Heat pump system

By using a composite system consisting of an air source heat pump and a water source heat pump, and by switching the circulation loop, the problem that heat pump systems cannot simultaneously meet the needs for hot water and cooling in summer is solved, thus improving indoor humidity and comfort while meeting the hot water requirements.

CN223869412UActive Publication Date: 2026-02-03GUANGDONG VANWARD ELECTRIC
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Patent Information

Application Number
CN202520498247.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-20
Publication Date
2026-02-03
Estimated Expiration
2035-03-20

AI Technical Summary

Technical Problem

Existing heat pump systems cannot simultaneously meet the demand for hot water and indoor cooling in summer, resulting in dry indoor air and a poor user experience.

Method used

The composite system consists of an air source heat pump, a floor heating system, and a water source heat pump. By switching between the first and second floor heating circulation loops, the air source heat pump reduces the water supply temperature of the floor heating system, maintains indoor humidity, and improves comfort while meeting the hot water requirements.

Benefits of technology

While meeting the hot water demand, the water supply temperature of the underfloor heating system is reduced by adjusting the circulation loop, maintaining indoor humidity, improving user comfort, and preventing indoor dryness.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

The utility model belongs to the technical field of heat pumps, and discloses a heat pump system, in summer, a floor heating device exchanges heat with indoor air and absorbs heat of the indoor air, a water source heat pump assembly absorbs heat of the floor heating device to heat water in an inner container, and when the heat absorbed by the floor heating device is larger than the heat absorbed by the water source heat pump assembly, the water source heat pump assembly absorbs heat of the water source heat pump assembly. At the moment, a water outlet of a water source heat pump assembly can be connected into a water return opening of an air source heat pump device through a floor heating water return pipe and is communicated with the water return opening, cold water prepared by the air source heat pump device is led into a water inlet of the floor heating device, and the indoor environment dew point temperature is increased. Therefore, the air source heat pump device is used for reducing the water supply temperature of the floor heating device so as to ensure that the indoor humidity meets the requirement, and the purpose of improving the comfort level of a user is achieved while the requirement for heating water is ensured.
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Description

TECHNICAL FIELD

[0001] The utility model relates to heat pump technical field especially relates to a heat pump system. BACKGROUND

[0002] In order to save energy, the prior art uses a heat pump system to meet the demand of winter heating, summer cooling and all-year hot water preparation.

[0003] In summer, the water source heat pump absorbs the heat energy of water in the floor heating coil to heat the water in the water tank, and reduces the temperature of water in the floor heating coil to cool the room through the floor heating coil. In actual use, it may not be able to meet the hot water demand and indoor cooling demand at the same time, generally the hot water demand is given priority to, resulting in that sometimes the hot water temperature meets the requirements but the indoor temperature is higher than the indoor temperature set by the user, the indoor is relatively dry, and the user's use feeling is poor. SUMMARY

[0004] One of the technical problems solved by the utility model is to provide a heat pump system, which can meet the indoor cooling demand while meeting the hot water demand, and improve the user experience.

[0005] The first technical problem is solved by the following technical scheme:

[0006] The heat pump system comprises:

[0007] An air source heat pump device and a floor heating device; a water outlet of the air source heat pump device is connected to a water inlet of the floor heating device through a floor heating water supply pipe, a water outlet of the floor heating device is connected to a water inlet of the air source heat pump device through a floor heating water return pipe, and the floor heating water supply pipe is connected to the floor heating water return pipe through a first bypass pipe,

[0008] A water source heat pump device, the water source heat pump device comprises an inner container and a water source heat pump assembly located outside the inner container, and the water source heat pump assembly is used for heating water in the inner container; a water inlet and a water outlet of the water source heat pump assembly are connected to the floor heating water return pipe between a water outlet of the floor heating device and a first bypass pipe connection position, so that the air source heat pump device, the floor heating device and the water source heat pump assembly can be connected in series to form a first floor heating circulation loop, and the water source heat pump assembly and the floor heating device can be connected in series to form a second floor heating circulation loop;

[0009] A temperature detection unit is used for detecting the water inlet temperature of the floor heating device, the water outlet temperature of the floor heating device, the water inlet temperature of the water source heat pump assembly and the water temperature downstream of the communication position between the floor heating water return pipe and the water outlet of the water source heat pump assembly;

[0010] A dew point detection unit is used for detecting the indoor environment dew point temperature.

[0011] The heat pump system has the beneficial effects compared with the background art:

[0012] The heat pump system provided by the utility model, when in summer, the floor heating device exchanges heat with indoor air and absorbs indoor air heat, the water source heat pump assembly absorbs the heat of the floor heating device to heat the water in the inner bag, when the heat absorbed by the floor heating device is greater than the heat absorbed by the water source heat pump assembly, with the time going on, the return water temperature of the floor heating device will rise and be higher than the indoor environment dew point temperature, thus leading to indoor dryness, at this time, the water outlet of the water source heat pump assembly can be connected to the return water outlet of the air source heat pump device through the floor heating return water pipe and be conducted, the cold water prepared by the air source heat pump device is introduced into the water inlet of the floor heating device, the first floor heating circulation loop is conducted, thus the air source heat pump device is used to reduce the water supply temperature of the floor heating device to ensure that the indoor humidity meets the requirements, and the purpose of improving user comfort is achieved while ensuring the hot water requirements.

[0013] In one of the embodiments, the heat pump system further comprises an indoor heat exchange device, the water outlet of the air source heat pump device is connected to the water inlet of the indoor heat exchange device, and the water outlet of the indoor heat exchange device is connected to the water inlet of the air source heat pump device through a return water pipeline;

[0014] The water inlet and the water outlet of the water source heat pump assembly can be selectively connected to the return water pipeline, so that the air source heat pump device, the indoor heat exchange device and the water source heat pump assembly are connected in series to form a first heat exchange circulation loop.

[0015] In one of the embodiments, the return water pipeline has a first intersection point and a second intersection point arranged in sequence along the water flow direction in the pipeline, the water inlet of the water source heat pump assembly is connected to the first intersection point, and the water outlet of the water source heat pump assembly is connected to the second intersection point;

[0016] The heat pump system further comprises:

[0017] A water inlet three-way valve, a first inlet A2 of the water inlet three-way valve is connected to the first intersection point, a second inlet B2 and an outlet C2 of the water inlet three-way valve are connected in series to a pipeline connecting the floor heating return water pipe and the water inlet of the water source heat pump assembly, and the outlet C2 can be selectively connected to the first inlet A2 or the second inlet B2;

[0018] A water outlet three-way valve, an inlet A3 and a first outlet C3 of the water outlet three-way valve are connected in series to a pipeline connecting the water outlet of the water source heat pump assembly and the floor heating return water pipe, a second outlet B3 of the water outlet three-way valve is connected to the second intersection point, and the inlet A3 can be selectively connected to the first outlet C3 or the second outlet B3.

[0019] In one embodiment, the underfloor heating return pipe has a first connection point and a second connection point arranged sequentially along the water flow direction therein; the inlet of the water source heat pump assembly is connected to the first connection point, and the outlet of the water source heat pump assembly is connected to the second connection point.

