Jacking mechanism and patch packaging equipment

Abstract

The utility model discloses a jacking mechanism and patch packaging equipment, and relates to the technical field of semiconductor equipment. The jacking mechanism comprises a shell, an ejector pin cap fixedly arranged at the top of the shell, a lifting table movably arranged in the shell and an ejector pin fixedly arranged on the lifting table, an airflow channel is formed in the shell, an adsorption hole is formed in the ejector pin cap and communicated with the vacuum mechanism through the airflow channel, and the ejector pin penetrates through the adsorption hole; wherein the blue film is arranged on the ejector pin cap, the adsorption hole adsorbs the blue film under the action of negative pressure provided by the vacuum mechanism, the lifting table moves relative to the shell, the ejector pin is driven to extend out of the ejector pin cap through the adsorption hole, the blue film is jacked up through the ejector pin so that a chip attached to the blue film can be separated from the blue film, and the top of the lifting table is provided with a limiting protrusion. The limiting protrusions are used for limiting movement of the lifting table relative to the shell. The jacking mechanism can solve the problem that an existing ejector pin stroke is too long, so that an ejector pin pierces a blue film, and ejector pin marks and cracks are left on the back face of a chip.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a lifting mechanism and a die bonding equipment. BACKGROUND

[0002] With the rapid development of the semiconductor industry, the die bonding equipment generally adopts the method of lifting the blue film by the ejector pin in the process of separating the chip from the blue film. The vacuum hole provided on the ejector pin cap adsorbs the blue film around the ejector pin, so as to achieve the effect of separating the chip from the blue film. Once the stroke of the ejector pin is too long, the ejector pin is very easy to pierce the blue film, resulting in the problem of the ejector pin mark and even the crack on the back of the chip. CONTENT OF THE UTILITY MODEL

[0003] The purpose of the present application is to provide a lifting mechanism and a die bonding equipment, which can solve the problem of the ejector pin mark and even the crack on the back of the chip caused by the too long stroke of the ejector pin.

[0004] The embodiment of the present application is implemented as follows:

[0005] In a first aspect, the present application provides a lifting mechanism, which comprises an outer shell, an ejector pin cap fixedly arranged on the top of the outer shell, a lifting platform movably arranged in the outer shell, and an ejector pin fixedly arranged on the lifting platform. An airflow channel is arranged in the outer shell. An adsorption hole is arranged on the ejector pin cap. The adsorption hole is communicated with a vacuum mechanism through the airflow channel. The ejector pin is arranged in the adsorption hole. A blue film is arranged on the ejector pin cap. The adsorption hole adsorbs the blue film under the action of the negative pressure provided by the vacuum mechanism. The lifting platform moves relative to the outer shell, drives the ejector pin to extend out of the ejector pin cap through the adsorption hole, and lifts the blue film through the ejector pin, so that a chip arranged on the blue film can be separated from the blue film. A limiting protrusion is arranged on the top of the lifting platform. The limiting protrusion is used for limiting the movement of the lifting platform relative to the outer shell. The lifting mechanism can solve the problem of the ejector pin mark and even the crack on the back of the chip caused by the too long stroke of the ejector pin.

[0006] As an implementable manner, when the number of the limiting protrusions is one, the limiting protrusion is located at the center position of the lifting platform.

[0007] As an implementable manner, when the number of the limiting protrusions is multiple, the multiple limiting protrusions are uniformly distributed along the lifting platform.

[0008] As an implementable manner, a fixing hole is arranged on the top of the lifting platform. An installation hole is arranged on the bottom of the ejector pin. A fastener is sequentially arranged in the fixing hole and the installation hole, so that the ejector pin is fixedly installed on the lifting platform.

[0009] As an implementable manner, a vacuum groove is arranged on the outer wall of the ejector pin, and the vacuum groove penetrates through the top and bottom of the ejector pin.

[0010] As an implementable manner, the mounting hole is located at the groove bottom of the vacuum groove, and the fastener is arranged in and fixed in the vacuum groove.

[0011] As an implementable manner, the number of the vacuum grooves is multiple, and the multiple vacuum grooves are uniformly distributed along the circumferential direction of the ejector pin.

