Low-temperature bonding clamp

Abstract

The utility model relates to the technical field of low-temperature bonding clamping, and discloses a low-temperature bonding clamp which comprises a supporting seat, a lower clamp is fixedly connected to the left side of the top of the supporting seat, an upper clamp is arranged at the top of the lower clamp, and buffer mechanisms are arranged on the surfaces of the upper clamp and the lower clamp. And a clamping mechanism is arranged on the right sides of the lower clamp and the upper clamp. According to the low-temperature bonding clamp, a silicon wafer is clamped and attached electrically instead of manually through the arranged clamping mechanism, an electric clamping and attaching system has high repeatability, and parameters of each operation can be kept consistent. The bonding quality of each silicon wafer can be well controlled in batch production, the consistency and the stability of products are higher, the buffer mechanism is arranged, a connecting plate slides downwards on the surface of a fixing rod, a spring can be extruded, a buffer force is provided for the spring, and the bonding quality of the silicon wafers is improved. The damage to the silicon wafer caused by the direct downward impact force of the upper clamp is avoided, and the silicon wafer is protected.

Description

TECHNICAL FIELD

[0001] The utility model relates to low temperature bonding clamping technical field, concretely to a low temperature bonding fixture. BACKGROUND

[0002] Low temperature bonding is a kind of technology that realizes the connection of material or device at lower temperature, mainly relies on the mechanical interlocking, van der waals force or hydrogen bond force of material surface to realize connection. For example, in some silicon wafer bonding, when the surface of silicon wafer is treated to be very smooth, at low temperature, the molecules between silicon wafers will be attracted to each other due to van der waals force, so that the silicon wafers are connected together.

[0003] At present, during the process of low temperature bonding of silicon wafer, mainly rely on manual bonding of two silicon wafers, manual operation, due to the unevenness of human force, it is easy to cause the pressure of some areas of silicon wafer to be too large, and the pressure of some areas to be insufficient, which affects the bonding quality. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of low temperature bonding fixture to solve the problems raised in the above background.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of low temperature bonding fixture, including support seat, the lower clamp is fixedly connected in the left side of the top of support seat, the upper clamp is provided in the top of lower clamp, the surface of upper clamp and lower clamp is provided with buffer mechanism, the right side of lower clamp and upper clamp is provided with clamping mechanism.

[0006] The clamping mechanism includes connecting plate, the connecting plate is fixedly connected to the surface of upper clamp on both sides, the sliding plate is fixedly connected to the right side of connecting plate, the screw rod is screw-connected in the both sides in sliding plate, the screw rod is rotatably connected to the top of support seat, the support frame is rotatably connected to the top of screw rod, and the support frame is fixedly connected to the top of support seat.

[0007] Preferably, the bottom of screw rod is fixedly connected with second flat gear, the surface of two second flat gears is engaged with first flat gear, the inner ring of first flat gear is fixedly connected with output shaft, and the top of output shaft is fixedly connected with motor. Under the cooperation of first flat gear and second flat gear, the screw rods on both sides can be rotated synchronously.

[0008] Preferably, the top of motor is fixedly connected with fixed frame, the fixed frame is rotatably connected to the surface of screw rod, the fixed frame is fixedly connected to the top of support seat, and the fixed frame can support screw rod to avoid the inclination of screw rod during rotation.

[0009] Preferably, the left side of the connecting plate is fixedly connected with a support, the support is fixedly connected with a telescopic rod, and the telescopic rod is fixedly connected to the top left side of the support base.

[0010] Preferably, the buffer mechanism comprises a fixed rod, the fixed rod is slidably connected in the connecting plate, the fixed rod is fixedly connected to the top of the support base, a spring is sleeved on the surface of the fixed rod, and the spring is arranged at the bottom of the connecting plate.

[0011] Preferably, the top of the fixed rod is fixedly connected with a fixed plate, the surface of the fixed plate is fixedly connected with a vertical plate, and the vertical plate is fixedly connected to the top of the support base.