[0020] The heat pump system also includes:

[0021] A return water three-way valve, wherein the inlet C1 and the first outlet A1 of the return water three-way valve are respectively connected in series to the floor heating return water pipe between the second connection point and the water inlet of the air source heat pump device, the second outlet B1 of the return water three-way valve is connected to the first bypass pipe, and the inlet C1 can be selectively connected to the first outlet A1 and / or the second outlet B1.

[0022] In one embodiment, a first one-way valve is provided on the underfloor heating return pipe. The first one-way valve is located between the first connection point and the second connection point, and is used to ensure that the water in the underfloor heating return pipe can only flow from the first connection point to the second connection point.

[0023] And / or, a second one-way valve is provided on the return water pipeline, the second one-way valve being located between the first junction point and the second junction point, for ensuring that water in the return water pipeline can only flow from the first junction point to the second junction point.

[0024] In one embodiment, the heat pump system further includes a first water pump connected in series to the underfloor heating water supply pipe, and the position where the underfloor heating water supply pipe connects to the first bypass pipe is located upstream of the first water pump along the water flow direction in the underfloor heating water supply pipe; or the first water pump is connected in series to the underfloor heating return water pipe, and the first water pump is located upstream of the return water three-way valve along the water flow direction in the underfloor heating return water pipe.

[0025] And / or, the outlet of the air source heat pump device is connected to the inlet of the indoor heat exchange device through a water supply pipeline, and the heat pump system further includes a second water pump, which is connected in series to the water supply pipeline or the return water pipeline.

[0026] In one embodiment, the water source heat pump assembly includes a compressor, a first heat exchanger, a throttling unit, and a second heat exchanger connected end to end to form a heating circulation loop. The second heat exchanger is used to heat the water in the inner tank. The inlet of the first heat exchanger, which has a heat exchange channel, is connected to the underfloor heating return pipe through a heat exchange inlet pipe, and the outlet of the heat exchange channel is connected to the underfloor heating return pipe through a heat exchange return pipe.

[0027] A third heat exchanger is connected in series on the heat exchange inlet pipe. The third heat exchanger is located inside the inner tank or around the outer tank. Along the water flow direction inside the heat exchange inlet pipe, the third heat exchanger is located downstream of the inlet three-way valve.

[0028] In one embodiment, a third water pump is connected in series on the heat exchange inlet pipe, and the third water pump is located downstream of the inlet three-way valve along the water flow direction in the heat exchange inlet pipe.

[0029] Alternatively, a third water pump is connected in series on the heat exchange return water pipe, and the third water pump is located upstream of the outlet three-way valve along the water flow direction in the heat exchange return water pipe.

[0030] In one embodiment, the heat exchange inlet pipe includes a first inlet pipe located between the inlet of the third heat exchanger and one end of the heat exchange inlet pipe connected to the underfloor heating return pipe, and a second inlet pipe located between the outlet of the third heat exchanger and the inlet of the heat exchange channel;

[0031] The second inlet B2 and outlet C2 of the three-way inlet valve are connected in series to the first inlet pipe. A second bypass pipe is connected between the first inlet pipe and the second inlet pipe. The first inlet pipe between the second bypass pipe and the first inlet pipe and the first connection point is selectively connected to the second bypass pipe or the inlet of the third heat exchanger.

[0032] Along the water flow direction in the first inlet pipe, the connection point between the second bypass pipe and the first inlet pipe is located downstream of the inlet three-way valve.

[0033] In one embodiment, the water source heat pump device further includes a water inlet three-way valve, wherein the inlet A4 and the first outlet B4 of the water inlet three-way valve are connected in series to the first water inlet pipe, and the water inlet three-way valve is located downstream of the water inlet three-way valve along the water flow direction in the first water inlet pipe; the second outlet C4 of the water inlet three-way valve is connected to the second bypass pipe, and the inlet A4 can be selectively connected to the first outlet B4 and / or the second outlet C4. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the heat pump system provided in this embodiment of the utility model;

[0035] Figure 2 This is a state diagram of the heat pump system provided in this embodiment of the present invention when it is in the first summer mode;

[0036] Figure 3 This is a first flowchart of the heat pump system control method provided in this embodiment of the present invention;

[0037] Figure 4 This is a state diagram of the heat pump system in the second summer mode provided in this embodiment of the utility model;

[0038] Figure 5 This is a second flowchart of the heat pump system control method provided in this embodiment of the present invention;

[0039] Figure 6 This is a state diagram of the heat pump system in the third summer mode provided in this embodiment of the utility model;

[0040] Figure 7 This is a schematic diagram of the water source heat pump device provided in this embodiment of the utility model;

[0041] Figure 8 This is a first state diagram of the water source heat pump device provided in this embodiment of the utility model;

[0042] Figure 9 This is a second state diagram of the water source heat pump device provided in this embodiment of the utility model;

[0043] Figure 10 This is a third state diagram of the water source heat pump device provided in this embodiment of the utility model;

[0044] Figure 11 This is the third flowchart of the heat pump system control method provided in this embodiment of the utility model;

[0045] Figure 12 This is a state diagram of the heat pump system provided in this embodiment of the present invention when it is in winter mode.

[0046] In the picture:

[0047] 100. Water source heat pump unit; 101. Compressor; 102. First heat exchanger; 103. Throttling unit; 104. Second heat exchanger; 105. First filter; 106. Inner tank; 107. Third water pump; 108. Inlet three-way valve; 109. Second filter; 110. Tank shell; 111. Controller; 112. Third heat exchanger; 113. Water tank temperature detection device; 114. Electric heater; 115. Anode rod; 116. Heat pump on / off valve; 117. Inlet water temperature detection device; 118. Air vent valve; 119. Display screen;

[0048] 200. Air source heat pump unit; 201. Air source heat pump assembly; 202. Buffer water tank;

[0049] 300. Underfloor heating system; 301. Manifold; 302. Underfloor heating coils;

[0050] 400. Indoor heat exchange device;

[0051] 510. First water pump; 520. Second water pump;

[0052] 610. First check valve; 620. Second check valve;

[0053] 710. Return water three-way valve; 720. Inlet water three-way valve; 730. Outlet water three-way valve;

[0054] 810. Supply water temperature sensor; 820. Return water temperature sensor; 830. Mixing water temperature sensor;

[0055] 901, First bypass pipe; 902, Second bypass pipe; 910, Cold water inlet pipe; 920, Hot water outlet pipe; 930, Cold water supply pipe; 940, Water supply line; 950, Return line; 960, Underfloor heating supply pipe; 970, Underfloor heating return pipe; 980, Heat exchange inlet pipe; 990, Heat exchange return pipe;

[0056] 1000, using the water end. Detailed Implementation

[0057] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0058] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0059] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0060] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0061] like Figure 1 As shown, an embodiment of this utility model provides a heat pump system to avoid the problem of dryness in the room when using a floor heating device 300 to cool the room, thereby improving comfort.

[0062] The heat pump system provided in this embodiment includes an air source heat pump device 200, a floor heating device 300, and a water source heat pump device 100.

