A cutting silicon core discharging device for single crystal silicon processing

Abstract

The utility model relates to monocrystalline silicon processing technical field, and disclose a cutting silicon core blanking device for monocrystalline silicon processing, including guide table, guide chute, protective layer, transport device, conveyer belt, fixed clamp holder, adjustable clamp holder, limit hole, screw shaft, clamping layer, nut, in the utility model, when the monocrystalline silicon rod is cut by diamond wire and forms the silicon wafer blanking, the silicon wafer can be buffered and received by the protective layer and downwardly rolls and guides, and the fixed clamp holder and adjustable clamp holder on the conveyer belt correspond to the position of guide chute, at this time, the silicon wafer can roll down and fall into the fixed clamp holder and adjustable clamp holder between the guide chute and be collected, and the clamping layer between the fixed clamp holder and adjustable clamp holder can clamp and protect the falling silicon wafer, and the adjustable clamp holder can be located outside the screw shaft and slide and adjust to adapt to the silicon wafer thickness, when the transport device drives the conveyer belt and starts conveying, the silicon wafer between the fixed clamp holder and adjustable clamp holder can be automatically collected and conveyed.

Description

Technical Field

[0001] This utility model relates to the field of monocrystalline silicon processing technology, and in particular to a cutting and unloading device for monocrystalline silicon processing. Background Technology

[0002] Monocrystalline silicon, as a relatively reactive non-metallic element crystal, is an important component of crystalline materials and is at the forefront of new material development. The manufacturing process of monocrystalline silicon involves the following steps: quartz sand – metallurgical-grade silicon – purification and refining – deposition of polycrystalline silicon ingots – monocrystalline silicon – silicon wafer cutting. Its main applications are as a semiconductor material and in solar photovoltaic power generation and heating.

[0003] Existing monocrystalline silicon is formed into monocrystalline silicon rods by rotating and pulling them upwards using the Czochralski method, and then cut into silicon wafers. However, during the cutting and unloading process, the silicon wafers are collected by a receiving assembly and placed manually, which makes them prone to damage during unloading and limits the conveying efficiency. To address this, we propose a cutting and unloading device for monocrystalline silicon processing. Utility Model Content

[0004] The present invention mainly addresses the technical problems existing in the prior art and provides a cutting and unloading device for single crystal silicon processing.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a silicon core cutting and unloading device for single-crystal silicon processing, comprising a guide platform, a guide groove inside the guide platform, a protective layer on the inner side of the guide groove, a transport device on one side of the guide platform, a transmission belt inside the transport device, a fixed clamp mounted on the surface of the transmission belt, an adjustable clamp slidably mounted on one side of the fixed clamp, a limit hole inside the adjustable clamp, a screw shaft through the limit hole mounted on one side of the fixed clamp, a clamping layer between the fixed clamp and the adjustable clamp, and a nut threaded onto one end of the screw shaft.

[0006] Preferably, the inside of the guide trough is a trapezoidal hollow trough and the inside of the guide trough becomes narrower from one side to the other. The bottom side of the guide trough is an inclined trough surface. The protective layer is made of a soft material and has deformation characteristics. The protective layer has the same internal structure as the guide trough.

[0007] Preferably, when the silicon core material falls into the protective layer inside the guide trough, the silicon core material is in a downward rolling guide feeding state through the protective layer.

[0008] Preferably, when the silicon core material falls between the fixed clamp and the adjustable clamp, both the fixed clamp and the adjustable clamp are clamped and protected by a clamping layer, and the adjustable clamp is located outside the screw shaft through a limiting hole and is in a sliding and adjustable state.

[0009] Preferably, cleaning brushes are equidistantly arranged on both sides of the interior of the protective layer, and wiping cotton is connected to the outlet positions on both sides of the interior of the protective layer. The wiping cotton is made of sponge material and has adsorption properties.

[0010] Preferably, when the silicon core material moves within the protective layer inside the guide trough, both sides of the silicon core material are initially cleaned by cleaning brushes, and when the silicon core material passes through two sets of wiping cotton, both sides of the silicon core material are wiped and adsorbed by the wiping cotton.

