Flexible sheet suction device

Abstract

The utility model discloses a flexible suction device, which relates to the field of semiconductor manufacturing, and comprises a fixed seat and a suction part, a flexible connecting piece is arranged on the lower side of the fixed seat, the suction part is hung below the fixed seat through the flexible connecting piece, and the suction part is connected with the flexible connecting piece under the action of external force. The flexible connecting piece allows the adsorption part to incline relative to the fixing base, and horizontal adjustment of the adsorption part is achieved. The inclination can realize fine adjustment of the adsorption part in the horizontal direction, so that the adsorption part can be contacted with the wafer only through partial self weight according to the surface condition of the wafer without additionally increasing pressure, and the horizontal position of the adsorption part is adjusted in the process of contacting with the surface of the wafer; stable contact between the adsorption part and the surface of the wafer is achieved, complete attachment of the ceramic suction cup and the wafer can be achieved, and the situation that the surface of the wafer is locally pressed excessively, and deformation, even fragmentation and the like are caused is prevented.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor manufacturing especially relates to a flexible wafer sucking device. BACKGROUND

[0002] As the core process object in the semiconductor process, wafers need to be frequently handled in each production link. Since they are mostly designed in a thin sheet structure, and the difference in base material quality leads to different brittleness and hardness, but overall, they all belong to fragile articles, so the precision requirement in the handling process is extremely strict.

[0003] In the semiconductor industry, the current mainstream wafer handling mode covers manipulators and suction cups, and due to the working condition, sometimes the structure of the wafer placement platform may not be stable enough. In the case where the wafer placement platform has wafers, there is an empty phenomenon between the wafer and the placement platform, which causes the wafer lower surface to be partially stressed, and some areas to be suspended. In addition, the wafer surface precision difference under different working conditions is significant, which makes it difficult to ensure the relative parallelism between each wafer handling device to be sucked. During the wafer picking process, the wafer surface is easily partially pressed too much, which further causes the wafer to deform or even crack, not only increasing the material cost and process cost, but also reducing the overall efficiency and manufacturing quality of the production line. SUMMARY

[0004] The purpose of the embodiment of the utility model is to provide a flexible wafer sucking device to solve the problems of deformation or even cracking caused by excessive local pressure during wafer picking.

[0005] To achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A flexible wafer sucking device is provided, comprising:

[0007] A fixed seat is provided with a flexible connecting piece on the lower side;

[0008] An adsorption component is hung below the fixed seat through the flexible connecting piece. Under the action of external force, the flexible connecting piece allows the adsorption component to tilt relative to the fixed seat, realizing the horizontal adjustment of the adsorption component.

[0009] As an optional implementation, an adjusting mechanism is further provided between the flexible connecting piece and the fixed seat, which is movably connected to the fixed seat and / or the adsorption component in the up-down direction.

[0010] As an optional implementation, the adjusting mechanism comprises:

[0011] An adjusting stud is threadedly connected to the fixed seat.

[0012] A connecting rod is rotatably connected to the adjusting stud via a bearing, and the connecting rod and the adjusting stud are coaxially arranged. The flexible connector is installed on the connecting rod.

[0013] As an optional implementation, the flexible connector is provided in multiple forms, and the multiple flexible connectors are equally spaced along the circumferential direction on the fixed base;

[0014] Each of the flexible connectors is movably connected to the fixed base in the vertical direction via an adjustment mechanism.

[0015] As an optional implementation, the flexible connector is configured as a tension spring.

[0016] As an optional implementation, a guide mechanism is further provided between the fixing base and the adsorption component. The guide mechanism is provided in multiple ways, and the multiple guide mechanisms are connected to the fixing base and the adsorption component at equal intervals along the circumferential direction.

[0017] Each of the aforementioned guiding mechanisms is used to guide the adsorption component at its corresponding position to move relative to the fixed base in the vertical direction.

[0018] As an optional implementation, the guiding mechanism includes:

[0019] A guide seat is fixedly installed on the fixed base, and the guide seat has a guide hole with the orifice facing downwards.

[0020] One end of the guide post is fixedly connected to the adsorption component, and the other end of the guide post is movably inserted into the guide seat.

