface (211) is arranged oppositely to the second surface (12), and the pressure measuring chip (22) is arranged oppositely to the port of the air hole (213).

2. The load measuring apparatus according to claim 1, wherein The detection device (20) and the supporting seat (10) are connected through a supporting ring (23), the supporting ring (23) is located between the second surface (12) and the third surface (211), the air hole (213) of the detection device (20) is located in the region enclosed by the supporting ring (23), and the port of the pressure measuring hole (13) corresponding to the detection device (20) is located in the region enclosed by the supporting ring (23).

3. The load measuring apparatus according to claim 2, wherein In the thickness direction of the supporting seat (10), the projection of the air hole (213) and the projection of the pressure measuring hole (13) overlap.

4. The load measuring apparatus according to claim 1, wherein The supporting seat (10) is a wafer or a mask plate.

5. The load measuring apparatus according to claim 1, wherein A plurality of grooves (14) are formed in the second surface (12) of the supporting seat (10), the plurality of grooves (14) correspond to the plurality of pressure measuring holes (13) one by one, the pressure measuring hole (13) is formed in the groove bottom of the corresponding groove (14), and the detection device (20) is embedded in the groove (14), so that the corresponding air hole (213) and pressure measuring hole (13) are directly communicated.

6. The load measuring apparatus according to claim 1, wherein The detection device (20) further comprises a shell (24) and a signal processing chip (25), the shell (24) is arranged on the fourth surface (212) of the substrate (21) and jointly encloses a containing cavity together with the substrate (21), the signal processing chip (25) and the pressure measuring chip (22) are located in the containing cavity, and the signal processing chip (25) and the pressure measuring chip (22) are electrically connected.

7. The load measuring apparatus according to claim 6, wherein The shell (24) is filled with sealant (26) inside, the sealant (26) covers the signal processing chip (25) and the pressure measuring chip (22), and the sealant (26) is flexible material.

8. The load measuring apparatus according to claim 7, wherein The shell (24) has a top wall (241) opposite to the pressure measuring chip (22), a gap is formed between the side of the sealant (26) away from the pressure measuring chip (22) and the top wall (241), and the top wall (241) is provided with a gas pressure hole (242) penetrating through the top wall (241), the gas pressure hole (242) communicates the gap with the outside of the shell (24).

9. The load measuring apparatus according to claim 6, wherein The signal transmission device (30) is further included, each detection device (20) is electrically connected with the signal transmission device (30), and the signal transmission device (30) is used for outputting the electrical signal output by the detection device (20).

10. The load measuring apparatus according to claim 9, wherein The signal transmission device (30) transmits signals through a lead (27) or transmits signals through wireless communication. When the signal transmission device (30) transmits signals through wireless communication, the signal transmission device (30) is arranged on the support seat (10).

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