[0012] As an implementable manner, the cross-sectional shape of the vacuum groove is one or a combination of multiple of circular arc shape, V shape and U shape.

[0013] As an implementable manner, the number of the ejector pins is multiple, and the multiple ejector pins are uniformly distributed along the top of the lifting platform.

[0014] The second aspect of the embodiment of the present application provides a patch packaging device, which comprises a machine table, a vacuum mechanism and a driving mechanism arranged on the machine table, and the lifting mechanism described above, the shell of the lifting mechanism is fixedly installed on the machine table, the airflow channel of the lifting mechanism is in communication with the vacuum mechanism, and the lifting platform of the lifting mechanism is in transmission connection with the driving mechanism. The lifting mechanism can solve the problem that the existing long stroke of the ejector pin causes the ejector pin to pierce the blue film and leave the ejector pin mark and cracks on the back of the chip.

[0015] The beneficial effects of the embodiment of the present application include:

[0016] The lifting mechanism comprises a shell, an ejector pin cap fixedly arranged on the top of the shell, a lifting platform movably arranged in the shell, and an ejector pin fixedly arranged on the lifting platform. An airflow channel is arranged in the shell, an adsorption hole is arranged on the ejector pin cap, the adsorption hole is in communication with the vacuum mechanism through the airflow channel, and the ejector pin is arranged in the adsorption hole; wherein the blue film is arranged on the ejector pin cap, the adsorption hole adsorbs the blue film under the action of the negative pressure provided by the vacuum mechanism, the lifting platform moves relative to the shell, drives the ejector pin to extend out of the ejector pin cap through the adsorption hole, and lifts the blue film through the ejector pin, so that the chip arranged on the blue film can be separated from the blue film. A limiting protrusion is arranged on the top of the lifting platform, and the limiting protrusion is used for limiting the movement of the lifting platform relative to the shell. Compared with the prior art, the lifting mechanism provided by the present application can more stably and accurately realize the separation of the chip and the blue film by combining the adsorption of the blue film through the adsorption hole and the lifting of the blue film through the ejector pin, thereby improving the success rate and efficiency of the separation of the chip and the blue film. On this basis, the stroke of the ejector pin is limited through the limiting protrusion, thereby effectively avoiding the piercing of the blue film caused by the long stroke of the ejector pin, preventing the appearance of the ejector pin mark and cracks on the back of the chip, and further improving the product performance and service life of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. It should be understood that the following drawings only show some of the embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those of ordinary skill in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.

[0018] Figure 1 A structural schematic diagram of a jacking mechanism provided for the embodiments of the present application is shown in the figure.

[0019] Figure 2 A structural schematic diagram of a top pin provided for the embodiments of the present application is shown in the figure.

[0020] Figure 3 A structural schematic diagram of a top pin provided for the embodiments of the present application is shown in the figure.

[0021] Figure legend: 100 - jacking mechanism; 10 - shell; 11 - air flow channel; 20 - top pin cap; 21 - adsorption hole; 30 - lifting platform; 31 - limiting protrusion; 32 - fastener; 40 - top pin; 41 - vacuum groove; 200 - blue film; 300 - chip. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0023] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art on the basis of the embodiments in the present application without creative labor are within the scope of protection of the present application.

[0024] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0025] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly used when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0026] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" only means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0027] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "arrangement", "installation", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the connection between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0028] Please refer to Figure 1 The embodiment of the present application provides a jacking mechanism 100, which comprises a shell 10, a thimble cap 20 fixedly arranged on the top of the shell 10, a lifting platform 30 movably arranged in the shell 10, and a thimble 40 fixedly arranged on the lifting platform 30. The shell 10 is provided with an airflow channel 11, the thimble cap 20 is provided with a suction hole 21, the suction hole 21 is communicated with a vacuum mechanism through the airflow channel 11, and the thimble 40 is arranged in the suction hole 21. Wherein, a blue film 200 is arranged on the thimble cap 20, the suction hole 21 adsorbs the blue film 200 under the action of negative pressure provided by the vacuum mechanism, the lifting platform 30 moves relative to the shell 10, drives the thimble 40 to extend out of the thimble cap 20 through the suction hole 21, and lifts the blue film 200 through the thimble 40, so that the chip 300 arranged on the blue film 200 can be separated from the blue film 200. The lifting platform 30 is provided with a limiting protrusion 31 on the top, and the limiting protrusion 31 is used for limiting the movement of the lifting platform 30 relative to the shell 10. The jacking mechanism 100 can solve the problem that the existing thimble 40 has too long stroke, which causes the thimble 40 to pierce the blue film 200 and leave thimble marks and cracks on the back of the chip 300.