[0021] As an optional implementation, the fixed base has a plurality of mounting holes extending through its upper and lower sides, and each guide seat is respectively mounted on the fixed base through the mounting holes, with the guide holes extending through the upper and lower ends of the guide seat;

[0022] Each of the guide posts can be movably passed through each of the guide holes, and a limiting member is provided at the end of the guide post away from the adsorption component. The limiting member can abut against the guide seat to prevent the guide post from detaching from the guide seat.

[0023] As an optional implementation, the outer circumferential surface of the guide post is provided with multiple planar structures, and any two adjacent planar structures are connected by an arc surface.

[0024] As an optional implementation, the adsorption component is configured as a ceramic suction cup.

[0025] The utility model discloses a beneficial effect is: the flexible suction piece device utilizes the fixed seat as the support main part, ensures that the whole device can be by the fixed seat and the stable connection of external motion system, realizes the synchronous movement of adsorption component and fixed seat to meet the demand of flexible suction piece device in the wide range of taking piece operation.

[0026] Meanwhile, since the fixed seat and the adsorption component are connected through the flexible connecting piece, in the case that the adsorption component is subjected to external force, the flexible connecting piece will be elastically deformed, thereby allowing the adsorption component to be inclined relative to the fixed seat. This inclination can realize fine adjustment of the adsorption component in the horizontal direction, so that the adsorption component can be in contact with the wafer only through part of its own weight according to the surface condition of the wafer, without the need for additional pressure. In the process of contacting the wafer surface, the horizontal position of the wafer is adjusted to realize smooth contact of the adsorption component with the wafer surface, so that complete adhesion of the ceramic suction disc and the wafer can be realized, preventing the wafer surface from being deformed or even cracked due to excessive local pressure, thereby improving the manufacturing quality and reducing the material and process costs, which is suitable for large-scale application in the wafer processing field. BRIEF DESCRIPTION OF DRAWINGS

[0027] The utility model will be further described in detail below according to the drawings and examples.

[0028] Figure 1 The flexible suction piece device overall structure schematic view for the utility model embodiment is shown in the figure.

[0029] Figure 2 The fixed seat structure schematic view for the utility model embodiment is shown in the figure.

[0030] Figure 3 The adjustment mechanism internal structure schematic view for the utility model embodiment is shown in the figure.

[0031] Figure 4 The adsorption component structure schematic view for the utility model embodiment is shown in the figure.

[0032] Figure 5 The guide column structure schematic view for the utility model embodiment is shown in the figure.

[0033] In the figure: 10, fixed seat;11, mounting hole;20, flexible connecting piece;30, adsorption component;40, adjustment mechanism;41, adjustment stud;42, connecting rod;43, bearing;50, guide mechanism;51, guide seat;511, guide hole;52, guide column;521, limiting piece;522, plane structure. DETAILED DESCRIPTION

[0034] In order to make the technical problems solved by the utility model, the technical scheme adopted and the technical effects reached more clear, the technical scheme of the utility model embodiment is further described in detail below. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.

[0035] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements or the interaction relationship between two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0036] In the utility model, unless explicitly defined and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0037] As the core process object in semiconductor process, wafer needs to be frequently handled in each production link. Because it is mostly designed in sheet structure, and the difference in base material leads to different brittleness and hardness, but overall, it belongs to fragile articles, so the precision requirement in handling process is extremely strict.

[0038] In the current semiconductor industry, wafer handling mainly adopts mechanical hand, rubber suction cup and ceramic suction cup. Among them, mechanical hand has the advantages of high precision, high stability and fast response, but it occupies large space and has high cost. Rubber suction cup has small space occupation and low cost, but its corrosion-resistant property is poor in water vapor environment, and the contact area with wafer is limited during suction, which easily leads to uneven stress. In comparison, ceramic suction cup realizes uniform stress of the whole suction surface by virtue of its fine microporous ceramic structure on the surface, and modern technology can ensure high-precision processing of the ceramic surface, thereby ensuring the stability of wafer suction. In addition, ceramic suction cup also has the characteristics of small space occupation, low cost, strong corrosion resistance and wide application.

