Wafer butt joint detection equipment

Abstract

The utility model relates to the technical field of semiconductor processing, and specifically discloses wafer butt joint detection equipment. The equipment comprises a wafer ring cutting machine table and a wafer detection machine table, the wafer ring cutting machine table comprises a butt joint positioning plate, and the butt joint positioning plate is provided with two insertion holes and at least two butt joint positioning pieces; the wafer detection machine table comprises a detection machine table main body, a locking unit, a fixed side plate and two alignment pins, the fixed side plate is detachably and movably connected with the detection machine table main body through the locking unit, the fixed side plate is selectively locked on the detection machine table main body through the locking unit, and the fixed side plate is detachably connected to the butt joint positioning plate; butt-joint positioning holes and two through holes are formed in the fixed side plate, the butt-joint positioning holes and the butt-joint positioning pieces are the same in number and are in one-to-one correspondence, the butt-joint positioning holes and the butt-joint positioning pieces are in clearance fit, and the alignment pins can penetrate through the through holes and are inserted into the insertion holes. The equipment is used for realizing firm butt joint of a wafer ring cutting machine table and a wafer detection machine table, and the alignment precision and the sealing performance are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor processing, especially to wafer butt joint detection equipment. BACKGROUND

[0002] Wafer refers to the silicon chip used for integrated circuit manufacturing, and the wafer is a carrier used for producing integrated circuits. In general, the wafer refers to a single crystal silicon wafer. This material is the basis for integrated circuit production. Through precise processes, various circuit elements are constructed on the wafer surface to form integrated circuits with specific electrical properties. After these circuit elements are completed, the wafer needs to be divided into independent chips.

[0003] With the advancement of technology, the size of the wafer is continuously increasing, while the thickness and chip size are gradually decreasing, which makes the wafer cutting technology face higher challenges. During the cutting process, accurate control of the cutting depth and cutting surface morphology is crucial, as improper parameter settings can cause abnormal electrical performance or physical damage to the product.

[0004] Therefore, after the wafer is cut, it is necessary to detect whether the cutting parameters of the wafer are qualified.

[0005] Currently, wafer detection equipment is generally used to detect the wafer cut by the wafer ring cutting equipment. During detection, the wafer ring cutting machine needs to be fixed first, then the wafer ring cutting machine is adjusted to be level, then the wafer detection machine is moved close to the wafer ring cutting machine, and finally the wafer detection machine is adjusted to be level. The wafer ring cutting machine and the wafer detection machine are connected in a close manner.

[0006] The wafer ring cutting machine and the wafer detection machine are connected in a gradually close manner, which has the following three disadvantages:

[0007] 1) The wafer ring cutting machine and the wafer detection machine are not fixed firmly.

[0008] 2) The butt joint position of the wafer ring cutting machine and the wafer detection machine is uncertain, and the point of the mechanical hand in the wafer ring cutting machine needs to be adjusted every time.

[0009] To solve the above problems, a high-precision butt joint detection equipment is needed to measure the wafer cutting depth and wafer cutting width after wafer ring cutting, in order to achieve faster and more accurate cutting quality evaluation. UTILITY MODEL CONTENTS

[0010] The utility model aims to provide wafer butt joint detection equipment to achieve firm butt joint of the wafer ring cutting machine and the wafer detection machine, and improve the alignment accuracy and sealing performance.

[0011] To achieve this purpose, the utility model adopts the following technical solutions:

[0012] The wafer butt joint detection device comprises a wafer ring cutting machine and a wafer detection machine; the wafer ring cutting machine comprises a butt joint positioning plate, the butt joint positioning plate has two insertion holes and at least two butt joint positioning members; the wafer detection machine comprises a detection machine body, a locking unit, a fixed side plate and two alignment pins, the fixed side plate is detachably and movably connected to the detection machine body through the locking unit, so that the fixed side plate can move in a vertical plane relative to the detection machine body, and the fixed side plate is selectively locked to the detection machine body through the locking unit, the fixed side plate is detachably connected to the butt joint positioning plate, the fixed side plate is provided with a butt joint positioning hole and two through holes, the butt joint positioning hole is the same in number as the butt joint positioning members and one-to-one corresponding, and the butt joint positioning hole and the butt joint positioning member are clearance fitted, and the alignment pins are one-to-one corresponding to the insertion holes and can pass through the through holes and be inserted into the insertion holes.

