An automated soldering machine

Abstract

The application relates to an automatic solder coating machine and relates to the technical field of solder coating; the automatic solder coating machine comprises a workbench and a solder bucket used for storing solder; a clamping piece and a coating assembly are arranged on the workbench; the clamping piece is used for clamping a carrier; the coating assembly comprises a first lifting piece; the first lifting piece is used for inserting the carrier into the solder bucket; the application has the effects of improving solder coating efficiency, optimizing coating uniformity and reducing solder waste caused by excessive coating.

Description

Technical Field

[0001] This application relates to the field of solder coating technology, and in particular to an automated solder coating machine. Background Technology

[0002] A solder coating machine is a device used to coat solder onto metal structures, such as metal catalyst carriers used for exhaust gas catalysts.

[0003] Existing solder coating machines include a solder bin for holding solder, a solder delivery pipeline, and a pressure spray gun. One end of the solder delivery pipeline is connected to the solder bin, and the other end is connected to the pressure spray gun. The pressure spray gun is used to spray solder under pressure control. During the processing, the operator holds the pressure spray gun in one hand and the carrier in the other, pointing the nozzle of the pressure spray gun towards the carrier. The pressure spray gun sprays out solder onto the carrier, thus achieving the solder coating operation.

[0004] Regarding the aforementioned technologies, the inventors have discovered that when using the aforementioned coating solder machine to spray metal catalyst carriers used for waste gas catalysts, because the carrier has a honeycomb structure inside, the manual hand-held solder machine spraying method makes it difficult for the solder to completely cover the gaps between the inner cores of the carrier, resulting in uneven coating, which needs to be improved. Summary of the Invention

[0005] To improve the uniformity of solder coating, this application provides an automated solder coating machine.

[0006] This application provides an automated solder coating machine, which adopts the following technical solution:

[0007] An automated solder coating machine includes a worktable and a solder bucket for storing solder. The worktable is provided with a clamping member and a coating component. The clamping member is used to clamp a carrier. The coating component includes a first lifting member for inserting the carrier into the solder bucket.

[0008] By adopting the above technical solution, when it is necessary to coat the carrier with solder, since the solder barrel contains solder, the carrier can be clamped by the clamping component, and then the carrier can be inserted into the solder barrel by the first lifting component, so that the carrier is immersed in the solder. At this time, the solder in the solder barrel will be immersed into the channel of the carrier core, so that the gap of the carrier core is evenly covered by the solder, thereby improving the uniformity of solder coating.

[0009] Preferably, the coating assembly includes a docking tank and a first rotating component, wherein the solder tank is inserted into the docking tank, the first rotating component is used to drive the solder tank to rotate, and the first lifting component is used to drive the docking tank to move toward or away from the carrier.

[0010] By adopting the above technical solution, when the docking barrel is moved towards the carrier by the first lifting component, the solder barrel is sleeved around the carrier. At this time, the carrier will be inserted into the solder barrel and immersed in the solder. At the same time, the solder barrel can be rotated by the first rotating component at a specified angle to achieve full contact between the solder and the inner core of the carrier, thereby optimizing the uniformity of solder coating on the carrier.

[0011] Preferably, the coating assembly further includes an air blowing pipe and a first sliding member. The air blowing pipe is connected to an air pump and is located above the solder barrel. A first space is reserved between the air blowing pipe and the solder barrel for a carrier to pass through, and the outlet of the air blowing pipe faces the first space. The first sliding member is used to drive the air blowing pipe to move back and forth.

[0012] By adopting the above technical solution, after the carrier that has entered the solder barrel extends out of the solder barrel, high-pressure gas is blown into the carrier in the first space through the air blowing pipe and the air pump connected to it, so that some of the solder adhering to the carrier drips into the solder barrel under the action of airflow, reducing the waste of solder due to over-coating and optimizing the energy-saving effect. In addition, by the first sliding member sliding during the blowing process of the air blowing pipe, the blowing surface of the high-pressure gas on the carrier can be expanded, further optimizing the blowing effect of the solder on the carrier.

[0013] Preferably, the system also includes a frame, the worktable is rotatably connected to the frame, and the first space is located on the rotation path of the worktable; the frame is provided with a second rotating component, a trigger switch and a controller, the trigger switch and the second rotating component are both electrically connected to the controller, the controller is used to receive the trigger signal from the trigger switch and control the second rotating component to drive the worktable to rotate; there are several clamping components, which are distributed on the worktable along the circumference of the worktable.

[0014] By adopting the above technical solution, since the workbench is equipped with multiple clamping components, each of which can clamp and fix a carrier, one carrier can be clamped by each clamping component, and the workbench can be rotated so that all the carriers can be sequentially transferred to the first space for solder coating, thereby achieving efficient coating operation on batch carriers and improving processing efficiency.

