Automatic fusion welding machine for chip packaging

Abstract

The utility model relates to the technical field of hot melting welding, in particular to an automatic melting welding machine for chip packaging, which comprises a feeding assembly, a welding assembly, a welding assembly, a welding assembly, a welding assembly and a welding assembly, and is characterized in that the feeding assembly comprises a strip-shaped feeding tray and is used for sequentially receiving and conveying chip cover plates to a material taking position; the limiting assembly is arranged at the output end of the feeding assembly and used for bearing the welding bottom plate and limiting the welding bottom plate; the material moving assembly comprises a moving part and a clamping part fixedly arranged on the moving part, the clamping part is provided with a clamping jaw which can be opened and closed, the top of the chip cover plate is provided with a material taking head for the clamping jaw to form a clamping action, and the moving part is used for driving the clamping part to reciprocate between the material taking position and the limiting assembly and driving the chip cover plate to be transferred to the welding position; the melting assembly is connected with the material moving assembly and comprises a hot melting welding die opposite to the welding position, and the hot melting welding die is used for bearing the chip cover plate and conducting melting treatment on the chip cover plate and the welding bottom plate; automatic feeding, positioning and fusion welding treatment of chips are achieved, and the welding quality of the chips is guaranteed.

Description

TECHNICAL FIELD

[0001] The utility model relates to hot melting welding technical field especially relates to a chip package automatic melting welding machine. BACKGROUND

[0002] Chip as a kind of core component based on wireless radio frequency identification technology, is widely used in automation system, logistics, identification, intelligent transportation and other fields, with high precision, reliable and stable, easy to integrate and other advantages.

[0003] In the application process, to prevent damaging label sensor in use and affecting continuous use, usually adopt mould or equipment to process sink groove on bottom plate, with label sensor built-in sink groove mode, to protect label sensor, in the relevant technology, usually adopt ultrasonic welding, cast welding or laser welding mode to make chip and bottom plate connect, in the welding process, the vibration energy generated by ultrasonic welding is easy to damage the internal circuit of chip;The high-temperature process of cast welding technology is easy to cause chip thermal stress failure;Laser welding requires high welding precision, and small deviation may cause chip ablation or penetration;The above welding methods are easy to damage the chip, so that the quality of the product after welding is difficult to guarantee.

[0004] The information disclosed in this BACKGROUND section is only for the purpose of enhancing the understanding of the background of the present utility model and should not be treated as acknowledging that the information is prior art known to those of ordinary skill in the art. SUMMARY

[0005] The utility model solves the technical problems that provide a kind of chip package automatic melting welding machine, realize chip automatic feeding, positioning, melting welding processing, guarantee chip welding quality.

[0006] In order to achieve the above purpose, the technical scheme adopted by the utility model is: a kind of chip package automatic melting welding machine, comprising:

[0007] Feeding assembly, including strip-shaped feeding tray, for sequentially receiving and conveying chip cover plate to material taking position;

[0008] Limiting assembly is arranged at the output end of the feeding assembly, for receiving and limiting the welding bottom plate;

[0009] Material moving assembly, including moving part and clamping part fixedly arranged on the moving part, the clamping part has openable and closable clamping jaw, the chip cover plate top has the material taking head for the clamping action of the clamping jaw, the moving part is used to drive the clamping part reciprocating between the material taking position and the limiting assembly, and drive the chip cover plate to shift to welding position;

[0010] The melting assembly, connected to the material transfer assembly, includes a hot melt welding mold disposed opposite to the welding position. The hot melt welding mold is used to receive the chip cover plate and to melt the chip cover plate and the welding base plate.

[0011] Furthermore, the top of the feeding tray has a limiting groove for accommodating the chip cover plate, the inner side of the limiting groove is tangent to the outer side of the chip cover plate; and the limiting groove is opened at one end away from the limiting component to form a feeding port.

[0012] Furthermore, the feeding assembly also includes a vibratory feeder, which is a hollow inverted cone with a spiral feeding groove on its inner side. Several chip cover plates are located in the vibratory feeder and are arranged in a vibratory pattern on the feeding groove.