[0063] The heat pump system includes a water source heat pump device 100, an air source heat pump device 200, and a floor heating device 300. The outlet of the air source heat pump device 200 is connected to the inlet of the floor heating device 300, and the outlet of the floor heating device 300 is connected to the inlet of the air source heat pump device 200 through a floor heating return pipe 970. The water source heat pump device 100 includes an inner tank 106 and a water source heat pump assembly located outside the inner tank 106. The water source heat pump assembly is used to heat the water in the inner tank 106. The inlet and outlet of the water source heat pump assembly are respectively connected to the floor heating return pipe 970. The air source heat pump device 200, the floor heating device 300, and the water source heat pump assembly can be connected end to end to form a first floor heating circulation loop. The water source heat pump assembly and the floor heating device 300 can be connected end to end to form a second floor heating circulation loop.

[0064] Specifically, the outlet of the air source heat pump device 200 is connected to the inlet of the underfloor heating device 300 via the underfloor heating supply pipe 960, and the underfloor heating supply pipe 960 is connected to the underfloor heating return pipe 970 via the first bypass pipe 901. The inlet and outlet of the water source heat pump component are respectively connected to the underfloor heating return pipe 970 between the outlet of the underfloor heating device 300 and the connection point of the first bypass pipe 901, so that the air source heat pump device 200, the underfloor heating device 300 and the water source heat pump component can be connected end to end to form a first underfloor heating circulation loop, and the water source heat pump component and the underfloor heating device 300 can be connected end to end to form a second underfloor heating circulation loop.

[0065] For example, the underfloor heating device 300 includes a manifold 301 and an underfloor heating coil 302. The underfloor heating water in the underfloor heating supply pipe 960 enters the underfloor heating coil 302 through the manifold 301, and the underfloor heating water in the underfloor heating coil 302 enters the underfloor heating return pipe 970 through the manifold 301.

[0066] likeFigure 2 As shown, when the second floor heating circulation loop is activated, the water in the second floor heating circulation loop absorbs heat energy from the surrounding environment and heats up when it flows through the floor heating device 300, so as to provide slight cooling to the room. When the water in the second floor heating circulation loop flows through the water source heat pump component, it releases heat energy, which is absorbed by the refrigerant circulating in the water source heat pump component to heat the water in the inner tank 106. This realizes the use of the floor heating device 300 to absorb heat energy from the room to heat the water in the inner tank 106, thereby reducing the energy consumption of the water source heat pump device 100.

[0067] When the first floor heating circulation loop is activated, the cold water prepared by the air source heat pump device 200 is sent to the floor heating device 300 to absorb heat energy from the surrounding environment and raise its temperature to provide micro-cooling for the room. The return water from the floor heating device 300 releases heat energy and cools down as it flows through the water source heat pump component. The refrigerant circulating in the water source heat pump component absorbs the heat to heat the water in the inner tank 106. The return water from the water source heat pump component returns to the air source heat pump device 200 and is cooled down again. This setup ensures that the temperature of the water returning to the air source heat pump device 200 is relatively low, thereby reducing the temperature difference between the inlet and outlet water of the air source heat pump device 200, reducing the energy consumption of the air source heat pump device 200, and improving the energy efficiency of the air source heat pump device 200.

[0068] The heat pump system has a first summer mode where both the second and first underfloor heating circulation loops are active. For example... Figure 3 As shown, this embodiment also provides a control method for a heat pump system, used to control the aforementioned heat pump system. The heat pump system control method includes the following steps:

[0069] S100, real-time acquisition of indoor ambient dew point temperature tL, water supply temperature tg of floor heating device 300, water return temperature th of floor heating device 300, water inlet temperature tb of water source heat pump component, and water temperature tc downstream of the connection position between floor heating return pipe 970 and water source heat pump component outlet.

[0070] S110. Calculate Δt1 and Δt2, Δt1=th-tg, Δt2=tb-tc;

[0071] When S120, Δt1≥Δt2 and tg-tL>preset temperature difference, the heat pump system is controlled to execute the first summer mode.

[0072] When tg = tL, or tg > tL and the difference between tg and tL is small, the ambient temperature around the water inlet area of ​​the underfloor heating device 300 is close to and slightly higher than the water supply temperature of the underfloor heating device 300. Therefore, the humidity in the room is relatively suitable, resulting in a good user experience. When tg > tL, if the difference between tg and tL is large, it will lead to dryness in the room, affecting the user experience. When the underfloor heating water supply temperature tg equals the indoor ambient dew point temperature tL, the ambient temperature around the water inlet area of ​​the underfloor heating device 300 is slightly higher than the water supply temperature of the underfloor heating device 300, meaning the ambient temperature around the water inlet area of ​​the underfloor heating device 300 is slightly higher than the indoor ambient dew point temperature tL, so there will be no condensation in the room. However, once tg < tL, the temperature around the water inlet area of ​​the underfloor heating device 300 will drop to tL or even < tL, causing condensation problems around the water inlet area of ​​the underfloor heating device 300. Therefore, the preset temperature difference is ≥ 0℃.

[0073] During the summer, when only the second floor heating circulation loop is in operation, the floor heating device 300 exchanges heat with the indoor air and absorbs the heat from the indoor air. The water source heat pump component absorbs the heat from the floor heating device 300 to heat the water in the inner tank 106. If Δt1 ≥ Δt2 occurs, in other words, the heat energy absorbed by the underfloor heating device 300 from the surrounding environment is greater than or equal to the heat energy required by the water source heat pump component to heat the water in the inner tank 106, as time continues, the return water temperature of the underfloor heating device 300 will rise and exceed the indoor dew point temperature, making tg - tL > preset temperature difference and preset temperature difference ≥ 0℃. That is, the inlet water temperature of the underfloor heating device 300 is greater than the indoor dew point temperature tL, thus causing the indoor environment to gradually dry out. Therefore, the heat pump system is controlled to execute the first summer mode, and the second underfloor heating circulation loop is opened at the same time as the first underfloor heating circulation loop. At least part of the return water of the water source heat pump component is introduced into the return water port of the air source heat pump device 200, and the cold water prepared by the air source heat pump device 200 is sent to the inlet water port of the underfloor heating device 300 to reduce the supply water temperature of the underfloor heating device 300 and reduce the temperature difference between tg and tL to ensure that the indoor humidity meets the requirements. In this way, while ensuring the hot water production requirements, the user comfort is improved.

[0074] The heat pump system also includes a temperature detection unit and a dew point detection unit. The temperature detection unit is used to detect the inlet water temperature of the underfloor heating device 300, the outlet water temperature of the underfloor heating device 300, the inlet water temperature of the water source heat pump component, and the water temperature downstream of the connection point between the underfloor heating return pipe 970 and the outlet of the water source heat pump component. The dew point detection unit is used to detect the dew point temperature of the indoor environment.

[0075] It should be noted that the dew point detection unit can be a dew point meter, and the temperature detection unit includes a supply water temperature detection element 810, a return water temperature detection element 820, an inlet water temperature detection element 117, and a mixing water temperature detection element 830. The supply water temperature detection element 810 is located at the inlet of the underfloor heating device 300 and is used to detect the inlet water temperature tg of the underfloor heating device 300; the return water temperature detection element 820 is located at the inlet of the underfloor heating device 300 and is used to detect the outlet water temperature th of the underfloor heating device 300; the inlet water temperature detection element 117 is located at the inlet of the water source heat pump component and is used to detect the inlet water temperature tb of the water source heat pump component; the mixing water temperature detection element 830 is located at the connection point between the underfloor heating return water pipe 970 and the outlet of the water source heat pump component and is used to detect the water temperature tc downstream of the connection point between the underfloor heating heat exchange pipe and the outlet of the water source heat pump component.

