Outer circle grinding and polishing machine for semiconductor optical silicon wafer

Abstract

The utility model relates to the technical field of semiconductor silicon wafer production equipment, in particular to a semiconductor optical silicon wafer outer circle grinding and polishing machine, which comprises a supporting seat, a supporting frame is fixedly connected onto the supporting seat, a connecting shaft is fixedly connected onto the supporting frame, a rotating shaft is rotatably connected onto the connecting shaft, a grinding and polishing wheel is clamped on the rotating shaft, and the grinding and polishing wheel is fixedly connected onto the supporting seat. A fixing structure is arranged on the supporting frame and comprises a sliding rod and an abutting block, the sliding rod is connected to the supporting frame in a sliding mode, a protective cover is fixedly connected to the sliding rod, the abutting block is rotationally connected to the bottom end of the sliding rod and abuts against the grinding and polishing wheel, and a connecting base is fixedly connected to the supporting frame. An inserting block is connected to the connecting base in a sliding mode, two inserting grooves are formed in the sliding rod, and one end of the inserting block is clamped with one of the inserting grooves; the grinding and polishing wheel can be quickly disassembled and assembled, so that the grinding and polishing wheel is convenient to replace.

Description

Technical Field

[0001] This utility model relates to an external cylindrical grinding and polishing machine, specifically an external cylindrical grinding and polishing machine for semiconductor optical silicon wafers, belonging to the technical field of semiconductor silicon wafer production equipment. Background Technology

[0002] Semiconductor optical silicon wafers are a basic material used to manufacture chips. Their main component is silicon (Si). Silicon wafers are thin sheets made by pulling and slicing high-purity polycrystalline silicon materials. They are commonly used in the manufacture of integrated circuits and various semiconductor devices. During the production of semiconductor silicon wafers, the edges of the silicon crystal rods are relatively rough after slicing. At this time, it is necessary to use an outer cylindrical polishing machine to polish the outer circle to make it smooth and flat, so as to facilitate subsequent processing.

[0003] However, the polishing wheel of a traditional polishing machine is bolted to the machine, and a protective cover is also installed on one side of the polishing wheel with multiple bolts to protect it. Therefore, when the polishing wheel needs to be replaced, multiple bolts must be turned to remove the protective cover first, and then the polishing wheel must be removed by turning the bolts. This process is time-consuming and labor-intensive, making it inconvenient to quickly replace the polishing wheel. Utility Model Content

[0004] The purpose of this invention is to provide a semiconductor optical silicon wafer outer cylindrical grinding and polishing machine to solve the above problems, which can realize the quick disassembly and assembly of the grinding and polishing wheel, thereby facilitating the replacement of the grinding and polishing wheel.

[0005] This utility model achieves the above-mentioned objectives through the following technical solution: a semiconductor optical silicon wafer outer cylindrical grinding and polishing machine, comprising a support base, a support frame fixedly connected to the support base, a connecting shaft fixedly connected to the support frame, a rotating shaft rotatably connected to the connecting shaft, a grinding and polishing wheel engaged on the rotating shaft, a fixed structure provided on the support frame, the fixed structure comprising a slide rod and a stop block, a slide rod slidably connected to the support frame, a protective cover fixedly connected to the slide rod, a stop block rotatably connected to the bottom end of the slide rod, the stop block abutting against the grinding and polishing wheel, a connecting seat fixedly connected to the support frame, an insert block slidably connected to the connecting seat, two slots provided on the slide rod, one end of the insert block engaging with one of the slots.

[0006] Preferably, a spring is sleeved on the outside of the insert block, one end of the spring abutting against the connecting seat, and the other end of the spring abutting against the insert block.

[0007] Preferably, the cross-section of one end of the insert is T-shaped, and the cross-section of the other end of the insert is trapezoidal.

[0008] Preferably, the cross-section at the top of the slide rod is T-shaped, and the cross-section between the slide rod and the stop block is also T-shaped.

[0009] Preferably, the support frame is provided with a drive structure, the drive structure includes a first motor and a first gear, the first motor is mounted on the support frame, the first gear is fixedly connected to the output shaft of the first motor, and a second gear is fixedly connected to the rotating shaft, and the first gear and the second gear mesh with each other.

[0010] Preferably, the support frame is provided with a placement structure, the placement structure including an electric push rod and a slide block, the electric push rod is installed on the support frame, the slide block is slidably connected to the support frame, and one end of the electric push rod is fixedly connected to the slide block.

[0011] Preferably, a suction cup is rotatably connected to the support frame, a fourth gear is fixedly connected to the suction cup, a second motor is mounted on the support frame, a third gear is fixedly connected to the output shaft of the second motor, and the third gear meshes with the fourth gear.

