Semiconductor processing equipment

Abstract

The utility model provides semiconductor processing equipment. The semiconductor processing equipment comprises a bracket; the plurality of ejector pin assemblies are distributed around the central axis of the bracket at intervals; the ejector pin assembly comprises a supporting seat, a first ejector pin, a second ejector pin, a first ejector pin and a second ejector pin, the ejector pin is positioned above the supporting seat; and the pressure sensor is positioned between the ejector pin and the supporting seat and is fixedly connected with the ejector pin and the supporting seat. When the semiconductor processing equipment works, the damage to the wafer can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing equipment, concretely relates to a semiconductor processing equipment. BACKGROUND

[0002] In the semiconductor process, a wafer is transported into a process chamber by a transfer robot, and the wafer is processed in the process chamber. The process chamber has a susceptor, and a needle passes through the susceptor and reciprocates up and down in the susceptor. The transfer robot transports the wafer to the needle, and the needle drops to place the wafer on the susceptor, and then the wafer is processed. After processing the wafer, the needle lifts the wafer, and the transfer robot removes the wafer from the needle.

[0003] However, the wafer is easy to slip off the needle, and the wafer falls off some needles, which causes the transfer robot to collide with the front of the wafer during removal, resulting in damage to the wafer. SUMMARY

[0004] The technical problem to be solved by the utility model is how to reduce the damage to the wafer when the semiconductor processing equipment is working.

[0005] To solve the above technical problem, the utility model provides a semiconductor processing equipment, which comprises a support and a plurality of needle assemblies, the plurality of needle assemblies are distributed at intervals around the central axis of the support, wherein the needle assembly comprises a support seat fixed with the support, a needle located above the support seat, and a pressure sensor located between the needle and the support seat and fixedly connected with the needle and the support seat.

[0006] Optionally, the support seat comprises a support seat body and a sleeve shaft located above the support seat body and fixedly connected with the support seat body, wherein the pressure sensor is located between the sleeve shaft and the needle, and the pressure sensor is fixedly connected with the sleeve shaft.

[0007] Optionally, the needle assembly further comprises a blocking piece sleeved on the side wall of the sleeve shaft and located between the pressure sensor and the support seat body, and an elastic piece sleeved on the side wall of the sleeve shaft and located between the blocking piece and the support seat body.

[0008] Optionally, the blocking piece comprises first to Mth sub-blocking zones arranged from the support seat to the needle, and M is an integer greater than or equal to 2; the outer diameters of the first to Mth sub-blocking zones increase first and then decrease from the support seat to the needle.

[0009] Optionally, the elastic piece comprises a bellows.

[0010] Optionally, the semiconductor processing device further comprises a base, the base having a plurality of through holes penetrating through the base, wherein the support, the support seat and the pressure sensor are located at the bottom of the base, the top pin is used to penetrate through the through hole, and the width of the pressure sensor in the direction perpendicular to the extension direction of the top pin is greater than the diameter of the through hole.

[0011] Optionally, the semiconductor processing device further comprises a driving member, the driving member being used to drive the support to move towards the base and to move away from the base.

[0012] Optionally, the semiconductor processing device further comprises a conveying member, the conveying member being used to remove the wafer from the top pin penetrating through the through hole and to place the wafer on the top pin penetrating through the through hole.

[0013] Optionally, the semiconductor processing device further comprises a heating member located in the base, and the through hole is spaced apart from the heating member.

[0014] Optionally, the support comprises a support body and a plurality of extension arms, the plurality of extension arms being spaced apart around the central axis of the support body, wherein one end of the extension arm is fixedly connected with the support body, and the other end of the extension arm away from the support body is fixedly connected with the support seat body.

[0015] Optionally, the semiconductor processing device further comprises a processor, the processor being used to determine whether the wafer slips on the top pin according to the pressure deviation of the pressure sensor in the plurality of top pin assemblies.