[0076] For example, the dew point meter, the water supply temperature sensor 810, the inlet water temperature sensor 117, and the mixing water temperature sensor 830 are all electrically connected to the controller 111 of the heat pump system, so that the controller 111 can acquire the detection signals of the dew point meter, the water supply temperature sensor 810, the inlet water temperature sensor 117, and the mixing water temperature sensor 830.

[0077] In some embodiments, such as Figure 4 As shown, the heat pump system also includes an indoor heat exchanger 400. The outlet of the air source heat pump device 200 is connected to the inlet of the indoor heat exchanger 400, and the outlet of the indoor heat exchanger 400 is connected to the inlet of the air source heat pump device 200 through a return water pipe 950. Specifically, the inlet of the indoor heat exchanger 400 is connected to the outlet of the air source heat pump device 200 through a water supply pipe 940. For example, the indoor heat exchanger 400 includes a fan coil unit and a fan. The fan's operation drives airflow, allowing the water flowing through the fan coil unit to exchange heat with the surrounding air.

[0078] The indoor heat exchange device 400 and the air source heat pump device 200 are connected end to end to form a second heat exchange circulation loop. Whether it is the first summer working mode or the second summer working mode, the second heat exchange circulation loop is always open, so that the floor heating device 300 can be used to provide auxiliary cooling while the indoor heat exchange device 400 is used to cool the room.

[0079] In some embodiments, 0℃ ≤ preset temperature difference ≤ 2℃. If the preset temperature difference > 2℃, once it is determined that Δt1 ≥ Δt2 and tg - tL > preset temperature difference, the room will already be dry, and excessively dry, severely impacting the user experience. Therefore, when the difference between tg and tL is between 0℃ and 2℃, excessive dryness in the room can be avoided, resulting in a better user experience.

[0080] In some embodiments, such as Figure 4As shown, the underfloor heating return pipe 970 has a first connection point and a second connection point arranged sequentially along the water flow direction. The inlet of the water source heat pump component is connected to the first connection point, and the outlet of the water source heat pump component is connected to the second connection point. A first one-way valve 610 is provided on the underfloor heating return pipe 970, located between the first and second connection points. The first one-way valve 610 is used to ensure that the water in the underfloor heating return pipe 970 can only flow from the first connection point to the second connection point. The first one-way valve 610 only allows the underfloor heating return water to flow from the first connection point to the second connection point, so that the water flowing from the water source heat pump component to the second connection point will not flow back to the first connection point, thus forming a circulation of water flow between the first connection point, the water source heat pump component, and the second connection point. This ensures that the underfloor heating water circulates in the second underfloor heating circulation loop, thereby ensuring the heat exchange effect.

[0081] In some embodiments, such as Figure 2 and Figure 4 As shown, the heat pump system also includes a return water three-way valve 710. The inlet C1 and the first outlet A1 of the return water three-way valve 710 are connected in series to the underfloor heating return water pipe 970 between the second connection point and the inlet of the air source heat pump device 200. The second outlet B1 of the return water three-way valve 710 is connected to the first bypass pipe 901, and the inlet C1 can be selectively connected to the first outlet A1 and / or the second outlet B1. Exemplarily, the return water three-way valve 710 is an electromagnetic three-way valve electrically connected to the controller 111.

[0082] like Figure 2 As shown, when the heat pump system is in the first summer mode, the control return water three-way valve 710 connects the inlet C1 and the first outlet A1, and also connects to the second outlet B1. Figure 4 As shown, when the heat pump system is in the second summer mode, the control return water three-way valve 710 connects the inlet C1 and the second outlet B1 while disconnecting the inlet C1 and the first outlet A1.

[0083] In other embodiments, two switching valves can be used to replace the aforementioned return water three-way valve 710. Specifically, the two switching valves are a first switching valve one and a first switching valve two. The first switching valve one is connected in series to the underfloor heating return water pipe 970 between the second connection point and the inlet of the air source heat pump device 200, and the first switching valve two is connected in series to the first bypass pipe 901. The first switching valve one and the first switching valve two work together to control whether to send the cold water prepared by the air source heat pump device 200 into the underfloor heating device 300 through the underfloor heating supply water pipe 960.

[0084] In some embodiments, such as Figure 4As shown, the water source heat pump assembly includes a first heat exchanger 102 and a second heat exchanger 104 for heating the water inside the inner tank 106. The first heat exchanger 102 has a heat exchange channel and a second heat exchange channel. The inlet of the heat exchange channel is connected to a first connection point, and the outlet of the heat exchange channel is connected to a second connection point. The second heat exchange channel is used for circulating refrigerant.

[0085] like Figure 2 As shown, when the heat pump system executes the first summer mode, the return water from the underfloor heating device 300 flows to the first connection point. Then, part of the underfloor heating return water flows directly to the second connection point through the underfloor heating return water pipe 970. Another part of the underfloor heating return water enters the heat exchange channel through the first connection point, cools down, and then flows to the second connection point. A portion of the underfloor heating return water from the second connection point enters the air source heat pump device 200, cools down, and then flows into the underfloor heating supply water pipe 960. Another portion of the underfloor heating return water from the second connection point flows directly to the underfloor heating supply water pipe 960 through the first bypass pipe 901. The underfloor heating water in the underfloor heating supply water pipe 960 flows into the underfloor heating device 300 to continue absorbing heat energy.

[0086] like Figure 4 As shown, when the heat pump system executes the second summer mode, the underfloor heating device 300 absorbs heat energy from the surrounding environment, thereby cooling the surrounding environment. Part of the underfloor heating return water directly enters the heat exchange channel through the first connection point, exchanges heat with the refrigerant in the second heat exchange channel, and then flows to the second flow point after cooling. Another part of the underfloor heating return water flows directly through the first connection point and the first one-way valve 610 to the second connection point. The underfloor heating return water at the second connection point returns to the underfloor heating device 300 to continue absorbing heat energy.

[0087] In some embodiments, such as Figure 4 As shown, the heat pump system also includes a first water pump 510, which is connected in series to the underfloor heating water supply pipe 960. Along the water flow direction within the underfloor heating water supply pipe 960, the position where the underfloor heating water supply pipe 960 connects to the first bypass pipe 901 is located upstream of the first water pump 510, so that when both the second and first underfloor heating circulation loops are open, the underfloor heating water can enter the underfloor heating device 300 under the action of the first water pump 510. In other embodiments, the first water pump 510 can also be connected in series to the underfloor heating return pipe 970, and along the water flow direction within the underfloor heating return pipe 970, the first water pump 510 is located upstream of the connection point of the return three-way valve 710.

[0088] In some embodiments, such as Figure 4As shown, the heat pump system also includes a third water pump 107, which is located on the pipe connecting the first connection point and the inlet of the water source heat pump assembly, so that the third water pump 107 can pump the recovered floor heating water from the first connection point into the heat exchange channel of the first heat exchanger 102. In other embodiments, the third water pump 107 may also be located on the pipe connecting the second connection point and the outlet of the water source heat pump assembly.