[0039] However, in the wafer carrying process, although the wafer placing platform structure is stable in most cases and is not easy to cause wafer damage, the working condition often leads to instability of the platform structure or the existence of hollow phenomenon, so that the lower surface of the wafer is unevenly stressed when placed on the placing platform, and some areas are suspended. At the same time, the surface precision of the wafer is quite different due to the difference in working conditions, and it is difficult to ensure the relative parallelism between each wafer and the ceramic chuck. In this situation, when the ceramic chuck is used to adsorb the upper surface of the wafer, it is easy to cause the wafer surface to be locally pressed too much, thereby causing the risk of deformation or even cracking, which not only increases the material cost and process cost, but also reduces the overall efficiency and manufacturing quality of the production line.

[0040] Therefore, the embodiment provides a flexible wafer suction device, which uses a fixed seat as the support body of the device, and connects the fixed seat and the adsorption component through a flexible connecting piece, so that the adsorption component can be inclined relative to the fixed seat under the action of external force, to solve the problem that the wafer is locally pressed too much due to the local hollow phenomenon of the wafer on the wafer placing platform or the different parallelism between the adsorption component and the wafer in the process of contacting the wafer.

[0041] Please refer to the drawings in the description Figure 1 The flexible wafer suction device includes a fixed seat 10 and an adsorption component 30. Among them, the fixed seat 10 is the support body of the flexible wafer suction device in the above-mentioned flexible wafer suction device, and the lower side of the fixed seat 10 is provided with a flexible connecting piece 20 to connect the adsorption component 30 through the flexible connecting piece 20. In the specific application scenario of the related equipment, the fixed seat 10 not only connects the flexible connecting piece 20 and the adsorption component 30, but also is responsible for connecting with the external motion system. In this way, under the driving of the external motion system, the whole flexible wafer suction device (including the fixed seat 10, the flexible connecting piece 20 and the adsorption component 30) can realize synchronous movement in all directions, meeting the needs of the flexible wafer suction device in a wide range of wafer taking operation.

[0042] It can be understood that in order to meet the support requirements of the flexible wafer suction device, the fixed seat 10 is usually made of a material with relatively high strength (such as aluminum alloy) to ensure that it can remain stable when bearing the weight of the wafer and the force applied by the motion system.

[0043] It should be noted that the flexible connecting piece 20 of the embodiment is a connecting assembly that can deform under the action of external force and restore to its original state after the external force is removed. Its main physical property is that it has a certain flexibility and elasticity to meet the needs of the adsorption component 30 in dealing with various complex working conditions.

[0044] Exemplarily, the flexible connecting member 20 can be, but is not limited to, a rubber connecting member (such as a rubber hose), a metal bellows (a metal tube with a corrugated shape so that it can be deformed in the axial and radial directions), a braided hose (usually woven by stainless steel wire or synthetic fiber, etc., and filled with rubber or plastic, etc., so as to have good flexibility and wear resistance), a spring (as a common flexible element, it has excellent elasticity and recovery ability), and other high polymer material connecting members (such as polyurethane, polytetrafluoroethylene, etc.), etc. In actual application scenarios, the selection of the flexible connecting member 20 depends on various factors, including but not limited to process environment, stress requirement, displacement range, temperature range, and size and shape of the connecting member, etc., which are not strictly limited and required in this embodiment.

[0045] In connection with the above embodiment, the adsorption component 30 is mainly used to adsorb target objects (such as wafers, panels, etc.), and realizes precise horizontal adjustment under the cooperation of the flexible connecting member 20. The adsorption component 30 is hung below the fixed seat 10 through the flexible connecting member 20, and the lower side (the side away from the fixed seat 10) of the adsorption component 30 usually has one or more adsorption surfaces, which can be covered with adsorption materials (such as rubber, silica gel, vacuum chuck, etc.) to provide corresponding adsorption function. When the adsorption component 30 contacts the target object, the adsorption surface forms a close fit with the surface of the target object through the adsorption material. In addition, the upper side of the adsorption component 30 is provided with a connecting structure (such as a hook, a bolt, a pin shaft, etc.) matched with the flexible connecting member 20, so as to ensure that the adsorption component 30 can stably transmit force when subjected to external force, and allow a certain degree of displacement.

[0046] In actual application scenarios, the adsorption component 30 of this embodiment can be, but is not limited to, a vacuum chuck (which adsorbs wafers by generating negative pressure, and is usually made of rubber, silica gel or other soft and durable materials to ensure close fit with the surface of the wafer) and a ceramic chuck (made of porous ceramic material, the pore size is uniformly distributed, and the inside is interconnected, by forming a negative pressure difference between the wafer and the ceramic surface, the wafer can be firmly adsorbed on the ceramic chuck), which is not strictly limited and required in this embodiment.

