Double faced adhesive tape structure for enhancing connection stability of electronic product parts

Abstract

The utility model relates to the technical field of double-faced adhesive tapes, and discloses a double-faced adhesive tape structure for enhancing the connection stability of electronic product parts, which comprises a first adhesive layer, a second adhesive layer and a support layer arranged between the first adhesive layer and the second adhesive layer, and a plurality of through holes penetrating through the thickness direction of the support layer are distributed on the support layer. The first adhesive layer is attached to one face of the supporting layer, the second adhesive layer is attached to the other face of the supporting layer, and the through holes are filled with adhesive parts of the first adhesive layer and the second adhesive layer. The double-faced adhesive tape has the advantages that the stability of the double-faced adhesive tape structure is improved, and the double-faced adhesive tape structure is not prone to thermal deformation.

Description

Technical Field

[0001] This utility model relates to the field of double-sided adhesive technology, specifically to a double-sided adhesive structure that enhances the connection stability of electronic product components. Background Technology

[0002] Double-sided adhesive tape for electronic products is a specialized double-sided bonding material used in the assembly and repair of electronic products. It typically consists of a substrate and an adhesive. The substrate generally possesses good flexibility and stability, adapting to the surfaces of various electronic components. The adhesive provides strong adhesion, quickly and firmly bonding various electronic components and parts, such as screens to frames, batteries to motherboards, etc. Furthermore, it exhibits good temperature resistance, moisture resistance, and insulation properties, maintaining stable performance in different environments to ensure the quality and reliability of electronic products. Moreover, it allows for easy disassembly during repairs without causing excessive damage to the product.

[0003] In the current electronics manufacturing industry, the stability of double-sided adhesive is a prominent issue. While commonly used double-sided adhesives for electronic products can effectively bond components at room temperature, they struggle to withstand the heat generated during operation. As heat accumulates inside electronic products, the adhesive properties of the double-sided adhesive are significantly affected. Its original physical structure gradually softens, causing changes in its shape and a substantial decrease in adhesion. This can not only loosen the connections between components but may even lead to the detachment of critical parts. Utility Model Content

[0004] To address the aforementioned problems, this invention proposes a double-sided adhesive structure that enhances the stability of electronic product component connections and reduces the likelihood of heat deformation.

[0005] To solve the above-mentioned technical problems, the technical solution proposed by this utility model is as follows: a double-sided adhesive structure for enhancing the connection stability of electronic product components, comprising a first adhesive layer, a second adhesive layer, and a support layer disposed between the first adhesive layer and the second adhesive layer. The support layer has a plurality of through holes extending through its thickness direction. The first adhesive layer is attached to one side of the support layer, and the second adhesive layer is attached to the other side of the support layer. The adhesive portion of the first adhesive layer and the second adhesive layer fills the through holes.

[0006] Furthermore, the through holes are arranged in an array on the support layer.

[0007] Furthermore, the shape of the through hole is one of a circle, a square, or a polygon.

[0008] Furthermore, the edges of both the first adhesive layer and the second adhesive layer extend beyond the edge of the support layer, with the width of the extended portion being 0.1-1 mm.

[0009] Furthermore, a first release film is provided on the side of the first adhesive layer away from the support layer, and a second release film is provided on the side of the second adhesive layer away from the support layer.

[0010] Furthermore, both the first release film and the second release film have pull tabs on their edges for easy removal.

[0011] Furthermore, the support layer is provided with a plurality of reinforcing ribs, which are equidistantly distributed around the sidewall of the support layer and are integrally formed with the support layer.

[0012] Furthermore, the first adhesive layer and the second adhesive layer have different thicknesses, wherein the thickness of the thicker adhesive layer is 1.2-1.5 times the thickness of the thinner adhesive layer.

[0013] Furthermore, both the first adhesive layer and the second adhesive layer have micro-protrusion structures on their surfaces, and the micro-protrusion structures are evenly distributed on the surfaces of the first adhesive layer and the second adhesive layer.