[0089] In some embodiments, such as Figure 5 As shown, the heat pump system control method further includes the following steps: when Δt1 < Δt2 and tg - tL > preset temperature difference, the heat pump system is controlled to execute the second summer mode. Specifically, when the heat pump system is in the second summer mode, the second floor heating circulation loop is open, and the first floor heating circulation loop is closed. The return water from the floor heating device 300 is cooled by the water source heat pump component and then returns to the floor heating device 300, thus realizing the circulation of floor heating water in the second floor heating circulation loop. During this process, the floor heating water does not flow through the air source heat pump device 200.

[0090] During the operation of only the second floor heating circulation loop, if Δt1 < Δt2, it indicates that the heat energy absorbed by the floor heating device 300 from the surrounding environment is less than the heat energy required by the water source heat pump component to heat the water in the inner tank 106. As time continues, the inlet water temperature of the floor heating device 300 will continuously decrease. If tg - tL > the preset temperature difference, it indicates that the indoor environment is dry. At this time, the heat pump system is controlled to execute the second summer mode. As the inlet water temperature of the floor heating device 300 continuously decreases, the difference between tg and tL continuously decreases, making the humidity in the room more suitable, thereby improving user comfort.

[0091] In some embodiments, such as Figure 6 As shown, the air source heat pump device 200, the indoor heat exchange device 400, and the water source heat pump assembly are connected end-to-end to form a first heat exchange circulation loop. Specifically, the return water pipe 950 has a first junction point and a second junction point arranged sequentially along the water flow direction. The inlet of the water source heat pump assembly is connected to the first junction point, and the outlet of the water source heat pump assembly is connected to the second junction point, so that the air source heat pump device 200, the indoor heat exchange device 400, and the water source heat pump assembly are connected end-to-end to form the first heat exchange circulation loop.

[0092] In some embodiments, such as Figure 5 and Figure 6 As shown, the heat pump system control method further includes the following steps: when Δt1≤Δt2 and tg-tL≤preset temperature difference, the heat pump system is controlled to execute the third summer mode. When the heat pump system is in the third summer mode, the first heat exchange circulation loop is turned on, and the second floor heating circulation loop and the first floor heating circulation loop are both cut off.

[0093] If Δt1 ≤ Δt2, the heat energy absorbed by the underfloor heating device 300 from the surrounding environment is less than the heat energy required by the water source heat pump component to heat the water in the inner tank 106. As time continues, the inlet water temperature of the underfloor heating device 300 will continuously decrease. If tg-tL ≤ preset temperature difference occurs, the ambient temperature near the inlet area of ​​the underfloor heating device 300 will be lower than the indoor dew point temperature tL. As the inlet water temperature of the underfloor heating device 300 continues to decrease, condensation will occur near the inlet area of ​​the underfloor heating device 300, and the condensation will become more severe. Therefore, when Δt1≤Δt2 and tg-tL≤preset temperature difference, the heat pump system is controlled to execute the third summer mode, which cuts off both the second and first floor heating circulation loops to stop the use of the floor heating device 300, and opens the first heat exchange circulation loop to send the cold water prepared by the air source heat pump device 200 into the indoor heat exchange device 400. The indoor heat exchange device 400 absorbs heat energy from the surrounding environment to raise its temperature and lower the temperature of the surrounding environment. Part of the return water from the indoor heat exchange device 400 is sent into the water source heat pump component. The water source heat pump component uses the heat energy in this part of the water to heat the water in the inner tank 106, so that the water entering the water source heat pump component is cooled and then returns to the air source heat pump device 200. Only the indoor heat exchange device 400 is used to cool the room and eliminate condensation in the room.

[0094] In addition, when the heat pump system is in the third summer mode, the water source heat pump device 100 can further reduce the return water temperature of the air source heat pump device 200, reduce the temperature difference between the outlet and inlet of the air source heat pump device 200, and reduce the energy consumption of the air source heat pump device 200.

[0095] In some embodiments, when tg < tL, it indicates that continued use of the underfloor heating device 300 to cool the indoor floor may result in condensation. However, if Δt1 > Δt2, the heat energy absorbed by the underfloor heating device 300 from the surrounding environment is greater than the heat energy required by the water source heat pump component to heat the water in the inner tank 106. As time continues, the inlet water temperature of the underfloor heating device 300 continuously rises. It is possible that tg has already exceeded or equaled tL before condensation occurs on the floor, or it is possible that because tg < tL and the absolute value of the difference between the two is large, tg cannot reach tL in a short period of time. Therefore, as Figure 4 to Figure 6 As shown, the heat pump system control method further includes the following steps: when Δt1 > Δt2 and tg - tL ≤ preset temperature difference, the heat pump system is controlled to execute a second summer mode and the duration is accumulated. When the duration reaches the preset duration, if tg - tL > preset temperature difference, the process returns to the step of obtaining tL, tg, th, tb, and tc, and Δt1 and Δt2 are calculated, i.e., the process returns to step S100; when the duration reaches the preset duration, if tg - tL ≤ preset temperature difference, the heat pump system is controlled to execute a third summer mode.

[0096] If, when the preset duration is reached, tg - tL is still less than or equal to the preset temperature difference, it indicates that the initial temperature difference between tg and tL was large. Although the inlet water temperature of the underfloor heating device 300 continuously rises, the time required for tg to rise to tL is relatively long. If the heat pump system continues to operate in the second summer mode, condensation will occur on the floor. Therefore, when the preset duration is reached, if tg - tL ≤ the preset temperature difference, the heat pump system is controlled to operate in the third summer mode, and the underfloor heating device 300 is stopped. If, when the preset duration is reached, tg - tL > the preset temperature difference, it indicates that the inlet water temperature of the underfloor heating device 300 rises rapidly, tg is already greater than tL, and condensation will not occur on the floor. The process returns to step S100.

[0097] In some embodiments, such as Figure 2 and Figure 5 As shown, when Δt2 = 0℃, the heat pump system is controlled to execute the first summer mode. When Δt2 = 0℃, it indicates that the water source heat pump device 100 is not started. At this time, the heat pump system is directly controlled to execute the first summer mode, so that after the water source heat pump device 100 is started, it can immediately absorb the heat energy from the return water of the underfloor heating system, so that the underfloor heating device 300 can cool the room while heating the water in the inner tank 106.

[0098] It should be noted that when the water temperature in the inner tank 106 reaches the maximum temperature limit or the water temperature set by the user, the heat pump system is controlled to execute the fourth summer mode, which connects the heat exchange loop formed by the air source heat pump device 200 and the underfloor heating device 300, and no longer uses the water source heat pump device 100 to absorb heat energy from the underfloor heating return water; when the water temperature in the inner tank 106 does not reach the maximum temperature limit and / or does not reach the water temperature set by the user, the heat pump system is controlled to execute the first summer mode.

[0099] The heat pump system control method provided by the embodiments of this utility model can automatically switch between the first summer mode, the second summer mode, and the third summer mode without human intervention, resulting in a high user experience. It should be noted that the changes in Δt1 and Δt2 mainly reflect the user's active adjustment of the indoor temperature required when using the underfloor heating device 300 for indoor cooling, and the required water temperature when using the water source heat pump component to heat the water in the inner tank 106.