[0015] Preferably, the workbench is further provided with a first sealing cover, a material receiving bucket, a first moving component, and a first blower. The first sealing cover is located above the material receiving bucket. The first moving component is used to drive the first sealing cover and the material receiving bucket to move toward each other or away from each other. The first blower is located on top of the first sealing cover. A second space is reserved between the first sealing cover and the material receiving bucket for the carrier to pass through. The air outlet of the first blower faces the second space, and the second space is located on the rotation path of the workbench.

[0016] By adopting the above technical solution, after the carrier immersed in the solder bucket is re-exposed from the solder bucket, the carrier is rotated to the second space along with the worktable. Then, high-pressure gas is blown onto the carrier by the first blower. The receiving bucket is used to receive the solder dripping from the carrier, so as to further blow some of the solder off the carrier and reduce the waste of solder due to over-coating.

[0017] Preferably, the frame is also provided with a second sealing cover arranged symmetrically on the upper and lower sides, a second moving part for driving the second sealing cover to move in a direction closer to or further away from each other, and a second blower; a third space for the carrier to pass through is reserved between the symmetrically arranged second sealing covers, the third space is located on the rotation path of the worktable, the second blower is disposed on the lower side wall of the second sealing cover, and the air outlet of the second blower faces the third space.

[0018] By adopting the above technical solution, since the bottom of the carrier will inevitably come into contact with the solder first when the carrier is inserted into the solder barrel, the solder will mainly be concentrated in the lower part of the carrier. In order to make the solder in the carrier evenly distributed, the carrier can be rotated into the third space, and then the second sealing cover can be moved towards each other by the second moving part. Then, high-pressure gas is blown towards the bottom of the solder by the second blower. The solder in the carrier will move towards the top of the carrier under the blowing of the high-pressure gas, increasing the solder distribution area in the carrier and making it more evenly distributed in the carrier, thus optimizing the solder coating effect.

[0019] Preferably, the frame is also provided with a cleaning tank and a second lifting component. The second lifting component is used to drive the cleaning tank to move towards or away from the worktable. A fourth space is reserved between the cleaning tank and the worktable for the carrier to pass through. The fourth space is located on the rotation path of the worktable. A spraying assembly is provided inside the cleaning tank. The spraying assembly is used to spray the peripheral wall and bottom wall of the carrier entering the fourth space.

[0020] By adopting the above technical solution, after the carrier immersed in the solder re-exits the solder barrel, it is transferred to the fourth space. Then, the carrier is inserted into the cleaning barrel through the second lifting component. Water is sprayed onto the outer peripheral wall and bottom wall of the carrier through the spraying component to clean the solder on the outer peripheral wall of the carrier and dilute the solder inside the carrier.

[0021] Preferably, the workbench has a plurality of fixing holes through it, and the fixing holes are respectively set with the clamping members. Each clamping member includes at least two clamping plates. The clamping plates are located below the workbench. The top of the clamping plate is connected to the inner wall of the corresponding fixing hole, and the other end is provided with a protrusion for fitting with the bottom end of the carrier. The workbench is provided with a material changing assembly for changing the carrier between the clamping plates.

[0022] By adopting the above technical solution, the carrier is inserted between the clamping plates, and the protrusion is used to support the carrier. After the carrier completes the coating of solder, the carrier is removed from the clamping plate by the material changing component and a new carrier is replaced, realizing the automatic carrier changing operation and further improving the processing efficiency.

[0023] Preferably, the material changing assembly includes a push plate, a pusher plate, a second sliding member, a third lifting member, and a storage frame; the push plate is located below the workbench, the third lifting member is used to drive the push plate through the fixing hole, the storage frame is used to stack carriers to be coated in sequence along its height direction, the side wall at the bottom of the storage frame is provided with a through hole for a single carrier or pusher plate to pass through, and the second sliding member is used to drive the pusher plate to slide and pass through the through hole.

[0024] By adopting the above technical solution, the worktable is rotated to move the carrier with the finished coating to the top of the push plate. Then, the third lifting component drives the push plate to move up, so that the carrier between the clamping plates is pushed by the push plate to the top of the fixing hole and is located in the sliding direction of the push plate. At this time, the third lifting component pushes the push plate to slide through the through hole, thereby pushing the carrier at the bottom of the storage frame to the top of the push plate, and then pushing the carrier with the finished coating away from the top of the fixing hole. Then, the third lifting component drives the carrier above it to move down and insert into the clamping space to realize the material replacement.

