Carrier tape and electronic component carrier tape assembly

Abstract

The utility model provides a carrier tape and an electronic component carrier tape assembly. The carrier tape comprises at least one bearing unit; each bearing unit comprises a substrate, and the substrate comprises a first surface and a second surface which are oppositely arranged; the first surface is provided with a conductive layer; the second surface is recessed towards the first surface to form a packaging groove for accommodating an electronic component and packaging glue; the substrate further comprises a connecting hole communicated with the first surface and the second surface, and the conductive layer is electrically connected with an electronic element through the connecting hole.

Description

Technical Field

[0001] This application relates to the field of electronic component packaging and transportation technology, and in particular to a carrier tape and electronic component carrier tape assembly. Background Technology

[0002] A smart card is a card with a built-in integrated circuit chip that can store and process data. The carrier tape, as one of the key components of a smart card, is mainly used to fix and protect the chip, and enables the chip to communicate with external reading and writing devices via electrical connection.

[0003] When encapsulating chips by applying encapsulating adhesive onto existing carrier tapes, the encapsulating adhesive is affected by factors such as the surface roughness of the carrier tape and the amount of adhesive dispensed by the dispensing equipment, resulting in poor uniformity in the size of the encapsulated body formed by the encapsulating adhesive. Utility Model Content

[0004] This application provides a carrier tape and an electronic component carrier tape assembly.

[0005] A first aspect of this application provides a carrier tape, the carrier tape including at least one carrier unit; each carrier unit includes a substrate, the substrate including a first surface and a second surface disposed opposite to each other; the first surface is provided with a conductive layer; the second surface is recessed toward the first surface to form an encapsulation groove for accommodating electronic components and encapsulating adhesive; the substrate also includes a connection hole connecting the first surface and the second surface, the conductive layer being electrically connected to the electronic components through the connection hole.

[0006] In one embodiment, the orthographic projection of the connecting hole onto the plane of the second surface lies within the orthographic projection of the encapsulation groove onto the plane of the second surface.

[0007] In one embodiment, when there are multiple carrier units, the shape, size, and depth of the encapsulation groove of each carrier unit are the same.

[0008] In one embodiment, the cross-sectional shape of the encapsulation groove is rectangular or circular.

[0009] In one embodiment, the carrier belt includes a plurality of carrier unit groups arranged along a first direction, each carrier unit group including a plurality of carrier units arranged along a second direction; the first direction intersects the second direction.

[0010] In one embodiment, the carrier belt includes a plurality of teeth arranged along a first direction, the teeth being distributed on opposite sides of the carrier unit group.

[0011] In one embodiment, the toothed holes located on both sides of the bearing unit are symmetrically arranged along the first direction.

[0012] In one embodiment, the conductive layer includes etched lines that divide the conductive layer into a plurality of contacts.

[0013] In one embodiment, there are multiple connection holes, with one end of each connection hole connected to a contact point and the other end connected to the encapsulation groove.

[0014] A second aspect of this application provides an electronic component carrier tape assembly, the electronic component carrier tape assembly including electronic components and the carrier tape described above, the electronic components being located within the encapsulation groove of the carrier tape.

[0015] When the carrier tape provided in this application is used to encapsulate electronic components by applying encapsulating adhesive within the encapsulation groove, the shape and volume of the encapsulation groove can limit the total amount of encapsulating adhesive. When the encapsulating adhesive is applied, it is confined within the encapsulation groove and will not overflow or spread to other areas. After the encapsulating adhesive cures to form a package, because the encapsulating adhesive can only cure and solidify within the space defined by the encapsulation groove, the shape and size of the formed package correspond to the shape and size of the encapsulation groove, thereby ensuring the uniformity of the package's shape and size and the reliability of the encapsulation.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] Figure 1 This is a schematic diagram of the structure of the first surface of a carrier tape provided in an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure of the second surface of a carrier tape provided in an embodiment of this application;

[0020] Figure 3 for Figure 2 The illustrated embodiment is a partial sectional view taken along the AA direction. Detailed Implementation

[0021] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0022] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0023] The carrier tape and electronic component carrier tape assembly of the present application embodiments will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features of the following embodiments and implementations can complement or combine with each other.

[0024] This application provides a carrier tape. For example... Figures 1 to 3 As shown, the carrier tape 100 includes at least one carrier unit 10. Each carrier unit 10 includes a substrate 11, which includes a first surface 111 and a second surface 112 disposed opposite to each other. The first surface 111 is provided with a conductive layer 12. The second surface 112 is recessed toward the first surface 111 to form an encapsulation groove 13 for accommodating electronic components and encapsulating adhesive. The substrate 11 also includes a connection hole 14 connecting the first surface 111 and the second surface 112, through which the conductive layer 12 is electrically connected to the electronic components.

[0025] The substrate 11 forms the main body of the carrier tape 100, used for mounting and setting the conductive layer 12 and electronic components. The conductive layer 12 has good conductivity, which can not only be used to transmit electrical signals, but also provide contact points for subsequent soldering or crimping. After filling the connection hole 14 with conductive material, the connection hole 14 can be used to realize the electrical connection between the conductive layer 12 and the electronic components, ensuring high-speed signal transmission while avoiding complex wiring connections.

