Silicon wafer cleaning device for industrial batch production

Abstract

The utility model relates to the technical field of silicon wafer cleaning, in particular to a silicon wafer cleaning device for industrial batch production, which comprises a top frame, an annular slide rail and an annular water delivery tank, the annular slide rail is synchronously, annularly and slidably connected with a plurality of U-shaped cleaning frames, chucks are mounted on two sides of each U-shaped cleaning frame, and the chucks can rotate. A to-be-cleaned silicon wafer is detachably clamped between the two chucks, and a plurality of cleaning assemblies are installed on the side wall of the inner circumference of the annular water feeding tank in an equally-divided circumferential mode. According to the silicon wafer cleaning device, multi-surface jet impact is carried out on the silicon wafer through the cleaning assemblies at multiple positions, so that multi-surface dead-corner-free cleaning operation on the silicon wafer is achieved, and after the U-shaped cleaning frame slides along the annular sliding rail for a circle, the silicon wafer cleaned once enters the cleaning position again, and the cleaning efficiency is improved. And then the cleaning assemblies at different positions spray and clean the silicon wafer again, so that multi-surface dead-corner-free washing of the silicon wafer is further enhanced, and on the other hand, batch cleaning operation is facilitated.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cleaning technology, specifically to a silicon wafer cleaning device for industrial mass production. Background Technology

[0002] Silicon wafers are an important material for manufacturing integrated circuits and are quietly entering the fields of aviation, aerospace, industry, agriculture, and defense, as well as every household. The enormous power of this tiny silicon wafer is something our predecessors could never have imagined. During the processing of silicon wafers, they need to go through processes such as surface shaping, orientation, cutting, grinding, etching, polishing, and cleaning. When cleaning silicon wafers, a corresponding silicon wafer cleaning machine is needed, which involves clamping the silicon wafers between wafer holders and completing the cleaning operation under the continuous spraying and rinsing of cleaning fluid.

[0003] In the actual cleaning process, the silicon wafers to be cleaned need to be clamped and fixed between the wafer holders, and then the different surfaces of the silicon wafers are rinsed by spraying water cleaning solution. However, the existing cleaning equipment can often only perform a single cleaning operation, that is, the silicon wafers need to be reloaded after one cleaning before they can return to the original cleaning position. This is not conducive to double-sided cleaning without dead angles, nor is it conducive to batch cleaning.

[0004] Therefore, it is necessary to invent a silicon wafer cleaning device for industrial mass production to solve the above problems. Utility Model Content

[0005] To address the shortcomings of existing technologies, the purpose of this utility model is to provide a silicon wafer cleaning device for industrial mass production. This device solves the problem that existing cleaning devices often only perform single-pass cleaning operations, meaning that after one cleaning, the silicon wafers need to be reloaded before returning to their original cleaning position. This is not conducive to double-sided cleaning without dead angles, nor is it suitable for mass cleaning.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A silicon wafer cleaning device for industrial mass production includes a top frame, an annular slide rail detachably installed below the top frame, and an annular water tank detachably disposed between the top frame and the annular slide rail. The annular slide rail is synchronously and slidably connected to multiple U-shaped cleaning frames. Each U-shaped cleaning frame has a clamping plate that can extend and retract toward the center of the U-shaped cleaning frame installed on both sides, and the clamping plate is rotatable. The silicon wafer to be cleaned is detachably clamped between two of the clamping plates. The inner circumferential sidewall of the annular water tank is equally divided into multiple cleaning components that can spray water onto the silicon wafer for cleaning.

[0008] As a preferred embodiment of the present invention, the cleaning assembly includes a connecting pipe, a horizontal pipe disposed at one end of the connecting pipe, and a plurality of spray nozzles disposed on the periphery of the horizontal pipe. The plurality of spray nozzles all point towards the center of the annular slide rail. The other end of the connecting pipe away from the horizontal pipe is detachably installed to the inner periphery of the annular water tank.

[0009] As a preferred embodiment of this utility model, the annular water tank is semi-circular in shape and located on the upper half of the annular slide rail.

[0010] As a preferred embodiment of this utility model, a slide block is detachably threadedly installed on one side of the U-shaped cleaning rack near the center of the annular slide rail. The slide block is slidably connected to the annular slide rail. Telescopic components are installed on the end faces of both sides of the U-shaped cleaning rack, and the telescopic components can extend and retract towards the center of the U-shaped cleaning rack. The clamping plate is rotatably connected to the other end of the telescopic component. An annular baffle plate can be detachably installed between two adjacent U-shaped cleaning racks.

[0011] As a preferred embodiment of this utility model, side brackets can be detachably installed on the end faces of both sides of the top frame, and a disc can be detachably clamped between the two side brackets. The annular slide rail can be detachably installed on the circumferential side wall of the disc.

