High-precision automatic stamping device for semiconductor equipment processing

Abstract

The utility model belongs to the technical field of punching devices, and discloses a high-precision automatic punching device for processing semiconductor equipment, which comprises a punching machine and a semiconductor material, a conveying device and an output device are respectively arranged on two sides of the punching machine, a cleaning pool is arranged between the conveying device and the punching machine, and the semiconductor material is arranged in the cleaning pool. The cleaning pool is connected with a liquid inlet pipeline, the liquid outlet end of the liquid inlet pipeline is connected with a first conveying pipeline and a second conveying pipeline, the liquid outlet end of the first conveying pipeline is provided with a first flushing head, and the liquid outlet end of the second conveying pipeline is connected with a third conveying pipeline. The first flushing head and the second flushing head in the cleaning pool are used for flushing the upper surface and the lower surface of the material respectively. Meanwhile, the two rolling brush assemblies are located on the upper surface and the lower surface of the material respectively, bristles are evenly distributed on the outer wall of the roller, impurities and residues are efficiently removed, the cleanliness of the material before the material enters a punching machine is guaranteed, and the punching precision and the surface quality of finished products are improved.

Description

Technical Field

[0001] This utility model belongs to the field of stamping device technology, specifically relating to a high-precision automated stamping device for semiconductor equipment processing. Background Technology

[0002] A stamping machine is a mechanical device that uses pressure to plastically deform materials, thereby forming or separating them. Its core components include a stamping press, die, feeding device, discharging device, transmission system, control system, and safety devices. The stamping press is the core of the machine, responsible for providing the stamping force; the die determines the shape and size of the finished product; the feeding and discharging devices are responsible for conveying materials and outputting finished products; the transmission system transmits power; the control system ensures precise operation; and the safety devices ensure operational safety. This machine is widely used in the automotive, electronics, aerospace, home appliance, and daily necessities manufacturing industries, and is a key piece of equipment for achieving efficient and precise machining in modern manufacturing.

[0003] Application No. 202410094511.8 discloses a stamping device for semiconductor component production. "By adopting a sliding cylinder structure, the sliding cylinder and the stamping block cooperate to allow the stamping block to move vertically up and down, ensuring that the stamping surface is parallel to the stamping base plane, thus improving stamping accuracy. Since both the sliding cylinder and the stamping base are fixed structures, accurate stamping position is guaranteed. Furthermore, the stamping block structure is easy to replace, making this semiconductor component stamping device highly adaptable." However, the aforementioned device directly stamps the fed semiconductor material. Impurities may exist on the material surface, which can adhere to the surface, causing severe wear and damage to the molds, tools, and equipment during the stamping process. Moreover, the presence of impurities directly affects the dimensional accuracy and surface finish of the stamped product, leading to a decrease in product quality and increasing the probability of defective and scrap products. This not only reduces overall production efficiency and increases unnecessary production costs but also has a significant negative impact on the reliability and performance of the final product, thereby affecting the product's market competitiveness and customer satisfaction. Utility Model Content

[0004] The purpose of this utility model is to provide a high-precision automated stamping device for semiconductor equipment processing, so as to solve the problem mentioned in the background art that direct stamping after conveying will cause impurities on the material surface to adhere and wear the mold, tool and equipment, reduce the quality of finished products, increase the defect rate, and affect production efficiency and cost.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-precision automated stamping device for semiconductor equipment processing, comprising: a stamping machine and a semiconductor material, wherein a conveying device and an output device are respectively provided on both sides of the stamping machine, the semiconductor material sequentially passes through the conveying device, the stamping machine and the output device, a cleaning tank is provided between the conveying device and the stamping machine, an inlet pipe is connected to the cleaning tank, a first conveying pipe and a second conveying pipe are connected to the outlet end of the inlet pipe, a first rinsing head is installed at the outlet end of the first conveying pipe, a third conveying pipe is connected to the outlet end of the second conveying pipe, a second rinsing head is installed at the outlet end of the third conveying pipe, and the first rinsing head and the second rinsing head are respectively disposed on the upper surface and the lower surface of the semiconductor material, a circulation system component is configured inside the cleaning tank, a roller brush component is installed inside the cleaning tank, a drying component is provided on one side of the cleaning tank, and a wiping component is provided on one side of the drying component.

