Positioning and fixing device for silicon wafer processing
By introducing a combination structure of positioning base, boss, micro motor and pressure rod into the silicon wafer cutting and processing equipment, the problem of insufficient clamping structure limit is solved, and the stable fixing of silicon wafers and processing safety are achieved.
Patent Information
- Application Number
- CN202423319395.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing silicon wafer cutting and processing equipment has poor clamping structure limiting, and it requires space during clamping, which can easily cause it to hit other components inside the equipment, resulting in unstable silicon wafer position and potential damage.
A silicon wafer processing positioning and fixing device is adopted, which includes a positioning base, a boss, a micro motor, a lead screw and a pressure bar. The micro motor controls the pressure plate to fix the silicon wafer from multiple directions, and the limiting groove and limiting hole restrict the movement of the silicon wafer to ensure stable clamping.
This technology enables multi-directional fixation of silicon wafers, preventing wafer displacement and equipment collisions, and improving processing stability and safety.
Smart Images
Figure CN223864050U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon wafer processing positioning technology, specifically to a silicon wafer processing positioning and fixing device. Background Technology
[0002] During silicon wafer cutting, the blue film of the silicon wafer is usually adsorbed onto the positioning base by a suction cup gripper, and then clamped and fixed by a clamping plate structure on the top of the positioning base. The clamping plate structure is usually rotated and set on the side of the positioning base. After the blue film of the silicon wafer is placed on the top of the positioning base, the clamping plate structure flips to press the plate down and fix it.
[0003] However, this clamping structure is usually set on the left and right sides of the positioning base, which cannot restrict the front and back position of the silicon wafer blue film plate, making it easy to cause displacement. Furthermore, when the clamping structure is flipped, it will occupy a certain amount of space and may hit the suction cup structure or other components inside the equipment, easily causing scratches or damage. Utility Model Content
[0004] The technical problem this invention aims to solve is that the clamping structure inside existing silicon wafer cutting and processing equipment has poor limiting properties, requires a certain working space during clamping, and is prone to hitting other components inside the equipment.
[0005] To solve the above problems, the technical solution adopted by this utility model is a silicon wafer processing positioning and fixing device, including a positioning base, a boss fixed on the upper side of the positioning base, a plurality of limiting grooves opened on the upper side of the boss near the edge, a micro motor one fixed on the side of the boss at the limiting groove, a lead screw one fixed on the output end of the micro motor one, the lead screw one rotatably set in the limiting groove, an adjustment platform slidably set in the limiting groove, a micro motor two fixed obliquely on the top of one side of the adjustment platform, a lead screw two fixed through the output end of the micro motor two through the adjustment platform, a connecting block rotatably connected to the outer side of the lead screw two, a pressure rod fixed on one side of the connecting block, and a pressure plate fixed on the lower side of one end of the pressure rod.
[0006] As a further embodiment of this utility model: the adjusting table is threadedly connected to the outside of the lead screw, and the adjusting table can be moved by rotating the lead screw.
[0007] As a further embodiment of this utility model: a limiting rod is fixed on the upper side of the pressure rod, and a limiting hole is provided at the top of the adjustment table for the limiting rod to slide, which can limit the movement direction of the pressure rod.
[0008] As a further embodiment of this utility model, a silicon wafer blue film plate is sandwiched between the boss and the pressure plate.
[0009] As a further embodiment of this utility model: there are a total of six limiting grooves, which are evenly distributed on the outside of the boss, enabling the pressure plate to fix the silicon wafer blue film plate above the boss from multiple directions.
[0010] As a further embodiment of this utility model: micro motor one and micro motor two are electrically connected to an external power source.
[0011] Compared with the prior art, the advantages of this utility model are as follows: This patent adds several obliquely arranged micro motors II, which can control the pressure plate to press the silicon wafer blue film plate, and micro motor I, which can control the position of the pressure plate so that the pressure plate can press on the silicon wafer blue film plate. Attached Figure Description
[0012] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0013] Figure 1 This is a three-dimensional view of the overall structure of a silicon wafer processing positioning and fixing device according to the present invention.
[0014] Figure 2 This is a partial structural cross-sectional view of a silicon wafer processing positioning and fixing device according to the present invention.
[0015] Figure 3 This is an enlarged view of part A of the silicon wafer processing positioning and fixing device of this utility model.
[0016] Figure 4 This is an enlarged view of part B of the silicon wafer processing positioning and fixing device of this utility model.