[0013] As an optional technical solution of the wafer butt joint detection device, the butt joint positioning hole is an elongated hole extending in the vertical direction.

[0014] As an optional technical solution of the wafer butt joint detection device, the locking unit comprises a plurality of first bolts, the detection machine body comprises at least two fixed vertical plates, the fixed vertical plates are provided with adjustment holes, the adjustment holes are the same in number as the first bolts and one-to-one corresponding, the screw rods of the first bolts pass through the adjustment holes and are screwed to the fixed side plate, the screw heads of the first bolts can press the side surface of the fixed vertical plate, and the screw rods of the first bolts are clearance fitted with the adjustment holes.

[0015] As an optional technical solution of the wafer butt joint detection device, the fixed vertical plate is provided with two fixed vertical plates, and the two fixed vertical plates are respectively used for connecting two ends of one side of the fixed side plate.

[0016] As an optional technical solution of the wafer butt joint detection device, the fixed vertical plate is provided with at least two adjustment holes, and all the adjustment holes on the fixed vertical plate are uniformly distributed in the vertical direction.

[0017] As an optional technical solution of the wafer butt joint detection device, the adjustment hole is an elongated hole extending in the vertical direction.

[0018] As an optional technical solution of the wafer butt joint detection device, the fixed side plate extends in the vertical direction, one side of the fixed side plate can be attached to the butt joint positioning plate, and the other side is connected to the fixed vertical plate.

[0019] As an optional technical scheme of the wafer butt joint detection equipment, the wafer detection machine comprises at least two second bolts, the second bolts are used to lock and connect the fixed side plate and the butt joint positioning plate, the fixed side plate penetrates a fixed hole, the fixed hole is the same as the number of the second bolts and one-to-one correspondence, the butt joint positioning plate is provided with a locking hole, the locking hole is the same as the number of the second bolts and one-to-one correspondence, and the second bolt can pass through the fixed hole and be locked and connected in the locking hole.

[0020] As an optional technical scheme of the wafer butt joint detection equipment, the butt joint positioning hole is directly arranged on the fixed side plate.

[0021] As an optional technical scheme of the wafer butt joint detection equipment, the fixed side plate is fixedly connected with a clamp bushing, and the butt joint positioning hole is arranged on the clamp bushing.

[0022] The wafer butt joint detection equipment has the following beneficial effects:

[0023] The wafer butt joint detection equipment is provided with the butt joint positioning plate and the wafer detection machine, so that the butt joint positioning piece can be accurately aligned with the butt joint positioning hole, the wafer ring cutting machine and the wafer detection machine are firmly butt jointed and positioned, and the butt joint precision and the sealing performance are improved. The fixed side plate can be limited to move in the vertical plane relative to the detection machine body, the adjustability of the fixed side plate in the vertical plane is realized, the relative position between the wafer detection machine and the wafer ring cutting machine can be finely adjusted, the feasibility of aligning the butt joint positioning piece with the butt joint positioning hole is ensured, the wafer butt joint detection equipment can adapt to different scenes and conditions, the relative position of the fixed side plate and the wafer ring cutting machine can be determined in time after the position is found by selectively locking the fixed side plate on the detection machine body through the locking unit. The fixed side plate is detachably connected to the detection machine body through the locking unit, so that the fixed side plate and the detection machine body are convenient to disassemble and assemble, the butt joint is avoided during the reinstallation of the detection machine body, and the operation efficiency of the wafer butt joint detection equipment is greatly improved. With the help of the two alignment pins, the two plug-in holes on the butt joint positioning plate and the two through holes on the fixed side plate, the fixed side plate and the butt joint positioning plate are quickly connected and positioned, the stable connection between the wafer detection machine and the butt joint positioning plate is ensured, the shaking and deviation during the butt joint process are avoided, and the relative position of the butt joint positioning piece and the butt joint positioning hole is determined, so that the process of the butt joint operation is simplified, and the accuracy of the butt joint operation is improved. Meanwhile, the fixed side plate and the detection machine body are detachably connected through the locking unit, the detection machine body is convenient to disassemble and assemble, and the maintenance efficiency of the wafer detection machine is improved. The above design makes the wafer butt joint detection equipment have the characteristics of high efficiency, precision, stability and flexibility, improves the stability and safety, helps to improve the detection efficiency and accuracy of the wafer detection, and provides strong technical support for the wafer detection work. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 is a structure schematic view of a wafer butt joint detection equipment provided by an embodiment of the present application;