[0029] It should be noted that, as Figure 1As shown, the jacking mechanism 100 includes a shell 10, a thimble cap 20, a lifting platform 30 and a thimble 40, wherein the shell 10 is the external support structure of the whole jacking mechanism 100, which plays a role of protecting the internal components and providing a mounting base; inside the shell 10, there is a lifting platform 30 arranged movably, which can move up and down inside the shell 10; the thimble 40 is fixedly arranged on the lifting platform 30, and will move together with the lifting platform 30 when the lifting platform 30 moves; the movement of the lifting platform 30 can be driven by a suitable driving mechanism (such as a motor, a pneumatic cylinder, etc.), and the above structure design can make the lifting action of the thimble 40 be accurately controlled.

[0030] The thimble cap 20 is fixed at the top of the shell 10, and has two important functions: one is as a channel for the thimble 40 to extend out, and the thimble 40 can be arranged in the suction hole 21 on the thimble cap 20, so that the thimble 40 can contact the blue film 200 and jack up the blue film 200; the other is as a carrier of the suction hole 21, and the suction hole 21 is communicated with the vacuum mechanism through the air flow channel 11 arranged in the shell 10, and when the vacuum mechanism works, the suction hole 21 can generate negative pressure, so as to adsorb the blue film 200.

[0031] In this way, a passage connecting the suction hole 21 and the vacuum mechanism is constructed inside the shell 10 through the air flow channel 11, when the vacuum mechanism is started, air is sucked out through the suction hole 21, and a negative pressure area is formed around the suction hole 21, which can firmly adsorb the blue film 200. At the same time, the thimble 40 is arranged in the suction hole 21, and on the basis of adsorbing the blue film 200, the thimble 40 can jack up the blue film 200 upward, and the suction hole 21 is located on the thimble cap 20, and its distribution and size design can be determined according to the actual need of adsorbing the area and effect of the blue film 200.

[0032] More importantly, a limiting protrusion 31 is arranged at the top of the lifting platform 30, which is used to limit the movement range of the lifting platform 30 relative to the shell 10, in other words, to limit the stroke of the thimble 40. When the lifting platform 30 moves upward to a certain extent, the limiting protrusion 31 will contact the corresponding structure inside the shell 10, thereby preventing the lifting platform 30 from continuing to move upward, which avoids the situation that the thimble 40 pierces the blue film 200 due to too long stroke.

[0033] The working process of the lifting mechanism 100 provided in this application is as follows: First, the blue film 200 is placed on the ejector cap 20, and the vacuum mechanism is activated. The vacuum mechanism generates negative pressure in the adsorption hole 21 through the airflow channel 11. The adsorption hole 21 adsorbs the blue film 200 and fixes it on the ejector cap 20. Then, the lifting platform 30 is driven to move upward relative to the outer shell 10. Since the ejector pin 40 is fixed on the lifting platform 30, the ejector pin 40 will move upward with the lifting platform 30 so that the ejector pin 40 extends out of the ejector cap 20 through the adsorption hole 21 and gradually lifts the blue film 200. At this time, the chip 300 attached to the blue film 200 gradually separates from the blue film 200 due to the lifting of the blue film 200. When the lifting platform 30 moves upward to a certain position, the limiting protrusion 31 contacts the corresponding structure inside the outer shell 10 (which may be the inner wall of the outer shell 10), restricting the further upward movement of the lifting platform 30, thereby ensuring that the ejector pin 40 will not pierce the blue film 200 due to excessive travel.