[0100] The following is combined with Figure 5 The flowchart shown below provides a detailed description of one embodiment of the heat pump system control method.

[0101] S210, real-time acquisition of indoor ambient dew point temperature tL, water supply temperature tg of floor heating device 300, water return temperature th of floor heating device 300, water inlet temperature tb of water source heat pump component, and water temperature tc downstream of the connection position between floor heating return pipe 970 and water source heat pump component outlet.

[0102] S220. Calculate Δt1 and Δt2, Δt1=th-tg, Δt2=tb-tc;

[0103] S230. Determine if Δt2 = 0℃ is satisfied; if yes, execute S240; if no, execute S251.

[0104] S240, Control the heat pump system to execute the first summer mode, and return to S210;

[0105] S251. Determine whether tg - tL > preset temperature difference is satisfied. If yes, execute S252; otherwise, execute S253.

[0106] S252. Determine whether Δt1≥Δt2 is satisfied. If yes, execute S240; otherwise, execute S260.

[0107] S253. Determine whether Δt1 > Δt2 is satisfied. If yes, execute S254; otherwise, execute S270.

[0108] S254, Control the heat pump system to execute the second summer mode, accumulate the duration, and execute S255;

[0109] S255. When the duration reaches the preset duration, determine whether tg-tL≤ preset temperature difference is satisfied. If yes, execute S270; otherwise, return to S210.

[0110] S260, Control the heat pump system to execute the second summer mode, and return to S210;

[0111] S270, Control the heat pump system to execute the third summer mode, and return to S210.

[0112] In some embodiments, such as Figure 1 As shown, the heat pump system also includes an inlet three-way valve 720 and an outlet three-way valve 730. The first inlet A2 of the inlet three-way valve 720 is connected to the first junction point. The second inlet B2 and outlet C2 of the inlet three-way valve 720 are connected in series to the pipe connecting the underfloor heating return water pipe 970 and the inlet of the water source heat pump assembly. The outlet C2 can be selectively connected to either the first inlet A2 or the second inlet B2. Specifically, the second inlet B2 is connected to the first junction point, and the outlet C2 is connected to the inlet of the heat exchange channel.

[0113] The inlet A3 and the first outlet C3 of the outlet three-way valve 730 are connected in series to the pipeline connecting the outlet of the water source heat pump assembly and the underfloor heating return pipe 970. The second outlet B3 of the outlet three-way valve 730 is connected to the second junction point, and the inlet A3 can be selectively connected to either the first outlet C4 or the second outlet B3. Specifically, the first outlet C3 is connected to the second junction point, and outlet A3 is connected to the outlet of the heat exchange channel.

[0114] like Figure 2 and Figure 4 As shown, when the heat pump system is in either the first summer mode or the second summer mode, outlet C2 and the first inlet A2 are disconnected and connected to the second inlet B2, while inlet A3 is connected to the first outlet C3 and disconnected from the second outlet B3. When the heat pump system is in the third summer mode, outlet C2 and the first inlet A2 are connected and disconnected from the second inlet B2, while inlet A3 is disconnected from the first outlet C3 and connected to the second outlet B3.

[0115] In other embodiments, two switching valves can be used to replace the inlet three-way valve 720. Specifically, the two switching valves are a second switching valve one and a second switching valve two. The first connection point is connected to the inlet of the heat exchange channel through the heat exchange inlet pipe 980. The second switching valve one is connected in series to the heat exchange inlet pipe 980. The inlet of the second switching valve two is connected to the first junction point, and the outlet of the second switching valve two is connected to the heat exchange inlet pipe 980 between the second switching valve and the inlet of the heat exchange channel. By controlling the second switching valve one and the second switching valve two, the inlet of the heat exchange channel can be selectively connected to either the first connection point or the first junction point.

[0116] Alternatively, two switching valves can be used to replace the aforementioned outlet three-way valve 730. Specifically, the two switching valves are a third switching valve one and a third switching valve two. The outlet of the heat exchange channel is connected to the second connection point via a heat exchange return water pipe 990. The third switching valve one is connected in series to the heat exchange return water pipe 990. The inlet of the third switching valve two is connected to the heat exchange return water pipe 990 between the inlet of the third switching valve one and the outlet of the heat exchange channel. The outlet of the third switching valve two is connected to the second junction point. Through the third switching valve one and the third switching valve two, the outlet of the heat exchange channel can be selectively connected to either the second connection point or the second junction point.

[0117] In some embodiments, such as Figure 6As shown, the air source heat pump system includes an air source heat pump assembly 201 and a buffer water tank 202. The buffer water tank 202 has an upper inlet and an upper outlet, and a lower inlet and a lower outlet. The outlet of the air source heat pump assembly 201 is connected to the upper inlet, and the inlet is connected to the lower outlet. The upper outlet is connected to a third connection point. The outlet of the indoor heat exchange device 400 is connected to the lower inlet, and the first outlet A1 of the return water three-way valve 710 is connected to the lower inlet. The buffer water tank 202 not only prevents frequent start-stop of the air source heat pump assembly 201 but also facilitates rapid defrosting in winter. Impurities in the water flow during circulation can also settle at the bottom of the buffer water tank 202. A drain valve can be installed at the bottom of the buffer water tank 202 for timely drainage.

[0118] In some embodiments, such as Figure 6 As shown, a second check valve 620 is provided on the return water pipe 950. Along the water flow direction in the return water pipe 950, the second check valve 620 is located between the first junction point and the second junction point to ensure that the water flow in the return water pipe 950 can only flow from the first junction point to the second junction point.

[0119] like Figure 5 and Figure 6 As shown, when the heat pump system is in the third summer mode, the cold water prepared by the air source heat pump component 201 enters the indoor heat exchange device 400 through the water supply pipe 940. The water flowing through the indoor heat exchange device 400 absorbs heat energy from the surrounding indoor environment and rises in temperature. The return water of the indoor heat exchange device 400 flows to the first junction point. A portion of the indoor return water at the first junction point flows through the first inlet A2 and outlet C2 into the heat exchange channel to cool down. The cooled indoor return water flows through the inlet A3 and the second outlet B3 to the second junction point, where it mixes with another portion of the indoor return water and returns to the buffer water tank 202 through the lower inlet. The water at the bottom of the buffer water tank 202 returns to the air source heat pump component 201 through the lower outlet to cool down.

[0120] By setting a second one-way valve 620, the second one-way valve 620 only allows the return water of the indoor heat exchange device 400 to flow from the first junction point to the second junction point, so that the water flowing from the heat exchange channel to the second junction point will not flow back to the first junction point to form a circulation of water between the first junction point, the heat exchange channel and the second junction point, ensuring the circulation of indoor water in the first heat exchange loop, thereby ensuring the heat exchange effect.

[0121] In some embodiments, such as Figure 6As shown, the heat pump system also includes a second water pump 520, which is connected in series to the water supply pipe 940. The second water pump 520 circulates the water in the second heat exchange loop. In other embodiments, the second water pump 520 can also be connected in series to the return water pipe 950 between the inlet of the water source heat pump assembly and the outlet of the indoor heat exchange device 400. In other words, along the water flow direction in the return water pipe 950, the second water pump 520 is located upstream of the first junction point.