[0025] Figure 2 is a shaft side view of a wafer detection machine provided by an embodiment of the present application;

[0026] Figure 3 is a structure schematic view of a detection platform provided by an embodiment of the present application;

[0027] Figure 4 is a structure schematic view of an alignment assembly provided by an embodiment of the present application;

[0028] Figure 5 is a structure schematic view of a wafer ring cutting machine provided by an embodiment of the present application;

[0029] Figure 6 is a structure schematic view of a fixed bottom plate, an alignment assembly and a butt joint positioning plate assembled together provided by an embodiment of the present application.

[0030] In the drawings:

[0031] 1, wafer ring cutting machine; 11, ring cutting machine main body; 12, butt joint positioning plate; 13, butt joint positioning piece;

[0032] 2, wafer detection machine; 21, FFU assembly; 22, static eliminator assembly; 23, detection platform; 24, lower frame; 231, alignment assembly; 2311, fixed vertical plate; 2312, clamp bushing; 2313, fixed side plate; 2314, alignment pin; 232, line scanning assembly; 233, wafer in-place assembly; 234, wafer Notch detection assembly; 235, camera assembly; 236, wafer bearing assembly; 237, fixed bottom plate. DETAILED DESCRIPTION

[0033] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0034] In the description of the utility model, it is necessary to explain, the term "center", "upper", "lower", "left", "right", "vertical", "horizontal", "internal", "external" and so on indicate the orientation or positional relationship is based on the orientation or positional relationship shown in the drawing, only for the convenience of describing the utility model and simplifying the description, and not indicate or imply that the device or element indicated must have a particular orientation, construct and operate in a particular orientation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first", "second", are only for the purpose of description, and cannot be understood as indicating or implying relative importance. Among them, the terms "first position" and "second position" are two different positions, and, the first feature is "above", "above" and "above" the second feature, including the first feature is directly above and obliquely above the second feature, or just indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature is "below", "below" and "below" the second feature, including the first feature is directly below and obliquely below the second feature, or just indicates that the horizontal height of the first feature is less than that of the second feature.

[0035] In the description of the utility model, it is necessary to explain, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixed connection, can also be detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the communication between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0036] The embodiments of the utility model are described in detail below, the examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals represent the same or similar elements or elements with the same or similar function throughout. The embodiments described below by referring to the drawings are exemplary, only for explaining the utility model, and cannot be understood as a limitation on the utility model.

[0037] As Figures 1 to 6As shown, the embodiment provides a wafer butt joint detection device, which comprises a wafer ring cutting machine 1 and a wafer detection machine 2; the wafer ring cutting machine 1 comprises a butt joint positioning plate 12, the butt joint positioning plate 12 has two plug-in holes and at least two butt joint positioning members 13; the wafer detection machine 2 comprises a detection machine main body, a locking unit, a fixed side plate 2313 and two alignment pins 2314, the fixed side plate 2313 is detachably connected to the detection machine main body through the locking unit, so that the fixed side plate 2313 can move in the vertical plane relative to the detection machine main body, and the fixed side plate 2313 is selectively locked to the detection machine main body through the locking unit, the fixed side plate 2313 is detachably connected to the butt joint positioning plate 12, the fixed side plate 2313 is provided with a butt joint positioning hole and two through holes, the butt joint positioning hole and the butt joint positioning member 13 are the same in number and one-to-one correspondence, and the butt joint positioning hole and the butt joint positioning member 13 are in clearance fit, and the alignment pin 2314 is one-to-one corresponding with the plug-in hole and can pass through the through hole and be plugged into the plug-in hole.

[0038] The wafer butt joint detection device is provided with the butt joint positioning plate 12 and the wafer detection machine 2, so that the butt joint positioning member 13 can be accurately positioned with the butt joint positioning hole, the firm butt joint and positioning of the wafer ring cutting machine 1 and the wafer detection machine 2 are realized, and the butt joint precision and sealing performance are improved.