[0034] Compared to existing technologies, the lifting mechanism 100 provided in this application, by combining the adsorption of the blue film 200 through the adsorption hole 21 and the lifting of the blue film 200 by the lifting pin 40, can more stably and accurately separate the chip 300 from the blue film 200, thereby improving the success rate and efficiency of the separation of the chip 300 and the blue film 200. On this basis, the travel of the lifting pin 40 is limited by the limiting protrusion 31, which effectively avoids the lifting pin 40 from piercing the blue film 200 due to excessive travel, thereby preventing the appearance of lifting pin marks and cracks on the back of the chip 300, and thus improving the product performance and service life of the chip 300.

[0035] As one possible implementation method, such as Figure 1 As shown, in some embodiments, when the number of limiting protrusions 31 is one, the limiting protrusion 31 is located at the center of the lifting platform 30.

[0036] It should be noted that when there is only one limiting protrusion 31 located at the center of the lifting platform 30, this structural design is relatively simple. During the upward movement of the lifting platform 30, the limiting protrusion 31 at the center plays the main limiting role. From a mechanical point of view, when the ejector pins 40 uniformly push up the blue film 200, the reaction force on the lifting platform 30 is relatively evenly distributed on its plane. If the distribution of the ejector pins 40 is also relatively centrally symmetrical, then the limiting protrusion 31 at the center can effectively prevent the lifting platform 30 from rising excessively when it is subjected to a relatively balanced upward force. For example, when the number of ejector pins 40 is odd and they are centrally symmetrically distributed, the limiting protrusion 31 at the center can better balance the forces in all directions, preventing the ejector pins 40 from losing control of their stroke due to excessive force in one direction.

[0037] Alternatively, as an implementable manner, in other embodiments, when the number of the limiting protrusions 31 is multiple, the multiple limiting protrusions 31 are uniformly distributed along the lifting platform 30.

[0038] It should be noted that when the number of the limiting protrusions 31 is multiple and uniformly distributed along the lifting platform 30, such a structure design can provide more uniform limiting effect. Assuming that the lifting platform 30 is a regular shape such as a circle or a square, the uniformly distributed limiting protrusions 31 can form multiple support points at the edges or key stress positions of the lifting platform 30. For example, taking a square lifting platform 30 as an example, the limiting protrusions 31 can be arranged at the four corners and the midpoint positions of the four sides, so that during the upward movement of the lifting platform 30, no matter how uneven the stress of the ejector pin 40 is when the blue film 200 is lifted, the uniformly distributed limiting protrusions 31 can limit the lifting platform 30 from multiple directions, so that the lifting platform 30 is not easy to have excessive displacement in each direction.

[0039] As an implementable manner, as shown in Figure 1 , the top of the lifting platform 30 is provided with a fixing hole, the bottom of the ejector pin 40 is provided with a mounting hole, and the fastener 32 is sequentially arranged in the fixing hole and the mounting hole to fix and install the ejector pin 40 on the lifting platform 30.

[0040] It should be noted that the fixing hole is arranged at the top of the lifting platform 30, and the mounting hole is arranged at the bottom of the ejector pin 40, so as to realize the fixed connection of the ejector pin 40 and the lifting platform 30 through the fastener 32. The above-mentioned fastener 32 can be a common connecting piece such as a screw, a bolt or a jack. For example, taking the jack as an example, when installing, the jack is sequentially arranged through the fixing hole of the lifting platform 30 and the mounting hole of the ejector pin 40, so as to firmly fix the ejector pin 40 at the specified position of the lifting platform 30. Such a connection mode makes the ejector pin 40 and the lifting platform 30 become a relatively stable whole, so as to ensure that the ejector pin 40 can move synchronously with the lifting platform 30 when the lifting platform 30 moves.

[0041] As an implementable manner, please refer to Figure 2 and Figure 3 , the outer wall of the ejector pin 40 is provided with a vacuum groove 41, and the vacuum groove 41 penetrates through the top and the bottom of the ejector pin 40.