[0013] A transition plate is provided between the vibratory feeder and the feeding tray. The transition plate and the feeding port are located on the same horizontal plane. The chip cover plate is inserted into the limiting groove from the feeding slot through the transition plate and the feeding port.

[0014] Furthermore, the bottom of the loading tray has a support frame, and the loading tray is fixedly mounted on the top of the support frame.

[0015] Furthermore, the limiting component includes a base plate and two positioning blocks. The base plate is disposed on a horizontal surface and is used to support the welding base plate. The two positioning blocks are fixedly disposed on adjacent sides of the top surface of the base plate and abut against adjacent sides of the welding base plate.

[0016] Furthermore, the moving part includes a bracket, a first support arm, and a first driving member. The bracket is mounted on both sides of the feeding tray, the first support arm is clamped on the top of the bracket, and its length direction is arranged along the feeding direction of the chip cover plate. The first driving member and the clamping part are respectively disposed at both ends of the first support arm.

[0017] Furthermore, the clamping part also includes a telescopic drive member and a clamping drive member. The telescopic drive member is arranged in a vertical direction, the clamping drive member is fixedly arranged at the output end of the telescopic drive member, and the gripper is arranged at the output end of the clamping drive member.

[0018] Furthermore, the hot melt welding mold includes a copper sleeve, an upper mold, and a lower mold. The upper mold and the lower mold are respectively fixedly disposed on two sides of one end of the copper sleeve, and the copper sleeve is rotatably connected to the material transfer assembly.

[0019] Further, the melting assembly further comprises a second supporting arm, a second driving member and a rotary driving member, the second supporting arm is arranged along a vertical direction and located at one end of the first supporting arm towards the clamping part, the second driving member and the rotary driving member are arranged at two ends of the second supporting arm respectively, the clamping part is fixedly connected with the side surface of the second supporting arm, and one side of the upper die of the copper sleeve is fixedly connected with the output end of the rotary driving member.

[0020] Further, the melting assembly further comprises a heat insulation block, which is located between the copper sleeve and the output end of the rotary driving member.

[0021] The chip automatic melting welding machine has the advantages that: through the collaborative operation of the feeding, limiting and material moving assemblies, the automatic conveying of the chip cover plate, the accurate positioning of the welding base plate and the lossless transfer of the chip cover plate are realized, the automatic melting welding processing of the chip is realized through the hot melting welding die processing of the melting assembly, the damage to the chip is avoided, the production efficiency is greatly improved, and the stability and consistency of the welding quality are ensured. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0023] Figure 1 FIG. 1 is a structural schematic view of a chip automatic melting welding machine in an embodiment of the present application;

[0024] Figure 2 FIG. 2 is a structural schematic view of a feeding assembly in an embodiment of the present application;

[0025] Figure 3 FIG. 3 is a structural schematic view of a limiting assembly in an embodiment of the present application; Figure 2 FIG. 4 is an enlarged view of position A in FIG. 3;

[0026] Figure 4 FIG. 5 is a structural schematic view of a material moving assembly and a melting assembly in an embodiment of the present application;

[0027] Figure 5 FIG. 6 is a structural schematic view of the material moving assembly and the melting assembly in an embodiment of the present application;

[0028] Figure 6 FIG. 7 is an enlarged view of position B in FIG. 6. Figure 5 FIG. 8 is an enlarged view of position B in FIG. 6.

[0029] Reference numerals: 01, chip cover plate; 10, feeding assembly; 11, feeding tray; 111, limiting groove; 112, feeding port; 12, vibrating plate; 121, feeding groove; 13, transition plate; 14, support frame; 20, limiting assembly; 21, substrate; 22, positioning block; 30, material transfer assembly; 31, moving part; 311, bracket; 312, first support arm; 313, first driving component; 32, clamping part; 321, gripper; 322, telescopic driving component; 323, clamping driving component; 40, melting assembly; 41, hot melt welding mold; 411, copper sleeve; 412, upper mold; 413, lower mold; 42, second support arm; 43, second driving component; 44, rotation driving component; 45, heat insulation block. Detailed Implementation

[0030] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0033] like Figures 1 to 6 The automated melt soldering machine for chip packaging shown includes:

[0034] The feeding assembly 10 includes a strip-shaped feeding tray 11, which is used to sequentially receive and transport the chip cover plate 01 to the picking position;

[0035] The limiting component 20 is located at the output end of the feeding component 10 and is used to receive the welding base plate and limit its movement.

