Cleaning device for silicon wafer processing
By designing a lifting plate and rinsing water tank system in the cleaning device, the problem of poor cleaning effect of water tank soaking was solved, achieving efficient cleaning of silicon wafer surface and ensuring the cleanliness and surface integrity of silicon wafer.
Patent Information
- Application Number
- CN202423319400.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-31
AI Technical Summary
In existing technologies, the water immersion coarse cleaning in silicon wafer processing is not effective and is difficult to completely remove surface microparticles and impurities, affecting the yield of subsequent process steps and device performance.
A cleaning device was designed, comprising a cleaning chamber, a drive chamber, a drive motor, a lifting plate, and a rinsing water tank. The lifting plate drives the rinsing water tank to move up and down, and combined with a placement plate and a rinsing probe, it achieves efficient rinsing and cleaning of silicon wafers.
This improved the cleaning effect on the silicon wafer surface, ensuring the integrity and smoothness of the silicon wafer surface, and providing a high-quality foundation for subsequent processes.
Smart Images
Figure CN223862381U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer processing, especially to a cleaning device for silicon wafer processing. BACKGROUND
[0002] Silicon wafer is the basic material of integrated circuits and other electronic devices, and has become the key basic material of modern electronic industry due to its excellent semiconductor characteristics, rich resources, good thermal stability and relatively low cost.
[0003] In the silicon wafer processing process, in order to ensure that the surface of the silicon wafer is not damaged, the silicon wafer is usually immersed in a water tank for rough cleaning. However, the rough cleaning effect of water tank immersion is relatively poor, and it is difficult to completely remove the small particles and impurities attached to the surface of the silicon wafer. Especially during the processing, the oil, chemicals or other pollutants generated during processing are easily left. It affects the subsequent process steps, such as photoetching, etching, etc., resulting in a decrease in process yield or unstable device performance. SUMMARY
[0004] The technical problem to be solved by the utility model is that the rough cleaning effect of water tank immersion is poor in the silicon wafer processing process, and it is difficult to completely remove the small particles and impurities on the surface.
[0005] In order to solve the above technical problems, the utility model adopts the following technical scheme: a cleaning device for silicon wafer processing, comprising a cleaning bin, the cleaning bin is set as a prism and has a cavity inside, two drive bins are fixedly arranged on the top of the cleaning bin, two push motors are fixedly arranged inside the drive bin, the output end of the push motor penetrates through the top of the cleaning bin, and the output end is fixedly connected with a lifting plate that can displace up and down, a flushing water tank is fixedly connected to the lifting plate, a storage rack is fixedly connected to the cleaning bin below the flushing water tank, a storage plate is slidingly connected to the storage rack, and a slot is formed on one side of the cleaning bin for the storage plate to move out.
[0006] As a further improvement of the utility model, the lifting plate is set as an I-shaped, and the output ends of the four push motors are fixedly connected to the four corners of the lifting plate.
[0007] As a further improvement of the utility model, the inner wall of the cleaning bin is provided with a capacity scale, and the capacity scale is vertically arranged with the bottom wall of the cleaning bin.
[0008] As a further improvement of the utility model, a sliding groove is formed in the top of the storage rack, the sliding groove is parallelly arranged with the bottom wall of the cleaning bin, and sliding blocks are fixedly arranged on both sides of the storage plate and slidingly connected with the sliding groove.
[0009] As a further improvement of the utility model, a plurality of flushing probes are fixedly arranged at the bottom of the flushing water tank, and a through slot for the flushing probes to pass through is arranged through the center of the lifting plate.
[0010] As a further improvement of the utility model, an ear plate is fixedly arranged at the top of the lifting plate, and the flushing water tank is fastened and connected with the ear plate through bolts.
[0011] The utility model discloses the beneficial effect: the utility model discloses two drive bins are fixedly arranged at the top of the cleaning bin, and two push motors are fixedly arranged at the two sides in each drive bin, and the push motor output is fixedly arranged at the four corners of the lifting plate of the I shape, and the lifting plate drives the up and down displacement of the flushing water tank, provides the stability reliability, the silicon wafer is arranged on the material placing plate, and the cleaning fluid for the silicon wafer soaking is arranged in the recess on the material placing plate, and the height of the flushing water tank is adjusted through the lifting plate during rough cleaning, and the washing operation of suitable force is carried out, and the cleaning effect is improved. DRAWINGS
[0012] Figure 1 It is the whole schematic view of the cleaning device for silicon wafer processing of the utility model;
[0013] Figure 2 It is the sectional view of the cleaning device for silicon wafer processing of the utility model;
[0014] Figure 3 It is the component display view of the cleaning device for silicon wafer processing of the utility model;
[0015] Figure 4 It is the local display view of the cleaning device for silicon wafer processing of the utility model.
[0016] As shown in the figure: 1, cleaning bin; 2, drive bin; 3, lifting plate; 4, flushing water tank; 5, material rack; 6, material placing plate; 7, sliding block; 8, flushing probe; 9, through slot; 10, ear plate. CONCRETE IMPLEMENTATION
[0017] In the present specification, the orientation terms such as up, down, left, right, front, back, front face, back face, top, bottom, etc. are defined relative to its structure, and they are relative concepts. Therefore, it is possible to change accordingly according to its different positions, different use states, so it should not be interpreted as a restrictive term.