[0122] In some embodiments, such as Figure 6 and Figure 7 As shown, the water source heat pump device 100 also includes a third heat exchanger 112, which is connected in series to the heat exchange inlet pipe 980. The third heat exchanger 112 is located inside the inner tank 106 or around the outer side of the inner tank 106, and is located downstream of the inlet three-way valve 720 along the water flow direction inside the heat exchange inlet pipe 980. Whether the underfloor heating return water is introduced into the heat exchange inlet pipe 980 from the first connection point or the return water from the indoor heat exchange device 400 is introduced into the heat exchange inlet pipe 980 from the first junction point, it will flow through the third heat exchanger 112 to preheat the water in the inner tank 106.

[0123] In some embodiments, the heat exchange inlet pipe 980 includes a first inlet pipe and a second inlet pipe. The inlet of the third heat exchanger 112 is connected to the first connection point through the first inlet pipe, and the outlet of the third heat exchanger 112 is connected to the inlet of the heat exchange channel through the second inlet pipe. The second inlet B2 and outlet C2 of the inlet three-way valve 720 are connected in series to the first inlet pipe. A second bypass pipe 902 is connected between the first inlet pipe and the second inlet pipe. The second bypass pipe 902 is located outside the inner tank 106. The first inlet pipe between the connection point of the second bypass pipe 902 and the first inlet pipe and the first connection point is selectively connected to the second bypass pipe 902 or the inlet of the third heat exchanger 112. Along the water flow direction in the first inlet pipe, the inlet three-way valve 720 is located upstream of the connection point of the first bypass pipe 901 and the first inlet pipe.

[0124] Specifically, the water source heat pump device 100 also includes a water inlet three-way valve 108. The inlet A4 and the first outlet B4 of the water inlet three-way valve 108 are connected in series to the first water inlet pipe. Along the water flow direction in the first water inlet pipe, the water inlet three-way valve 720 is located upstream of the water inlet three-way valve 108. The second outlet C4 of the water inlet three-way valve 108 is connected to the second bypass pipe 902, and the inlet A4 can be selectively connected to the first outlet B4 and / or the second outlet C4.

[0125] When inlet A4 and first outlet B4 are connected and also connected to second outlet C4, the first heat exchanger 102 and the third heat exchanger 112 simultaneously heat the water in the inner tank 106. When inlet A4 and first outlet B4 are not connected but are connected to second outlet C4, only the first heat exchanger 102 is used to heat the water in the inner tank 106.

[0126] In other embodiments, two switching valves can be used to replace the aforementioned three-way inlet valve 108. These two switching valves are designated as a first fourth switching valve and a second fourth switching valve. The first fourth switching valve is located on the first inlet pipe, and the second fourth switching valve is located on the second bypass pipe 902. Along the water flow direction within the first inlet pipe, the first fourth switching valve is downstream of the connection point between the second bypass pipe 902 and the first inlet pipe. By controlling the first and second fourth switching valves, the heat exchange inlet pipe 980 can be selectively connected to either the second bypass pipe 902 or the inlet of the third heat exchanger 112.

[0127] For example, the inlet water temperature detection element 117 is provided on the first inlet water pipe, and the inlet water temperature detection element 117 is used to measure the inlet water temperature of the heat exchange inlet water pipe 980.

[0128] Heat pump system control methods also include:

[0129] If tb≤ts, where ts is the water temperature inside the inner tank 106, then the inlet of the heat exchange inlet pipe 980 is connected to the second bypass pipe 902.

[0130] If tb > ts, then the inlet of the heat exchange inlet pipe 980 is connected to the inlet of the third heat exchanger 112.

[0131] If tb > ts and the preset conditions are met, then the inlet of the heat exchange inlet pipe 980 is connected to the inlet of the third heat exchanger 112.

[0132] like Figure 8 As shown, when tb > ts, meaning the inlet water temperature of the heat exchange inlet pipe 980 is higher than the water temperature inside the inner tank 106, the inlet of the heat exchange inlet pipe 980 is connected to the inlet of the third heat exchanger 112. Water entering the heat exchange inlet pipe 980 at the first connection point first flows into the third heat exchanger 112, where it exchanges heat with the water in the inner tank 106. This causes the water in the inner tank 106 to heat up, while the water flowing through the third heat exchanger 112 cools down before entering the heat exchange channel. This method is suitable for users who do not require hot water. By preheating the water in the inner tank 106 through the third heat exchanger 112, it shortens the time required to heat the water in the inner tank 106 to the user-set temperature when the user requires hot water.

[0133] like Figure 9As shown, when tb≤ts, that is, the inlet water temperature entering the heat exchange inlet pipe 980 is not higher than the water temperature inside the inner tank 106, the inlet of the heat exchange inlet pipe 980 is connected to the second bypass pipe 902, so that the water entering the heat exchange inlet pipe 980 will not flow into the third heat exchanger 112 to exchange heat with the water inside the inner tank 106, but will flow directly through the second bypass pipe 902 to the heat exchange channel for heat exchange. This avoids the water temperature inside the inner tank 106 being reduced due to the water temperature entering the third heat exchanger 112 being too low, thereby reducing the energy consumption of the water source heat pump component and ensuring the operating efficiency of the water source heat pump component.

[0134] like Figure 10 As shown, the preset conditions include the user selecting the rapid heating mode. When tb > ts and the preset conditions are met, the inlet of the heat exchange water inlet pipe 980 is connected to the inlet of the second bypass pipe 902 and the inlet of the third heat exchanger 112, thereby increasing the heating rate of the water in the inner tank 106 and enabling the water in the inner tank 106 to quickly reach the temperature set by the user.

[0135] Specifically, such as Figure 11 As shown, the heat pump system control method includes the following steps:

[0136] S310, Obtain the inlet water temperature of the heat exchanger inlet pipe 980 and the water temperature inside the inner tank 106;

[0137] S320: Determine whether the inlet water temperature of the heat exchanger inlet pipe 980 is less than or equal to the water temperature inside the inner tank 106. If yes, execute S330; otherwise, execute S340.

[0138] S330, the inlet of the heat exchanger inlet pipe 980 is connected to the second bypass pipe 902;

[0139] S340. Determine whether the preset conditions are met. If yes, execute S350; otherwise, return to S330.

[0140] S550, the inlet of the control heat exchange inlet water pipe 980 is connected to the inlet of the third heat exchanger 112.

[0141] In other embodiments, preset conditions may not be set, and the inlet of the heat exchange inlet pipe 980 may be controlled to be connected to the inlet of the third heat exchanger 112 as long as the inlet water temperature of the heat exchange inlet pipe 980 is greater than the water temperature in the inner tank 106, thereby simplifying the control process.

[0142] In some embodiments, such as Figure 7As shown, the second heat exchanger 104 preferably adopts a microchannel heat exchanger to reduce the overall footprint of the second heat exchanger 104, thereby reducing the overall size of the water source heat pump device 100 and lowering its cost while ensuring the water storage volume of the inner tank 106. The specific structure of the microchannel heat exchanger and its installation structure on the inner tank 106 can be set with reference to the prior art, which is not the focus of this utility model and will not be described in detail here. The third heat exchanger 112 preferably adopts a coil heat exchanger, and the first heat exchanger 102 is preferably set as a plate heat exchanger.