[0025] Preferably, the clamping plate is rotatably connected to the inner wall of the fixing hole; the material changing assembly includes a ring plate, a reset component, a storage frame, a pusher plate, a third rotating component, a top material rod, and a fourth lifting component; the ring plate is provided in a one-to-one correspondence with the fixing hole, and the ring plate slides along the depth direction of the fixing hole to be connected to the inner wall of the corresponding fixing hole, and the side wall of the clamping plate is provided with a clearance slope that fits against the side wall of the ring plate;

[0026] The top material rod is located below the workbench. The fourth lifting component is used to drive the top material rod to rise and fall and push the ring plate. The reset component is used to drive the ring plate to move and reset and drive the clamping plate to rotate and reset. The storage frame has carriers to be coated stacked sequentially along its height direction. The side wall at the bottom of the storage frame has a through hole for a single carrier or push plate to pass through. The third rotating component is used to drive the rotation and pass through the through hole.

[0027] By adopting the above technical solution, when any carrier moves above the top bar, the fourth lifting component drives the top bar to move upward and push the ring plate. The ring plate moves upward and pushes the clamping plate, causing the clamping plate to rotate. The lower end of the clamping plate rotates away from the carrier, so that the carrier can be released from the clamping space under its own weight and achieve unloading. When the top bar moves down to reset, the ring plate and the clamping plate will be reset under the action of the reset component. At this time, the third rotating component drives the electric push plate to rotate, so that the push plate passes through the through hole and pushes the carrier at the bottom of the storage frame above the fixing hole. At this time, the carrier will be inserted into the fixing hole under its own weight and clamped by the clamping plate, thus realizing the automatic material changing operation.

[0028] In summary, this application includes at least one of the following beneficial technical effects:

[0029] The carrier to be coated with solder is fixed to the worktable using clamps. The worktable is rotated to move the carrier above the solder bucket, and the solder bucket is raised to immerse the carrier in the solder. High-pressure gas is then blown onto the carrier through an air pipe. The carrier is then moved above the receiving bucket, and high-pressure gas is blown onto the carrier again using a first blower to prevent excessive solder coating. The carrier is then moved above the cleaning bucket, and the outer and bottom walls of the carrier are sprayed and cleaned using a spray assembly to dilute the solder in the carrier core. Finally, the carrier is moved between two second sealing covers, and high-pressure gas is blown onto the carrier from the lower right to the upper left using a second blower to ensure uniform solder distribution within the carrier core. After completing the above operations, the carrier is removed from the clamps, thus achieving an efficient and uniform solder coating operation. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of an automated solder coating machine in Example 1.

[0031] Figure 2 This is a structural block diagram of an automated solder coating machine in Example 1.

[0032] Figure 3 This is a cross-sectional view used in Example 1 to illustrate the structure of the coating component.

[0033] Figure 4 This is a cross-sectional view used in Example 1 to illustrate the structure of the cleaning tank and the spray assembly.

[0034] Figure 5 This is a schematic diagram illustrating the structure of the material changing component in Example 2.

[0035] Figure 6 This is a cross-sectional view used in Embodiment 2 to illustrate the structure of the material changing component.

[0036] Figure 7 This is a schematic diagram illustrating the structure of the material changing component in Example 3.

[0037] Figure 8 This is a cross-sectional view used in Embodiment 3 to illustrate the positional relationship between the ring plate and the clamping plate.

[0038] Explanation of reference numerals in the attached drawings: 1. Frame; 11. First space; 12. Second space; 121. First sealing cover; 122. Material receiving bucket; 123. First moving part; 124. First blower; 13. Third space; 131. Second sealing cover; 132. Second moving part; 133. Second blower; 14. Fourth space; 141. Cleaning bucket; 142. Second lifting part; 143. Spray assembly; 1431. Spray pipe; 15. Fifth space; 17. Fixed plate; 171. Material passage hole; 2. Workbench; 21. Fixed hole; 22. Clamping part; 221. Clamping plate; 222. Leaving slope; 3. Control 31. Control device; 32. Second rotating component; 33. Trigger switch; 34. Through-beam photoelectric switch; 4. Pressure sensor; 5. Solder bucket; 6. Coating assembly; 51. First lifting component; 52. Docking bucket; 53. First rotating component; 54. Air blowing pipe; 55. First sliding component; 56. Air pump; 6. Material changing assembly; 61. Top push plate; 62. Push plate; 63. Second sliding component; 64. Third lifting component; 65. Storage frame; 651. Through hole; 66. Ring plate; 661. Docking block; 67. Reset component; 671. Torsion spring; 672. Spring; 68. Third rotating component; 69. Top material rod; 7. Fourth lifting component. Detailed Implementation

[0039] The following is in conjunction with the appendix Figure 1-8 This application will be described in further detail.

[0040] This application discloses an automated solder coating machine. (Refer to...) Figure 1 and Figure 2 The automated solder coating machine includes a frame 1, with a worktable 2 rotatably connected inside the frame 1. The frame 1 is equipped with a second rotating component 31, a trigger switch 32, and a controller 3. The second rotating component 31 can be a motor, and the drive end of the second rotating component 31 is connected to the center of the worktable 2. The trigger switch 32 can be a pedal with a pressure sensor. The controller 3 can be a PLC controller. Both the trigger switch 32 and the second rotating component 31 are electrically connected to the controller 3. When the operator steps on the pedal, the pressure data detected by the pressure sensor increases, and the controller 3 activates the second rotating component 31 to drive the worktable 2 to rotate.