[0006] Preferably, the circulation system components include a fourth delivery pipe, a filter, and a pump. The fourth delivery pipe is connected to the bottom of the inner wall of the cleaning tank. The filter is installed at the outlet end of the fourth delivery pipe. The pump is installed at the outlet end of the filter, and the outlet end of the pump is connected to the inlet pipe.

[0007] The roller brush assembly includes a roller and bristles. There are two roller brush assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material. The roller is rotatably connected to the inner wall of the cleaning tank through a bearing, and the bristles are evenly distributed on the outer wall of the roller.

[0008] Through the above technical solution:

[0009] In operation, the stamping press is located at the core of the entire system, responsible for stamping semiconductor materials. The conveying and output devices are located on either side of the stamping press, forming a continuous processing line. Specifically, the semiconductor material first enters the stamping press via the conveying device, completes the stamping operation, and then exits via the output device.

[0010] The cleaning tank, located between the conveying device and the stamping machine, is used to clean the semiconductor material before stamping. The cleaning tank is connected to an external liquid supply system via an inlet pipe to ensure a continuous supply of cleaning liquid. The outlet of the inlet pipe connects to a first and a second conveying pipe, which respectively deliver the cleaning liquid to different rinsing heads. The outlet of the first conveying pipe is equipped with a first rinsing head for rinsing the upper surface of the semiconductor material. The outlet of the second conveying pipe connects to a third conveying pipe, and the outlet of the third conveying pipe is equipped with a second rinsing head for rinsing the lower surface of the semiconductor material. This symmetrical rinsing design ensures that the semiconductor material is thoroughly and uniformly cleaned during the cleaning process.

[0011] The fourth delivery pipe is connected to the bottom of the inner wall of the cleaning tank and is used to extract the liquid from the tank. A filter is installed at the outlet of the fourth delivery pipe to filter impurities from the cleaning solution. A pump is installed at the outlet of the filter, and its outlet is connected to the inlet pipe, forming a circulation system to ensure continuous purification and reuse of the cleaning solution.

[0012] The roller brush assembly consists of two rollers, one positioned on the upper surface and the other on the lower surface of the semiconductor material. Each roller is rotatably connected to the inner wall of the cleaning tank via bearings, allowing it to rotate freely due to friction as the semiconductor material moves along the production line. Bristles are evenly distributed on the outer wall of the rollers, effectively removing impurities and residues from the material surface, achieving efficient and uniform double-sided cleaning. This design not only simplifies the structure and reduces energy consumption but also improves cleaning quality and production efficiency, providing a reliable guarantee for the precision machining of semiconductor materials.

[0013] Through precise rinsing and brushing processes, various impurities on the surface of semiconductor materials are effectively removed, ensuring extremely high cleanliness before entering the stamping press for precision stamping. This process not only prevents impurities from causing wear and damage to molds, tools, and equipment during stamping, but also significantly improves the dimensional accuracy and surface finish of the stamped products, reducing defects and scrap caused by impurities, thereby drastically lowering the defect rate and optimizing the production process. Furthermore, clean surface conditions help improve the stability of the stamping process, further increasing production efficiency and product yield, laying a solid foundation for subsequent high-precision processing of semiconductor materials.

[0014] The drying component is a dryer, which acts on the outer surface of the semiconductor material.

[0015] Preferably, the wiping assembly includes a mounting plate and a wiping block. There are two wiping assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material. The mounting plate is connected to the outer wall of the dryer. The outer wall of the mounting plate has a mounting groove. A movable plate is disposed in the mounting groove. A limiting component is provided between the movable plate and the mounting groove. The wiping block is connected to the outer wall of the movable plate. A spring is connected between the mounting groove and the movable plate.