[0016] The technical scheme of the utility model has the following technical effects:

[0017] The semiconductor processing device provided by the technical scheme of the utility model uses the end of the top pin away from the support seat to support the wafer. Since the pressure sensor is located between the top pin and the support seat, the pressure sensor can test the pressure of the end of the top pin away from the support seat supporting the wafer. The size of the pressure deviation of the pressure sensor in the plurality of top pin assemblies reflects the position information of the wafer at the end away from the support seat, and the wafer can be determined to slip on the top pin according to the pressure deviation of the pressure sensor in the plurality of top pin assemblies. If the wafer does not slip on the top pin, the wafer will not be damaged in the process of removing the wafer from the top pin. If the wafer slips on the top pin, the operation of removing the wafer from the top pin is suspended, and the wafer can be removed from the top pin after the position of the wafer is corrected manually. In summary, the operation process of removing the wafer from the top pin does not damage the wafer. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the specific embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the description of the specific embodiments or the prior art. Obviously, the drawings described below are some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0019] Figure 1 A schematic diagram of a semiconductor processing device in the related art;

[0020] Figure 2 A schematic diagram of a semiconductor processing device in an embodiment of the present application. DETAILED DESCRIPTION

[0021] The semiconductor processing device in the related art, referring to Figure 1 , comprises: a susceptor 10, the susceptor 10 has a heating element therein; a pin 11 passing through the susceptor 10 and capable of reciprocating up and down in the susceptor 10; a transfer robot 12.

[0022] The transfer robot 12 transfers a wafer 13 to the pin 11, the pin 11 falls to place the wafer 13 on the susceptor 10, and then the wafer 13 is processed. After the wafer 13 is processed, the pin 11 lifts the wafer 13, and the transfer robot 12 removes the wafer 13 from the pin 11.

[0023] However, when the pin 11 lifts the wafer 13, there is a temperature difference between the back surface temperature of the wafer 13 and the temperature of the susceptor 10, which makes the wafer 13 subject to a slight stress change, so that the wafer 13 is easy to slip off the pin, the wafer 13 falls off the pin 11, and then the transfer robot 12 is easy to collide with the front surface of the wafer 13 in the process of taking away the wafer 13, causing the wafer 13 to be damaged.

[0024] On this basis, an embodiment of the present application provides a semiconductor processing device, which can reduce damage to the wafer when working.

[0025] The technical solutions of the present application will be described below in conjunction with the drawings, and obviously, the described embodiments are some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] In the description of the utility model, it needs to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or position relation is based on the orientation or position relation shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the device or element must have a particular orientation, with a particular orientation structure and operation, therefore cannot be understood as the limitation of the utility model. In addition, the term "first", "second", "third" is only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0027] In the description of the utility model, it needs to explain, unless otherwise explicitly provided and limited, the term "installation", "connection", "connection" should be broad understanding, for example, can be fixed connection, can also be detachable connection, or integrally connected;Can be mechanical connection, can also be electrical connection;Can be directly connected, can also be indirectly connected through the intermediate medium, can also be the communication between two elements, can be wireless connection, can also be wired connection. For ordinary skilled in the art, the specific meaning of the above-mentioned terms in the utility model can be understood according to the specific circumstances.

[0028] In addition, the technical features involved in different embodiments of the utility model described below can be combined with each other as long as there is no conflict.

[0029] An embodiment of the utility model provides a kind of semiconductor processing equipment, reference Figure 2 , comprising:

[0030] Support 180;And

[0031] Multiple pin assemblies A, multiple the pin assemblies A are distributed around the center axis of the support 180;

[0032] Wherein, the pin assembly A includes:

[0033] Support seat 150, is fixed with the support 180;

[0034] Pin 110, is located above the support seat 150;

[0035] Pressure sensor 140, is located between the pin 110 and the support seat 150 and is fixedly connected with the pin 110 and the support seat 150.

[0036] In the embodiment, the end of the top pin 110 away from the support base 150 is used to support the wafer 130. Since the pressure sensor 140 is located between the top pin 110 and the support base 150, the pressure sensor 140 can test the pressure of the end of the top pin 110 away from the support base 150 supporting the wafer 130. The size of the deviation of the pressure data of the pressure sensor 140 in the plurality of top pin assemblies A reflects the position information of the wafer 130 at the end away from the support base 150, and the wafer 130 can be judged whether it is slipped on the top pin 110 according to the deviation of the pressure data of the pressure sensor 140 in the plurality of top pin assemblies A. If the wafer 130 is not slipped on the top pin 110, the wafer 130 will not be damaged in the process of moving the wafer 130 away from the top pin 110. If the wafer 130 is slipped on the top pin 110, the operation of moving the wafer 130 away from the top pin 110 is paused, and the wafer 130 can be moved away from the top pin 110 after the position of the wafer 130 is corrected manually. In summary, the operation process of moving the wafer 130 away from the top pin 110 avoids damaging the wafer 130.

