Chip heat dissipation device

Abstract

The utility model provides a chip heat dissipation device, which comprises a heat conduction module and a radiator, and is characterized in that the heat conduction module is mounted on the bottom surface of the radiator; an air inlet hole is formed in the side face of the radiator, and the top face of the radiator inclines downwards from the end close to the air inlet hole to the end away from the air inlet hole. A plurality of radiating fins and air outlet holes are arranged on the top surface of the radiator, the air outlet holes are located among the radiating fins, and a radiating channel communicated with the air outlet holes and the air inlet holes is arranged in the radiator. The top face of the radiator inclines downwards from the end close to the air inlet hole to the end away from the air inlet hole, the air pressure of the air outlet in the air inlet side is higher than that of the air outlet away from the air inlet, part of airflow flows to the low-pressure area from the high-pressure area along the inclined upper surface of the radiator, and dust slides off from the radiator. Therefore, dust accumulated on the surface of the radiator is automatically removed while heat dissipation is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor chips, in particular to a chip heat dissipation device. BACKGROUND

[0002] At present, the existing chip heat dissipation methods mainly adopt the following ways: 1. The heat dissipation device + semiconductor heat conductor, specifically, the semiconductor heat conductor is attached to the chip, and the semiconductor heat conductor and the chip are coated with heat-conducting silicone grease. A voltage is applied to the power semiconductor to transfer heat from the chip to the heat dissipation device. 2. The main difference between the first heat dissipation method is that the heat dissipation device is embedded with vacuum or filled with liquid (water, oil, etc.) copper pipe. The heat is quickly transferred from the heat transfer base to the outer surface of the heat dissipation device through the copper pipe, improving the heat dissipation effect. The above two methods do not have the function of removing dust. With the passage of time, dust will gradually accumulate on the surface of the heat dissipation device, reducing the heat dissipation efficiency of the heat dissipation device. SUMMARY

[0003] The purpose of the present application is to provide a chip heat dissipation device that utilizes the flow characteristics of air flow on an inclined surface to automatically remove dust and improve the heat dissipation efficiency of the heat dissipation device.

[0004] A chip heat dissipation device, comprising a heat conduction module and a heat dissipation device, the heat conduction module is installed on the bottom surface of the heat dissipation device; the side surface of the heat dissipation device is provided with an air inlet hole, and the top surface of the heat dissipation device is inclined downward from one end close to the air inlet hole to one end away from the air inlet hole; the top surface of the heat dissipation device is provided with a plurality of heat dissipation fins and an air outlet hole, the air outlet hole is located between the heat dissipation fins, and the heat dissipation device is provided with a heat dissipation channel communicating with the air outlet hole and the air inlet hole.

[0005] Compared with the prior art, the chip heat dissipation device provided by the present application combines a heat conductor, a heat dissipation device and an air pump, wherein the chip is fixedly connected to the lower end of the heat conductor, and the upper end of the heat conductor is tightly connected to the lower end of the heat dissipation device, thereby realizing the conduction of heat from the chip to the heat dissipation device for heat dissipation. In particular, the top surface of the heat dissipation device is inclined downward from one end close to the air inlet hole to one end away from the air inlet hole, and the air pressure of the air outlet hole on the air inlet side is higher than that of the air outlet hole away from the air inlet. When the air flow flows out of the air outlet hole, part of the air flow will flow from the high-pressure area to the low-pressure area along the inclined top surface of the heat dissipation device, enhancing the removal effect of dust particles and causing the dust to slide off the heat dissipation device, thereby automatically removing the dust accumulated on the surface of the heat dissipation device while dissipating heat, which effectively reduces the maintenance cost of the heat dissipation system and improves the heat dissipation efficiency of the heat dissipation device.

[0006] Further, the air outlet hole is perpendicular to the bottom surface of the heat dissipation device.

[0007] Further, the air outlet hole is communicated with one end of the heat dissipation channel, and extends to the top surface of the heat sink in a direction away from the air inlet hole.

[0008] Further, gaps exist between the heat dissipation fins, and at least one air outlet hole is arranged on the gaps.

[0009] Further, the air outlet holes are uniformly arranged on the gaps in the length direction of the gaps.

[0010] Further, at least one air inlet hole is respectively communicated with each air outlet hole through at least one heat dissipation channel.

[0011] Further, the heat dissipation channels are respectively arranged in the heat sink in the length direction of the gaps, and the air inlet hole is respectively communicated with the air outlet hole on the corresponding gap through the heat dissipation channel.

[0012] Further, the heat conduction module comprises heat conduction silicone grease and a heat conduction device, and the heat conduction silicone grease is uniformly arranged between the heat conduction device and the heat sink.