[0016] The limiting component includes a limiting groove, a limiting block, and an anti-detachment block. The limiting groove is opened vertically on the inner wall of the mounting groove. The limiting block is installed on the outer wall of the movable plate. The anti-detachment block is fixed on the outer wall of the mounting plate and is located outside the limiting groove.

[0017] Through the above technical solution:

[0018] In use, the primary function of the dryer is to dry the cleaned semiconductor materials. Specifically, the dryer acts on the outer surface of the semiconductor material, using hot air or other drying methods to quickly remove residual liquid from the surface, achieving the required dryness for subsequent processing. The dryer's temperature and operating parameters are precisely regulated within a stable control range, ensuring efficient removal of residual liquid from the semiconductor material surface without causing any thermal damage or deformation to the material itself. Through an intelligent temperature control system and real-time monitoring mechanism, the dryer can automatically adjust the drying intensity and duration based on the material's characteristics and real-time status, ensuring both effective drying and preventing material performance degradation due to overheating or prolonged exposure. This precise control process ensures that the semiconductor material, after drying, achieves the required dryness while maintaining its original physical and chemical properties, providing a reliable guarantee for subsequent precision stamping processes.

[0019] To further improve the surface quality of semiconductor materials, a wiping assembly is designed for the final cleaning and wiping process. A mounting plate, serving as the foundation of the wiping assembly, is connected to the outer wall of the dryer, forming a stable support platform. A mounting slot is formed on the outer wall of the mounting plate to accommodate and secure other components of the wiping assembly. A movable plate is positioned within the mounting slot and can move within a certain range. This design allows the wiping block to adaptively adjust to the surface shape and position of the semiconductor material, achieving more effective wiping and further reducing moisture residue. To ensure the stability of the movable plate during movement, a limiting assembly is introduced. A limiting slot is formed vertically on the inner wall of the mounting slot to limit the movement range of the movable plate. A limiting block is mounted on the outer wall of the movable plate, cooperating with the limiting slot to restrict the movement of the movable plate and prevent excessive movement. An anti-detachment block is securely mounted on the outer wall of the mounting plate, located outside the limiting slot, to further prevent the movable plate from detaching from the mounting slot. The wiping block is connected to the outer wall of the movable plate, directly contacting the surface of the semiconductor material to perform the wiping operation. The wiping pad's material and shape are carefully designed to ensure effective residue removal and improved material surface quality. A spring connects the mounting slot and the movable plate, providing continuous elasticity and maintaining appropriate pressure when the wiping pad contacts semiconductor materials. This design not only enhances wiping performance but also extends the wiping pad's lifespan.

[0020] The wiping block and the movable plate can be connected with Velcro or double-sided tape to facilitate the replacement of the wiping block.

[0021] The wiping assembly is designed in two parts, one on the upper surface and the other on the lower surface of the semiconductor material. This symmetrical wiping design ensures that the semiconductor material is thoroughly and evenly wiped after being processed by the dryer, further improving its surface quality.

[0022] The dryer and wiping assembly work together to ensure that semiconductor materials undergo final surface treatment before precision machining. The dryer quickly removes residual liquid, while the wiping assembly further reduces moisture residue and improves material surface quality through precise wiping operations. The design of the limiting components and springs makes the wiping process more precise and efficient, providing a reliable guarantee for subsequent high-precision machining of semiconductor materials.

[0023] In summary, the entire process begins with precise rinsing and brushing to effectively remove various impurities from the surface of the semiconductor material. Subsequently, a high-efficiency dryer dries the material, rapidly evaporating any residual liquid. Finally, a fine wiping assembly cleans and polishes the surface, thoroughly removing any remaining impurities and liquid particles. This series of rigorous steps ensures that the semiconductor material reaches an extremely high level of cleanliness before entering the stamping press, effectively preventing damage to the molds, cutting tools, and equipment from impurities. This improves the precision and surface quality of the stamped product, reduces the reject rate, optimizes the production process, and lays a solid foundation for the precision machining of semiconductor materials.