[0037] In the embodiment, referring to Figure 2 , the support base 150 includes a support base body and a sleeve shaft located above the support base body and fixedly connected with the support base body; wherein the pressure sensor 140 is located between the sleeve shaft and the top pin 110, and the pressure sensor 140 is fixedly connected with the sleeve shaft.

[0038] The central axis of the top pin 110 coincides with the central axis of the sleeve shaft.

[0039] In the embodiment, referring to Figure 2 , the top pin assembly A further includes a blocking piece 170, the blocking piece 170 is sleeved on the side wall of the sleeve shaft and located between the pressure sensor 140 and the support base body; and an elastic piece 160, the elastic piece 160 is sleeved on the side wall of the sleeve shaft and located between the blocking piece 170 and the support base body.

[0040] In the embodiment, the elastic piece 160 includes a bellows. The bellows is a tubular elastic sensitive element connected by foldable corrugated pieces in the folding and telescoping direction.

[0041] In the embodiment, the elastic piece 160 includes a bellows. The displacement of the bellows in the folding and telescoping direction is proportional to the pressure signal indicated by the pressure sensor 140, that is, the greater the displacement of the bellows in the folding and telescoping direction, the greater the pressure signal indicated by the pressure sensor 140. In an embodiment, the pressure sensor 140 outputs a pressure signal according to the displacement of the bellows in the folding and telescoping direction.

[0042] In the embodiment, the blocking piece 170 comprises a first sub-blocking zone to an Mth sub-blocking zone arranged from the support base 150 to the ejector pin 110, M being an integer greater than or equal to 2; the outer diameter of the first sub-blocking zone to the outer diameter of the Mth sub-blocking zone increase first and then decrease from the support base 150 to the ejector pin 110.

[0043] In the embodiment, referring to Figure 2 , the semiconductor processing device further comprises a base 100, the base 100 having a plurality of through holes, the through holes penetrating the base 100; wherein the support 180, the support base 150, and the pressure sensor 140 are located at the bottom of the base 100; the ejector pin 110 is used to penetrate the through holes.

[0044] The width of the pressure sensor 140 in the direction perpendicular to the extension direction of the ejector pin 110 is greater than the hole diameter of the through hole. When the ejector pin 110 penetrates the through hole of the base 100 and is lifted upward, the pressure sensor 140 is used for limiting. The pressure sensor 140 will not move into the through hole of the base 100.

[0045] In the embodiment, referring to Figure 2 , the semiconductor processing device further comprises a driving piece 190, the driving piece 190 being used to drive the support 180 to move towards the base 100, and the driving piece 190 being used to drive the support 180 to move away from the base 100. The driving piece 190 comprises a pneumatic cylinder. The driving piece 190 can also be a motor.

[0046] In the embodiment, referring to Figure 2 , the semiconductor processing device further comprises a transmission piece 120, the transmission piece 120 being used to remove the wafer 130 from the ejector pin 110 penetrating the through hole, and the transmission piece 120 being used to place the wafer 130 on the ejector pin 110 penetrating the through hole. The transmission piece 120 comprises a transmission mechanical arm.

[0047] If the wafer 130 does not slide on the ejector pin 110, the transmission piece 120 will not damage the wafer 130 during the process of removing the wafer 130 from the ejector pin 110. If the wafer 130 slides on the ejector pin 110, the operation of removing the wafer 130 from the ejector pin 110 by the transmission piece 120 is paused, and the position of the wafer 130 is corrected manually, and then the wafer 130 is removed from the ejector pin 110 by the transmission piece 120. In summary, the operation of removing the wafer 130 from the ejector pin 110 does not damage the wafer 130.

[0048] In the embodiment, the semiconductor processing apparatus further comprises a heating element, which is located in the susceptor 100, and the through hole is spaced apart from the heating element. The heating element is used to provide a temperature for the wafer 130 during a process operation on the wafer 130.

[0049] In the embodiment, the support 180 comprises a support body 181 and a plurality of extension arms 182, which are spaced apart around a central axis of the support body 181; one end of the extension arm 182 is fixedly connected to the support body 181, and the other end of the extension arm 182, which is away from the support body 181, is fixedly connected to the support seat body. Figure 2

[0050] The central axis of the thimble 110 and the central axis of the sleeve shaft coincide and are parallel to the central axis of the support body 181.