[0012] Compared with the prior art, the low-temperature bonding clamp has the following beneficial effects:

[0013] 1. The low-temperature bonding clamp, through the clamping mechanism, the silicon wafer is clamped and attached by electricity instead of manually, and the electric clamping and attaching system has high repeatability, and the parameters of each operation can be kept consistent. This means that in batch production, the bonding quality of each silicon wafer can be well controlled, and the consistency and stability of the product are higher.

[0014] 2. The low-temperature bonding clamp, through the buffer mechanism, the connecting plate slides downward on the surface of the fixed rod, can extrude the spring, provide a buffering force, avoid the damage of the silicon wafer caused by the direct downward impact force of the upper clamp, and protect the silicon wafer. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the drawings needed to be used in the embodiment description will be simply introduced below, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without creative labor:

[0016] Figure 1 It is the overall schematic view of the utility model structure;

[0017] Figure 2 It is the partial structure schematic view of the utility model;

[0018] Figure 3 It is the clamping mechanism schematic view of the utility model;

[0019] Figure 4The utility model discloses a buffer mechanism schematic view.

[0020] In the drawing: 1, support seat, 2, clamping mechanism, 21, support piece, 22, telescopic link, 23, sliding plate, 24, connecting plate, 25, threaded rod, 26, support frame, 27, fixed frame, 28, first flat gear, 29, motor, 201, second flat gear, 3, buffer mechanism, 31, vertical board, 32, spring, 33, fixed rod, 34, fixed plate, 4, upper clamp, 5, lower clamp. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be apparently and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor belong to the protection scope of the utility model.

[0022] The utility model provides a technical scheme:

[0023] Embodiment one:

[0024] Combined Figures 1-2 To Figure 3 A low-temperature bonding clamp, including support seat 1, support seat 1 top left side fixedly connected with lower clamp 5, and lower clamp 5 top is provided with upper clamp 4, and the surface of upper clamp 4 and lower clamp 5 is provided with buffer mechanism 3, and lower clamp 5 and upper clamp 4 right side are provided with clamping mechanism 2.

[0025] Clamping mechanism 2 includes connecting plate 24, and connecting plate 24 is fixedly connected to the surface both sides of upper clamp 4, and connecting plate 24 right side is fixedly connected with sliding plate 23, and the both sides in sliding plate 23 are screw-connected with threaded rod 25, and threaded rod 25 is rotatably connected to the top of support seat 1, and the top of threaded rod 25 is rotatably connected with support frame 26, and support frame 26 is fixedly connected to the top of support seat 1.

[0026] Further, the bottom of threaded rod 25 is fixedly connected with second flat gear 201, and the surface of two second flat gears 201 is engaged with first flat gear 28, and the inner ring of first flat gear 28 is fixedly connected with output shaft, and the top of output shaft is fixedly connected with motor 29, and under the cooperation of first flat gear 28 and second flat gear 201, the threaded rod 25 on both sides can rotate synchronously.

[0027] Further, the top of motor 29 is fixedly connected with fixed frame 27, and fixed frame 27 is rotatably connected to the surface of threaded rod 25, and fixed frame 27 is fixedly connected to the top of support seat 1, and by the setting of fixed frame 27, threaded rod 25 can be supported, and the inclination phenomenon of threaded rod 25 in the process of rotating is avoided.

[0028] Further, the left side of the connecting plate 24 is fixedly connected with a support 21, the support 21 is fixedly connected with a telescopic rod 22, the telescopic rod 22 is fixedly connected to the top left side of the support base 1, and the telescopic rod 22 is arranged to support the connecting plate 24.

[0029] Example two:

[0030] Referring to Figure 4 , and on the basis of example one, the buffer mechanism 3 further comprises a fixed rod 33, the fixed rod 33 is slidingly connected in the connecting plate 24, the fixed rod 33 is fixedly connected to the top of the support base 1, the surface of the fixed rod 33 is sleeved with a spring 32, the spring 32 is arranged at the bottom of the connecting plate 24, the connecting plate 24 slides downward on the surface of the fixed rod 33, can extrude the spring 32, so as to provide a buffering force, avoid the damage of the silicon wafer caused by the direct downward impact force of the upper clamp 4, and play a protective role on the silicon wafer.