[0014] Compared with existing technologies, the advantages of this invention are as follows: The double-sided adhesive comprises a first adhesive layer, a second adhesive layer, and a support layer. The edge of the adhesive layer extends beyond the support layer, increasing the contact area with the component and enhancing the connection strength. The micro-protrusion structure on the surface of the adhesive layer increases the friction with the component surface, resulting in a tighter fit. The through-holes in the support layer ensure more uniform adhesive distribution and stress distribution, further improving connection stability. The reinforcing ribs enhance the strength and rigidity of the support layer, making the double-sided adhesive structure more durable and less prone to damage.

[0015] The support layer provides structural support, and the reinforcing ribs enhance its rigidity, allowing it to maintain a good structural shape and resist deformation when heated. The through-holes not only ensure more uniform adhesive distribution but also help disperse heat, preventing deformation caused by localized heat concentration. Furthermore, the optimized adhesive layer thickness and structural design enable the double-sided adhesive to maintain stable bonding performance when heated, guaranteeing the stability of the overall structure under different temperature environments. This effectively improves the structural stability of the double-sided adhesive and reduces the possibility of heat deformation. Attached Figure Description

[0016] Figure 1 This is a perspective view of the present invention;

[0017] Figure 2 This is a top view of the present invention;

[0018] Figure 3 This is the front view of this utility model;

[0019] Figure 4 This is a structural schematic diagram of the support layer portion of this utility model;

[0020] Figure 5 This is a schematic diagram of the structure of this utility model excluding the first release film and the second release film.

[0021] As shown in the figure: 1. First adhesive layer; 2. Second adhesive layer; 3. Support layer; 4. Through hole; 5. First release film; 6. Second release film; 7. Pull ear; 8. Reinforcing rib; 9. Micro-protrusion structure. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings.

[0023] Combined with appendix Figure 1 Appendix Figure 3 Appendix Figure 5 A double-sided adhesive structure for enhancing the connection stability of electronic product components includes a first adhesive layer 1, a second adhesive layer 2, and a support layer 3 disposed between the first adhesive layer 1 and the second adhesive layer 2. The first adhesive layer 1 is adhered to one side of the support layer 3, and the second adhesive layer 2 is adhered to the other side of the support layer 3. The edges of both the first adhesive layer 1 and the second adhesive layer 2 extend beyond the edge of the support layer 3 by 0.1-1 mm, increasing the contact area between the adhesive layer and the component, further enhancing the connection's strength and preventing component detachment. The first adhesive layer 1 and the second adhesive layer 2 have different thicknesses, with the thicker layer being 1.2-1.5 times thicker than the thinner layer, facilitating the differentiation of the two sides of the double-sided adhesive and adapting to different bonding requirements.

[0024] Combined with appendix Figure 5 The surfaces of the first adhesive layer 1 and the second adhesive layer 2 are provided with micro-protrusion structures 9. The micro-protrusion structures 9 are evenly distributed on the surfaces of the first adhesive layer 1 and the second adhesive layer 2, which increases the friction between the adhesive layer and the surface of the component, making the double-sided adhesive adhere more tightly to the component and improving the stability of the connection.

[0025] Combined with appendix Figure 4 The support layer 3 has multiple through-holes 4 extending through its thickness, and the adhesive portions of the first adhesive layer 1 and the second adhesive layer 2 fill the through-holes 4. The through-holes 4 are arrayed on the support layer 3, resulting in more uniform stress distribution and adhesive distribution in the double-sided adhesive structure. This enhances the connection stability of electronic product components and improves the overall structural reliability. The through-holes 4 can be circular, square, or polygonal in shape, allowing for flexible selection based on different usage requirements and scenarios, increasing the applicability and design flexibility of the double-sided adhesive structure.

[0026] Combined with appendix Figure 1 Appendix Figure 4The support layer 3 is also provided with a plurality of reinforcing ribs 8. The reinforcing ribs 8 are equidistantly distributed around the side wall of the support layer 3, and the reinforcing ribs 8 are integrally formed with the support layer 3, which enhances the strength and rigidity of the support layer 3, making the double-sided adhesive structure more durable and less prone to damage.