[0024] Compared with the prior art, the beneficial effects of this utility model are:

[0025] (1) This utility model uses a cleaning tank and brushes to rinse and scrub the surface of semiconductor materials. During use, the first and second rinsing heads in the cleaning tank rinse the upper and lower surfaces of the material, respectively. Simultaneously, two roller brush assemblies are located on the upper and lower surfaces of the material, with brush bristles evenly distributed on the outer wall of the rollers, efficiently removing impurities and residues, achieving double-sided scrubbing, and ensuring high cleanliness of the material before it enters the stamping machine. This design effectively prevents impurities from causing wear on molds, tools, and equipment, improves stamping accuracy and finished product surface quality, reduces the defect rate, and optimizes the production process.

[0026] (2) This utility model uses a dryer and a wiping block to dry and wipe the surface of semiconductor materials. During use, the dryer efficiently removes residual liquid from the material surface after cleaning, while the wiping block, with its carefully designed material and shape, effectively removes residue and improves surface quality. A spring connects the mounting slot and the movable plate, providing continuous pressure to the wiping block and ensuring appropriate contact force when contacting the material. The coordinated design of the limiting component and the spring makes the wiping process more precise and efficient, further reducing moisture residue, significantly improving the surface quality of the material, and providing a reliable guarantee for subsequent precision machining. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the structure of this utility model;

[0028] Figure 2 This is a schematic diagram of the structure of the first conveying pipeline of this utility model;

[0029] Figure 3 This is a schematic diagram of the structure of the second conveying pipeline of this utility model;

[0030] Figure 4 This is a schematic diagram of the structure of the second flushing head of this utility model;

[0031] Figure 5 This is a schematic diagram of the structure of the spring of this utility model;

[0032] In the diagram: 1. Press; 2. Semiconductor material; 3. Conveying device; 4. Output device; 5. Cleaning tank; 6. Liquid inlet pipe; 7. First conveying pipe; 8. First flushing head; 9. Second conveying pipe; 10. Third conveying pipe; 11. Second flushing head; 12. Fourth conveying pipe; 13. Filter; 14. Liquid pump; 15. Roller; 16. Brush bristles; 17. Dryer; 18. Mounting plate; 19. Mounting groove; 20. Movable plate; 21. Wiping block; 22. Spring; 23. Limiting groove; 24. Limiting block; 25. Anti-detachment block. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] Please see Figures 1-4 As shown, this utility model provides the following technical solution: a high-precision automated stamping device for semiconductor equipment processing, comprising: a stamping machine 1 and a semiconductor material 2, a conveying device 3 and an output device 4 respectively provided on both sides of the stamping machine 1, the semiconductor material 2 passing sequentially through the conveying device 3, the stamping machine 1 and the output device 4, a cleaning tank 5 provided between the conveying device 3 and the stamping machine 1, an inlet pipe 6 connected to the cleaning tank 5, a first conveying pipe 7 and a second conveying pipe 9 connected to the outlet end of the inlet pipe 6, a first flushing head 8 installed at the outlet end of the first conveying pipe 7, a third conveying pipe 10 connected to the outlet end of the second conveying pipe 9, a second flushing head 11 installed at the outlet end of the third conveying pipe 10, and the first flushing head 8 and the second flushing head 11 respectively disposed on the upper surface and the lower surface of the semiconductor material 2, a circulation system component configured inside the cleaning tank 5, a roller brush component installed inside the cleaning tank 5, a drying component provided on one side of the cleaning tank 5, and a wiping component provided on one side of the drying component.

[0035] Furthermore, the circulation system components include a fourth delivery pipe 12, a filter 13, and a pump 14. The fourth delivery pipe 12 is connected to the bottom of the inner wall of the cleaning tank 5. The filter 13 is installed at the outlet end of the fourth delivery pipe 12. The pump 14 is installed at the outlet end of the filter 13, and the outlet end of the pump 14 is connected to the inlet pipe 6.

