Carrying table and machining equipment

Abstract

The utility model discloses a carrying table and machining equipment, the carrying table comprises a lifting platform, an adjusting mechanism and an adsorption mechanism, the adjusting mechanism comprises a mounting base arranged at the moving end of the lifting platform, a plurality of micrometer heads arranged on the mounting base, a carrying plate arranged above the mounting base and abutting against the micrometer heads, and a supporting piece connected with the mounting base and the carrying plate; the adsorption mechanism comprises a connecting piece which is arranged on the carrier plate and located between the carrier plate and the mounting base, a cavity is formed between the connecting piece and the carrier plate, and an adsorption hole communicated with the cavity is further formed in the carrier plate. The adsorption holes can be used for adsorbing workpieces, the lifting platform can adjust the height of the carrying table in the vertical direction, the inclination angle of the carrying plate is adjusted by screwing the micrometer head, it is ensured that the height and the inclination angle of the workpieces on the carrying plate meet the set requirements, and the positioning precision is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of automation equipment, in particular to a carrier and a processing equipment. BACKGROUND

[0002] With the rapid development of science and technology, especially the rapid progress of the electronic industry, the product update speed is significantly accelerated, and the product quality requirements are also improved. In the early stage of product research and development, multiple tests and verifications are required. Different products often need to use different tooling fixtures to be installed on the carrier. In the use process of the traditional carrier, there are often problems of inaccurate positioning, which affects the processing precision. These problems are particularly prominent in the field of laser processing which requires high precision, multiple shapes and angles, and seriously affect the production efficiency and product quality. CONTENT OF THE INVENTION

[0003] The present application provides a carrier and a processing equipment, which adjusts the height and inclination angle of the carrier through the differential head and the lifting module, and solves the problem of inaccurate positioning.

[0004] The present application provides a carrier, which comprises:

[0005] A lifting platform;

[0006] An adjusting mechanism, comprising a mounting seat arranged at the moving end of the lifting platform, a plurality of differential heads arranged on the mounting seat, a carrier plate arranged above the mounting seat and abutting against the differential heads, and a support connecting the mounting seat and the carrier plate; the differential heads are used to adjust the inclination angle of the carrier plate;

[0007] A suction mechanism, comprising a connecting piece arranged on the carrier plate and located between the carrier plate and the mounting seat, a cavity being formed between the connecting piece and the carrier plate, and a suction hole being arranged on the carrier plate and communicating with the cavity.

[0008] In some embodiments, the differential heads are arranged at four corners of the mounting seat, the differential head comprises an adjusting knob arranged below the mounting seat, and a measuring rod connected with the adjusting knob, and the measuring rod also abuts against the carrier plate.

[0009] In some embodiments, the carrier plate is further provided with a plurality of mounting holes, the mounting holes are arranged in an array and uniformly distributed on the upper surface of the carrier plate, and the suction holes are arranged in an array and located in the central region of the carrier plate.

[0010] In some embodiments, the upper surface of the connecting piece is provided with the cavity, and the suction mechanism further comprises a sealing ring arranged on the connecting piece and surrounding the cavity, the sealing ring abuts against the carrier plate and is used to seal the cavity.

[0011] In some embodiments, the lifting platform includes:

[0012] substrate;

[0013] The lower wedge-shaped block is slidably connected to the substrate along a first direction;

[0014] A guide assembly is disposed on the substrate and located at one end of the lower wedge block;

[0015] The upper wedge block is slidably connected to the guide assembly along the second direction, and the upper wedge block is also slidably connected to the lower wedge block;

[0016] A platform plate, disposed on the upper wedge-shaped block, is used to form the mobile end;

[0017] A driving component, disposed on the substrate, is used to drive the lower wedge block to move along a first direction.

[0018] In some embodiments, the driving component includes:

[0019] A lead screw is rotatably mounted on the substrate and is arranged along a first direction;

[0020] A nut, adapted to the lead screw, and connected to the lower wedge block;

[0021] The motor is mounted on the base plate and is connected to the lead screw drive.

[0022] In some embodiments, the lifting platform further includes an outer frame disposed on the base plate, and the lower wedge block, the upper wedge block, and the guide assembly are disposed in the outer frame.

[0023] In some embodiments, the lifting platform further includes a bushing disposed on the underside of the platform plate, the bushing being slidably connected to the inner wall of the outer frame.

[0024] In some embodiments, the stage further includes a plurality of pads disposed on the substrate, the pads being disposed on the underside of the substrate and stacked in layers.

[0025] This application also proposes a processing apparatus, including a stage and a frame for mounting the stage.