[0039] The limitation that the fixed side plate 2313 can move in the vertical plane relative to the detection machine main body realizes the adjustability of the fixed side plate 2313 in the vertical plane, so that the relative position between the wafer detection machine 2 and the wafer ring cutting machine 1 can be finely adjusted, thereby ensuring the feasibility of aligning the butt joint positioning member 13 with the butt joint positioning hole, so that the wafer butt joint detection device can adapt to different scenes and conditions; in combination with the limitation that the fixed side plate 2313 is selectively locked to the detection machine main body through the locking unit, the relative position of the fixed side plate 2313 and the wafer ring cutting machine 1 can be determined in time after the position is found.

[0040] The limitation that the fixed side plate 2313 is detachably connected to the detection machine main body through the locking unit facilitates the disassembly and assembly of the fixed side plate 2313 and the detection machine main body, avoids re-butting when reinstalling the detection machine main body, and greatly improves the operation efficiency of the wafer butt joint detection device.

[0041] With the settings of the two alignment pins 2314, the two plug-in holes on the butt joint positioning plate 12 and the two through holes on the fixed side plate 2313, the quick connection and positioning of the fixed side plate 2313 and the butt joint positioning plate 12 are realized, the stable connection between the wafer detection machine 2 and the butt joint positioning plate 12 is ensured, the shaking and deviation in the butt joint process are avoided, and at the same time, the relative position of the butt joint positioning member 13 and the butt joint positioning hole is determined, thereby simplifying the process of butt joint operation and improving the accuracy of butt joint operation.

[0042] Meanwhile, the fixed side plate 2313 is detachably connected with the detection machine main body through the locking unit, facilitating the disassembly of the detection machine main body, and helping to improve the maintenance efficiency of the wafer detection machine 2.

[0043] The above design makes the wafer butt joint detection equipment have the characteristics of high efficiency, precision, stability and flexibility, improves the stability and safety, helps to improve the detection efficiency and accuracy of wafer detection, and provides strong technical support for wafer detection work.

[0044] In the embodiment, the butt joint positioning hole is an elongated hole and extends in the vertical direction.

[0045] The butt joint positioning hole is designed as an elongated hole and extends in the vertical direction, realizing the position adjustment of the fixed side plate 2313 in the vertical direction, making the fixed side plate 2313 have greater flexibility when adjusting, so that the fixed side plate 2313 can adapt to different wafer ring cutting machines 1, improving the adaptability and flexibility of the wafer butt joint detection equipment. Meanwhile, the above design facilitates the adjustment of the position of the fixed side plate 2313, so that it is accurately butt jointed with the butt joint positioning piece 13. Specifically, the butt joint positioning piece 13 is a butt joint positioning pin.

[0046] Exemplarily, the locking unit includes a plurality of first bolts, the detection machine main body includes at least two fixed vertical plates 2311, the fixed vertical plate 2311 penetrates the adjustment hole, the number of adjustment holes is the same as that of the first bolts and one-to-one correspondence, the screw rod of the first bolt passes through the adjustment hole and is screwed to the fixed side plate 2313, and the screw head of the first bolt can press the side surface of the fixed vertical plate 2311, and the screw rod of the first bolt and the adjustment hole are gap-fitted.

[0047] The design that the screw rod of the first bolt of the locking unit passes through the adjustment hole and is screwed to the fixed side plate 2313 makes the position of the fixed side plate 2313 adjustable, so as to firmly connect the fixed side plate 2313 with the detection machine main body, and realize the movement of the fixed side plate 2313 in the vertical plane and the accurate locking of the position through the gap-fitting of the screw rod of the first bolt and the adjustment hole. The above design makes the installation and adjustment of the fixed side plate 2313 more convenient, improves the operability and stability of the wafer butt joint detection equipment, so as to adapt to different detection requirements. Moreover, the means that the screw head of the first bolt presses the side surface of the fixed vertical plate 2311 facilitates the quick installation and disassembly of the wafer butt joint detection equipment, and thereby realizes the quick disassembly and locking between the fixed side plate 2313 and the detection machine main body, improving the convenience and stability of the wafer butt joint detection equipment.

[0048] Further, the fixed vertical plate 2311 is provided with two, and the two fixed vertical plates 2311 are respectively used for connecting two ends of one side of the fixed side plate 2313.

[0049] The two fixed vertical plates 2311 are arranged to connect the two ends of one side of the fixed side plate 2313, so that the fixed side plate 2313 is stably connected with the main body of the detection machine, the loosening or falling off in the detection process is avoided, the structural stability of the main body of the detection machine is enhanced, and the overall strength and safety of the wafer butt joint detection equipment are improved.