[0047] However, it can be understood from the above background art that, since the ceramic chuck has higher precision, compared with the traditional vacuum chuck, the ceramic chuck can meet the higher precision requirement in the semiconductor process, and the physical properties of the ceramic chuck are more excellent, and the service life is longer, so the adsorption component 30 of this embodiment can preferably adopt the ceramic chuck.

[0048] In actual application scenarios, the present embodiment considers the contact between the adsorption component 30 and the wafer as being affected by external force, and in this state, the flexible connecting piece 20 will be elastically deformed, thereby allowing the adsorption component 30 to tilt relative to the fixed seat 10. This tilt can achieve fine adjustment of the adsorption component 30 in the horizontal direction, so that the adsorption component 30 can adapt to the surface conditions of the wafer. The adsorption component 30 is adjusted horizontally to form a completely conformal surface contact relationship between the adsorption surface of the adsorption component 30 and the wafer surface. In this process, the fixed seat 10 does not need to apply additional pressure to the adsorption component 30 through the flexible connecting piece 20 to allow smooth contact between the adsorption component 30 and the wafer surface, thereby preventing the wafer surface from being locally pressed too hard to cause deformation or even cracking, thereby improving manufacturing quality and also allowing the material cost and process cost to be controlled accordingly, which is suitable for large-scale application in the wafer processing field.

[0049] Please refer to the drawings in the specification Figures 1-3 In an embodiment, the flexible connecting piece 20 and the fixed seat 10 are further provided with an adjusting mechanism 40. The adjusting mechanism 40 can adopt the following active adjustment modes in this embodiment:

[0050] I. The adjusting mechanism 40 is movably connected to the fixed seat 10 in the up-down direction;

[0051] II. The adjusting mechanism 40 is movably connected to the adsorption component 30 in the up-down direction;

[0052] III. The adjusting mechanism 40 is movably connected to the fixed seat 10 in the up-down direction, and the adjusting mechanism 40 is movably connected to the adsorption component 30 in the up-down direction.

[0053] In the process of adjusting the distance between the fixed seat 10 and the flexible connecting piece 20 in the up-down direction by the adjusting mechanism 40, the flexible connecting piece 20 drives the adsorption component 30 to move in the up-down direction relative to the fixed seat 10 at the corresponding position, so that the relative position between the adsorption component 30 and the fixed seat 10 can meet the adsorption requirements of the wafer or other target objects, and at the same time, the horizontal position of the adsorption component 30 can be adjusted to tend to be parallel to the target object before adsorption, so as to increase the contact area between the adsorption component 30 and the target object as much as possible during the initial contact process, reduce the pressure on the local target object, and further alleviate the deformation or even cracking of the target object.

[0054] It can be understood that the connection mode between the adjusting mechanism 40, the fixed seat 10 and the flexible connecting piece 20 in this embodiment can be not limited to thread connection, welding connection, sliding connection (such as slider and slide rail connection), etc. according to actual needs.

[0055] On the basis of the above-mentioned embodiment, as an optional technical solution, in order to facilitate the adjustment mechanism 40 to adjust between the fixed seat 10 and the flexible connecting piece 20, the embodiment adopts the mode that the adjustment mechanism 40 is movably connected with the fixed seat 10 in the up-down direction.

[0056] For details, please refer to the drawings Figure 3 The adjustment mechanism 40 in the embodiment mainly includes an adjusting stud 41 and a connecting rod 42. The adjusting stud 41 is threadedly connected to the fixed seat 10. The outer peripheral part of the adjusting stud 41 is provided with an external thread structure, and correspondingly, the fixed seat 10 is also processed with a threaded hole matched therewith. The part of the adjusting stud 41 processed with the external thread structure is used for threadedly connecting with the fixed seat 10, and the head part of the adjusting stud 41 is outside the fixed seat 10, which is used for being driven in rotation by a tool (such as a screwdriver, a wrench, etc.) or manually, so that the adjusting stud 41 can relatively move in the up-down direction relative to the fixed seat 10. This movement can realize the accurate adjustment of the position of the connecting part, and after the adjustment, the stable self-locking of the adjusting stud 41 and the fixed seat 10 is realized by the characteristics of the threaded structure. Before and after the adjustment, no unlocking and locking operation of the rest is required, so that the adjustment process of the adsorption part 30 is simple and fast. Since the embodiment adopts the mode that the adjustment mechanism 40 realizes the relative movement with the fixed seat 10 in the up-down direction by rotation, the connecting rod 42 is rotatably connected to the adjusting stud 41 through a bearing 43, and the end of the connecting rod 42 away from the fixed seat 10 is exposed outside the adjusting stud 41 for being connected with the flexible connecting piece 20. This connection mode ensures that the connecting rod 42 can remain stable when the adjusting stud 41 rotates and does not rotate together, thereby avoiding the adverse effects on the flexible connecting piece 20 and ensuring the stable state of the flexible connecting piece 20, so that the elastic force does not change due to the movement of the flexible connecting piece 20 with the movement of the adjusting stud 41.