[0012] As a preferred embodiment of this utility model, side plates are extended and installed on both sides of the top frame, and side mounting brackets are extended and installed at the corresponding positions on the outer peripheral sidewall of the annular water supply tank. The side plates and side mounting brackets on the same side are detachably connected by connectors, and an inlet pipe is installed on the top of the outer peripheral sidewall of the annular water supply tank.

[0013] The technical effects and advantages provided by this utility model in the above technical solution are as follows:

[0014] In this invention, multiple U-shaped cleaning racks slide synchronously along an annular slide rail, allowing for the simultaneous cleaning of multiple silicon wafers. This facilitates batch cleaning operations. During the actual cleaning process, a silicon wafer can be held between two clamping plates within the same U-shaped cleaning rack. As the U-shaped cleaning rack slides along the annular slide rail, cleaning components pointing towards the center of the annular slide rail spray cleaning fluid onto the silicon wafer. Under the impact of the sprayed cleaning fluid, the silicon wafer rotates between the two clamping plates, ensuring it remains in a rotating state as it passes through cleaning components at different positions. This allows for multi-faceted spraying and impacting of the silicon wafer by cleaning components at multiple positions, achieving a thorough, multi-faceted cleaning operation. After the U-shaped cleaning rack completes one revolution along the annular slide rail, the cleaned silicon wafer re-enters the cleaning position, where it is then sprayed and cleaned again by cleaning components at different positions, further enhancing the thorough, multi-faceted cleaning of the silicon wafer and facilitating batch cleaning operations. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 This is a front view structural diagram of the present utility model;

[0017] Figure 3 This is a side view of the structure of this utility model.

[0018] Explanation of reference numerals in the attached figures:

[0019] 1. Top frame; 2. Disc; 3. Circular slide rail; 4. Slide seat; 5. U-shaped cleaning rack; 6. Telescopic component; 7. Clamping plate; 8. Circular baffle plate; 9. Circular water supply tank; 10. Connecting pipe; 11. Horizontal pipe; 12. Spray nozzle; 13. Side plate; 14. Side mounting bracket; 15. Connecting component; 16. Water inlet pipe; 17. Side support. Detailed Implementation

[0020] The present invention will be further described below with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present invention, and should not be used to limit the scope of protection of the present invention.

[0021] This utility model provides, for example Figure 1-3 The silicon wafer cleaning device shown includes a top frame 1, an annular slide rail 3 detachably installed below the top frame 1, and an annular water tank 9 detachably disposed between the top frame 1 and the annular slide rail 3. The annular slide rail 3 is synchronously and slidably connected to multiple U-shaped cleaning racks 5. Each U-shaped cleaning rack 5 has a clamping plate 7 that can extend and retract toward the center of the U-shaped cleaning rack 5 installed on both sides. The clamping plate 7 is rotatable. The silicon wafer to be cleaned is detachably clamped and disposed between two clamping plates 7. The inner circumferential sidewall of the annular water tank 9 is equally divided into multiple cleaning components that can spray water onto the silicon wafer for cleaning. The two clamping plates 7 can move closer or further apart under the extension and retraction drive, thereby enabling rinsing of silicon wafers of different sizes that are clamped and fixed.

[0022] The cleaning assembly includes a connecting pipe 10, a horizontal pipe 11 located at one end of the connecting pipe 10, and multiple spray nozzles 12 located on the periphery of the horizontal pipe 11. All spray nozzles 12 point towards the center of the annular slide rail 3. The other end of the connecting pipe 10 away from the horizontal pipe 11 is detachably installed on the inner periphery of the annular water tank 9. Multiple spray nozzles 12 are provided on a single horizontal pipe 11, thereby spraying and impacting a single silicon wafer from different directions at multiple angles, thereby improving the cleaning intensity of a single cleaning operation.

[0023] The annular water tank 9 is semi-circular in shape and located on the upper part of the annular slide rail 3. When part of the U-shaped cleaning rack 5 is located in the cleaning position of the annular water tank 9, part of the U-shaped cleaning rack 5 is located below the annular slide rail 3, which facilitates the loading and unloading of silicon wafers in this part of the U-shaped cleaning rack 5.

[0024] A slide block 4 is detachably threaded onto one side of the U-shaped cleaning rack 5 near the center of the annular slide rail 3. The slide block 4 is slidably connected to the annular slide rail 3. Telescopic components 6 are installed on the end faces of both sides of the U-shaped cleaning rack 5, and the telescopic components 6 can extend and retract toward the middle of the U-shaped cleaning rack 5. The clamping plate 7 is rotatably connected to the other end of the telescopic component 6. An annular baffle plate 8 can be detachably installed between two adjacent U-shaped cleaning racks 5. The telescopic component 6 can change the distance between the two clamping plates 7, which is convenient for clamping and fixing silicon wafers of different sizes.