[0036] The roller brush assembly includes a roller 15 and bristles 16. There are two roller brush assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material 2. The roller 15 is rotatably connected to the inner wall of the cleaning tank 5 through a bearing, and the bristles 16 are evenly distributed on the outer wall of the roller 15.

[0037] Through the above technical solution:

[0038] In operation, the stamping machine 1 is located at the core of the entire device, undertaking the task of stamping the semiconductor material 2. The conveying device 3 and the output device 4 are respectively located on both sides of the stamping machine 1, forming a continuous processing line. Specifically, the semiconductor material 2 first enters the stamping machine 1 through the conveying device 3, completes the stamping operation, and then is output through the output device 4.

[0039] The cleaning tank 5 is located between the conveying device 3 and the stamping machine 1, and its function is to clean the semiconductor material 2 before stamping. The cleaning tank 5 is connected to an external liquid supply system via an inlet pipe 6 to ensure a continuous supply of cleaning liquid. The outlet end of the inlet pipe 6 is connected to a first conveying pipe 7 and a second conveying pipe 9, which are used to deliver the cleaning liquid to different rinsing heads. The outlet end of the first conveying pipe 7 is equipped with a first rinsing head 8 for rinsing the upper surface of the semiconductor material 2. The outlet end of the second conveying pipe 9 is connected to a third conveying pipe 10, and the outlet end of the third conveying pipe 10 is equipped with a second rinsing head 11 for rinsing the lower surface of the semiconductor material 2. This symmetrical rinsing design ensures that the semiconductor material 2 is thoroughly and uniformly cleaned during the cleaning process.

[0040] The fourth delivery pipe 12 is connected to the bottom of the inner wall of the cleaning tank 5 and is used to extract liquid from the cleaning tank 5. The filter 13 is installed at the outlet of the fourth delivery pipe 12 and is used to filter impurities in the cleaning solution. The liquid pump 14 is installed at the outlet of the filter 13, and its outlet is connected to the inlet pipe 6 to form a circulation system to ensure continuous purification and reuse of the cleaning solution.

[0041] The roller brush assembly consists of two rollers 15, respectively positioned on the upper and lower surfaces of the semiconductor material 2. Each roller 15 is rotatably connected to the inner wall of the cleaning tank 5 via bearings, allowing it to rotate freely due to friction as the semiconductor material 2 moves along the production line. Brush bristles 16 are evenly distributed on the outer wall of the rollers 15, effectively removing impurities and residues from the material surface, achieving efficient and uniform double-sided brushing. This design not only simplifies the structure and reduces energy consumption but also improves cleaning quality and production efficiency, providing a reliable guarantee for the precision machining of the semiconductor material 2.

[0042] Through precise rinsing and brushing processes, various impurities on the surface of semiconductor material 2 are effectively removed, ensuring extremely high cleanliness before it enters the stamping press 1 for precision stamping. This process not only prevents impurities from causing wear and damage to the molds, tools, and equipment during stamping, but also significantly improves the dimensional accuracy and surface finish of the stamped products, reducing defects and scrap caused by impurities, thereby greatly reducing the defect rate and optimizing the production process. Furthermore, the clean surface conditions help improve the stability of the stamping process, further increasing production efficiency and product yield, laying a solid foundation for the subsequent high-precision processing of semiconductor material 2.

[0043] Please see Figures 1-5 As shown, the drying component is a dryer 17, which acts on the outer surface of the semiconductor material 2.

[0044] Furthermore, the wiping assembly includes a mounting plate 18 and a wiping block 21. There are two wiping assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material 2. The mounting plate 18 is connected to the outer wall of the dryer 17. The outer wall of the mounting plate 18 has a mounting groove 19. A movable plate 20 is disposed in the mounting groove 19. A limiting component is provided between the movable plate 20 and the mounting groove 19. The wiping block 21 is connected to the outer wall of the movable plate 20. A spring 22 is connected between the mounting groove 19 and the movable plate 20.