[0011] This invention provides a silicon core cutting and blanking device for single-crystal silicon processing. It has the following beneficial effects:

[0012] 1. A single-crystal silicon core cutting and unloading device for processing single-crystal silicon. In this invention, when the single-crystal silicon rod is cut into silicon wafers by diamond wire cutting, the silicon wafers fall into the protective layer inside the guide trough. The bottom side of the guide trough is inclined downwards. At this time, the silicon wafers can first pass through the protective layer for buffering and receiving and then roll downwards. The fixed clamps and adjustable clamps on the conveyor belt correspond to the positions of the guide trough. The silicon wafers can then roll down through the guide trough into the space between the fixed clamps and the adjustable clamps for collection. The clamping layer between the fixed clamps and the adjustable clamps can clamp and protect the falling silicon wafers. The adjustable clamps can be located outside the screw shaft for adaptive sliding adjustment to adapt to the thickness of the silicon wafers. When the conveyor belt is started to transport the silicon wafers, the silicon wafers between the fixed clamps and the adjustable clamps can be automatically collected and transported, thereby improving the protection and conveying efficiency of silicon wafer unloading.

[0013] 2. A silicon core cutting and unloading device for monocrystalline silicon processing, wherein a cleaning brush and a wiping cotton are respectively provided on the inner side of the protective layer. When the silicon wafer falls into the protective layer, the silicon wafer will tilt and roll downward through the protective layer. At this time, the two sides of the silicon wafer can be cleaned by friction by the cleaning brush. When the silicon wafer passes through the two sets of cleaning brushes, the water stains remaining on the two sides of the silicon wafer can be wiped and absorbed by the wiping cotton, ensuring the cleanliness of the silicon wafer itself, thereby improving the quality of subsequent processing of the silicon wafer. Attached Figure Description

[0014] To more clearly illustrate the embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings in the following description are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0015] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This utility model Figure 1 Enlarged view of A in the middle;

[0018] Figure 3 This utility model Figure 1 Enlarged view of B in the middle;

[0019] Figure 4 This utility model Figure 1 A magnified view of C.

[0020] Legend:

[0021] 1. Guide platform; 2. Guide trough; 3. Protective layer; 4. Conveying device; 5. Conveyor belt; 6. Fixed clamp; 7. Adjustable clamp; 8. Limiting hole; 9. Screw; 10. Clamping layer; 11. Nut; 12. Cleaning brush; 13. Wiping cotton. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Example: A silicon core cutting and blanking device for monocrystalline silicon processing, such as... Figures 1-4As shown, the device includes a guide platform 1, a guide groove 2 inside the guide platform 1, a protective layer 3 on the inner side of the guide groove 2, a conveyor device 4 on one side of the guide platform 1, a conveyor belt 5 inside the conveyor device 4, a fixed clamp 6 on the surface of the conveyor belt 5, an adjustable clamp 7 slidably mounted on one side of the fixed clamp 6, a limit hole 8 inside the adjustable clamp 7, a screw 9 through the limit hole 8 on one side of the fixed clamp 6, a clamping layer 10 between the fixed clamp 6 and the adjustable clamp 7, a nut 11 threaded onto one end of the screw 9, cleaning brushes 12 equidistantly arranged on both sides inside the protective layer 3, and wiping cotton 13 connected to the outlet positions on both sides inside the protective layer 3. The wiping cotton 13 is made of sponge material and has adsorption properties.

[0024] Furthermore, the inside of the guide trough 2 is a trapezoidal hollow trough, and the inside of the guide trough 2 becomes narrower from one side to the other. The bottom side of the guide trough 2 is an inclined trough surface. The protective layer 3 is made of a soft material and has deformation characteristics. The protective layer 3 has the same internal structure as the guide trough 2.

[0025] Furthermore, when the silicon core material falls into the protective layer 3 inside the guide trough 2, the silicon core material is in a downward rolling guide feeding state through the protective layer 3.

[0026] Furthermore, when the silicon core material falls between the fixed clamp 6 and the adjustable clamp 7, the fixed clamp 6 and the adjustable clamp 7 are both clamped and protected by the clamping layer 10. The adjustable clamp 7 is located outside the screw shaft 9 through the limiting hole 8 and is in a sliding and adjustable state.