[0041] Reference Figure 1 and Figure 3In this embodiment, the workbench 2 has a circular cross-section. Several fixing holes 21 are provided through the upper surface of the workbench 2 along its thickness direction. The fixing holes 21 are evenly arranged around the circumference of the workbench 2. In this embodiment, the number of fixing holes 21 is 5. Several clamping members 22 are provided on the workbench 2. The clamping members 22 are arranged one-to-one with the fixing holes 21. The clamping members 22 are used to fix the carrier to be coated with solder on the workbench 2. Specifically, each clamping member 22 includes three clamping plates 221. The clamping plates 221 are arranged vertically, and the top of the clamping plate 221 is welded to the inner wall of the fixing hole 21. The bottom end of the clamping plate 221 is integrally formed with a protrusion. The protrusion is located on the side of the clamping plate 221 near the fixing hole 21. When the carrier passes through the fixing hole 21 and is inserted between the three clamping plates 221, the outer peripheral wall of the carrier is attached to the side wall of the clamping plate 221, and the bottom wall of the carrier is attached to the upper surface of the protrusion.

[0042] Reference Figure 1 and Figure 3 The frame 1 is provided with a first space 11, a second space 12, a fourth space 14, a third space 13 and a fifth space 15 in sequence along the rotation direction of the worktable 2; the first space 11, the second space 12, the fourth space 14, the third space 13 and the fifth space 15 are all located on the rotation path of the worktable 2, and the first space 11, the second space 12, the fourth space 14, the third space 13 and the fifth space 15 are respectively arranged with the fixing hole 21; a solder bucket 4 and a coating component 5 are provided in the first space 11 of the frame 1, and the coating component 5 includes a first lifting component 51, a docking bucket 52 and a first rotating component 53.

[0043] Reference Figure 3 The first lifting component 51 can be a hydraulic cylinder. The driving end of the first lifting component 51 is vertically upward and connected to the bottom wall of the docking barrel 52. The docking barrel 52 is located below the workbench 2 and has an open top. The solder barrel 4 and the first rotating component 53 are both inserted into the docking barrel 52. The first rotating component 53 can be a motor. The driving end of the first rotating component 53 is fixedly connected to the bottom wall of the solder barrel 4 to drive the solder barrel 4 to rotate. The solder barrel 4 has an open top and contains solder. The first lifting component 51 and the first rotating component 53 can be controlled by the controller 3. The clamping component 22 holding the carrier can rotate to the top of the solder barrel 4 as the workbench 2 rotates. At this time, the first lifting component 51 drives the docking barrel 52 and the solder barrel 4 to rise, so that the carrier is inserted into the solder barrel 4 and immersed in the solder. The solder penetrates from the bottom of the carrier into the gap of the carrier core to achieve solder coating. At the same time, the docking barrel 52 is rotated by the first rotating component 53 so that the solder fully fills the carrier core.

[0044] Optionally, in another embodiment, an air pipe with a one-way valve can be inserted into the solder barrel 4. During the process of inserting the carrier into the solder barrel 4, the one-way valve is opened and gas is introduced into the air pipe so that the solder surges under the action of the airflow, increasing the fluidity of the solder and increasing the contact area between the solder and the inner core of the carrier.

[0045] Reference Figure 2 and Figure 3 The coating component 5 also includes an air blowing pipe 54 and a first sliding member 55 disposed above the workbench 2. A sliding frame is installed on the frame 1 to support the air blowing pipe 54 and the first sliding member 55. The first sliding member 55 is used to drive the sliding frame to slide horizontally. The air blowing pipe 54 passes through the sliding frame and is connected to an air source. The air source includes at least an air pump 56. The outlet of the air blowing pipe 54 faces the solder canister 4. After the carrier that has entered the solder extends out of the solder canister 4, the air pump 56 draws gas into the air blowing pipe 54. The first sliding member 55 drives the air blowing pipe 54 to slide back and forth, so that the high-pressure gas acts on the top of the carrier, so that some of the solder adhering to the carrier drips into the solder canister 4 under the action of the airflow, avoiding over-coating.