[0050] In this embodiment, at least two adjusting holes are arranged on the fixed vertical plate 2311, and all the adjusting holes on the fixed vertical plate 2311 are uniformly distributed along the vertical direction. Specifically, two adjusting holes are arranged on each fixed vertical plate 2311.

[0051] The plurality of adjusting holes arranged on the fixed vertical plate 2311 are uniformly distributed along the vertical direction, so that the position of the fixed side plate 2313 can be finely adjusted along the vertical direction, and the adjustment accuracy and convenience are improved.

[0052] Exemplarily, the adjusting hole is an elongated hole extending along the vertical direction.

[0053] By limiting the adjusting hole, the first bolt can move along the vertical direction during adjustment, so that the adjustment range of the first bolt is larger, the butt joint operation of the operator is more convenient, more application scenarios and requirements are adapted, and the adjustability of the wafer butt joint detection equipment is improved.

[0054] In this embodiment, the fixed side plate 2313 extends along the vertical direction, one side of the fixed side plate 2313 is in contact with the butt joint positioning plate 12, and the other side is connected with the fixed vertical plate 2311.

[0055] By limiting the fixed side plate 2313, the arrangement of the fixed side plate 2313 in space is determined, which extends along the vertical direction and forms a stable structure with the butt joint positioning plate 12 and the fixed vertical plate 2311. The design that one side of the fixed side plate 2313 is in contact with the butt joint positioning plate 12 and the other side is in contact with the fixed vertical plate 2311 makes the whole structure more stable, reduces the difficulty of butt joint operation, reduces the shaking and deviation of the wafer butt joint detection equipment during work, further improves the detection accuracy and work efficiency, helps to simplify the butt joint process, and improves the safety of the wafer butt joint detection equipment and the convenience of the operator.

[0056] Exemplarily, the wafer detection machine 2 includes at least two second bolts for locking the fixed side plate 2313 and the butt joint positioning plate 12. The fixed side plate 2313 penetrates a fixing hole, the number of the fixing hole is the same as that of the second bolt and one-to-one correspondence, the butt joint positioning plate 12 is provided with a locking hole, the number of the locking hole is the same as that of the second bolt and one-to-one correspondence, and the second bolt can pass through the fixing hole and be locked in the locking hole.

[0057] The design of locking and connecting the fixed side plate 2313 and the butt joint positioning plate 12 through the second bolt realizes the quick disassembly and assembly between the wafer detection machine 2 and the butt joint positioning plate 12, facilitates the maintenance of the wafer butt joint detection equipment, and ensures the stability and reliability in the butt joint process. Meanwhile, the fixing holes on the fixed side plate 2313 and the locking holes on the butt joint positioning plate 12 correspond to each other one by one, so that the connection is more accurate and convenient.

[0058] In one embodiment of the present embodiment, the butt joint positioning hole is directly formed on the fixed side plate 2313. In another embodiment of the present embodiment, the fixed side plate 2313 is fixedly connected with a clamp bushing 2312, and the butt joint positioning hole is formed on the clamp bushing 2312. Specifically, the clamp bushing 2312 is a U-shaped bushing or a circular bushing.

[0059] By forming the butt joint positioning hole on the fixed side plate 2313 or arranging the clamp bushing 2312, the butt joint positioning is more accurate, thereby improving the butt joint accuracy and efficiency of the wafer butt joint detection equipment. Meanwhile, the above two methods also improve the adaptability and flexibility of the wafer butt joint detection equipment, adapt to different types of wafer detection requirements, and make the wafer butt joint detection equipment more easy to adjust and maintain.

[0060] In other embodiments of the present embodiment, the formation of the butt joint positioning hole on the fixed side plate 2313 is different from the above-mentioned scheme, and the specific formation scheme is determined by the workers in the field according to the engineering practice, and the determination method is the common knowledge in the field, which will not be described here. The above-mentioned scheme provides more choices for the formation of the butt joint positioning hole, which facilitates selection and adjustment according to actual needs.