[0012] Preferably, a connecting rod is fixedly connected to the support frame, a water spray pipe is fixedly connected to the connecting rod, and a water collection tank is placed on the support base.

[0013] The beneficial effects of this utility model are: when the polishing wheel needs to be replaced, the insert block can be pulled. When the insert block is not engaged with one of the slots, the slide rod can be pulled. The slide rod will drive the stop block and the protective cover to move away from the polishing wheel. As the slide rod moves, one end of the insert block will engage with the other slot. At this time, the protective cover will not block the polishing wheel. Then, the polishing wheel can be directly removed from the shaft, thus realizing the quick disassembly of the polishing wheel and facilitating its replacement. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the connection structure between the electric push rod and the slide of this utility model;

[0016] Figure 3 for Figure 2 The enlarged schematic diagram of part A shown below;

[0017] Figure 4 This is a schematic diagram of the structure of the rotating shaft of this utility model.

[0018] In the diagram: 1. Support base; 2. Support frame; 3. Connecting shaft; 4. Rotating shaft; 5. Grinding wheel; 6. Fixing structure; 601. Slide rod; 602. Abutment block; 603. Connecting base; 604. Insert block; 605. Spring; 606. Slot; 7. Drive structure; 701. First motor; 702. First gear; 703. Second gear; 8. Placement structure; 801. Electric push rod; 802. Slide base; 803. Suction cup; 804. Second motor; 805. Third gear; 806. Fourth gear; 9. Protective cover; 10. Connecting rod; 11. Water spray pipe; 12. Water collection tank. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, a semiconductor optical silicon wafer external cylindrical polishing machine includes a support base 1, a support frame 2 fixedly connected to the support base 1, a connecting shaft 3 fixedly connected to the support frame 2, a rotating shaft 4 rotatably connected to the connecting shaft 3, a polishing wheel 5 engaged on the rotating shaft 4, a fixing structure 6 provided on the support frame 2, the fixing structure 6 including a slide rod 601 and a stop block 602, the slide rod 601 slidably connected to the support frame 2, a protective cover 9 fixedly connected to the slide rod 601, a stop block 602 rotatably connected to the bottom end of the slide rod 601, the stop block 602 abutting against the polishing wheel 5, a connecting seat 603 fixedly connected to the support frame 2, an insert block 604 slidably connected to the connecting seat 603, two slots 606 provided on the slide rod 601, one end of the insert block 604 engaging with one of the slots 606.

[0021] As a technical optimization solution of this utility model, such as Figure 3 As shown, a spring 605 is sleeved on the outside of the insert 604. One end of the spring 605 abuts against the connecting seat 603, and the other end of the spring 605 abuts against the insert 604. Therefore, the insert 604 can automatically engage with the slot 606 under the action of the spring 605.

[0022] As a technical optimization solution of this utility model, such as Figure 3As shown, the cross-section of one end of the insert 604 is T-shaped, and the cross-section of the other end of the insert 604 is trapezoidal, thus it can play a guiding role when the insert 604 and the slot 606 are engaged.

[0023] As a technical optimization solution of this utility model, such as Figure 3 As shown, the top section of the slide rod 601 has a T-shaped structure, and the section between the slide rod 601 and the stop block 602 has a T-shaped structure, thus making it easy to pull the slide rod 601.

[0024] As a technical optimization solution of this utility model, such as Figure 2 and Figure 3 As shown, the support frame 2 is provided with a drive structure 7, which includes a first motor 701 and a first gear 702. The first motor 701 is mounted on the support frame 2, and the first gear 702 is fixedly connected to the output shaft of the first motor 701. The second gear 703 is fixedly connected to the rotating shaft 4. The first gear 702 and the second gear 703 mesh with each other, so they can drive the polishing wheel 5 to rotate, thereby realizing the polishing of the outer circle of the silicon wafer.

[0025] As a technical optimization solution of this utility model, such as Figure 1 , Figure 2 and Figure 3 As shown, the support frame 2 is provided with a placement structure 8, which includes an electric push rod 801 and a slide block 802. The electric push rod 801 is mounted on the support frame 2, and the slide block 802 is slidably connected to the support frame 2. One end of the electric push rod 801 is fixedly connected to the slide block 802. A suction cup 803 is rotatably connected to the support frame 2, and a fourth gear 806 is fixedly connected to the suction cup 803. A second motor 804 is mounted on the support frame 2, and a third gear 805 is fixedly connected to the output shaft of the second motor 804. The third gear 805 meshes with the fourth gear 806, thus enabling the silicon wafer to be fixed.

[0026] As a technical optimization solution of this utility model, such as Figure 1 As shown, a connecting rod 10 is fixedly connected to the support frame 2, and a water spray pipe 11 is fixedly connected to the connecting rod 10. A water collection tank 12 is placed on the support base 1. Therefore, cooling water can flow from the end of the water spray pipe 11 to the silicon wafer polishing area, thereby avoiding damage caused by frictional heat generation of the silicon wafer.