[0013] Further, the heat conduction device is a copper heat conduction device, and the heat sink is an aluminum heat conduction device.

[0014] In order to more clearly understand the present application, the specific embodiments of the present application will be described below in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a chip heat dissipation device of the present application.

[0016] Figure 2 It is a partial structural schematic diagram of a chip heat dissipation device of the present application. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical scheme and advantages of the present application clearer, the embodiments of the present application will be further described in detail below in conjunction with the accompanying drawings.

[0018] The technical scheme of the embodiments of the present application will be clearly and completely described below in conjunction with the drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor are within the protection scope of the present application. It can be understood that the drawings are only provided for reference and illustration, and are not used to limit the present application. The connection relationship shown in the drawings is only for the purpose of clear description, and does not limit the connection mode.

[0019] It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component, or there may be an intervening component. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be noted that, unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly, for example, as a fixed connection, a detachable connection, or an integral connection; as a mechanical connection or an electrical connection; or as a connection within two components. For those skilled in the art, the above terms can be understood in the context of this utility model.

[0020] The specific meaning of the term in the description is not specified. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0021] It should also be noted that in the description of this application, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0022] Please see Figure 1 This application provides a chip heat dissipation device, including a heat-conducting module 1 and a heat sink 2. The heat-conducting module 1 is installed on the bottom surface of the heat sink 2. An air inlet 21 is provided on the side of the heat sink 2, and the top surface of the heat sink 2 slopes downward from the end near the air inlet 21 to the end away from the air inlet 21. A plurality of heat dissipation fins 22 and an air outlet 23 are provided on the top surface of the heat sink 2. The air outlet 23 is located between the heat dissipation fins 22, and a heat dissipation channel 24 is provided inside the heat sink 2, which connects the air outlet 23 and the air inlet 21.

[0023] In this embodiment, a chip heat dissipation device further includes a temperature sensor (not shown in the figure) for measuring the chip temperature and an air pump (not shown in the figure) for delivering airflow to the heat sink 1. The temperature sensor is electrically connected to the chip, and the air pump is electrically connected to the chip.

[0024] The temperature sensor monitors the temperature of the chip in real time and sends the temperature data to the chip integrated with the temperature data processing function, when the temperature data is lower than the preset threshold, the heat of the chip is conducted to the heat sink 2 by the heat conductor 1, and the heat is radiated to the air through the heat conductor 1 and the heat sink 2, at this time, the part of dust falling on the inclined upper end of the heat sink 2 can slide out of the heat sink 2 under the action of gravity, achieving the purpose of dust removal; when the temperature data is higher than the preset threshold, the chip outputs a PWM control signal to the air pump to control the working state of the air pump, and the air pump sends airflow into the heat dissipation channel 24 through the air inlet hole 21 and flows out from the air outlet hole 23, which can effectively take away the heat of the heat sink 2. In addition, since the upper end of the heat sink 2 is downwardly inclined from the end close to the air inlet hole 21 to the end away from the air inlet hole 21, a gas pressure gradient is formed, in which the gas pressure of the air outlet on the air inlet side is higher than that of the air outlet away from the air inlet, which promotes part of the airflow to flow along the inclined upper end of the heat sink 2, thereby driving the dust to move along the inclined surface of the heat sink and finally slide off the heat sink.

[0025] Compared with the prior art, the chip heat dissipation device provided by the application combines the heat conductor, the heat sink and the air pump, wherein the chip is fixedly connected with the heat conductor, the heat conductor is tightly connected with the heat sink, the heat of the chip is conducted to the heat sink, the upper end of the heat sink is provided with a plurality of heat dissipation fins to increase the contact area of the airflow with the heat sink, thereby increasing the heat dissipation area and improving the heat dissipation effect of the heat sink. In particular, the top surface of the heat sink is downwardly inclined from the end close to the air inlet hole to the end away from the air inlet hole, and the gas pressure of the air outlet on the air inlet side is relatively higher than that of the air outlet away from the air inlet. When the airflow flows out of the air outlet hole, part of the airflow flows along the inclined upper surface of the heat sink from the high-pressure area to the low-pressure area, thereby enhancing the removal effect of the dust particles and causing the dust to slide off the heat sink, so that the dust accumulated on the surface of the heat sink is automatically removed while the heat is dissipated, which effectively reduces the maintenance cost of the heat dissipation system and improves the heat dissipation efficiency of the heat sink.

[0026] In other embodiments, for the chip without integrated temperature data processing function, the chip heat dissipation device provided by the application further comprises a microprocessor (not labeled in the figure), which is connected with the temperature sensor and the air pump, respectively. The temperature sensor sends the temperature data to the microprocessor, and when the temperature data is higher than the preset threshold, the microprocessor outputs a PWM control signal to the air pump to control the working state of the air pump.