[0057] In the process of adjusting the up-down position of the adsorption part 30 by the above-mentioned adjustment mechanism 40, when the adjusting stud 41 rotates and moves up and down on the support seat, the connecting rod 42 remains relatively stationary through the bearing 43 connected with the adjusting stud 41, and the other end of the connecting rod 42 is connected with the flexible connecting piece 20, which converts the movement of the adjusting stud 41 into the position change of the flexible connecting piece 20, so as to realize the up-down movement of the adsorption part 30 (part of the structure) relative to the fixed seat 10, and realize the adjustment requirement of the adsorption part 30 in the up-down direction, and make the whole adjustment process more convenient.

[0058] It is worth mentioning that in the above technical solution, the connecting rod 42 is coaxially arranged with the adjusting stud 41 to ensure that the rotation axis between the adjusting stud 41 and the fixed seat 10 and the rotation axis between the adjusting stud 41 and the connecting rod 42 are substantially coincident, maintaining the relative stability of the fixed seat 10 and the flexible connecting piece 20 during adjustment.

[0059] Based on any of the above embodiments, the flexible connecting piece 20 can be provided in multiple numbers, and the multiple flexible connecting pieces 20 are arranged at the fixed seat 10 at equal intervals in the circumferential direction. In this way, the connection stability of the adsorption component 30 on the fixed seat 10 can be improved, so that when each position of the adsorption component 30 is subjected to an external force and changes in position accordingly, there is a corresponding flexible connecting piece 20 to provide support for the position change, enabling the adsorption component 30 to remain stable in state when it tilts in each direction, and ensuring that the target object does not appear to be locally compressed too much.

[0060] Further, each flexible connecting piece 20 is movably connected to the fixed seat 10 in the up-down direction by an adjusting mechanism 40, so that the up-down position of each adsorption component 30 can be adjusted by the corresponding adjusting mechanism 40 through the flexible connecting piece 20, ensuring that the state of the adsorption component 30 before the suction piece tends to be parallel to the target object.

[0061] Below, the process and principles of adjustment in the above scheme are as follows:

[0062] Before starting the adjustment, all flexible connecting pieces 20 are in the initial state, i.e. their relative positions with the fixed seat 10 and the adsorption component 30 are pre-set, and the adjusting mechanism 40 (such as the adjusting stud 41) is also in the initial position without any adjustment. According to the actual application scenario or task requirements, it is determined which positions of the adsorption component 30 need to be adjusted, which may involve displacement in the horizontal direction, adjustment of the inclination angle or change in height, etc. According to the adjustment requirements, the corresponding adjusting mechanism 40 is selected for operation. Since each flexible connecting piece 20 is connected to the fixed seat 10 by an independent adjusting mechanism 40, the position of each flexible connecting piece 20 can be adjusted individually. By rotating the adjusting stud 41 or other operation methods, the position of the flexible connecting piece 20 in the up-down direction is changed, thereby changing the distance between the flexible connecting piece 20 and the fixed seat 10, and further changing the relative position between the adsorption component 30 and the fixed seat 10.