[0027] In use, this invention connects the cooling water pipe to the spray pipe 11. When polishing silicon wafers, the wafers are placed on the suction cup 803 and fixed in place. Then, by activating the electric push rod 801, the push rod retracts, causing the slide 802 to move. The slide 802 then moves the suction cup 803, and the silicon wafer moves with the suction cup 803. When the silicon wafer comes into contact with the polishing wheel 5, the first motor 701 is activated. The output shaft of the first motor 701 rotates, driving the first gear 702 to rotate. The first gear 702 drives the second gear 703 to rotate, which in turn drives the rotating shaft 4 to rotate. The rotating shaft 4 then drives the polishing wheel 5 to rotate. Simultaneously, the second motor 804 is activated, causing the output shaft of the second motor 804 to rotate, which in turn drives the third gear 805 to rotate. The third gear 805 then drives the fourth gear 806 to rotate, which in turn drives the suction cup 803. The rotating suction cup 803 causes the silicon wafer to rotate, and during this rotation, the silicon wafer rubs against the rotating polishing wheel 5, thus polishing the outer circumference of the silicon wafer. During the polishing process, cooling water flows from the end of the water spray pipe 11 to the polishing area of ​​the silicon wafer, thus preventing damage caused by frictional heat. The flowing cooling water is collected in the water collection tank 12. When the polishing wheel 5 needs to be replaced, the insert block 604 is pulled, and the spring 605 retracts. When 604 is not engaged with one of the slots 606, the slide bar 601 can be pulled. The slide bar 601 will drive the stop block 602 and the protective cover 9 to move away from the polishing wheel 5. As the slide bar 601 moves, under the action of the spring 605, one end of the 604 insert will engage with the other slot 606. At this time, the protective cover 9 will not block the polishing wheel 5. Then, the polishing wheel 5 can be directly removed from the rotating shaft 4, thus realizing the quick disassembly of the polishing wheel 5 and facilitating the replacement of the polishing wheel 5.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor optical silicon wafer external cylindrical grinding and polishing machine, comprising a support base (1), characterized in that: A support frame (2) is fixedly connected to the support base (1), a connecting shaft (3) is fixedly connected to the support frame (2), a rotating shaft (4) is rotatably connected to the connecting shaft (3), a polishing wheel (5) is engaged on the rotating shaft (4), a fixing structure (6) is provided on the support frame (2), the fixing structure (6) includes a slide rod (601) and a stop block (602), the slide rod (601) is slidably connected to the support frame (2), the slide rod (601) A protective cover (9) is fixedly connected to the upper part of the slide rod (601). A stop block (602) is rotatably connected to the bottom end of the slide rod (601). The stop block (602) abuts against the polishing wheel (5). A connecting seat (603) is fixedly connected to the support frame (2). An insert block (604) is slidably connected to the connecting seat (603). Two slots (606) are provided on the slide rod (601). One end of the insert block (604) engages with one of the slots (606).

2. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: A spring (605) is sleeved on the outside of the insert (604). One end of the spring (605) abuts against the connecting seat (603), and the other end of the spring (605) abuts against the insert (604).

3. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: The cross-section of one end of the insert (604) is T-shaped, and the cross-section of the other end of the insert (604) is trapezoidal.

4. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: The top of the slide rod (601) has a T-shaped cross-section, and the cross-section between the slide rod (601) and the stop block (602) also has a T-shaped cross-section.

5. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: The support frame (2) is provided with a drive structure (7), which includes a first motor (701) and a first gear (702). The first motor (701) is mounted on the support frame (2), and the first gear (702) is fixedly connected to the output shaft of the first motor (701). The second gear (703) is fixedly connected to the rotating shaft (4), and the first gear (702) and the second gear (703) mesh with each other.

6. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: The support frame (2) is provided with a placement structure (8), which includes an electric push rod (801) and a slide (802). The electric push rod (801) is installed on the support frame (2), and the slide (802) is slidably connected to the support frame (2). One end of the electric push rod (801) is fixedly connected to the slide (802).

7. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 6, characterized in that: A suction cup (803) is rotatably connected to the support frame (2), a fourth gear (806) is fixedly connected to the suction cup (803), a second motor (804) is installed on the support frame (2), a third gear (805) is fixedly connected to the output shaft of the second motor (804), and the third gear (805) meshes with the fourth gear (806).

8. The semiconductor optical silicon wafer external cylindrical grinding and polishing machine according to claim 1, characterized in that: A connecting rod (10) is fixedly connected to the support frame (2), a water spray pipe (11) is fixedly connected to the connecting rod (10), and a water collection tank (12) is placed on the support base (1).

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