[0025] Side brackets 17 can be detachably installed on both ends of the top frame 1. A disc 2 can be detachably clamped between the two side brackets 17. An annular slide rail 3 can be detachably installed on the side wall of the disc 2. The side brackets 17 can fix the disc 3 and the annular slide rail 3 in the position below the top frame 1.

[0026] Side plates 13 are extended on both sides of the top frame 1, and side mounting brackets 14 are extended on the outer periphery of the annular water tank 9 at the matching positions. The side plates 13 and the side mounting brackets 14 on the same side are detachably connected by connectors 15. A water inlet pipe 16 is installed on the top of the outer periphery of the annular water tank 9.

[0027] In this invention, multiple U-shaped cleaning racks 5 slide synchronously along annular slide rail 3, allowing for the simultaneous cleaning of multiple silicon wafers. This facilitates batch cleaning operations. During the actual cleaning process, a silicon wafer can be held between two clamping plates 7 within the same U-shaped cleaning rack 5. As the U-shaped cleaning rack 5 slides along the annular slide rail 3, cleaning components pointing towards the center of the annular slide rail 3 spray cleaning fluid onto the silicon wafer. Under the impact of the sprayed cleaning fluid, the silicon wafer rotates between the two clamping plates 7, ensuring that the silicon wafer remains in a rotating state as it passes through cleaning components at different positions. This allows for multi-faceted spraying and impacting of the silicon wafer by cleaning components at multiple positions, achieving a thorough, multi-faceted cleaning operation without dead angles. After the U-shaped cleaning rack 5 slides one revolution along the annular slide rail 3, the cleaned silicon wafer re-enters the cleaning position and is then sprayed and cleaned again by cleaning components at different positions, further enhancing the thorough, multi-faceted cleaning of the silicon wafer and facilitating batch cleaning operations.

[0028] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A silicon wafer cleaning device for industrial mass production, characterized in that: The device includes a top frame (1), an annular slide rail (3) detachably installed below the top frame (1), and an annular water tank (9) detachably disposed between the top frame (1) and the annular slide rail (3). The annular slide rail (3) is synchronously and annularly slidably connected to multiple U-shaped cleaning racks (5). Each U-shaped cleaning rack (5) has a clamping plate (7) that can extend and retract toward the center of the U-shaped cleaning rack (5) on both sides. The clamping plate (7) is rotatable. The silicon wafer to be cleaned is detachably clamped between two clamping plates (7). The inner circumferential sidewall of the annular water tank (9) is equally divided into multiple cleaning components that can spray water onto the silicon wafer for cleaning.

2. The silicon wafer cleaning device for industrial mass production according to claim 1, characterized in that: The cleaning assembly includes a connecting pipe (10), a horizontal pipe (11) at one end of the connecting pipe (10), and a plurality of spray nozzles (12) on the periphery of the horizontal pipe (11). The plurality of spray nozzles (12) all point towards the center of the annular slide rail (3). The other end of the connecting pipe (10) away from the horizontal pipe (11) is detachably installed on the inner periphery of the annular water tank (9).

3. The silicon wafer cleaning device for industrial mass production according to claim 1, characterized in that: The annular water tank (9) is semi-circular in shape and is located on the upper half of the annular slide rail (3).

4. A silicon wafer cleaning device for industrial mass production according to claim 1, characterized in that: The U-shaped cleaning rack (5) has a detachable threaded slide block (4) on one side near the center of the annular slide rail (3). The slide block (4) is slidably connected to the annular slide rail (3). Telescopic components (6) are installed on the end faces of both sides of the U-shaped cleaning rack (5), and the telescopic components (6) can extend and retract toward the middle of the U-shaped cleaning rack (5). The clamp (7) is rotatably connected to the other end of the telescopic component (6). An annular baffle plate (8) can be detachably installed between two adjacent U-shaped cleaning racks (5).

5. A silicon wafer cleaning device for industrial mass production according to claim 1, characterized in that: Side brackets (17) can be detachably installed on the end faces of both sides of the top frame (1), and a disc (2) can be detachably clamped between the two side brackets (17). The annular slide rail (3) can be detachably installed on the side wall of the disc (2).

6. A silicon wafer cleaning device for industrial mass production according to claim 1, characterized in that: Side plates (13) are extended on both sides of the top frame (1), and side mounting brackets (14) are extended on the outer peripheral sidewall of the annular water tank (9). The side plates (13) and side mounting brackets (14) on the same side are detachably connected by connectors (15). A water inlet pipe (16) is installed on the top of the outer peripheral sidewall of the annular water tank (9).

Images