[0036] The material moving assembly 30 comprises a moving part 31 and a clamping part 32 fixedly arranged on the moving part 31, the clamping part 32 is provided with a clamping jaw 321 which can be opened and closed, the top of the chip cover plate 01 is provided with a material taking head for forming a clamping action of the clamping jaw 321, the moving part 31 is used for driving the clamping part 32 to reciprocate between the material taking position and the limiting assembly 20, and driving the chip cover plate 01 to shift to the welding position.

[0037] The melting assembly 40 is connected with the material moving assembly 30 and comprises a hot melting welding die 41 which is arranged opposite to the welding position and is used for receiving the chip cover plate 01 and performing melting treatment on the chip cover plate 01 and the welding bottom plate.

[0038] The chip cover plate 01 is automatically conveyed, the welding bottom plate is accurately positioned, and the chip cover plate 01 is damage-free shifted through the collaborative operation of the feeding, limiting and material moving assembly 30, and the chip is automatically melted and welded through the hot melting welding die 41 of the melting assembly 40, so that the chip is prevented from being damaged, the production efficiency is greatly improved, and the stability and consistency of the welding quality are ensured.

[0039] Specifically, the feeding assembly 10 can sequentially receive and convey the chip cover plate 01 to the material taking position, and the tray strip structure is used to ensure the stability of the cover plate posture and prevent stacking misalignment, so that the continuous and sequential supply of the chip cover plate 01 is realized, and the production efficiency is improved.

[0040] The limiting assembly 20 is arranged at the output end of the feeding assembly 10 and is used for receiving and limiting the welding bottom plate, and specifically, the limiting can be realized through a mechanical limiting structure, such as a clamping groove or vacuum adsorption, so that the stability of the welding bottom plate during the welding process is ensured, the welding bottom plate is prevented from deviating during the melting process, and the welding defects caused by misalignment are reduced.

[0041] The material moving assembly 30 is in contact with the material taking head on the chip cover plate 01 through the clamping jaw 321 and clamps the chip cover plate 01, so that the non-contact type grabbing of the body of the chip cover plate 01 is realized, the chip is prevented from being damaged due to the direct contact and pressure of the clamping jaw 321, the moving part 31 realizes the accurate reciprocating motion of the clamping jaw 321 between the material taking position and the welding position, and the cover plate is quickly and stably shifted.

[0042] The melting assembly 40 can heat the surfaces of the welding bottom plate and the chip cover plate 01, so that the welding bottom plate and the chip cover plate 01 are naturally bonded after the surfaces are melted and cooled, and the welding quality is ensured.

[0043] It should be noted that the feeding component 10, the limiting component 20, the transferring component 30, and the melting component 40 are all fixedly installed on the worktable and controlled by the electrical control component on the worktable. For example, the temperature and pressure of the hot melt welding mold 41 can be adjusted to adapt to chip cover plates 01 and welding base plates of different materials, or the moving speed of the transferring component 30 can be adjusted to adapt to different processing requirements.

[0044] Based on the above embodiments, the top of the loading tray 11 has a limiting groove 111 for accommodating the chip cover plate 01, the inner side of the limiting groove 111 is tangent to the outer side of the chip cover plate 01; and the end of the limiting groove 111 facing away from the limiting component 20 is opened to form a loading port 112.

[0045] The design of the limiting groove 111 ensures that the chip cover plate 01 is accurately placed and positioned during the feeding process. The inner side of the limiting groove 111 is tangent to the outer side of the chip cover plate 01, and the contact surface between the two is a line contact, which reduces frictional resistance and avoids scratching the surface of the cover plate. At the same time, it provides a guiding function, which can effectively reduce the shaking and deviation of the chip cover plate 01 during the conveying process, ensure the stability of the chip cover plate 01 in the tray, and improve the feeding smoothness. The end of the limiting groove 111 opposite to the limiting component 20 is opened to form a feeding port 112. This makes it easy to push the chip cover plate 01 into the limiting groove 111 sequentially from the opening end, realize continuous automated feeding, simplify the feeding process, and eliminate the need for manual intervention to adjust the position of the chip cover plate 01.