[0063] In the process of the adsorption component 30 adsorbing the target object, the adsorption component 30 can be in contact with the target object under the action of partial self-weight, so that the adsorption component 30 changes its position in the horizontal direction according to the surface state of the target object. In this process, the adsorption component 30 can be slightly tilted relative to the fixed seat 10. Since the adsorption component 30 is connected to the fixed seat 10 through the flexible connectors 20 at multiple positions, the flexible connectors 20 at the multiple positions change their states. The flexible connectors 20 at the positions where the distance between the adsorption component 30 and the fixed seat 10 decreases are compressed, while the flexible connectors 20 at the other positions remain unchanged or are stretched. Thus, the fixed seat 10 and the adsorption component 30 are connected while the function of providing a buffer for the adsorption component 30 is maintained, so that the adsorption component 30 does not exert excessive pressure on the target object during the tilting process, and the structure of the target object is ensured to be intact.

[0064] In the above embodiment, the flexible connectors 20 are provided in the form of tension springs. As the flexible connectors 20, the tension springs not only meet the requirement of hoisting the adsorption component 30 on the fixed seat 10, but also allow the adsorption component 30 to change its state when the position of the adsorption component 30 changes, so that the adsorption component 30 can be adjusted in position within a certain range below the fixed seat 10. The tension springs have a relatively low cost and a long service life, which is conducive to the wide application of the flexible adsorption device.

[0065] In other embodiments, the vertical position and the tilting angle of the adsorption component 30 can be changed by adjusting the extension or compression state of the tension springs to preliminarily adjust the position of the adsorption component 30 relative to the fixed seat 10.

[0066] In addition, the elastic property of the tension springs allows them to adapt to different loads. When the load increases (the adsorption component 30 adsorbs the target object), the tension springs are elongated to provide sufficient support force. When the load decreases (the adsorption component 30 does not adsorb the target object), the tension springs are shortened to return to the original state. When the adsorption component 30 is subjected to external disturbance, the tension springs can absorb part of the energy and slow down the shaking of the adsorption component 30, thereby improving the stability of the device and reducing the risk of damage to the connection structure between the adsorption component 30 and the fixed seat 10.

[0067] Please refer to the drawings in the specification Figures 1-2 , Figure 4The guiding mechanism 50 is provided between the fixed seat 10 and the adsorption component 30, and is connected to the fixed seat 10 and the adsorption component 30 at intervals in the circumferential direction. The guiding mechanism 50 is used to guide the movement of the adsorption component 30 in the up-down direction relative to the fixed seat 10. One of the main functions of the guiding mechanism 50 is to ensure that the adsorption component 30 can move up and down along a predetermined path when adjusting the horizontal position of the adsorption component 30 relative to the fixed seat 10, preventing the adsorption component 30 from shifting or shaking during adjustment. In addition, the guiding mechanism 50 also has the function of limiting the maximum stroke of the adsorption component 30. By setting the stroke limit, the guiding mechanism 50 can prevent the adsorption component 30 from exceeding the predetermined movement range during adjustment, preventing damage to the device or safety risks caused by the adsorption component 30 exceeding the movement range, such as accidental impact of the adsorption component 30 on other components during adjustment, which may cause component damage or device failure.

[0068] In addition to the above two main functions, the guiding mechanism 50 can also provide additional support and stability for the adsorption component 30, making the cooperation between the adsorption component 30 and the fixed seat 10 more stable, and to some extent, prolonging the service life of the flexible connecting piece 20.

[0069] Specifically, the guiding mechanism 50 is provided in multiple and connected to the fixed seat 10 and the adsorption component 30 at intervals in the circumferential direction, which provides multiple support points for the adsorption component 30. These support points work together to significantly reduce the shaking and shifting of the adsorption component 30 during up-down movement, thereby improving the guiding accuracy and stability of the system. In addition, since the guiding mechanism 50 is evenly distributed, the force on the adsorption component 30 during up-down movement will also be more uniform, which helps to reduce the stress load on individual guiding mechanisms 50, prolong their service life, and reduce the risk of damage caused by uneven stress.

[0070] When the guiding mechanism 50 is evenly distributed around the adsorption component 30, it collectively provides multiple constraint points for the adsorption component 30. These constraint points not only limit the movement of the adsorption component 30 in the up-down direction, but also indirectly affect the adjustable range of the adsorption component 30 in the horizontal direction through their layout and number.

[0071] It should be understood that in the above embodiment in which the flexible connecting piece 20 is provided as a tension spring, the tension spring can flexibly adapt to different spatial layout requirements, which makes the flexible adsorption piece device more flexible in arranging the positions and layouts of various components during design, thereby optimizing the overall performance.