[0017] In the attached image:
[0018] 1. Positioning base; 2. Boss; 3. Micro motor one; 4. Lead screw one; 5. Adjustment platform; 6. Micro motor two; 7. Lead screw two; 8. Connecting block; 9. Pressure rod; 10. Pressure plate; 11. Limiting rod; 12. Silicon wafer blue film plate; 2.1. Limiting groove; 5.1. Limiting hole. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] This utility model provides a technical solution to address the existing problems mentioned in the background art.
[0021] Combined with appendix Figure 1-4It can be seen that the positioning base 1 is included, and a boss 2 is fixed on the upper side of the positioning base 1. Six limiting grooves 2.1 are opened on the upper side of the boss 2 near the edge and are evenly distributed on the outer side of the boss 2. The pressure plate 10 can fix the silicon wafer blue film plate 12 above the boss 2 from multiple directions. A micro motor 3 is fixed on the side of the boss 2 at the limiting groove 2.1. A lead screw 4 is fixed at the output end of the micro motor 3. The lead screw 4 is rotatably set in the limiting groove 2.1. An adjustment platform 5 is slidably provided in the limiting groove 2.1. The adjustment platform 5 is threadedly connected to the outer side of the lead screw 7. The adjustment platform 5 can be moved by rotating the lead screw 7. A micro motor 6 is obliquely fixed on the top side of one side of the adjustment platform 5. The output end of the micro motor 6 passes through the adjustment platform 5 and is fixed to the lead screw 7. A connecting block 8 is threadedly rotatably connected to the outer side of the lead screw 7. The rotation of the lead screw 7 can move the connecting block 8. A pressure rod 9 is fixed on one side of the connecting block 8. A pressure plate 10 is fixed on the lower side of one end of the pressure rod 9.
[0022] A limiting rod 11 is fixed on the upper side of the pressure rod 9, and a limiting hole 5.1 is opened at the top of the adjustment table 5 for the limiting rod 11 to slide, which can limit the movement direction of the pressure rod 9; a silicon wafer blue film plate 12 is sandwiched between the boss 2 and the pressure plate 10; micro motor 1 3 and micro motor 2 6 are electrically connected to an external power supply respectively.
[0023] The working principle of this application is as follows: Before fixing the silicon wafer blue film plate 12, the connecting block 8 is located at the top of the lead screw 7 to facilitate the placement of the silicon wafer blue film plate 12. Then, the silicon wafer blue film plate 12 is placed on the upper side of the positioning base 1 by the suction cup mechanism. At the same time, the micro motor 3 is started to adjust the position of the adjustment table 5 so that the pressure plate 10 can press on the upper side of the silicon wafer blue film plate 12. After adjustment, the micro motor 6 is started to drive the connecting block 8 to move obliquely downward so that the pressure plate 10 presses on the upper side of the silicon wafer blue film plate 12 for clamping and positioning. Then, the cutting process can be performed.
[0024] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.
Claims
1. A silicon wafer processing positioning and fixing device, comprising a positioning base (1), characterized in that: The positioning base (1) has a boss (2) fixed on its upper side. Several limiting grooves (2.1) are opened on the upper side of the boss (2) near the edge. A micro motor (3) is fixed on the side of the boss (2) at the limiting groove (2.1). A lead screw (4) is fixed at the output end of the micro motor (3). The lead screw (4) is rotatably set in the limiting groove (2.1). An adjustment platform (5) is slidably set in the limiting groove (2.1). A micro motor (6) is obliquely fixed on the top of one side of the adjustment platform (5). A lead screw (7) is fixed through the adjustment platform (5) at the output end of the micro motor (6). A connecting block (8) is threadedly rotatably connected to the outside of the lead screw (7). A pressure rod (9) is fixed on one side of the connecting block (8). A pressure plate (10) is fixed on the lower side of one end of the pressure rod (9).
2. The silicon wafer processing positioning and fixing device according to claim 1, characterized in that: The adjusting platform (5) is threaded to the outside of the lead screw (7).
3. The silicon wafer processing positioning and fixing device according to claim 1, characterized in that: The upper side of the pressure rod (9) is fixed with a limit rod (11), and the top of the adjustment table (5) is provided with a limit hole (5.1) for the limit rod (11) to slide.
4. The silicon wafer processing positioning and fixing device according to claim 1, characterized in that: A silicon wafer blue film plate (12) is sandwiched between the boss (2) and the pressure plate (10).
5. The silicon wafer processing positioning and fixing device according to claim 1, characterized in that: There are six limiting grooves (2.1) in total, and they are evenly distributed on the outside of the boss (2).
6. The silicon wafer processing positioning and fixing device according to claim 1, characterized in that: The micro motor one (3) and micro motor two (6) are electrically connected to an external power source, respectively.