[0027] Furthermore, when the silicon core material moves within the protective layer 3 inside the guide trough 2, both sides of the silicon core material are initially cleaned by the cleaning brush 12. When the silicon core material passes through two sets of wiping cotton 13, both sides of the silicon core material are wiped and adsorbed by the wiping cotton 13.

[0028] The working principle of this utility model:

[0029] When the monocrystalline silicon rod is cut into silicon wafers using diamond wire cutting, the silicon wafers fall into the protective layer 3 inside the guide trough 2. The bottom of the guide trough 2 is inclined downwards. At this time, the silicon wafers can first be buffered and received by the protective layer 3 and then rolled downwards. The fixed clamps 6 and adjustable clamps 7 on the conveyor belt 5 correspond to the positions of the guide trough 2. The silicon wafers can then roll down through the guide trough 2 into the space between the fixed clamps 6 and adjustable clamps 7 for collection. The clamping layer 10 between the fixed clamps 6 and adjustable clamps 7 can hold and prevent the falling silicon wafers from falling. The adjustable clamp 7 can be located outside the screw shaft 9 for adaptive sliding adjustment to accommodate the thickness of the silicon wafer. When the conveyor belt 5 is started to transport the silicon wafer, the silicon wafer between the fixed clamp 6 and the adjustable clamp 7 can be automatically collected and transported, thereby improving the protection of the silicon wafer and the conveying efficiency. When the silicon wafer is tilted and rolled downward through the protective layer 3, the two sides of the silicon wafer can be cleaned by friction with the cleaning brush 12. When the silicon wafer passes through two sets of cleaning brushes 12, the water stains remaining on the two sides of the silicon wafer can be wiped and absorbed by the wiping cotton 13 to ensure the cleanliness of the silicon wafer itself.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A silicon core cutting and blanking device for single-crystal silicon processing, characterized in that: The device includes a guide platform (1), a guide groove (2) is provided inside the guide platform (1), a protective layer (3) is provided on the inner side of the guide groove (2), a transport device (4) is provided on one side of the guide platform (1), a transmission belt (5) is provided inside the transport device (4), a fixed clamp (6) is installed on the surface of the transmission belt (5), an adjustable clamp (7) is slidably provided on one side of the fixed clamp (6), a limit hole (8) is provided inside the adjustable clamp (7), a screw (9) is installed on one side of the fixed clamp (6) through the limit hole (8), a clamping layer (10) is provided between the fixed clamp (6) and the adjustable clamp (7), and a nut (11) is threaded on one end of the screw (9).

2. The silicon core cutting and blanking device for single-crystal silicon processing according to claim 1, characterized in that: The inside of the guide trough (2) is a trapezoidal hollow trough and the inside of the guide trough (2) becomes narrower from one side to the other. The bottom side of the inside of the guide trough (2) is an inclined trough surface. The protective layer (3) is made of soft material and has deformation characteristics. The protective layer (3) has the same internal structure as the guide trough (2).

3. The silicon core cutting and blanking device for single-crystal silicon processing according to claim 2, characterized in that: When the silicon core material falls into the protective layer (3) inside the guide trough (2), the silicon core material is in a downward rolling guide feeding state through the protective layer (3).

4. The silicon core cutting and blanking device for single-crystal silicon processing according to claim 1, characterized in that: When the silicon core material falls between the fixed clamp (6) and the adjustable clamp (7), the fixed clamp (6) and the adjustable clamp (7) are clamped and protected by the clamping layer (10). The adjustable clamp (7) is located outside the screw shaft (9) through the limiting hole (8) and is in a sliding adjustable state.

5. The silicon core cutting and blanking device for single-crystal silicon processing according to claim 2, characterized in that: The protective layer (3) has cleaning brushes (12) equidistantly arranged on both sides inside. The protective layer (3) has wiping cotton (13) connected to the outlets on both sides inside. The wiping cotton (13) is made of sponge material and has adsorption properties.

6. The silicon core cutting and blanking device for single-crystal silicon processing according to claim 5, characterized in that: When the silicon core material falls into the protective layer (3) inside the guide groove (2) and moves, both sides of the silicon core material are initially cleaned by the cleaning brush (12). When the silicon core material passes through two sets of wiping cotton (13), both sides of the silicon core material are wiped and adsorbed by the wiping cotton (13).

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