[0026] The platform and device in this embodiment include a lifting platform, an adjustment mechanism, and an adsorption mechanism. The adjustment mechanism includes a mounting base on the movable end of the lifting platform, multiple micro-heads on the mounting base, a carrier plate above the mounting base and abutting against the micro-heads, and a support member connecting the mounting base and the carrier plate. The adsorption mechanism includes a connector on the carrier plate and located between the carrier plate and the mounting base. A cavity is formed between the connector and the carrier plate, and the carrier plate is also provided with adsorption holes communicating with the cavity. The adsorption holes can be used to adsorb workpieces. The lifting platform can adjust the height of the platform in the vertical direction, and the tilt angle of the carrier plate can be adjusted by turning the micro-heads to ensure that the height and tilt angle of the workpiece on the carrier plate meet the set requirements, thereby improving positioning accuracy. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the platform structure in one embodiment of this application;

[0028] Figure 2 This is a cross-sectional view of the platform in one embodiment of this application;

[0029] Figure 3 for Figure 2 A cross-sectional view of the lifting platform in the embodiment;

[0030] Figure 4 This is a schematic diagram of the lifting platform in one embodiment of this application;

[0031] Figure 5 This is an exploded view of the platform in one embodiment of this application;

[0032] Figure 6 A schematic diagram of the lifting platform in another embodiment of this application.

[0033] Label Explanation:

[0034] 10. Lifting platform; 11. Base plate; 12. Lower wedge block; 13. Lead screw; 14. Motor; 15. Upper wedge block; 16. Guide assembly; 17. Platform plate; 18. Outer frame; 19. Bushing; 21. Mounting base; 22. Micrometer head; 23. Carrier plate; 24. Support component; 25. Adsorption hole; 26. Mounting hole; 31. Connector; 32. Sealing ring; 33. Joint; 41. Pad.

[0035] The purpose, features, and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0036] The solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. It should also be noted that when an element is referred to as "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element at the same time. When an element is referred to as "connected to" another element, it can be directly connected to the other element or there may be an intervening element at the same time.

[0037] Furthermore, the descriptions involving "first," "second," etc., in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0038] Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0039] This application proposes a platform, referring to... Figures 1 to 6 The platform includes: a lifting platform 10; an adjustment mechanism including a mounting base 21 at the movable end of the lifting platform 10, multiple micro-heads 22 on the mounting base 21, a carrier plate 23 above the mounting base 21 and abutting against the micro-heads 22, and a support member 24 connecting the mounting base 21 and the carrier plate 23; the micro-heads 22 are used to adjust the tilt angle of the carrier plate 23; and an adsorption mechanism including a connector 31 on the carrier plate 23 and located between the carrier plate 23 and the mounting base 21, with a cavity formed between the connector 31 and the carrier plate 23, and adsorption holes 25 communicating with the cavity on the carrier plate 23. In this embodiment, a negative pressure can be created in the cavity to allow the adsorption holes 25 to adsorb the workpiece located on the carrier plate 23. The lifting platform 10 can adjust the height of the platform in the vertical direction, and the tilt angle of the carrier plate 23 can be adjusted by turning the micro-heads 22 to ensure that the height and tilt angle of the workpiece on the carrier plate 23 meet the set requirements, thereby improving the positioning accuracy.

[0040] In some embodiments, the micrometer heads 22 are distributed at the four corners of the mounting base 21. Each micrometer head 22 includes an adjustment knob located below the mounting base 21 and a measuring rod connected to the adjustment knob. The measuring rod also abuts against the carrier plate 23. In this embodiment, four support members 24 may also be provided, distributed at the four corners of the mounting base 21 and located close to the micrometer heads 22. By turning the knob, the measuring rod can be extended or retracted. Adjusting the extension or retraction length of the measuring rod can adjust the tilt angle of the carrier plate 23. The micrometer heads 22 act on the four corners of the carrier plate 23. When the micrometer heads 22 are adjusted, the carrier plate 23 is slightly lifted to form an angle. The desired pitch angle is achieved by adjusting the four micrometer heads 22, and finally, the micrometer heads are locked and fixed to the support members 24 with screws.

