Low-resistance adhesive tape of perovskite battery assembly

Abstract

The utility model discloses a low-resistance adhesive tape of a perovskite battery assembly. Comprising a copper foil layer, a first tin plating layer electroplated on the upper end face of the copper foil layer, a first copper plating layer electroplated on the upper end face of the first tin plating layer, a first nickel plating layer electroplated on the upper end face of the first copper plating layer, a second nickel plating layer electroplated on the lower end face of the copper foil layer and a second copper plating layer electroplated on the lower end face of the second nickel plating layer. The second tin plating layer is electroplated on the lower end face of the second copper plating layer; and the modified acrylic conductive adhesive is coated on the lower end face of the second tin plating layer. The adhesive tape has the advantages that the whole adhesive tape has higher viscosity at normal temperature, and adhesive is not easy to remain; high-efficiency electric conduction can be realized due to good low resistance; the performance of the aged adhesive tape is not affected, and the viscosity and conductivity of the adhesive tape are ensured. The design of multi-layer structure integration is combined with the ultraviolet blocking layer and the conductive layer, so that the dual functions of packaging protection and low-resistance transmission are realized; precious metal is not contained, the cost is reduced, and the environment-friendly requirement is met.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of adhesive tape, concretely to low resistance adhesive tape of perovskite battery assembly. BACKGROUND

[0002] The laboratory single junction efficiency of perovskite solar cell reaches 25.7%, and the laminated efficiency is more than 32, with extremely high photoelectric conversion efficiency, and low cost solution processing technology and material abundance, which is regarded as the core direction of next generation photovoltaic technology. However, its industrialization still faces two big bottlenecks: 1. Stability problem: perovskite material is sensitive to ultraviolet, and long-term exposure can easily lead to efficiency decay, which needs to be protected by packaging materials (such as ultraviolet blocking adhesive film); 2. Resistance and carrier transport loss: the interface resistance in the battery and the contact resistance at the electrode connection will reduce the overall efficiency, especially in the laminated or large-area assembly; although the traditional packaging adhesive film (such as POE, EVA) can block water and oxygen and ultraviolet, it has poor conductivity and cannot meet the low resistance connection requirement between electrodes. While the conventional conductive adhesive tape (such as silver paste adhesive tape) has low resistance, but has the following problems: poor process compatibility: high temperature or solution processing environment can easily lead to adhesive tape debonding or conductive filler oxidation; cost and environmental friendliness: high content of noble metal (such as silver), cost ratio reaches 37%, and the environmental problem of lead-based perovskite intensifies the demand for lead-free materials; insufficient interface matching: the energy level of perovskite active layer and electrode material does not match, leading to increased interface recombination loss.

[0003] Therefore, it is necessary to provide a low resistance adhesive tape for perovskite battery assembly. SUMMARY

[0004] The low resistance adhesive tape for perovskite battery assembly provided by the utility model effectively solves the problems of poor conductivity and poor connection performance of the existing adhesive tape.

[0005] The technical scheme adopted by the utility model is:

[0006] A low resistance adhesive tape for perovskite battery assembly, comprising a copper foil layer, a first tin plating layer electroplated on the upper end face of the copper foil layer, a first copper plating layer electroplated on the upper end face of the first tin plating layer, a first nickel plating layer electroplated on the upper end face of the first copper plating layer, a second nickel plating layer electroplated on the lower end face of the copper foil layer, a second copper plating layer electroplated on the lower end face of the second nickel plating layer, a second tin plating layer electroplated on the lower end face of the second copper plating layer, and a modified acrylic conductive adhesive coated on the lower end face of the second tin plating layer.

[0007] Further, the thickness of the copper foil layer is 0.018mm-0.1mm.

[0008] Further, the thickness of the copper foil layer is 0.035mm.

[0009] Furthermore, the thicknesses of the first tin plating layer, the first copper plating layer, the first nickel plating layer, the second nickel plating layer, the second copper plating layer, and the second tin plating layer are all greater than 0.002 mm.

[0010] Furthermore, the thicknesses of the No. 1 tin plating layer, No. 1 copper plating layer, No. 1 nickel plating layer, No. 2 nickel plating layer, No. 2 copper plating layer, and No. 2 tin plating layer are all equal.

[0011] The beneficial effects of this utility model are: the tape has high adhesion at room temperature, is not prone to residue, and has good process compatibility; its good low resistance enables efficient conductivity; the tape's performance is not affected after aging, ensuring its adhesion and conductivity; the multi-layer integrated design, combining a UV blocking layer and a conductive layer, achieves the dual functions of encapsulation protection and low-resistance transmission; it contains no precious metals, reducing costs and meeting environmental protection requirements. Attached Figure Description

[0012] Figure 1 This is an overall schematic diagram of the needle gauge inspection mechanism provided in the embodiments of this application.