[0046] Based on the above embodiments, the feeding assembly 10 also includes a vibratory plate 12. The vibratory plate 12 is a hollow inverted cone, and its inner side has a spiral feeding groove 121. Several chip cover plates 01 are located in the vibratory plate 12 and are arranged on the feeding groove 121 with vibration.

[0047] A transition plate 13 is provided between the vibrating plate 12 and the feeding tray 11. The transition plate 13 and the feeding port 112 are located on the same horizontal plane. The chip cover plate 01 is inserted into the limiting groove 111 from the feeding groove 121 through the transition plate 13 and the feeding port 112.

[0048] The hollow inverted cone vibration disc 12 uses vibration inertia to make the chip cover plate 01 gather to the center, avoids jamming or overturning caused by gravity center deviation during stacking, and guides the chip cover plate 01 to orderly rise along the set path and automatically arrange through the spiral track, combines with vibration screening to realize posture correction of the chip cover plate 01, ensures that the material taking heads of the chip cover plate 01 are all located above, facilitates clamping by the jaw 321, thereby realizing automatic directional sorting of disordered cover plates, and significantly reduces manual alignment cost; the transition plate 13 serves as a connecting bridge between the vibration disc 12 and the feeding tray 11, is located at the same horizontal plane as the feeding port 112, ensures that the chip cover plate 01 smoothly slides into the limiting groove 111 of the feeding port 112 from the spiral groove of the vibration disc 12, avoids jamming or posture deviation caused by height difference, and guarantees the position accuracy of the chip cover plate 01 entering the feeding tray 11.

[0049] On the basis of the above embodiment, the feeding tray 11 has a supporting frame 14 at the bottom, and the feeding tray 11 is fixedly arranged at the top of the supporting frame 14.

[0050] The supporting frame 14 serves as a basic bearing structure of the feeding tray 11, can ensure the stability of the tray under continuous vibration of the vibration disc 12 or frequent action of the material moving mechanism by using a high-rigidity material, such as an aluminum alloy or a steel frame, and prevents deformation or displacement of the tray; and the supporting frame 14 can be provided with an additional damping structure, such as a damping pad or a damper, to isolate high-frequency vibration transmitted by the vibration disc 12, avoid deviation of the chip cover plate 01 in the feeding tray 11 caused by vibration interference, ensure posture consistency of the chip cover plate 01 at the material taking position, prolong the service life of the feeding tray 11, and reduce the risk of fatigue deformation under long-term load.

[0051] Specifically, the feeding tray 11 can be fixed to the top of the supporting frame 14 by bolts or quick-release clamps, forming a modular design, facilitating quick replacement of the feeding tray 11 adapted to different sizes of chip cover plates 01, and meeting the needs of multi-species chip packaging.

[0052] On the basis of the above embodiment, the limiting assembly 20 includes a base plate 21 and two positioning blocks 22, the base plate 21 is arranged on a horizontal plane and used for receiving a welded bottom plate, and the two positioning blocks 22 are fixedly arranged on the top surface of the base plate 21 and abut against the adjacent two sides of the welded bottom plate.

[0053] The substrate 21 serves as a support platform for the welding base plate, and the horizontal arrangement ensures that the base plate remains flat during the melting welding process, avoids uneven contact surface pressure between the cover plate and the base plate due to inclination, reduces the positioning deviation caused by the warping of the base plate during the hot melting welding process, and provides a stable reference surface for ensuring the welding quality detection; the two positioning blocks 22 are respectively fixed to the adjacent two sides of the top surface of the substrate 21, and the two side edges of the welding base plate are constrained by the right-angle positioning to achieve accurate positioning in the horizontal plane of the welding base plate; specifically, the positioning block 22 can adjust the position or replace the block body of different sizes through bolts and other fasteners to adapt to welding base plates of various specifications.