[0026] When using a carrier tape to carry electronic components, the electronic components are placed within the encapsulation groove 13. The encapsulation groove 13 provides space for the electronic components, achieving initial positioning between the electronic components and the carrier tape. Then, encapsulating adhesive is applied into the encapsulation groove 13 to encapsulate the electronic components. The shape and volume of the encapsulation groove 13 limit the total amount of encapsulating adhesive, ensuring that the adhesive is confined within its area and does not overflow or spread to other areas. After the encapsulating adhesive cures to form a package, because it can only cure within the space defined by the encapsulation groove 13, the shape and size of the resulting package correspond to the shape and size of the encapsulation groove 13, thus ensuring the uniformity of the package's shape and size and the reliability of the encapsulation.

[0027] In the subsequent card manufacturing process, the milling operation requires determining appropriate milling parameters based on the shape and size of the package. When the shape and size of the package are fixed and uniform, it is easier to determine the milling parameters, allowing the milling operation to be performed more accurately and ensuring the smooth progress of the card manufacturing process.

[0028] In one embodiment, the substrate 11 may be made of polymer materials such as glass fiber or polyimide, or ceramic materials.

[0029] In one embodiment, the material of the conductive layer 12 may be, for example, copper, aluminum, silver, or other materials with good electrical conductivity.

[0030] In one embodiment, such as Figure 1 As shown, the conductive layer 12 includes etching lines 121, which divide the conductive layer 12 into multiple contacts 122. Specifically, a layer of photoresist is first coated on the surface of the conductive layer 12, then the photoresist is patterned using a photolithography process, and then the conductive layer portion not protected by the photoresist is etched using physical or chemical etching, thereby forming etching lines 121 that divide the continuous conductive layer into multiple contacts 122. Each contact 122 can be independently connected to a specific pin or electrode of an electronic component, realizing the separation and independent control of transmission paths for different signals or power supplies in the circuit.

[0031] In one embodiment, such as Figure 2 As shown, there are multiple connection holes 14. One end of each connection hole 14 is connected to a contact 122, and the other end is connected to the encapsulation groove 13. Electrodes or pins on electronic components can be electrically connected to corresponding contacts through the connection holes 14.

[0032] In one embodiment, the etched contact 122 conforms to the ISO 7816 protocol, such as Figure 1 As shown, the conductive layer 12 includes six contacts 122, enabling the carrier tape 100 to load electronic components conforming to the ISO 7816 standard.

[0033] In one embodiment, such as Figure 2 and Figure 3 As shown, the orthographic projection of the connection hole 14 onto the plane containing the second surface 112 lies within the orthographic projection of the encapsulation groove 13 onto the plane containing the second surface 112. This arrangement ensures that the connection hole can be accurately electrically connected to the electronic components placed within the encapsulation groove 13. When electronic components are installed within the encapsulation groove 13, the pins or electrodes of the electronic components can be more easily and accurately aligned with the connection hole, thereby achieving effective electrical connection between the electronic components and the conductive layer 12.

[0034] In one embodiment, such as Figure 2 As shown, when there are multiple carrier units 10, the shape, size, and depth of the encapsulation groove 13 in each carrier unit 10 are identical. This configuration ensures that the volume and distribution of the encapsulating adhesive injected into the encapsulation groove 13 are essentially consistent during the encapsulation process. This results in a well-uniform encapsulated body in terms of shape, size, and thickness after curing, avoiding situations where there is insufficient or excessive protection due to differences in encapsulated body size. Furthermore, the uniform size of the encapsulated body provides a stable processing object for subsequent milling operations. The milling equipment can be programmed and set according to fixed dimensional parameters, eliminating the need for individual adjustments for each carrier unit and reducing milling errors caused by differences in encapsulated bodies. Figure 2 In the embodiments shown, the encapsulation grooves 13 are all circular in shape, and the depth and cross-sectional surface of the encapsulation grooves 13 are all the same.

[0035] In one embodiment, the encapsulation groove 13 has a rectangular or circular cross-sectional shape. A rectangular encapsulation groove can better fit the shape of the electronic component; a circular encapsulation groove allows the stress generated during the curing process of the encapsulating adhesive to be evenly distributed around the electronic component, reducing stress concentration. Furthermore, both rectangles and circles are regular geometric shapes, which can reduce processing difficulty and cost. In other embodiments, the cross-sectional shape of the encapsulation groove 13 can be hexagonal or other irregular shapes.

[0036] In one embodiment, such as Figure 1 and Figure 2As shown, the carrier tape 100 includes multiple carrier unit groups 20 arranged along a first direction X, and each carrier unit group 20 includes multiple carrier units 10 arranged along a second direction Y, where the first direction X intersects the second direction Y. This arrangement fully utilizes the planar area of ​​the carrier tape 100, increasing the density of carrier units 10 per unit area, allowing for the integration of more electronic components onto a single carrier tape, and improving production efficiency. In the embodiment shown, two carrier unit groups 20 are illustrated, each including two carrier units 10. In other embodiments, the number of carrier unit groups 20 and the number of carrier units 10 in each carrier unit group 20 can be specifically set according to actual production needs.