[0041] In some embodiments, the carrier plate 23 is further provided with a plurality of mounting holes 26, which are arranged in an array and evenly distributed on the upper surface of the carrier plate 23. Adsorption holes 25 are also arranged in an array and located in the central region of the carrier plate 23. In this embodiment, the mounting holes 26 are blind holes with threads on their inner walls. The carrier plate 23 is used to support the workpiece, and its upper surface features mesh threaded mounting holes and large-format vacuum adsorption holes, which can conveniently fix fixtures or adsorb workpieces. The distribution area of ​​the mounting holes 26 can be 400x400mm. The mounting holes 26 are M6 threaded holes with a depth of 10mm and a spacing of 50mm. The small sample area in the carrier plate 23 is a vacuum adsorption area with an area of ​​250x250mm. The diameter of the adsorption holes 25 can be 2mm, and the spacing is 23.5mm. Furthermore, the upper surface of the connector 31 is provided with a cavity. The adsorption mechanism also includes a sealing ring 32 disposed on the connector 31 and surrounding the cavity. The sealing ring 32 abuts against the carrier plate 23 to seal the cavity. The side wall of the connector 31 may also be provided with a joint 33 that communicates with the cavity, so as to connect with an external vacuum generator to create negative pressure. When the cavity is connected to negative pressure, it can provide a large-area uniform vacuum adsorption force for the carrier plate 23.

[0042] In some embodiments, the lifting platform 10 includes: a base plate 11; a lower wedge block 12 slidably connected to the base plate 11 along a first direction; a guide assembly 16 disposed on the base plate 11 and located at one end of the lower wedge block 12; an upper wedge block 15 slidably connected to the guide assembly 16 along a second direction, and the upper wedge block 15 is also slidably connected to the lower wedge block 12; a platform plate 17 disposed on the upper wedge block 15 for forming a moving end; and a driving assembly disposed on the base plate 11 for driving the lower wedge block 12 to move along the first direction.

[0043] In some embodiments, the driving assembly includes: a lead screw 13, rotatably mounted on the base plate 11 and arranged along a first direction; a nut, adapted to the lead screw 13 and connected to the lower wedge block 12; and a motor 14, mounted on the base plate 11 and driven by the lead screw 13. The working principle of the lifting platform 10 is as follows: the motor 14 drives the lead screw 13 to rotate, causing the nut to move along the first direction. The lower wedge block 12 is connected to the nut and moves synchronously along the first direction. Simultaneously, due to the guiding effect of the guide assembly 16, the upper wedge block 15, pushed by the lower wedge block 12, moves along a second direction, forming a Z-axis fine-tuning. Its Z-axis movement stroke is typically small, mainly serving a fine-tuning function. Furthermore, the lifting platform 10 also includes an outer frame 18 mounted on the base plate 11, with the lower wedge block 12, upper wedge block 15, and guide assembly 16 disposed within the outer frame 18. The aforementioned Z-axis and Z-axis directions refer to the second direction.

[0044] In some embodiments, the lifting platform 10 further includes a bushing 19 disposed on the lower side of the platform plate 17, the bushing 19 being slidably connected to the inner wall of the outer frame 18. The outer frame 18 provides a certain degree of protection for internal components such as the lower wedge block 12, upper wedge block 15, guide assembly 16, and lead screw 13. The bushing 19 also provides a certain degree of sealing between the platform plate 17 and the outer frame 18, preventing external impurities from entering the interior of the outer frame 18, further enhancing the protective effect of the lifting platform 10 itself.

[0045] In some embodiments, the stage further includes a plurality of pads 41 disposed on the substrate 11. The pads 41 are disposed on the underside of the substrate 11 and are stacked. Specifically, two pads 41, one large and one small, can be provided, with one pad 41 having a height of 150mm and the other pad 41 having a height of 50mm. The combination of the two pads 41 can increase the height by 200mm in the Z-axis direction. Using one large pad 41 can increase the height by 150mm, and using one small pad 41 can increase the height by 50mm. In actual use, there can be other combinations, such as combining two large pads 41 or two small pads 41. This form is very flexible. By stacking pads 41 of different heights, the height of the workpiece can be quickly adjusted to meet the requirements of different processing depths. The upper mounting surface of the pad 41 is provided with pin holes for positioning and can be mated with other pads 41 or connecting plates; the upper mounting surface of the pad 41 is also provided with threaded holes for fixing and connecting other pads 41 or connecting plates. The lower mounting surface of the pad 41 also has pin holes and threaded holes, and the interior of the pad 41 can be hollowed out. Both the upper and lower mounting surfaces are positioned using pins to ensure positional accuracy when multiple pads 41 are combined. All four sides of the pad 41 are hollowed out, which reduces weight and facilitates handling and disassembly. Specifically, the pad 41 can be formed by combining four frame plates.

[0046] This application also proposes a processing device, including a stage and a frame for mounting the stage. The processing device in this application embodiment can be a laser processing device. The stage in this application embodiment fully considers stability and flexibility during the processing. It combines threaded fixing and adsorption functions to ensure the workpiece is fixed during processing, preventing processing errors caused by movement or vibration. Simultaneously, the pitch angle adjustment, combined pads, and Z-axis fine-tuning functions make the processing more flexible, capable of handling processing requirements of different shapes and angles. Furthermore, the device is simple and convenient to operate, accurately positioned, and securely clamped.