[0051] In one embodiment, the number of extension arms 182 is the same as the number of thimble assemblies A. The number of extension arms 182 is greater than or equal to 3. The number of thimble assemblies A is greater than or equal to 3.

[0052] In one embodiment, the number of extension arms 182 is three, and the number of thimble assemblies A is three. In other embodiments, the number of extension arms 182 and the number of thimble assemblies A can be other suitable numbers, which are not limited.

[0053] In the embodiment, the semiconductor processing apparatus further comprises a processor, which is used to determine whether the wafer 130 is slipping on the thimble 110 according to the pressure deviation of the pressure sensor 140 in the plurality of thimble assemblies A. The processor comprises a computer.

[0054] In the embodiment, the semiconductor processing apparatus further comprises a process cavity, wherein the susceptor 100, the support 180 and the thimble assembly A are all located in the process cavity. The process cavity can be used for various process treatments on the wafer 130, for example, a deposition cavity or a dry etching cavity.

[0055] Obviously, the above embodiments are only examples for clear illustration, and are not a limitation on the embodiments. Based on the above description, other different forms of changes or variations can be made by those skilled in the art. Here, all the embodiments need not and cannot be exhausted. The obvious changes or variations derived therefrom are still within the protection scope of the present application.​

Claims

1. A semiconductor processing apparatus, characterized by, The semiconductor processing device comprises: a support frame; a plurality of needle assemblies, which are arranged around a central axis of the support frame; wherein each needle assembly comprises: a support seat fixed to the support frame; a needle arranged above the support seat; a pressure sensor arranged between and fixed to the support seat and the needle. The support seat comprises a support seat body and a sleeve shaft arranged above the support seat body and fixed to the support seat body; wherein the pressure sensor is arranged between the sleeve shaft and the needle, and fixed to the sleeve shaft.

2. The semiconductor processing apparatus of claim 1, wherein The needle assembly further comprises:

3. The semiconductor processing apparatus of claim 2, wherein a blocking piece arranged on a side wall of the sleeve shaft and between the pressure sensor and the support seat body; and 4. The semiconductor processing apparatus of claim 3, wherein a resilient piece arranged on the side wall of the sleeve shaft and between the blocking piece and the support seat body.

5. The semiconductor processing apparatus of claim 3, wherein The blocking piece comprises a first sub-blocking zone to an Mth sub-blocking zone arranged from the support seat to the needle, M being an integer greater than or equal to 2; the outer diameter of the first sub-blocking zone to the outer diameter of the Mth sub-blocking zone increase first and then decrease from the support seat to the needle.

6. The semiconductor processing apparatus of claim 1, wherein The resilient piece comprises a bellows. The semiconductor processing device further comprises: a base having a plurality of through holes penetrating the base; 7. The semiconductor processing apparatus of claim 6, wherein wherein the support frame, the support seat and the pressure sensor are arranged at the bottom of the base; and 8. The semiconductor processing apparatus of claim 6, wherein, the needle is arranged to penetrate the through holes; 9. The semiconductor processing apparatus of claim 6, wherein, wherein the width of the pressure sensor in a direction perpendicular to the extension direction of the needle is greater than the hole diameter of the through holes.

10. The semiconductor processing apparatus of claim 2, wherein The semiconductor processing device further comprises: a driving member arranged to drive the support frame to move towards the base, and arranged to drive the support frame to move away from the base.

11. The semiconductor processing apparatus according to any one of claims 1 to 10, characterized by, The semiconductor processing device further comprises: a conveying member arranged to remove a wafer from the needle penetrating the through holes, and arranged to place a wafer on the needle penetrating the through holes. The semiconductor processing device further comprises: a heating member arranged in the base; and the through holes are arranged to be spaced apart from the heating member. The support frame comprises a support frame body and a plurality of extension arms arranged around a central axis of the support frame body; wherein one end of each extension arm is fixed to the support frame body, and the other end of each extension arm is fixed to the support seat body. The semiconductor processing device further comprises: a processor arranged to determine whether a wafer slips on the needle according to the pressure deviation of the pressure sensor in each needle assembly.

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