[0045] The limiting assembly includes a limiting groove 23, a limiting block 24, and an anti-detachment block 25. The limiting groove 23 is opened vertically on the inner wall of the mounting groove 19. The limiting block 24 is installed on the outer wall of the movable plate 20. The anti-detachment block 25 is fixed on the outer wall of the mounting plate 18 and is located outside the limiting groove 23.

[0046] Through the above technical solution:

[0047] In use, the main function of the dryer 17 is to dry the cleaned semiconductor material 2. Specifically, the dryer 17 acts on the outer surface of the semiconductor material 2, using hot air or other drying methods to quickly remove residual liquid from the material surface, achieving the required dryness for subsequent processing. The temperature and operating parameters of the dryer 17 are precisely adjusted within a stable control range to ensure that while efficiently removing residual liquid from the surface of the semiconductor material 2, it does not cause any thermal damage or deformation to the material itself. Through an intelligent temperature control system and real-time monitoring mechanism, the dryer 17 can automatically adjust the drying intensity and duration according to the material's characteristics and real-time status, ensuring both drying effectiveness and avoiding material performance degradation due to overheating or prolonged exposure. This precise control process ensures that the semiconductor material 2, after drying, achieves the required dryness while maintaining its original physical and chemical properties, providing a reliable guarantee for subsequent precision stamping processing.

[0048] To further improve the surface quality of semiconductor material 2, a wiping assembly is designed to perform final cleaning and wiping treatment on semiconductor material 2. Mounting plate 18, as the basic structure of the wiping assembly, is connected to the outer wall of dryer 17, forming a stable support platform. Mounting groove 19 is formed on the outer wall of mounting plate 18 to accommodate and fix other components of the wiping assembly. Movable plate 20 is disposed within mounting groove 19 and can move within a certain range. This design allows wiping block 21 to adaptively adjust according to the surface shape and position of semiconductor material 2, thereby achieving more effective wiping and further reducing moisture residue. To ensure the stability of movable plate 20 during movement, a limiting assembly is introduced. Limiting groove 23 is formed vertically on the inner wall of mounting groove 19 to limit the movement range of movable plate 20. Limiting block 24 is mounted on the outer wall of movable plate 20 and cooperates with limiting groove 23 to restrict the movement of movable plate 20 and prevent excessive movement. The anti-detachment block 25 is securely mounted on the outer wall of the mounting plate 18, located outside the limiting groove 23, further preventing the movable plate 20 from detaching from the mounting groove 19. The wiping block 21 is connected to the outer wall of the movable plate 20, directly contacting the surface of the semiconductor material 2 to perform a wiping operation. The material and shape of the wiping block 21 are carefully designed to ensure effective removal of residues and improve the surface quality of the material. A spring 22 connects the mounting groove 19 and the movable plate 20, providing continuous elasticity to maintain appropriate pressure on the wiping block 21 when in contact with the semiconductor material 2. This design not only enhances the wiping effect but also extends the service life of the wiping block 21.

[0049] The wiping block 21 and the movable plate 20 can be connected by Velcro or double-sided tape to facilitate the replacement of the wiping block 21.

[0050] Two wiping components are designed, one on the upper surface and the other on the lower surface of the semiconductor material 2. This symmetrical wiping design ensures that the semiconductor material 2 can be thoroughly and evenly wiped after being processed by the dryer 17, further improving its surface quality.

[0051] The dryer 17 works in conjunction with the wiping assembly to ensure that the semiconductor material 2 undergoes final surface treatment before precision machining. The dryer 17 quickly removes residual liquid, while the wiping assembly further reduces moisture residue and improves the surface quality of the material through a precise wiping operation. The design of the limiting component and spring 22 makes the wiping process more precise and efficient, providing a reliable guarantee for the subsequent high-precision machining of the semiconductor material 2.