[0027] Combined with appendix Figure 1 Appendix Figure 2 Appendix Figure 3 A first release film 5 is provided on the side of the first adhesive layer 1 away from the support layer 3, and a second release film 6 is provided on the side of the second adhesive layer 2 away from the support layer 3. This protects the adhesive layers during use, preventing premature contamination or adhesion and ensuring the adhesiveness of the layers. Both the first release film 5 and the second release film 6 have pull tabs 7 on their edges for easy removal, allowing users to quickly and easily remove the release film, improving ease of use and reducing operation time.

[0028] The specific implementation of this utility model is as follows: First, prepare the electronic product components that need to be connected. Observe the double-sided adhesive structure, which includes a first adhesive layer 1, a second adhesive layer 2, and a support layer 3 located between the two. The support layer 3 has through holes 4. The outer side of the first adhesive layer 1 is a first release film 5, and the outer side of the second adhesive layer 2 is a second release film 6. The edge of the release film has a pull tab 7, the sidewall of the support layer 3 has reinforcing ribs 8, and the surface of the adhesive layer has a micro-protrusion structure 9.

[0029] Next, choose a thicker or thinner adhesive layer depending on the actual bonding requirements. If the surface of the component to be bonded is relatively smooth, choose a thinner adhesive layer; if the surface of the component is slightly uneven, choose a thicker adhesive layer.

[0030] Then, pinch the pull tab 7, gently peel off the first release film 5, align the first adhesive layer 1 with the surface of the electronic product component to be pasted, and carefully attach it to ensure a tight fit. Use the micro-protrusion structure 9 to increase friction and make the adhesion more secure.

[0031] Next, pinch the pull tab 7 of the second release film 6, tear off the second release film 6, and align the second adhesive layer 2 with the surface of another component that needs to be connected, and adhere it tightly as well.

[0032] Finally, check the adhesion of the double-sided tape to the two components to ensure there are no air bubbles or gaps. At this point, the support layer 3, through holes 4, and reinforcing ribs 8 of the double-sided tape structure work together to ensure the stability of the component connection.

[0033] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the term "connection" should be interpreted broadly, for example, it can be a fixed connection, a detachable connection, or an integral connection; for those skilled in the art, the specific meaning of the above term in this utility model can be understood according to the specific circumstances.

[0034] The present invention and its embodiments have been described above. This description is not restrictive, and the accompanying drawings are only one embodiment of the present invention; the actual structure is not limited thereto. In conclusion, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit of the present invention, such designs should fall within the protection scope of the present invention.

Claims

1. A double-sided adhesive structure for enhancing the connection stability of electronic product components, characterized in that, It includes a first adhesive layer (1), a second adhesive layer (2), and a support layer (3) disposed between the first adhesive layer (1) and the second adhesive layer (2). The support layer (3) has a plurality of through holes (4) extending through its thickness direction. The first adhesive layer (1) is attached to one side of the support layer (3), and the second adhesive layer (2) is attached to the other side of the support layer (3). The adhesive portion of the first adhesive layer (1) and the second adhesive layer (2) fills the through holes (4).

2. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The through holes (4) are arranged in an array on the support layer (3).

3. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The through hole (4) is in the shape of a circle, a square or a polygon.

4. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The edges of the first adhesive layer (1) and the second adhesive layer (2) both extend beyond the edge of the support layer (3), with the width of the extended portion being 0.1-1 mm.

5. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: A first release film (5) is provided on the side of the first adhesive layer (1) away from the support layer (3), and a second release film (6) is provided on the side of the second adhesive layer (2) away from the support layer (3).

6. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 5, characterized in that: The edges of the first release film (5) and the second release film (6) are provided with pull tabs (7) for easy removal.

7. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The support layer (3) is also provided with a plurality of reinforcing ribs (8), which are equidistantly distributed around the side wall of the support layer (3) and are integrally formed with the support layer (3).

8. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The first adhesive layer (1) and the second adhesive layer (2) have different thicknesses, wherein the thickness of the thicker adhesive layer is 1.2-1.5 times the thickness of the thinner adhesive layer.

9. The double-sided adhesive structure for enhancing the connection stability of electronic product components according to claim 1, characterized in that: The surfaces of the first adhesive layer (1) and the second adhesive layer (2) are provided with micro-protrusion structures (9), which are uniformly distributed on the surfaces of the first adhesive layer (1) and the second adhesive layer (2).

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