[0061] In the present embodiment, the wafer ring cutting machine 1 further comprises a ring cutting machine body 11, the butt joint positioning plate 12 is screwed on the ring cutting machine body 11, and the butt joint positioning member 13 is screwed on the butt joint positioning plate 12. The detection machine body comprises a lower frame 24 and a FFU (Fan Filter Unit, air purification unit) assembly 21, an electrostatic eliminator assembly 22 and a detection platform 23 screwed on the lower frame 24. The FFU assembly 21 is used for filtering air. The electrostatic eliminator assembly 22 is used for eliminating static electricity. The detection platform 23 comprises a fixed bottom plate 237 and a positioning assembly 231, a line scanning assembly 232, a wafer in-position assembly 233, a wafer Notch detection assembly 234, a camera assembly 235 and a wafer bearing assembly 236 screwed on the fixed bottom plate 237. The line scanning assembly 232 is used for detecting the cutting depth of the wafer, and the camera assembly 235 is used for detecting the cutting width of the wafer.

[0062] The line scanning assembly 232, the wafer in-place assembly 233, the wafer Notch detection assembly 234, the camera assembly 235 and the wafer bearing assembly 236 are all conventional settings in the field, and their working principles and specific structures are well known to those skilled in the art, which will not be described here.

[0063] The fixed vertical plate 2311, the clamp bushing 2312, the fixed side plate 2313 and the alignment pin 2314 all belong to the alignment assembly 231. The clamp bushing 2312 is locked on the fixed side plate 2313 by screws. The fixed vertical plate 2311 is locked on the fixed bottom plate 237 by screws.

[0064] The wafer butt joint detection method provided by the embodiment is applied to the wafer butt joint detection device described above, and includes the following steps.

[0065] Step one: adjust the position of the wafer ring cutting machine 1 until the wafer ring cutting machine 1 is horizontal to the ground.

[0066] Step two: drive the wafer detection machine 2 to move towards the wafer ring cutting machine 1, so that each butt joint positioning hole corresponds to one butt joint positioning piece 13.

[0067] Step three: loosen the locking unit, so that the fixed side plate 2313 can move in the vertical plane relative to the detection machine body.

[0068] Step four: drive the wafer detection machine 2 to contact the wafer ring cutting machine 1, so that the butt joint positioning piece 13 passes through the butt joint positioning hole.

[0069] Step five: pass the alignment pin 2314 through the through hole and insert it into the insertion hole.

[0070] Step six: tighten the locking unit, so that the fixed side plate 2313 is locked on the detection machine body.

[0071] Step seven: connect the fixed side plate 2313 to the butt joint positioning plate 12.

[0072] Step eight: remove the alignment pin 2314.

[0073] The wafer butt joint detection method adjusts the position of the wafer ring cutting machine 1 and drives the wafer detection machine 2 to move, so that the butt joint positioning hole corresponds to the butt joint positioning piece 13, thereby realizing the precise butt joint between the wafer detection machine 2 and the wafer ring cutting machine 1, improving the detection efficiency and accuracy, and making the wafer butt joint detection equipment adapt to the use requirements in different scenes, improving the adaptability and flexibility of the wafer butt joint detection equipment. The loosening and tightening functions of the locking unit enable the fixed side plate 2313 to move and lock in the vertical plane, thereby realizing the precise butt joint and locking of the wafer detection machine 2 and the wafer ring cutting machine 1, completing the quick disassembly and assembly of the detection machine and the fixed side plate 2313, further enhancing the adjustability of the wafer butt joint detection equipment, simplifying the operation process, and making the butt joint process more convenient. By means of the plug-in alignment pin 2314, the position of the fixed side plate 2313 can be adjusted by the alignment pin 2314. After the two alignment pins 2314 are inserted into the butt joint positioning plate 12, the left and right positions of the fixed side plate 2313 are fixed, and the precise positioning of the butt joint positioning piece 13 and the butt joint positioning hole is completed. Through detailed step description, the standardization and standardization management of the wafer butt joint detection process is realized, and the reliability and stability of the wafer butt joint detection equipment are improved.

[0074] Further, after step eight, the following detailed steps are included: judging whether the wafer ring cutting machine 1 needs maintenance, if not, the wafer butt joint detection equipment is in normal operation, if yes, the locking unit is removed, the detection machine body is separated from the fixed side plate 2313, the detection machine body is removed, and the wafer ring cutting machine 1 is maintained; after the wafer ring cutting machine 1 is maintained, the detection machine body is moved back, and the detection machine body is locked on the fixed side plate 2313 by the locking unit; finally, the wafer butt joint detection equipment is in normal operation.