[0072] The guide structure in this embodiment can adopt a sliding guide structure, which includes but is not limited to a structure in which a sliding guide rail cooperates with a sliding block, or a structure in which a sliding bearing cooperates with a sliding rod, etc. This scheme in the present embodiment does not have explicit limitations and requirements.

[0073] Please continue to refer to the description of the accompanying drawings Figures 4-5 In an embodiment, the guide mechanism 50 includes a guide seat 51 and a guide column 52. The guide seat 51 is fixedly installed on the fixed seat 10, and provides a precise guide and support for the guide column 52. It can be understood that the guide seat 51 is internally provided with a downwardly open guide hole 511, and the shape and size of the guide hole 511 are determined according to the design of the guide column 52 to ensure that the guide column 52 can smoothly and accurately pass through. The guide column 52 is a bridge connecting the adsorption component 30 and the guide seat 51. Correspondingly, one end of the guide column 52 is fixedly connected with the adsorption component 30, and the other end of the guide column 52 is movably inserted into the guide seat 51, so that the guide column 52 can move in the up-down direction relative to the guide seat 51 along the guide hole 511, thereby meeting the requirement of adjusting the position of the adsorption component 30 in the up-down direction.

[0074] It should be understood that, due to the configuration of the guide seat 51 mainly allowing the guide column 52 to move in the up-down direction, the guide hole 511 may interfere with the guide column 52 during the horizontal position adjustment of the adsorption component 30. Therefore, in order to adapt to the horizontal adjustment requirement of the adsorption component 30, the hole diameter of the guide hole 511 should be slightly larger than that of the guide column 52, so that the guide column 52 can be tilted to a certain extent in the guide hole 511 when the adsorption component 30 is tilted, to avoid damage caused by excessive friction between the hole wall of the guide hole 511 and the outer surface of the guide column 52.

[0075] In order to facilitate the processing and installation of the guide mechanism 50 between the fixed seat 10 and the adsorption component 30, in a further embodiment, a plurality of mounting holes 11 are formed through the upper and lower sides of the fixed seat 10, and each guide seat 51 is mounted on the fixed seat 10 through the mounting hole 11, and the guide hole 511 penetrates the upper and lower ends of the guide seat 51. Correspondingly, each guide column 52 movably penetrates each guide hole 511, and the end of the guide column 52 away from the adsorption component 30 is provided with a limiting piece 521, which can abut against the guide seat 51 to limit the guide column 52 from separating from the guide seat 51, so that the guide mechanism 50 not only plays a guiding role, but also limits the adsorption component 30.

[0076] Please refer to the description of the accompanying drawings Figure 5The outer circumferential surface of each guide column 52 is provided with a plurality of planar structures 522, and in the circumferential direction of the guide column 52, any two adjacent planar structures 522 are connected by an arc surface, and the flexible connecting piece 20 is arranged on the inner side of the guide mechanism 50, so that the space occupied by the guide column 52 near the flexible connecting piece 20 can be reduced, the possibility of collision and interference between the guide column 52 and other components (such as the adsorption component 30 itself, the flexible connecting piece 20, etc.) during movement can be reduced, and problems such as wear, noise or instability of the device caused by collision can be avoided.

[0077] In this embodiment, the outer circumferential surface of the guide column 52 includes three planar structures 522 respectively connected by an arc surface, so as to reduce the interference between the guide column 52 and related components as much as possible, and also make the guide column 52 more easily inserted into the guide hole 511, thereby reducing the assembly difficulty of the guide mechanism 50.

[0078] In this way, the contact area between the guide column 52 and the guide hole 511 can be reduced as much as possible, and the friction between the guide column 52 and the guide seat 51 can be reduced, thereby improving the smoothness of the relative movement between the adsorption component 30 and the fixed seat 10.

[0079] In summary, the flexible suction piece device connects the fixed seat 10 and the adsorption component 30 by using the flexible connecting piece 20 and the guide mechanism 50, so that the adsorption component 30 can be flexibly suspended below the fixed seat 10, and the self-weight of the adsorption component 30 can be used to realize the self-adaptive leveling purpose with the target object (wafer), while ensuring the stable connection between the adsorption component 30 and the fixed seat 10, and ensuring that the flexible suction piece device as a whole can complete the preliminary adjustment of the relative position with the wafer under the driving of the external motion system, thereby meeting the basic functional requirements of the suction piece device, making the cooperation between the adsorption component 30 and the wafer more stable, avoiding the breakage of the wafer due to excessive pressure, effectively reducing the material cost generated in the wafer processing process, and improving the precision of the corresponding process.