[0046] Reference Figure 3 and Figure 4 The second space 12 of the frame 1 is provided with a first sealing cover 121, a material receiving bucket 122, a first moving part 123 and a first blower 124. The first sealing cover 121 is closed at the top and open at the bottom, and is located above the workbench 2. The material receiving bucket 122 is open at the top and located below the workbench 2. The first moving part 123 can be a motor and a two-way lead screw structure. The side walls of the first sealing cover 121 and the material receiving bucket 122 are threadedly sleeved to the side wall at the end of the two-way lead screw, so that the first sealing cover 121 and the material receiving bucket 122 can be driven by the first moving part 123 to move towards each other or away from each other. The first blower 124 is specifically an exhaust fan. The first blower 124 is installed on the first sealing cover 121, and the air outlet of the first blower 124 is connected to the internal cavity of the first sealing cover 121. The first blower 124 is used to deliver gas into the first sealing cover 121. When the carrier is moved between the first sealing cover 121 and the material receiving bucket 122, the first moving part 123 moves the first sealing cover 121 and the material receiving bucket 122 to a position that fits against the outer surface of the workbench 2. Then, the first blower 124 delivers gas into the first sealing cover 121. The gas moves from top to bottom, so that some of the solder adhering to the carrier drips into the material receiving bucket 122 under the action of the airflow, further reducing the problem of over-coating.

[0047] Reference Figure 3 and Figure 4A cleaning tank 141 and a second lifting component 142 are installed in the fourth space 14 of the frame 1. The cleaning tank 141 is open at the top and located below the workbench 2. The second lifting component 142 can be a hydraulic cylinder. The driving end of the second lifting component 142 is vertically arranged and welded to the bottom of the cleaning tank 141. The inner diameter of the cleaning tank 141 is much larger than the inner diameter of the fixing hole 21. A spray assembly 143 is installed inside the cleaning tank 141. The spray assembly 143 specifically includes several spray pipes 1431, which are connected to the cleaning tank 141. The spray pipes 1431 located on the periphery or bottom of the cleaning tank 141 have their nozzles facing the center of the cleaning tank 141, while the spray pipes 1431 located at the bottom of the cleaning tank 141 have their nozzles pointing vertically upwards. All spray pipes 1431 are connected to external water pumps. When the carrier moves from the second space 12 to the fourth space 14, the second lifting component 142 drives the cleaning tank 141 to move upwards and fit around the carrier. Water is sprayed onto the periphery and bottom of the carrier through the spray assembly 143 to clean the periphery of the carrier and dilute the core solder of the carrier.

[0048] Reference Figure 4 The fourth space 14 is located between the second space 12 and the third space 13. The third space 13 of the frame 1 contains a second sealing cover 131, a second moving part 132, and a second blower 133. There are two second sealing covers 131, symmetrically distributed on the upper and lower sides of the worktable 2 with the worktable 2 as the center. The second moving part 132 is a combination structure of a motor and a two-way lead screw. The two second sealing covers 131 are threaded onto the ends of the two-way lead screw, allowing the second moving part 132 to drive the two second sealing covers 131 away from or towards each other. The second blower 133 is installed on the second sealing cover 131 below the worktable 2. Specifically, the second blower 133 is an exhaust fan used to deliver gas into the second sealing cover 131, causing the gas to move upwards. Correspondingly, an exhaust fan can be installed on the second sealing cover 131 above the worktable 2 to extract the gas from the second sealing cover 131 above the worktable 2. During this process, the solder within the carrier will move towards the top of the carrier under the action of the airflow, achieving uniform distribution of the solder.

[0049] The implementation principle of an automated solder coating machine according to Embodiment 1 of this application is as follows: First, the carrier is inserted into the fixing hole 21 in the fifth space 15 and fixed by the clamping member 22. Then, the trigger switch 32 is stepped on, and the controller 3 controls the worktable 2 to rotate so that the clamping member 22 with the carrier first rotates to the first space 11. The controller 3 starts the first lifting member 51 to drive the solder barrel 4 to rise, and the carrier enters the solder. The first rotating member 53 drives the docking barrel 52 to rotate so that the solder fully contacts the core inside the carrier. Then, the solder barrel 4 moves down, and the controller 3 starts the first sliding member 55 and the first blower 124 so that the air pipe 54 blows high-pressure gas to the top of the carrier, so that some of the solder detaches from the carrier and drips into the solder barrel 4.

[0050] Then, the workbench 2 is driven to continue rotating so that the carrier moves into the second space 12. The first moving part 123 drives the first sealing cover 121 and the material receiving bucket 122 to move closer to each other, and the first blower 124 is started to blow high-pressure gas onto the carrier again. The high-pressure gas is blown from top to bottom, blowing some of the solder on the carrier into the material receiving bucket 122. Then, the workbench 2 is controlled to continue rotating so that the carrier moves into the fourth space 14. The second lifting part 142 drives the cleaning bucket 141 to move up and fit around the carrier. The spray assembly 143 sprays the outer peripheral wall and bottom wall of the carrier.