[0047] Particularly suitable for the following fields:

[0048] 1. Laser Processing: Particularly suitable for applications requiring high precision and flexibility, such as laser cutting, marking, and welding, significantly improving processing quality and efficiency. 2. Electronics Manufacturing: With the miniaturization and increasing complexity of electronic products, the versatility and flexibility of this platform make it an indispensable tool in the manufacturing process, especially in the early testing and development stages. 3. Scientific Research and Education: This design also plays a vital role in research institutions and university laboratories, supporting various complex experiments and research, while also serving as a teaching tool to help students understand and learn advanced processing technologies.

[0049] The platform and processing equipment in this application embodiment have the following advantages:

[0050] 1. Multifunctionality and Stability: With interchangeable tooling, this platform can adapt to products of various shapes and sizes, greatly improving the equipment's versatility and compatibility. Combined with threaded fixing and suction functions, it ensures workpiece stability during processing, effectively avoiding processing errors caused by movement or vibration, and improving processing accuracy. 2. Flexible Adjustment: Allows users to adjust the workpiece's tilt angle according to processing needs, which is crucial for processing tasks at specific angles. By stacking blocks of different heights, the workpiece height can be quickly adjusted to adapt to different processing depth requirements. It provides fine vertical adjustment, both manually and electrically, ensuring the workpiece's precise position during processing and further improving processing accuracy. 3. Ease of Operation: Simplified Operation Process: The design prioritizes user experience, making operation simple and intuitive, reducing operational complexity and improving work efficiency. 4. Precise Positioning: A precise positioning structure ensures accurate alignment with the target position for each processing operation, reducing the time and errors associated with repeated positioning.

[0051] The above are only some or preferred embodiments of this application. Neither the text nor the drawings should limit the scope of protection of this application. All equivalent structural transformations made using the content of this application's specification and drawings under the overall concept of this application, or direct / indirect applications in other related technical fields, are included within the scope of protection of this application.

Claims

1. A platform, characterized in that, include: Lifting platform; The adjustment mechanism includes a mounting base located at the movable end of the lifting platform, a plurality of micro-heads located on the mounting base, a carrier plate located above the mounting base and abutting against the micro-heads, and a support member connecting the mounting base and the carrier plate; the micro-heads are used to adjust the tilt angle of the carrier plate. The adsorption mechanism includes a connector disposed on the carrier plate and located between the carrier plate and the mounting base. A cavity is formed between the connector and the carrier plate. The carrier plate is also provided with adsorption holes communicating with the cavity.

2. The platform according to claim 1, characterized in that, The micrometer head is located at the four corners of the mounting base. The micrometer head includes an adjustment knob located below the mounting base and a probe connected to the adjustment knob. The probe also abuts against the carrier plate.

3. The platform according to claim 1, characterized in that, The carrier plate is also provided with a plurality of mounting holes, which are arranged in an array and evenly distributed on the upper surface of the carrier plate. The adsorption holes are arranged in an array and located in the central area of ​​the carrier plate.

4. The platform according to claim 1, characterized in that, The upper surface of the connector is provided with the cavity, and the adsorption mechanism further includes a sealing ring disposed on the connector and surrounding the cavity. The sealing ring abuts against the carrier plate to seal the cavity.

5. The platform according to claim 1, characterized in that, The lifting platform includes: substrate; The lower wedge-shaped block is slidably connected to the substrate along a first direction; A guide assembly is disposed on the substrate and located at one end of the lower wedge block; The upper wedge block is slidably connected to the guide assembly along the second direction, and the upper wedge block is also slidably connected to the lower wedge block; A platform plate, disposed on the upper wedge-shaped block, is used to form the mobile end; A driving component, disposed on the substrate, is used to drive the lower wedge block to move along a first direction.

6. The platform according to claim 5, characterized in that, The driving component includes: A lead screw is rotatably mounted on the substrate and is arranged along a first direction; A nut, adapted to the lead screw, and connected to the lower wedge block; The motor is mounted on the base plate and is connected to the lead screw drive.

7. The platform according to claim 6, characterized in that, The lifting platform also includes an outer frame disposed on the base plate, and the lower wedge block, the upper wedge block and the guide assembly are disposed in the outer frame.

8. The platform according to claim 7, characterized in that, The lifting platform also includes a bushing located on the underside of the platform plate, and the bushing is slidably connected to the inner wall of the outer frame.

9. The platform according to claim 5, characterized in that, The stage also includes a plurality of pads disposed on the substrate, the pads being disposed on the underside of the substrate and stacked in layers.

10. A processing device, characterized in that, It includes the platform according to any one of claims 1 to 9, and the frame for mounting the platform.

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