[0080] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", etc. orientation or position relationship are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used to distinguish in the description, and have no special meaning.

[0081] In the description of the present specification, the description referring to the terms "an embodiment", "an example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0082] In addition, it should be understood that, although the present specification is described in terms of embodiments, not every embodiment contains only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

[0083] The technical principles of the present application are described above in combination with specific embodiments. These descriptions are only for the purpose of explaining the principles of the present application, and cannot be interpreted in any way as a limitation on the scope of protection of the present application. Based on the explanation here, those skilled in the art can think of other specific embodiments of the present application without creative labor, and these ways will fall within the scope of protection of the present application.

Claims

1. A flexible sheet-suction device, characterized in that The utility model provides a kind of adjustable adsorption device, including: Fixed seat (10), the lower side of the fixed seat (10) is provided with flexible connecting piece (20); Suction component (30), the suction component (30) is hoisted below the fixed seat (10) by the flexible connecting piece (20), the flexible connecting piece (20) allows the suction component (30) to be inclined relative to the fixed seat (10) under external force, realize the horizontal adjustment of the suction component (30).

2. The flexible lollipop device of claim 1, wherein, Adjusting mechanism (40) is further provided between the flexible connecting piece (20) and the fixed seat (10), and the adjusting mechanism (40) is movably connected to the fixed seat (10) and / or the suction component (30) in the up-down direction.

3. The flexible pick-up device according to claim 2, characterized in that The adjusting mechanism (40) includes: Adjusting stud (41), screw thread is connected to the fixed seat (10); Connecting rod (42), rotatably connected to the adjusting stud (41) by bearing (43), and the connecting rod (42) is coaxially arranged with the adjusting stud (41), and the flexible connecting piece (20) is mounted on the connecting rod (42).

4. The flexible lollipop device of any one of claims 1-3, wherein, The flexible connecting piece (20) is provided as a plurality of flexible connecting pieces (20), and the plurality of flexible connecting pieces (20) are equidistantly arranged on the fixed seat (10) in the circumferential direction. Each of the flexible connecting pieces (20) is movably connected to the fixed seat (10) in the up-down direction by an adjusting mechanism (40).

5. The flexible pick-up device according to claim 4, characterized in that The flexible connecting piece (20) is provided as a tension spring.

6. The flexible pick-up device of claim 1, wherein, The fixed seat (10) and the suction component (30) are further provided with a guide mechanism (50), and the guide mechanism (50) is provided as a plurality of guide mechanisms (50), and the plurality of guide mechanisms (50) are equidistantly connected to the fixed seat (10) and the suction component (30) in the circumferential direction. Each of the guide mechanisms (50) is used for guiding the suction component (30) at the corresponding position to move in the up-down direction relative to the fixed seat (10).

7. The flexible pick-up device according to claim 6, characterized in that The guide mechanism (50) includes: Guide seat (51), fixedly mounted on the fixed seat (10), and a downward guide hole (511) is formed in the guide seat (51); Guide column (52), one end of the guide column (52) is fixedly connected to the suction component (30), and the other end of the guide column (52) is movably inserted into the guide seat (51).

8. The flexible pick-up device according to claim 7, characterized in that A plurality of mounting holes (11) are formed in the fixed seat (10) and penetrate the upper and lower sides of the fixed seat (10), each of the guide seats (51) is mounted on the fixed seat (10) through the mounting hole (11), and the guide hole (511) penetrates the upper and lower ends of the guide seat (51); Each of the guide columns (52) movably passes through each of the guide holes (511), and one end of the guide column (52) away from the suction component (30) is provided with a limiting piece (521), and the limiting piece (521) can abut against the guide seat (51) to limit the guide column (52) from being separated from the guide seat (51).

9. The flexible suction cup device of claim 7 or 8, wherein, The outer circumferential surface of the guide column (52) is provided with a plurality of planar structures (522), and any two adjacent planar structures (522) are connected by a circular arc surface.

10. The flexible pick-up device according to claim 1, characterized in that The adsorption component (30) is a ceramic suction cup.

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