[0042] It should be noted that the outer wall of the ejector pin 40 is provided with a vacuum groove 41, and the vacuum groove 41 penetrates the top and bottom of the ejector pin 40, in other words, the vacuum groove 41 extends from the top end to the bottom end of the ejector pin 40, thereby forming a continuous auxiliary channel. In this way, when the lifting mechanism 100 is working, the suction holes 21 on the ejector pin cap 20 are communicated with the vacuum mechanism through the airflow channel 11, and negative pressure is generated to adsorb the blue film 200, and at the same time, the vacuum groove 41 can serve as an auxiliary channel for negative pressure conduction, thereby enhancing the adsorption effect.

[0043] Due to the presence of the vacuum groove 41, during the process of lifting the blue film 200 by the ejector pin 40, negative pressure will also be generated in the vacuum groove 41, so that the blue film 200 around the ejector pin 40 is not only subjected to the adsorption of the suction holes 21, but also subjected to the adsorption of the vacuum groove 41. The double adsorption effect can more firmly adsorb the blue film 200, and prevent the blue film 200 from being locally lifted or separated from the adsorption area during the lifting process. For example, when processing a relatively thin or slightly sticky blue film 200, the auxiliary adsorption effect of the vacuum groove 41 can effectively improve the adhesion of the blue film 200 to the ejector pin cap 20, thereby ensuring the smooth separation of the chip 300 from the blue film 200.

[0044] As an implementable manner, the mounting hole is located at the groove bottom of the vacuum groove 41, and the fastener 32 is arranged and fixed in the vacuum groove 41. That is to say, when the fastener 32 is used to fix the ejector pin 40 on the lifting platform 30, the fastener 32 is located inside the vacuum groove 41. Through this structural design, the contact area between the fastener 32 and the ejector pin 40 can be increased, thereby improving the connection strength between the fastener 32 and the ejector pin 40, and at the same time, the fastener 32 can avoid occupying additional space around the ejector pin 40, so that the overall structure of the ejector pin 40 is more compact, which is helpful to reduce the volume of the lifting mechanism 100 or more reasonably arrange other components in limited space.

[0045] As an implementable manner, as shown in Figure 2 and Figure 3 , the number of vacuum grooves 41 is multiple, and the multiple vacuum grooves 41 are uniformly distributed along the circumferential direction of the ejector pin 40. In this way, when the ejector pin 40 lifts the blue film 200, uniform adsorption force can be generated in the circumferential direction of the ejector pin 40, so as to avoid the phenomenon that the chip 300 is tilted or positionally deviated due to uneven local force of the blue film 200, thereby ensuring the accuracy of the lifting action of the ejector pin 40.

[0046] As an implementable manner, the cross-sectional shape of the vacuum groove 41 is one or a combination of more than one of a circular arc shape, a V-shaped, and a U-shaped. In this regard, those skilled in the art should be able to make reasonable selection and design according to the actual situation, which is not specifically limited here. For example, in the present embodiment, as shown inFigure 1 As shown, the cross-sectional shape of the vacuum groove 41 is arc-shaped, and the arc-shaped vacuum groove 41 can provide a relatively smooth transition when the air flows through, and when the negative pressure acts on the blue film 200, the air is sucked from around the vacuum groove 41, and the arc-shaped design can reduce the turbulence of the air flow, thereby ensuring that the suction force is more evenly distributed around the vacuum groove 41, and thus enhancing the suction effect on the blue film 200.

[0047] As an implementable manner, as shown in Figure 1 As shown, the number of the ejector pins 40 is multiple, and the multiple ejector pins 40 are uniformly distributed along the top of the lifting platform 30, and this distribution ensures that the ejector pins 40 can uniformly function in the entire area of the blue film 200 during the work process, and ensures that the chip 300 is uniformly stressed during the separation process. For example, if the lifting platform 30 is circular, the multiple ejector pins 40 can be arranged like points uniformly distributed on the circumference; if the lifting platform 30 is square, the ejector pins 40 can be uniformly distributed in a matrix form on the top thereof.