[0013] The markings in the diagram are as follows: 1. Copper foil layer; 2. Tin plating layer 1; 3. Copper plating layer 1; 4. Nickel plating layer 1; 5. Nickel plating layer 2; 6. Copper plating layer 2; 7. Tin plating layer 2; 8. Modified acrylic conductive adhesive. Detailed Implementation

[0014] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0015] like Figure 1 As shown, the low-resistance tape for a perovskite battery module provided in the embodiments of this application has the following structure: a copper foil layer 1, a first tin plating layer 2 electroplated on the upper end face of the copper foil layer 1, a first copper plating layer 3 electroplated on the upper end face of the first tin plating layer 2, a first nickel plating layer 4 electroplated on the upper end face of the first copper plating layer 3, a second nickel plating layer 5 electroplated on the lower end face of the copper foil layer 1, a second copper plating layer 6 electroplated on the lower end face of the second nickel plating layer 5, a second tin plating layer 7 electroplated on the lower end face of the second copper plating layer 6, and a modified acrylic conductive adhesive 8 coated on the lower end face of the second tin plating layer 7.

[0016] The low-resistance adhesive tape of the application has a resistance of 4mm*4mm<0.1Ω after being manufactured, has low-resistance performance, has a peeling force of >2000g / inch on a SUS304 plate at normal temperature, has a SUS304 plate holding force of >72H for a 1KG weight, has a SUS plate holding force of >24H for a 1000g weight at a high temperature of 85 DEG C, has a shielding effectiveness of >100dB, has a good appearance without bubbles after aging at 85 DEG C / 85%RH / 500H, and has no delamination, no bulging and no cracking between the layers after aging at 85 DEG C / 85%RH / 500H.

[0017] In the above design, the whole adhesive tape has high adhesion at normal temperature and is not easy to leave adhesive residue; good low-resistance performance can realize efficient conduction; the performance of the adhesive tape is not affected after aging, thereby ensuring the adhesion and conductivity of the adhesive tape.

[0018] Specifically, the thickness of the copper foil layer 1 is 0.018mm-0.1mm. The copper foil layer 1 is calendered copper, alloy copper, high-resistance copper or the like with a copper content of more than 99.9%.

[0019] In the above design, the thickness of the copper foil layer 1 is 0.018mm-0.1mm, which can ensure the supporting effect, good conductivity and thinness of the product.

[0020] Specifically, the thickness of the copper foil layer 1 is 0.035mm.

[0021] Specifically, the thickness of the first tin-plated layer 2, the first copper-plated layer 3, the first nickel-plated layer 4, the second nickel-plated layer 5, the second copper-plated layer 6 and the second tin-plated layer 7 is greater than 0.002mm.

[0022] In the above design, the thickness of each plating layer is greater than 0.002mm, which can ensure the high-temperature resistance of the whole adhesive tape.

[0023] Specifically, the thickness of the first tin-plated layer 2, the first copper-plated layer 3, the first nickel-plated layer 4, the second nickel-plated layer 5, the second copper-plated layer 6 and the second tin-plated layer 7 is equal.

[0024] In the above design, the thickness of each plating layer is equal, which can ensure that the peeling forces between adjacent two plating layers are close to each other.

[0025] It should be understood that the above description is only a specific embodiment of the present application, and is not used to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A low-resistance tape for a perovskite solar cell module, characterized in that: It includes a copper foil layer (1), a first tin plating layer (2) electroplated on the upper end of the copper foil layer (1), a first copper plating layer (3) electroplated on the upper end of the first tin plating layer (2), a first nickel plating layer (4) electroplated on the upper end of the first copper plating layer (3), a second nickel plating layer (5) electroplated on the lower end of the copper foil layer (1), a second copper plating layer (6) electroplated on the lower end of the second nickel plating layer (5), a second tin plating layer (7) electroplated on the lower end of the second copper plating layer (6), and a modified acrylic conductive adhesive (8) coated on the lower end of the second tin plating layer (7).

2. The low-resistance tape for the perovskite solar cell module according to claim 1, characterized in that: The thickness of the copper foil layer (1) is 0.018 mm to 0.1 mm.

3. The low-resistance tape for the perovskite solar cell module according to claim 1, characterized in that: The thickness of the copper foil layer (1) is 0.035 mm.

4. The low-resistance tape for the perovskite solar cell module according to claim 1, characterized in that: The thicknesses of the first tin plating layer (2), the first copper plating layer (3), the first nickel plating layer (4), the second nickel plating layer (5), the second copper plating layer (6), and the second tin plating layer (7) are all greater than 0.002 mm.

5. The low-resistance tape for the perovskite solar cell module according to claim 1, characterized in that: The first tin plating layer (2), the first copper plating layer (3), the first nickel plating layer (4), the second nickel plating layer (5), the second copper plating layer (6), and the second tin plating layer (7) have the same thickness.

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