[0054] On the basis of the above embodiment, the moving part 31 includes a support 311, a first supporting arm 312 and a first driving member 313, the support 311 is arranged on both sides of the feeding tray 11, the first supporting arm 312 is clamped on the top of the support 311, and the length direction is arranged along the feeding direction of the chip cover plate 01, and the first driving member 313 and the clamping part 32 are respectively arranged at both ends of the first supporting arm 312.

[0055] The support 311 is arranged on both sides of the feeding tray 11 to form a gantry type frame, which provides high rigidity support for the first supporting arm 312, avoids vibration or deformation caused by cantilever structure during material moving process, enhances the overall stability of the material moving assembly 30, and ensures the trajectory accuracy of the clamping part 32 in high-speed reciprocating motion; the first supporting arm 312 extends horizontally along the feeding direction of the chip cover plate 01, and the length direction is consistent with the feeding path, which realizes the axial separation layout of the driving member and the clamping part 32, the length of the first supporting arm 312 can cover the whole process from the feeding tray 11 to the welding position, and the first driving member 313 can be arranged in the form of motor-driven structure, such as linear motor or servo motor, which drives the supporting arm to reciprocate along the guide rail of the support 311 through synchronous belt, ball screw or gear rack and pinion transmission structure.

[0056] On the basis of the above embodiment, the clamping part 32 further includes a telescopic driving member 322 and a clamping driving member 323, the telescopic driving member 322 is arranged along the vertical direction, and the clamping driving member 323 is fixedly arranged at the output end of the telescopic driving member 322, and the clamping jaw 321 is arranged at the output end of the clamping driving member 323.

[0057] The telescopic driving member 322 moves along the vertical direction to control the lifting height of the clamping jaw 321, ensures that the chip cover plate 01 is vertically approached to the material taking head when it is grabbed, avoids the offset or surface damage of the feeding cover plate caused by horizontal friction, ensures the accuracy of positioning, improves the positioning accuracy, and ensures the safety of operation; the clamping driving member 323 is independently installed at the output end of the telescopic driving member 322, directly drives the clamping jaw 321 to open and close, and realizes the accurate adjustment and rapid response of the clamping force.

[0058] Specifically, the telescopic drive component 322 can be configured as a cylinder or an electric push rod, and the clamping drive component 323 can be configured as a miniature cylinder or a servo motor. The clamping force can be adjusted according to the material of the chip cover plate 01 to prevent deformation and damage to the chip cover plate 01 or detachment due to insufficient clamping force. The opening and closing part of the gripper 321 can be provided with a groove structure that matches the picking head to ensure the stability of the clamping action.

[0059] Based on the above embodiments, the hot melt welding mold 41 includes a copper sleeve 411, an upper mold 412 and a lower mold 413. The upper mold 412 and the lower mold 413 are respectively fixedly disposed on the two sides of one end of the copper sleeve 411. The copper sleeve 411 is rotatably connected to the material transfer assembly 30.

[0060] The copper sleeve 411 serves as the core carrier of the hot melt welding mold 41. Utilizing the high thermal conductivity of copper, it can quickly and evenly transfer heat to the upper mold 412 and the lower mold 413, avoiding uneven hot melt welding caused by local temperature gradients. The upper mold 412 and the lower mold 413 are fixed to both sides of the copper sleeve 411, forming a bidirectional pressure structure. This simultaneously applies pressure and heat to the surfaces of the chip cover plate 01 and the welding base plate, achieving synchronous melting and improving melting efficiency.

[0061] Specifically, the upper mold 412 and the lower mold 413 are fixed to the copper sleeve 411 by bolts or quick-release interfaces, which makes it easy to replace according to different chip sizes or hot melt welding requirements, thus adapting to the needs of multi-variety production and reducing production costs.

[0062] Based on the above embodiments, the melting assembly 40 further includes a second support arm 42, a second driving member 43, and a rotary driving member 44. The second support arm 42 is arranged vertically and is located at the end of the first support arm 312 facing the clamping part 32. The second driving member 43 and the rotary driving member 44 are respectively arranged at both ends of the second support arm 42. The clamping part 32 is fixedly connected to the side of the second support arm 42. The side of the upper mold 412 of the copper sleeve 411 is fixedly connected to the output end of the rotary driving member 44.