[0075] In the wafer butt joint detection method, a step of judging whether the wafer ring cutting machine 1 needs maintenance is added, and corresponding maintenance operation is performed, which improves the maintenance efficiency of the wafer butt joint detection equipment and ensures the long-term stable operation of the wafer butt joint detection equipment. At the same time, the disassembly and maintenance operation design of the detection machine optimizes the maintenance process of the wafer butt joint detection equipment, making the maintenance process more convenient and reducing the maintenance difficulty, which helps to improve the working stability of the wafer butt joint detection equipment, prolong the service life and reduce the operation cost. The above method ensures the normal maintenance of the wafer butt joint detection equipment through standardized wafer butt joint detection equipment maintenance operation, which helps to improve the detection efficiency and quality.

[0076] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the present application, and are not intended to limit the implementation modes of the present application. For those skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, it is not necessary and also impossible to exhaust all the implementation modes. Any modification, equivalent replacement and improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application claims.

Claims

1. A wafer docking detection apparatus, characterized by, The application relates to a wafer ring cutting machine (1) comprising a butt joint positioning plate (12) with two insertion holes and at least two butt joint positioning members (13); and a wafer detection machine (2) comprising a detection machine body, a locking unit, a fixed side plate (2313) and two alignment pins (2314), wherein the fixed side plate (2313) is detachably and movably connected to the detection machine body through the locking unit, the fixed side plate (2313) can move in a vertical plane relative to the detection machine body, the fixed side plate (2313) is selectively locked to the detection machine body through the locking unit, the fixed side plate (2313) is detachably connected to the butt joint positioning plate (12), the fixed side plate (2313) is provided with butt joint positioning holes and two through holes, the butt joint positioning holes are in one-to-one correspondence with the butt joint positioning members (13) and are in clearance fit with the butt joint positioning members (13), and the alignment pins (2314) are in one-to-one correspondence with the insertion holes and can pass through the through holes and be inserted into the insertion holes. The butt joint positioning holes are long holes and extend in a vertical direction. The locking unit comprises a plurality of first bolts, the detection machine body comprises at least two fixed vertical plates (2311), the fixed vertical plates (2311) are provided with adjustment holes, the adjustment holes are in one-to-one correspondence with the first bolts, the screw rods of the first bolts pass through the adjustment holes and are screwed to the fixed side plate (2313), the screw heads of the first bolts can press the side surface of the fixed vertical plate (2311), and the screw rods of the first bolts are in clearance fit with the adjustment holes.

2. The wafer docking detection apparatus of claim 1, wherein The fixed vertical plates (2311) are provided with two fixed vertical plates (2311) respectively used for connecting two ends of one side of the fixed side plate (2313).

3. The wafer docking detection apparatus of claim 1, wherein The fixed vertical plate (2311) is provided with at least two adjustment holes, and all the adjustment holes on the fixed vertical plate (2311) are uniformly distributed in a vertical direction.

4. The wafer docking detection apparatus of claim 3, wherein The adjustment holes are long holes and extend in a vertical direction.

5. The wafer docking detection apparatus of claim 3, wherein The fixed side plate (2313) extends in a vertical direction, one side of the fixed side plate (2313) can be attached to the butt joint positioning plate (12), and the other side is connected to the fixed vertical plate (2311).

6. The wafer docking detection apparatus of claim 3, wherein The wafer detection machine (2) comprises at least two second bolts used for locking the fixed side plate (2313) and the butt joint positioning plate (12), the fixed side plate (2313) is provided with a fixed hole, the fixed hole is in one-to-one correspondence with the second bolts, the butt joint positioning plate (12) is provided with a locking hole, the locking hole is in one-to-one correspondence with the second bolts, and the second bolts can pass through the fixed hole and be locked in the locking hole.

7. The wafer docking detection apparatus of claim 3, wherein The butt joint positioning holes are directly arranged on the fixed side plate (2313).

8. The wafer docking detection apparatus of claim 1, wherein, The fixed side plate (2313) is fixedly connected with a clamp bushing (2312), and the butt joint positioning holes are arranged on the clamp bushing (2312).

9. The wafer docking detection apparatus of any of claims 1-8, wherein, ​ 10. The wafer docking detection apparatus of any of claims 1-8, wherein, ​

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