[0051] Next, the drive table 2 continues to rotate so that the carrier moves into the third space 13. The second moving part 132 drives the two second sealing covers 131 to move closer to each other and starts the second blower 133, which delivers high-pressure gas to the carrier from the lower right to the top, so that the solder in the carrier moves to the top of the carrier under the action of the airflow, making the carrier more evenly distributed. Finally, the carrier that has completed the entire coating process is moved to the fifth space 15, and a new carrier to be coated is replaced in the fifth space 15.

[0052] Example 2

[0053] The difference between Embodiment 2 and Embodiment 1 of this application is that, referring to... Figure 5 and Figure 6 The fifth space 15 of the frame 1 is equipped with a material changing assembly 6. The material changing assembly 6 includes a push plate 61, a pusher plate 62, a second sliding member 63, a third lifting member 64, and a storage frame 65. The push plate 61 and the third lifting member 64 are located below the worktable 2. The third lifting member 64 is specifically a hydraulic cylinder. The driving end of the third lifting member 64 is fixedly connected to the lower surface of the push plate 61. The sliding direction of the push plate 61 is parallel to the vertical direction, and the carrier can rotate to the top of the push plate 61 during the rotation of the worktable 2. The outer diameter of the push plate 61 is smaller than the outer diameter of the carrier, so that the push plate 61 can pass through the fixing hole 21 during the upward movement.

[0054] Reference Figure 5 and Figure 6 The lower end of the storage frame 65 is connected to the second rotating component 31 via a bearing (see reference). Figure 2 At the drive end, the storage frame 65 is relatively stationary with respect to the frame 1. Several carriers to be coated are pre-stored in the storage frame 65 along its height direction. The second sliding component 63 is specifically a cylinder. The cylinder body is fixedly connected to the side wall of the storage frame 65. The cylinder drive end is connected to the push plate 62. The side wall at the bottom of the storage frame 65 has a through hole 651 for a single carrier or the push plate 62 to pass through. The extension line of the sliding direction of the push plate 62 intersects with the extension line of the lifting direction of the top push plate 61.

[0055] Reference Figure 2 and Figure 6 The second sliding member 63 is electrically connected to the controller 3, which is also electrically connected to a through-beam photoelectric switch 33. The through-beam photoelectric switch 33 has multiple receivers, and each fixing hole 21 corresponds to one receiver. The receivers are embedded in the inner wall of the corresponding fixing hole 21. The through-beam photoelectric switch 33 has one transmitter, which is embedded in the periphery of the push plate 61. When the push plate 61 moves up into the fixing hole 21, the receiver in the fixing hole 21 can receive the light emitted by the transmitter on the push plate 61. At this time, the through-beam photoelectric switch 33 will send a switching signal to the controller 3. The controller 3 will activate the second sliding member 63 so that the push plate 62 pushes the carrier at the bottom of the storage frame 65 onto the push plate 61, and the carrier originally located on the push plate 61 will be pushed away from the worktable 2 to realize the material change.

[0056] The implementation principle of the automated solder coating machine disclosed in Embodiment 2 of this application is as follows: After the coated carrier is transferred to the fifth space 15, the controller 3 controls the third lifting component 64 to drive the push plate 61 to move upward, so as to push the coated carrier above the fixing hole 21. When the push plate 61 moves into the fixing hole 21, the receiver of the through-beam photoelectric switch 33 in the fixing hole 21 receives the light emitted by the transmitter on the push plate 61. The controller 3 activates the second sliding component 63 to drive the push plate 62 to push the carrier in the storage frame 65 onto the push plate 61, so as to realize the replacement of the carrier on the push plate 61. Then the push plate 61 moves downward and drives the carrier to be inserted between the clamping plates 221, thus completing the replacement of the carrier.

[0057] Example 3

[0058] The difference between Embodiment 3 and Embodiment 1 of this application is that: (Refer to...) Figure 7 and Figure 8 The top of the clamping plate 221 is rotatably connected to the inner wall of the corresponding fixing hole 21 via a rotating shaft. The fifth space 15 of the frame 1 is provided with a material changing assembly 6, which includes a ring plate 66, a reset component 67, a storage frame 65, a pusher plate 62, a third rotating component 68, a top material rod 69, and a fourth lifting component 7. The ring plate 66, the reset component 67, and the fixing hole 21 are arranged in a one-to-one correspondence. The ring plate 66 slides along the height direction of the fixing hole 21 and is connected to the inner wall of the fixing hole 21. The reset component 67 includes a torsion spring 671 sleeved on the rotating shaft and a spring 672 connected between the ring plate 66 and the inner wall of the fixing hole 21. When the torsion spring 671 is not deformed, the length direction of the clamping plate 221 is parallel to the vertical direction, and the extension direction of the spring 672 is parallel to the height direction of the fixing hole 21.