[0037] In one embodiment, such as Figure 1 and Figure 2 As shown, the first direction X is perpendicular to the second direction Y.

[0038] In one embodiment, such as Figure 1 and Figure 2 As shown, the carrier tape 100 includes a plurality of toothed holes 30 arranged along a first direction X, and the toothed holes 30 are distributed on opposite sides of the carrier unit group 20. In the production process, the carrier tape 100 needs to be conveyed and precisely positioned on automated equipment (such as a pick-and-place machine, packaging machine, etc.). The teeth on the transmission components of the automated equipment can mesh with the toothed holes 30 of the carrier tape 100. When the transmission components rotate, the carrier tape can be precisely moved along the first direction X through the engagement of the teeth and the toothed holes 30. Each toothed hole 30 corresponds to a fixed angle of rotation of the transmission components, thereby achieving precise step-by-step movement of the carrier tape 100, which helps to improve production efficiency and reduce production costs.

[0039] In one embodiment, such as Figure 1 and Figure 2 As shown, the toothed holes 30 located on both sides of the bearing unit group 20 are symmetrically arranged along the first direction X. When the toothed holes 30 are symmetrically arranged along both sides of the bearing unit group 20 and along the first direction X, during the transmission process of the carrier belt 100, after the toothed holes 30 on both sides mesh with the transmission components on the automated equipment, the tension on the carrier belt 100 can be evenly distributed on both sides of the carrier belt. This can prevent the carrier belt 100 from twisting or deforming due to uneven force, and ensure the stability and straightness of the carrier belt 100 during the transmission process.

[0040] This application embodiment also provides an electronic component carrier tape assembly, which includes electronic components and the aforementioned carrier tape 100. The electronic components are located within the encapsulation groove 13 of the carrier tape 100. The conductive layer 12 of the carrier tape 100 is electrically connected to the electronic components within the encapsulation groove 13 through connection holes 14. The pins or electrodes of the electronic components are mated with the connection holes 14, enabling current and signals to be transmitted between the electronic components and the conductive layer 12. This allows for communication and signal transmission between the electronic components and external circuits, ensuring that the electronic components can function properly.

[0041] In one embodiment, the encapsulation groove 13 is provided with an encapsulation body for encapsulating electronic components, the encapsulation body being formed by curing encapsulating adhesive. Specifically, the encapsulating adhesive can be a UV-curable adhesive, which can cure rapidly under UV irradiation, greatly shortening the encapsulation process time and improving production efficiency.

[0042] In one embodiment, the electronic component carrier assembly can be a smart card, and the electronic component is a smart card chip. The carrier can encapsulate and protect the chip, reducing the risk of damage to the chip caused by external factors and giving the smart card a longer service life.

[0043] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A carrier tape, characterized in that, The carrier tape includes at least one carrier unit; each carrier unit includes a substrate, the substrate including a first surface and a second surface disposed opposite to each other; the first surface is provided with a conductive layer; the second surface is recessed toward the first surface to form an encapsulation groove for accommodating electronic components and encapsulating adhesive; the substrate also includes a connection hole connecting the first surface and the second surface, the conductive layer being electrically connected to the electronic components through the connection hole.

2. The carrier tape according to claim 1, characterized in that, The orthographic projection of the connecting hole onto the plane of the second surface lies within the orthographic projection of the encapsulation groove onto the plane of the second surface.

3. The carrier tape according to claim 1, characterized in that, When there are multiple carrier units, the shape, size, and depth of the encapsulation groove of each carrier unit are the same.

4. The carrier tape according to claim 1, characterized in that, The cross-sectional shape of the encapsulation groove is rectangular or circular.

5. The carrier tape according to claim 1, characterized in that, The carrier belt includes multiple carrier unit groups arranged along a first direction, and each carrier unit group includes multiple carrier units arranged along a second direction; the first direction intersects the second direction.

6. The carrier tape according to claim 5, characterized in that, The carrier tape includes a plurality of teeth arranged along a first direction, the teeth being distributed on opposite sides of the bearing unit group.

7. The carrier tape according to claim 6, characterized in that, The toothed holes located on both sides of the bearing unit are symmetrically arranged along the first direction.

8. The carrier tape according to claim 1, characterized in that, The conductive layer includes etched lines that divide the conductive layer into multiple contacts.

9. The carrier tape according to claim 8, characterized in that, The number of connection holes is multiple, and one end of each connection hole is connected to one of the contact points, and the other end is connected to the encapsulation groove.

10. An electronic component carrier tape assembly, characterized in that, The electronic component carrier tape assembly includes electronic components and a carrier tape as described in any one of claims 1 to 9, wherein the electronic components are located within the encapsulation groove of the carrier tape.

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