[0048] The embodiment of the present application also provides a patch packaging device, which comprises a machine table, a vacuum mechanism and a driving mechanism arranged on the machine table, and the jacking mechanism 100 described above, the shell 10 of the jacking mechanism 100 is fixedly installed on the machine table, the airflow channel 11 of the jacking mechanism 100 is in communication with the vacuum mechanism, and the lifting platform 30 of the jacking mechanism 100 is in transmission connection with the driving mechanism. Since the structure and beneficial effects of the jacking mechanism 100 have been described in detail in the foregoing embodiment, they will not be described here again.

[0049] For example, as shown in Figure 1 A vacuum hole is arranged at the bottom of the shell 10 of the jacking mechanism 100, the airflow channel 11 of the jacking mechanism 100 is in communication with the vacuum mechanism through the vacuum hole; a clamping structure (for example, a protrusion or a groove) is arranged at the bottom of the lifting platform 30 of the jacking mechanism 100, and the lifting platform 30 of the jacking mechanism 100 is in transmission connection with the corresponding structure on the driving mechanism, so that the driving mechanism can drive the lifting platform 30 to move synchronously.

[0050] The above only describes optional embodiments of the present application and is not used to limit the present application. For those skilled in the art, the present application can have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0051] In addition, it should be noted that various specific technical features described in the foregoing specific embodiments can be combined in any suitable manner without contradiction, and in order to avoid unnecessary repetition, various possible combinations will not be described again in the present application.

Claims

1. A jacking mechanism, characterized by, The lifting mechanism comprises a shell, a thimble cap fixedly arranged on the top of the shell, a lifting platform movably arranged in the shell, and a thimble fixedly arranged on the lifting platform, wherein an airflow channel is arranged in the shell, an adsorption hole is arranged on the thimble cap, the adsorption hole is communicated with a vacuum mechanism through the airflow channel, and the thimble is arranged in the adsorption hole; Wherein, a blue film is arranged on the thimble cap, the adsorption hole adsorbs the blue film under the action of negative pressure provided by the vacuum mechanism, the lifting platform moves relative to the shell, drives the thimble to extend out of the thimble cap through the adsorption hole, and lifts the blue film through the thimble, so that the chip arranged on the blue film can be separated from the blue film, and a limiting protrusion is arranged on the top of the lifting platform, which is used for limiting the movement of the lifting platform relative to the shell.

2. The jacking mechanism of claim 1, wherein When the number of limiting protrusions is one, the limiting protrusion is located at the center position of the lifting platform.

3. The jacking mechanism of claim 1, wherein When the number of limiting protrusions is multiple, multiple limiting protrusions are uniformly distributed along the lifting platform.

4. The jacking mechanism of claim 1, wherein A fixing hole is arranged on the top of the lifting platform, a mounting hole is arranged on the bottom of the thimble, and a fastener is sequentially arranged in the fixing hole and the mounting hole, so that the thimble is fixedly installed on the lifting platform.

5. The jacking mechanism of claim 4, wherein, A vacuum groove is arranged on the outer wall of the thimble, and the vacuum groove penetrates through the top and the bottom of the thimble.

6. The jacking mechanism of claim 5, wherein, The mounting hole is located at the groove bottom of the vacuum groove, and the fastener is arranged and fixed in the vacuum groove.

7. The jacking mechanism of claim 5, wherein, The number of vacuum grooves is multiple, and multiple vacuum grooves are uniformly distributed along the circumferential direction of the thimble.

8. The jacking mechanism of claim 5, wherein, The cross-sectional shape of the vacuum groove is one or a combination of more than one of circular arc, V-shaped and U-shaped.

9. The jacking mechanism according to any one of claims 1 to 8, characterized in that The number of thimbles is multiple, and multiple thimbles are uniformly distributed along the top of the lifting platform.

10. A patch packaging apparatus characterized by comprising: The lifting mechanism comprises a shell, a thimble cap fixedly arranged on the top of the shell, a lifting platform movably arranged in the shell, and a thimble fixedly arranged on the lifting platform, wherein an airflow channel is arranged in the shell, an adsorption hole is arranged on the thimble cap, the adsorption hole is communicated with a vacuum mechanism through the airflow channel, and the thimble is arranged in the adsorption hole;

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