[0031] Further, the top of the fixed rod 33 is fixedly connected with a fixed plate 34, the surface of the fixed plate 34 is fixedly connected with a vertical plate 31, and the vertical plate 31 is fixedly connected to the top of the support base 1.

[0032] In actual operation, when the device is used, first, two silicon wafers are placed between the upper clamp 4 and the lower clamp 5, and the motor 29 is started, the motor 29 can drive the first flat gear 28 and the second flat gear 201 to rotate synchronously, at this time, the threaded rods 25 on both sides rotate synchronously, in the process of rotating the threaded rods 25, the upper clamp 4 can be driven to move downward, at this time, the upper clamp 4 and the lower clamp 5 are in close contact, which can realize the purpose of bonding two silicon wafers, so as to realize the low-temperature bonding process, and the electric drive is used instead of manual clamping and bonding of the silicon wafer, the electric clamping and bonding system has high repeatability, and the parameters of each operation can be kept consistent. This means that in batch production, the bonding quality of each silicon wafer can be well controlled, and the consistency and stability of the product are higher.

[0033] In the process of moving the upper clamp 4 downward, at this time, the connecting plate 24 slides downward on the surface of the fixed rod 33, which can extrude the spring 32, so as to provide a buffering force, avoid the damage of the silicon wafer caused by the direct downward impact force of the upper clamp 4, and play a protective role on the silicon wafer.

[0034] It is to be noted that, as used in this specification and the appended claims, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. Thus, for example, reference to "a component" can include a combination of two or more components. Additionally, the terms "comprise," "comprises," and "comprising," or any variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. Furthermore, unless otherwise indicated herein, the terms "first," "second," "third," etc., are used herein merely as labels, and are not intended to impose ordinal import.

Claims

1. Cryogenic bonding clamp comprising a support seat (1), characterized in that: The support seat (1) top left side is fixedly connected with a lower clamp (5), the lower clamp (5) top is provided with an upper clamp (4), the upper clamp (4) and the lower clamp (5) surface is provided with a buffer mechanism (3), the lower clamp (5) and the upper clamp (4) right side is provided with a clamping mechanism (2); The clamping mechanism (2) includes a connecting plate (24), the connecting plate (24) is fixedly connected to both sides of the surface of the upper clamp (4), the connecting plate (24) right side is fixedly connected with a sliding plate (23), the sliding plate (23) is screw connected with a threaded rod (25) on both sides, the threaded rod (25) is rotatably connected to the top of the support seat (1), the threaded rod (25) top is rotatably connected with a support frame (26), the support frame (26) is fixedly connected to the top of the support seat (1).

2. A cryogenic bonding clamp according to claim 1, wherein: Two threaded rods (25) bottom are fixedly connected with a second flat gear (201), two second flat gears (201) surface is engaged with a first flat gear (28), the first flat gear (28) inner ring is fixedly connected with an output shaft, the output shaft top is fixedly connected with a motor (29).

3. A cryogenic bonding clamp according to claim 2, wherein: The motor (29) top is fixedly connected with a fixed frame (27), the fixed frame (27) is rotatably connected to the surface of the threaded rod (25), and the fixed frame (27) is fixedly connected to the top of the support seat (1).

4. The cryogenic bonding clamp of claim 1, wherein: The connecting plate (24) left side is fixedly connected with a support (21), the support (21) is fixedly connected with a telescopic rod (22), the telescopic rod (22) is fixedly connected to the left side of the top of the support seat (1).

5. The cryogenic bonding clamp of claim 1, wherein: The buffer mechanism (3) includes a fixed rod (33), the fixed rod (33) is slidably connected in the connecting plate (24), the fixed rod (33) is fixedly connected to the top of the support seat (1), the fixed rod (33) surface is sleeved with a spring (32), the spring (32) is arranged at the bottom of the connecting plate (24).

6. A cryogenic bonding clamp according to claim 5, wherein: The fixed rod (33) top is fixedly connected with a fixed plate (34), the fixed plate (34) surface is fixedly connected with a vertical plate (31), the vertical plate (31) is fixedly connected to the top of the support seat (1).

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