[0018] In the present specification, the singular forms "a", "said" and "the" are intended to include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein means and includes any or all possible combinations of one or more associated listed items.
[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved in the present application more clear and explicit, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the embodiments described herein are only used to explain the present application and not used to limit the present application.
[0020] The utility model provides a cleaning device for silicon wafer processing Figures 1-4 As shown in a kind of cleaning device for silicon wafer processing, including cleaning bin 1, top of cleaning bin 1 is equipped with top cover, bottom is communicated with water outlet, cleaning bin 1 is set to prism and is equipped with cavity inside;Capacity scale is opened in the inner wall of cleaning bin 1, and capacity scale is vertically arranged with the bottom wall of cleaning bin 1;The capacity scale is used for the warning of the content of bin.The top of cleaning bin 1 is fixedly provided with two drive bins 2 on both sides, two push motors are fixedly arranged in the inside of drive bin 2, and the output end of push motor penetrates through the top of cleaning bin 1, and the output end is fixedly connected with the lifting plate 3 that can be displaced up and down, lifting plate 3 is set to I-shaped, and the output end of four push motors is fixedly connected with the four corners of lifting plate 3 respectively;For improving the stability when lifting plate 3 is displaced up and down.The lifting plate 3 is fixedly connected with flush water tank 4;Flush water tank 4 bottom is fixedly provided with multiple flush probes 8, and silicon wafer is flushed by flush probe 8, and the center of lifting plate 3 is fixedly provided with the through slot 9 for flush probe 8 to pass through;Lifting plate 3 top is fixedly provided with lug plate 10 on both sides, and flush water tank 4 is fixedly connected with lug plate 10 by bolt, and the structural connectivity is strengthened;The bolt and lug plate 10 are used to reinforce the connection between lifting plate 3 and flush water tank 4.The lower side of flush water tank 4 is equipped with the fixed connection of storage rack 5 with cleaning bin 1, and storage rack 5 is slidably connected with storage plate 6, and the top of storage plate is provided with recess for containing cleaning fluid and silicon wafer, and the top is provided with sliding groove, and the sliding groove is arranged in parallel with the bottom wall of cleaning bin 1, and the both sides of storage plate 6 are fixedly provided with the sliding block 7 slidably connected with sliding groove;For improving the separation guiding effect of storage plate 6 and storage rack 5.And the side of cleaning bin 1 is provided with the slot for the removal of storage plate 6, and the side of slot is fixedly provided with sealing plate.
[0021] Working principle: in the specific implementation of the utility model, first, the silicon wafer to be cleaned is placed in the recess at the top end of the storage plate 6, and cleaning soaking liquid is injected into the recess. The sliding guide of the sliding groove and the sliding block 7 of the storage plate 6 is moved downward, so that the storage plate 6 slides into the upper side of the storage rack 5 from the slot on one side of the cleaning bin 1, and the push motor in the two drive bins 2 is synchronously driven, so that the output end moves downward. When the flush probe 8 of the flush water tank 4 and the liquid level of the cleaning liquid soaked by the silicon wafer are 3 cm, start the flush probe 8, and clean and flush with 2MPa force, effectively clean the silicon wafer, to ensure good cleaning effect, effectively remove the surface contaminants of the silicon wafer, and at the same time maintain the integrity and smoothness of the surface of the silicon wafer, to provide high-quality basis for subsequent process.
[0022] The above embodiments are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that the technical solutions recorded in the foregoing embodiments can still be modified, or some technical features therein can be replaced by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A cleaning apparatus for silicon wafer processing, characterized in that: The cleaning chamber (1) is a prism with an internal cavity. Two drive chambers (2) are fixedly installed on both sides of the top of the cleaning chamber (1). Two drive motors are fixedly installed inside the drive chambers (2). The output end of the drive motor passes through the top of the cleaning chamber (1) and is fixedly connected to a lifting plate (3) that can move up and down. A rinsing water tank (4) is fastened to the lifting plate (3). A shelf (5) is fixedly connected to the cleaning chamber (1) below the rinsing water tank (4). A shelf (6) is slidably connected to the shelf (5). A slot for the shelf (6) to be moved out is opened on one side of the cleaning chamber (1).
2. The cleaning apparatus for silicon wafer processing according to claim 1, characterized in that: The lifting plate (3) is configured in the shape of an I-beam, and the output ends of the four drive motors are respectively fixedly connected to the four corners of the lifting plate (3).
3. The cleaning apparatus for silicon wafer processing according to claim 1, characterized in that: The inner wall of the cleaning chamber (1) is provided with a capacity scale, and the capacity scale is set perpendicular to the bottom wall of the cleaning chamber (1).
4. The cleaning apparatus for silicon wafer processing according to claim 1, characterized in that: The shelf (5) has a sliding groove on the top, which is parallel to the bottom wall of the cleaning chamber (1), and the shelf (6) has sliders (7) fixed on both sides that are slidably connected to the sliding groove.
5. A cleaning apparatus for silicon wafer processing according to claim 1, characterized in that: The bottom of the flushing water tank (4) is fixedly provided with multiple flushing probes (8), and the center of the lifting plate (3) is provided with a through groove (9) for the flushing probes (8) to pass through.
6. The cleaning apparatus for silicon wafer processing according to claim 1, characterized in that: The lifting plate (3) has ear plates (10) fixedly installed on both sides of its top, and the flushing water tank (4) is fastened to the ear plates (10) by bolts.