[0063] The second arm 42 is set vertically and moves together with the first arm 312 to achieve precise positioning of the clamping part 32 in three-dimensional space. The second arm 42 is fixed to the end of the first arm 312, distributing the weight of the clamping part 32 and the hot melt welding mold 41 to the entire bracket 311, reducing the risk of deformation caused by cantilever torque. The second drive component 43 is located at the top of the second arm 42 and drives the clamping part 32 to rise and fall vertically. The rotation drive component 44 is located at the bottom and controls the copper sleeve 411 to rotate around the axis, forming a separate drive design to avoid motion interference and achieve independent and precise control of lifting and rotation movements, thus avoiding interference.

[0064] On the basis of the above embodiment, the melting assembly 40 further comprises a heat insulation block 45 located between the copper sleeve 411 and the output end of the rotary driving member 44.

[0065] The heat insulation block 45 is located between the copper sleeve 411 and the rotary driving member 44, and uses a low thermal conductivity to block the high temperature during welding of the copper sleeve 411 from being transmitted to the rotary driving member 44, thereby avoiding the rotary driving member 44 from being heated to cause precision reduction, lubricant failure or electronic component aging, and prolonging the service life of the driving member; the heat insulation block 45 can be connected with the copper sleeve 411 and the rotary driving member 44 through high-strength bolts or a flange structure, thereby maintaining the rigidity of axial torque transmission while ensuring thermal insulation; and the failure rate caused by high temperature is reduced, thereby ensuring long-time and high-frequency continuous production.

[0066] The working process of the chip packaging automatic melting welding machine in the utility model is as follows:

[0067] The vibration disc 12 sequentially arranges the chip cover plates 01 in the feeding tray 11, and the welding base plate is manually placed on the base plate 21 with both sides being abutted with the two positioning blocks 22;

[0068] The first driving member 313 drives the first supporting arm 312 to drive the clamping part 32 and the moving assembly to move backward synchronously, and the second driving member 43 drives the second supporting arm 42 to drive the clamping part 32 and the moving assembly to move downward synchronously, so that the clamping jaw 321 is oppositely arranged with the top of the chip cover plate 01 located at the material taking position;

[0069] The telescopic driving member 322 drives the clamping jaw 321 to move downward, and the clamping driving member 323 drives the clamping jaw 321 to open, and a clamping action on the material taking head on the top of the chip cover plate 01 is formed, the telescopic driving member 322, the first driving member 313 and the second driving member 43 are reversely driven, so that the clamping jaw 321 drives the chip cover plate 01 to return to the initial height;

[0070] The rotary driving member 44 drives the hot melting welding die 41 to rotate by 90°, so that the upper die 412 is oppositely arranged with the bottom of the chip cover plate 01, and the first driving member 313 and the second driving member 43 respectively drive the first supporting arm 312 to move forward and the second supporting arm 42 to move downward, so that the lower die 413 is correspondingly arranged with the welding position on the welding base plate;

[0071] The telescopic driving member 322 drives the clamping jaw 321 to drive the chip cover plate 01 to move downward into the upper die 412, and the upper die 412 and the lower die 413 respectively melt the chip cover plate 01 and the welding base plate, so that the surface of the chip cover plate 01 is melted, and the welding base plate has a cavity for accommodating the chip cover plate 01;

[0072] The second driving member 43 drives the second supporting arm 42 to move upward, the telescopic driving member 322 drives the clamping jaw 321 to move the chip cover plate 01 out of the upper die 412, and the rotary driving member 44 drives the hot melt welding die 41 to rotate reversely by 90° to return to the initial position;

[0073] The clamping driving member 323 drives the clamping jaw 321 to release the clamping action on the top material taking head of the chip cover plate 01, so that the chip cover plate 01 falls into the cavity in the welding bottom plate, and the static cooling makes the two be integrated into one.