[0027] In one embodiment, please refer to Figure 2 , Figure 2Fig. 1 is a schematic diagram of a part of a chip heat dissipation device according to the present application. The air outlet hole 23 is perpendicular to the bottom surface of the heat sink 2. Of course, in other embodiments, in order to improve the dust removal effect, the air outlet hole 23 is arranged to extend obliquely from the end communicating with the heat dissipation channel 24 to the top surface of the heat sink 2 in a direction away from the air inlet hole 21. By this design, the flow path of the air flow is optimized, and more air flow flows along the oblique upper surface of the heat sink during the process of flowing out of the air outlet hole 23, thereby enhancing the scouring force of the air flow, and more effectively removing the dust particles on the upper surface of the heat sink, and significantly improving the dust removal effect.

[0028] There is a gap between the heat dissipation fins 22, and at least one air outlet hole 23 is arranged on the gap, specifically, the air outlet holes 23 are uniformly arranged on the gap in the length direction of the gap, and at least one air inlet hole 21 is communicated with each air outlet hole 23 through at least one heat dissipation channel 24.

[0029] In the present embodiment, one air inlet hole 21 is arranged on the side surface of the heat sink 2, and one heat dissipation channel 24 is arranged in the heat sink 2. Of course, in other embodiments, the heat dissipation channel 24 can also be arranged in the heat sink 2 corresponding to the length direction of the gap, and the air inlet hole 21 is communicated with the air outlet hole 21 on the corresponding gap through the heat dissipation channel 24. In order to improve the air intake amount, the number of air inlet holes 21 corresponding to the number of gaps is arranged on the side surface of the heat sink 2, and each air inlet hole 21 is communicated with the air outlet hole 21 on the corresponding gap through the heat dissipation channel 24.

[0030] In one embodiment, the heat conduction module 1 includes heat conduction silicone grease and a heat conduction device, and the heat conduction silicone grease is uniformly arranged between the heat conduction device and the heat sink 2. The heat conduction silicone grease increases the contact area by filling the small concave-convex on the contact surface between the heat conduction device and the heat sink 2, thereby improving the efficiency of transferring the heat generated by the chip to the heat conduction device, and then to the heat sink 2.

[0031] The material of the heat conduction device 1 is a copper heat conduction device with a heat conduction rate of 401 w / m.k, and the material of the heat sink 2 is an aluminum heat sink with a heat conduction rate of 237 w / m.k. In other embodiments, the heat conduction device 1 and the heat sink 2 can also be made of other materials with good heat conduction performance.

[0032] The present application is not limited to the above embodiments, and various modifications and changes can be made to the present application without departing from the spirit and scope of the present application. If the modifications and changes belong to the scope of the claims and the equivalent technology of the present application, the present application also intends to include these modifications and changes.

Claims

1. A chip heat dissipating device, characterized by comprising: The heat conduction module is installed on the bottom surface of the heat sink, the side surface of the heat sink is provided with an air inlet hole, the top surface of the heat sink is downwardly inclined from the end close to the air inlet hole to the end far from the air inlet hole, the top surface of the heat sink is provided with a plurality of heat dissipation fins and an air outlet hole, the air outlet hole is located between the heat dissipation fins, and the heat sink is provided with a heat dissipation channel which is communicated with the air outlet hole and the air inlet hole.

2. The chip heat dissipating device according to claim 1, wherein The air outlet hole is perpendicular to the bottom surface of the heat sink.

3. The chip heat dissipating device according to claim 1, wherein The air outlet hole is inclined and extended to the top surface of the heat sink in the direction far from the air inlet hole from the end communicated with the heat dissipation channel.

4. The chip heat dissipating device according to claim 1, wherein There is a gap between the heat dissipation fins, and at least one air outlet hole is arranged on the gap.

5. The chip heat dissipating device according to claim 4, wherein The air outlet holes are uniformly arranged on the gap in the length direction of the gap.

6. The chip heat dissipating device according to claim 5, wherein At least one air inlet hole is respectively communicated with each air outlet hole through at least one heat dissipation channel.

7. The chip heat dissipating device according to claim 6, wherein In the length direction of the gap, the heat dissipation channels are correspondingly arranged in the heat sink, and the air inlet hole is respectively communicated with the air outlet hole on the corresponding gap through each heat dissipation channel.

8. The chip heat dissipating device according to claim 1, wherein The heat conduction module comprises heat conduction silicone grease and a heat conduction device, and the heat conduction silicone grease is uniformly arranged between the heat conduction device and the heat sink.

9. The chip heat dissipating device according to claim 8, wherein The heat conduction device is a copper heat conduction device.

10. The chip heat dissipating device according to claim 1, wherein The heat sink is an aluminum heat conduction device.

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