[0052] In summary, the entire process begins with precise rinsing and brushing to effectively remove various impurities from the surface of semiconductor material 2. Subsequently, a high-efficiency dryer 17 dries the material, rapidly evaporating any residual liquid. Finally, a fine wiping assembly cleans and polishes the material surface, thoroughly removing any remaining impurities and liquid particles. This series of rigorous steps ensures that semiconductor material 2 reaches an extremely high level of cleanliness before entering the stamping press 1 for stamping processing. This effectively prevents impurities from damaging the molds, cutting tools, and equipment, improves the precision and surface quality of the stamped products, reduces the defect rate, optimizes the production process, and lays a solid foundation for the precision machining of semiconductor material 2.

[0053] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-precision automated stamping device for semiconductor equipment processing, characterized in that, include: A stamping press (1) and a semiconductor material (2) are provided. A conveying device (3) and an output device (4) are respectively provided on both sides of the stamping press (1). The semiconductor material (2) passes through the conveying device (3), the stamping press (1), and the output device (4) in sequence. A cleaning tank (5) is provided between the conveying device (3) and the stamping press (1). An inlet pipe (6) is connected to the cleaning tank (5). The outlet end of the inlet pipe (6) is connected to a first conveying pipe (7) and a second conveying pipe (9). The outlet end of the first conveying pipe (7) is... A first rinsing head (8) is installed, and the liquid outlet end of the second conveying pipe (9) is connected to a third conveying pipe (10). The liquid outlet end of the third conveying pipe (10) is equipped with a second rinsing head (11). The first rinsing head (8) and the second rinsing head (11) are respectively disposed on the upper surface and the lower surface of the semiconductor material (2). A circulation system component is configured inside the cleaning tank (5). A roller brush component is installed inside the cleaning tank (5). A drying component is provided on one side of the cleaning tank (5), and a wiping component is provided on one side of the drying component.

2. The high-precision automated stamping device for semiconductor equipment processing according to claim 1, characterized in that: The circulation system components include a fourth delivery pipe (12), a filter (13), and a pump (14). The fourth delivery pipe (12) is connected to the bottom of the inner wall of the cleaning tank (5). The filter (13) is installed at the outlet end of the fourth delivery pipe (12). The pump (14) is installed at the outlet end of the filter (13), and the outlet end of the pump (14) is connected to the inlet pipe (6).

3. The high-precision automated stamping device for semiconductor equipment processing according to claim 2, characterized in that: The roller brush assembly includes a roller (15) and bristles (16). There are two roller brush assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material (2). The roller (15) is rotatably connected to the inner wall of the cleaning tank (5) through a bearing. The bristles (16) are evenly distributed on the outer wall of the roller (15).

4. The high-precision automated stamping device for semiconductor equipment processing according to claim 3, characterized in that: The drying component is a dryer (17), which acts on the outer surface of the semiconductor material (2).

5. A high-precision automated stamping device for semiconductor equipment processing according to claim 4, characterized in that: The wiping assembly includes a mounting plate (18) and a wiping block (21). There are two wiping assemblies, which are respectively disposed on the upper and lower surfaces of the semiconductor material (2). The mounting plate (18) is connected to the outer wall of the dryer (17). The outer wall of the mounting plate (18) is provided with a mounting groove (19). A movable plate (20) is provided in the mounting groove (19). A limiting component is provided between the movable plate (20) and the mounting groove (19). The wiping block (21) is connected to the outer wall of the movable plate (20). A spring (22) is connected between the mounting groove (19) and the movable plate (20).

6. A high-precision automated stamping device for semiconductor equipment processing according to claim 5, characterized in that: The limiting component includes a limiting groove (23), a limiting block (24), and an anti-detachment block (25). The limiting groove (23) is opened vertically on the inner wall of the mounting groove (19). The limiting block (24) is installed on the outer wall of the movable plate (20). The anti-detachment block (25) is fixed on the outer wall of the mounting plate (18) and is located outside the limiting groove (23).

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