[0074] Those skilled in the art should understand that the utility model is not limited by the above-mentioned embodiments, and the above-mentioned embodiments and the description in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made to the utility model without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The protection scope of the utility model is defined by the appended claims and their equivalents.

Claims

1. A chip package automatic fusion welding machine characterized by, The utility model relates to a chip cover plate welding device, including: The upper feeding assembly includes a strip-shaped upper feeding tray for sequentially receiving and conveying the chip cover plate to a material taking position. The limiting assembly is arranged at the output end of the upper feeding assembly for receiving and limiting the welding base plate. The material moving assembly includes a moving part and a clamping part fixedly arranged on the moving part, the clamping part has clamping jaws arranged in an openable and closable manner, the top of the chip cover plate has a material taking head for the clamping action of the clamping jaws, the moving part is used to drive the clamping part to reciprocate between the material taking position and the limiting assembly and to drive the chip cover plate to shift to a welding position. The melting assembly is connected with the material moving assembly and includes a hot melt welding die arranged opposite to the welding position, the hot melt welding die is used to receive the chip cover plate and to melt the chip cover plate and the welding base plate.

2. The chip package automatic fusion welding machine according to claim 1, wherein, The top of the upper feeding tray has a limiting groove for accommodating the chip cover plate, the inner side surface of the limiting groove is tangent to the outer side surface of the chip cover plate, and the end of the limiting groove away from the limiting assembly is arranged in an open manner to form an upper feeding port.

3. The chip package automatic fusion welding machine according to claim 2, wherein, The upper feeding assembly further includes a vibrating disc, the vibrating disc is a hollow inverted cone, and the inner side surface has a spiral upper feeding groove, a plurality of chip cover plates are arranged in the vibrating disc and are arranged in a vibrating and arranged manner on the upper feeding groove. A transition plate is arranged between the vibrating disc and the upper feeding tray, the transition plate and the upper feeding port are located on the same horizontal plane, the chip cover plate is clamped in the limiting groove through the transition plate and the upper feeding port from the upper feeding groove.

4. The chip package automatic fusion welding machine according to claim 1, wherein The bottom of the upper feeding tray has a supporting bracket, and the upper feeding tray is fixedly arranged on the top of the supporting bracket.

5. The chip package automatic fusion welding machine according to claim 1, wherein The limiting assembly includes a base plate and two positioning blocks, the base plate is arranged on a horizontal plane for receiving the welding base plate, and the two positioning blocks are fixedly arranged on the adjacent two sides of the top surface of the base plate and abut against the adjacent two side surfaces of the welding base plate.

6. The chip package automatic fusion welding machine according to claim 1, wherein The moving part includes a support, a first supporting arm and a first driving member, the support is erected on both sides of the upper feeding tray, the first supporting arm is clamped on the top of the support, and the length direction is arranged along the direction of the chip cover plate feeding, and the first driving member and the clamping part are respectively arranged at both ends of the first supporting arm.

7. The chip package automatic fusion welding machine according to claim 6, wherein The clamping part further includes a telescopic driving member and a clamping driving member, the telescopic driving member is arranged along the vertical direction, the clamping driving member is fixedly arranged at the output end of the telescopic driving member, and the clamping jaw is arranged at the output end of the clamping driving member.

8. The chip package automatic fusion welding machine according to claim 6, wherein The hot melt welding die includes a copper sleeve, an upper die and a lower die, the upper die and the lower die are respectively fixedly arranged on the two side surfaces of one end of the copper sleeve, and the copper sleeve is rotationally connected with the material moving assembly.

9. The chip package automatic fusion welding machine according to claim 8, wherein, The melting assembly further includes a second supporting arm, a second driving member and a rotary driving member, the second supporting arm is arranged along the vertical direction and located at one end of the first supporting arm towards the clamping part, the second driving member and the rotary driving member are respectively arranged at both ends of the second supporting arm, the clamping part is fixedly connected with the side surface of the second supporting arm, and the side of the upper die of the copper sleeve is fixedly connected with the output end of the rotary driving member.

10. The chip package automatic fusion welding machine according to claim 9, wherein, The melting assembly further comprises a heat insulation block between the copper sleeve and the output end of the rotary driving member.

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