[0059] Reference Figure 6 and Figure 7The side wall at the top of the clamping plate 221 is provided with a relief slope 222 that fits against the inner wall of the ring plate 66. The inner side wall of the ring plate 66 is provided with an arc surface that fits against the relief slope 222. The top material rod 69 and the fourth lifting component 7 are located below the worktable 2. The fourth lifting component 7 is specifically a hydraulic cylinder. The driving end of the fourth lifting component 7 is fixedly connected to the bottom end of the top material rod 69 to drive the top material rod 69 to move vertically. The ring plate 66 can rotate above the top material rod 69 as the worktable 2 rotates. At this time, the fourth lifting component 7 drives the top material rod 69 to move upward to push the ring plate 66. The ring plate 66 moves upward under the push and squeezes the clamping plate 221, so that the clamping plate 221 rotates around the pivot. The bottom of the clamping plate 221 moves away from the carrier to release the clamping of the carrier. At this time, the carrier will fall under its own weight. A receiving bucket can be placed on the frame 1 to support the falling carrier.

[0060] Reference Figure 6 and Figure 7 A fixed plate 17 is suspended near the fifth space 15 of the frame 1. The fixed plate 17 is located above the worktable 2, and a material passage hole 171 communicating with the fixed hole 21 is opened through the fixed plate 17. The carrier can rotate to the position directly below the material passage hole 171 during the rotation of the worktable 2. The push plate 62 is rotatably connected to the upper surface of the fixed plate 17. The third rotating component 68 is specifically a motor and is installed on the upper surface at the center position of the fixed plate 17. The drive end of the third rotating component 68 is fixedly connected to the push plate 62 so that the push plate 62 rotates around the fixed plate 17. The storage frame 65 is fixedly connected to the upper surface of the fixed plate 17, and both the storage frame 65 and the material passage hole 171 are located on the rotation path of the push plate 62. A through hole 651 for a single carrier or the push plate 62 to pass through is opened on the side wall near the bottom of the storage frame 65.

[0061] Reference Figure 6 and Figure 7 The top of the ring plate 66 is integrally formed with a docking block 661. Each fixing hole 21 has a pressure sensor 34 installed on its inner top wall. The pressure sensor 34 is located directly above the corresponding docking block 661. The pressure sensor 34 and the third rotating component 68 are electrically connected to the controller 3. When the ring plate 66 moves upward, the docking block 661 presses against the pressure sensor 34. The controller 3 receives and determines the change in pressure data of the pressure sensor 34. After receiving the above change for a specified time (the specified time is the time taken for the docking block 661 to press against the pressure sensor 34 until the clamping plate 221 resets and turns to the vertical state), the controller 3 starts the third rotating component 68 so that the pusher plate 62 pushes the carrier at the bottom of the storage frame 65 to the material passage hole 171, so that the carrier passes through the material passage hole 171 and the fixing hole 21 under its own weight and is inserted between the clamping plate 221 to realize material replacement.

[0062] The implementation principle of the automated coating solder machine disclosed in Embodiment 3 of this application is as follows: After the carrier that has completed the entire coating operation is rotated to the fifth space 15 along with the worktable 2, the fourth lifting component 7 is activated to drive the top material rod 69 to move upward and push the ring plate 66. The ring plate 66 squeezes the clamping plate 221, so that the clamping plate 221 rotates. The carrier in the middle of the clamping plate 221 falls and detaches from the clamping plate 221 under its own weight. When the ring plate 66 moves upward to the point that the docking block 661 presses against the pressure sensor 34, the second lifting component 142 drives the top material rod 69 to move downward. The clamping plate 221 and the ring plate 66 are reset under the action of the reset component 67. At this time, the controller 3 receives the pressure data detected by the sensor and, after a specified time, activates the third rotating component 68 to drive the pusher plate 62 to rotate, so that the carrier in the placement frame 65 is pushed into the fixing hole 21 to realize the material change.

[0063] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. An automated solder coating machine, characterized in that: It includes a workbench (2) and a solder bucket (4) for storing solder. The workbench (2) is provided with a clamping member (22) and a coating component (5). The clamping member (22) is used to clamp the carrier. The coating component (5) includes a first lifting member (51) for inserting the carrier into the solder bucket (4). The coating assembly (5) further includes an air blowing pipe (54) and a first sliding member (55). The air blowing pipe (54) is connected to an air pump (56). The air blowing pipe (54) is located above the solder barrel (4). A first space (11) is reserved between the air blowing pipe (54) and the solder barrel (4) for the carrier to pass through. The opening of the air blowing pipe (54) faces the first space (11). The first sliding member (55) is used to drive the air blowing pipe (54) to move back and forth. It also includes a frame (1), the workbench (2) is rotatably connected to the frame (1), the first space (11) is located on the rotation path of the workbench (2); the frame (1) is provided with a first space (11), a second space (12), a fourth space (14), a third space (13) and a fifth space (15) in sequence along the rotation direction of the workbench (2); The workbench (2) is also provided with a first sealing cover (121), a material receiving bucket (122), a first moving part (123) and a first blower (124). The first sealing cover (121) is located above the material receiving bucket (122). The first moving part (123) is used to drive the first sealing cover (121) and the material receiving bucket (122) to move towards each other or away from each other. The first blower (124) is located on top of the first sealing cover (121). A second space (12) is reserved between the first sealing cover (121) and the material receiving bucket (122) for the carrier to pass through. The air outlet of the first blower (124) faces the second space (12). The second space (12) is located on the rotation path of the workbench (2). The frame (1) is also provided with a second sealing cover (131) arranged symmetrically on the upper and lower sides, a second moving part (132) for driving the second sealing cover (131) to move towards each other or away from each other, and a second blower (133); a third space (13) for the carrier to pass through is reserved between the symmetrically arranged second sealing covers (131), the third space (13) is located on the rotation path of the workbench (2), the second blower (133) is set on the side wall of the lower second sealing cover (131), and the air outlet of the second blower (133) faces the third space (13); the solder in the carrier will move towards the top of the carrier under the action of airflow, so as to achieve uniform distribution of solder; The frame (1) is also provided with a cleaning tank (141) and a second lifting component (142). The second lifting component (142) is used to drive the cleaning tank (141) to move towards or away from the workbench (2). A fourth space (14) for the carrier to pass through is reserved between the cleaning tank (141) and the workbench (2). The fourth space (14) is located on the rotation path of the workbench (2). A spray assembly (143) is provided inside the cleaning tank (141). The spray assembly (143) is used to spray the peripheral wall and bottom wall of the carrier entering the fourth space (14) to achieve cleaning of the peripheral wall of the carrier and dilution of the core solder of the carrier.

2. The automated solder coating machine according to claim 1, characterized in that: The coating assembly (5) includes a docking bucket (52) and a first rotating component (53). The solder bucket (4) is inserted into the docking bucket (52). The first rotating component (53) is used to drive the solder bucket (4) to rotate. The first lifting component (51) is used to drive the docking bucket (52) to move towards or away from the carrier.

3. The automated solder coating machine according to claim 1, characterized in that: The frame (1) is provided with a second rotating component (31), a trigger switch (32) and a controller (3). The trigger switch (32) and the second rotating component (31) are both electrically connected to the controller (3). The controller (3) is used to receive the trigger signal from the trigger switch (32) and control the second rotating component (31) to drive the worktable (2) to rotate. There are several clamping components (22), which are distributed on the worktable (2) around the circumference of the worktable (2).

4. The automated solder coating machine according to claim 3, characterized in that: The workbench (2) has several fixing holes (21) through it. The fixing holes (21) are arranged one-to-one with the clamping parts (22). Each clamping part (22) includes at least two clamping plates (221). The clamping plates (221) are located below the workbench (2). The top of the clamping plate (221) is connected to the inner wall of the corresponding fixing hole (21). The other end is provided with a protrusion for fitting with the bottom end of the carrier. The workbench (2) is provided with a material changing assembly (6). The material changing assembly (6) is used to change the carrier between the clamping plates (221).

5. The automated solder coating machine according to claim 4, characterized in that: The material changing assembly (6) includes a push plate (61), a pusher plate (62), a second sliding member (63), a third lifting member (64), and a storage frame (65). The push plate (61) is located below the workbench (2). The third lifting member (64) is used to drive the push plate (61) through the fixing hole (21). The storage frame (65) has carriers to be coated stacked sequentially along its height direction. The side wall at the bottom of the storage frame (65) has a through hole (651) for a single carrier or pusher plate (62) to pass through. The second sliding member (63) is used to drive the pusher plate (62) to slide and pass through the through hole (651).

6. The automated solder coating machine according to claim 4, characterized in that: The clamping plate (221) is rotatably connected to the inner wall of the fixing hole (21); the material changing assembly (6) includes a ring plate (66), a reset component (67), a storage frame (65), a pusher plate (62), a third rotating component (68), a top material rod (69), and a fourth lifting component (7); the ring plate (66) is provided in a one-to-one correspondence with the fixing hole (21), the ring plate (66) slides along the depth direction of the fixing hole (21) and is connected to the inner wall of the corresponding fixing hole (21), and the side wall of the clamping plate (221) is provided with a clearance slope (222) that fits against the side wall of the ring plate (66); The top material rod (69) is located below the workbench (2). The fourth lifting component (7) is used to drive the top material rod (69) to rise and push the ring plate (66). The reset component (67) is used to drive the ring plate (66) to move and reset and drive the clamping plate (221) to rotate and reset. The storage frame (65) is stacked with carriers to be coated in sequence along its height direction. The side wall at the bottom of the storage frame (65) is provided with a through hole (651) for a single carrier or push plate (62) to pass through. The third rotating component (68) is used to drive the push plate (62) to rotate and pass through the through hole (651).

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