[0143] like Figure 7 As shown, in order to detect the temperature inside the inner tank 106, a water tank temperature detection element 113 is installed inside the inner tank 106, and the water tank temperature detection element 113 is communicatively connected to the controller 111. Furthermore, an anode rod 115 is also installed inside the inner tank 106 to reduce the probability of scaling and corrosion inside the inner tank 106, improve the operational safety of the water source heat pump device 100, and extend the service life of the water source heat pump device 100.

[0144] In some embodiments, such as Figure 7 As shown, the water source heat pump assembly also includes a throttling unit 103 and a compressor 101. The compressor 101, the first heat exchanger 102, the throttling unit 103, and the second heat exchanger 104 are connected in series to form a refrigerant circulation loop. The first heat exchanger 102 has a heat exchange channel. The inlet of the heat exchange channel is connected to a first connection point through a heat exchange inlet water pipe 980, and the outlet of the heat exchange channel is connected to a second connection point through a heat exchange return water pipe 990.

[0145] The refrigerant circulates within the refrigerant circulation loop, enabling the second heat exchanger 104 to heat the water inside the inner tank 106, while the first heat exchanger 102 absorbs the heat energy from the water flowing through the heat exchange channel. For example, the throttling unit 103 is an electronic expansion valve.

[0146] In some embodiments, a third water pump 107 is connected in series to the heat exchange inlet pipe 980, and along the water flow direction within the heat exchange inlet pipe 980, the third water pump 107 is located downstream of the inlet three-way valve 720. This allows the third water pump 107 to be used to introduce both the underfloor heating return water from the first connection point and the return water from the indoor heat exchange device 400 from the first junction point into the heat exchange inlet pipe 980.

[0147] As an alternative, the third water pump 107 can be connected in series to the heat exchange return water pipe 990, and the third water pump 107 is located upstream of the outlet three-way valve 730 along the water flow direction in the heat exchange return water pipe 990.

[0148] In some embodiments, such as Figure 7As shown, the water source heat pump assembly also includes a first filter 105, which is located on the refrigerant circulation loop and upstream of the inlet of the throttling unit 103 to filter the refrigerant flowing to the throttling unit 103 and prevent impurities from clogging the throttling unit 103.

[0149] In some embodiments, such as Figure 7 As shown, the water source heat pump assembly also includes a second filter 109, which is located upstream of the heat exchange channel to filter the floor heating water flowing into the heat exchange channel and prevent impurities from clogging the heat exchange channel.

[0150] In some embodiments, such as Figure 7 As shown, the inner liner 106 is equipped with a housing 110. The water source heat pump assembly is located between the housing 110 and the inner liner 106. The inlet end of the third heat exchanger 112 extends out of the inner liner 106 and is connected to the outlet end of the heat exchange inlet pipe 980. The inlet end of the heat exchange inlet pipe 980 extends out of the housing 110 and is connected to the first connection point. The outlet end of the heat exchange inlet pipe 980 extends out of the inner liner 106 and is connected to the inlet of the heat exchange channel. The outlet end of the heat exchange return pipe 990 extends out of the housing 110 and is connected to the second connection point.

[0151] In some embodiments, such as Figure 7 As shown, the water source heat pump device 100 also includes a hot water outlet pipe 920 and a cold water inlet pipe 910. One end of both the cold water inlet pipe 910 and the hot water outlet pipe 920 is located outside the housing 110, and the other end is installed and inserted into the inner tank 106. The hot water outlet pipe 920 is connected to the water user 1000, and the cold water inlet pipe 910 is used to connect to the municipal water source. The cold water inlet pipe 910 is connected to the water user 1000 through a cold water supply pipe 930.

[0152] In one embodiment, such as Figure 7 As shown, the water source heat pump device 100 also includes an electric heater 114, which is installed inside the inner tank 106 to heat the water in the inner tank 106 by means of electricity. This serves as an auxiliary heating method for the water source heat pump device 100, ensuring the outlet water temperature of the water source heat pump device 100 even when the water source heat pump components malfunction and fail to heat the water in the inner tank 106 or the heating is insufficient, thereby improving the reliability of the water source heat pump device 100. The electric heating element is communicatively connected to the controller 111.

[0153] In some embodiments, such as Figure 7 As shown, a heat pump switch valve 116 is provided on the heat exchange inlet pipe 980, which facilitates the disconnection of the heat exchange inlet pipe 980 through the heat pump switch valve 116. The heat pump switch valve 116 is electrically connected to the controller 111.

[0154] In some embodiments, such asFigure 7 As shown, an exhaust temperature sensor is installed on the heat exchange return water pipe 990 to detect the exhaust temperature of compressor 101. The exhaust temperature sensor is located between compressor 101 and the first heat exchanger 102, and is positioned near the outlet of compressor 101. The exhaust temperature sensor is communicatively connected to controller 111.

[0155] To further improve the operational safety of the water source heat pump device 100, in one embodiment, such as Figure 7 As shown, the water source heat pump device 100 also includes an exhaust valve 118, which is located at the high point of the heat exchange pipeline formed by the first water inlet pipe, the third heat exchanger 112, the second water inlet pipe, the first heat exchanger 102 and the heat exchange return pipe 990 connected in series, in order to exhaust the gas in the heat exchange pipeline.

[0156] In some embodiments, such as Figure 12 As shown, the water source heat pump device 100 also includes a display screen 119, which is communicatively connected to the controller 111 and is mounted on the housing 110. The display screen 119 is used to display the operating parameters of the water source heat pump device 100, such as the water temperature inside the inner tank 106, so that users can view the operating status of the water source heat pump device 100.

[0157] In some embodiments, the air source heat pump device 200 has a heating state and a cooling state. When the heat pump system is in any of the first summer mode, the second summer mode and the third summer mode, the air source heat pump device 200 is in the cooling state.

[0158] like ​As shown, the heat pump system also has a winter mode. In winter mode, the air source heat pump unit 200 is in heating mode. Inlet C1 is connected to the first outlet A1 but not to the second outlet B1; the first inlet A2 is connected to outlet C2 but not to the second inlet B2; and inlet A3 is connected to the first outlet C3 but not to the second outlet B3. A portion of the hot water generated by the air source heat pump unit 201 enters the indoor heat exchanger 400 via the second water pump 520 to absorb cold energy from the room and cool it down, thus raising the room temperature. Afterward, it returns to the buffer water tank 202 via the second one-way valve 620. Meanwhile, another portion of the hot water generated by the air source heat pump component 201 enters the buffer water tank 202. The first water pump 510 draws hot water from the buffer water tank 202 and sends it to the underfloor heating device 300 to absorb the cold energy in the room and raise the temperature of the room. The return water from the underfloor heating device 300 enters the underfloor heating return water pipe 970. The third water pump 107 draws part of the underfloor heating return water at the first connection point and sends it to the heat exchange channel to cool it down, so as to use the water source heat pump component to heat the water in the inner tank 106. The underfloor heating water flowing out of the heat exchange channel returns to the second connection point. Another portion of the underfloor heating return water flows to the second connection point through the first one-way valve 610. The underfloor heating return water at the second connection point and the return water from the heat exchange channel are mixed and sent to the buffer water tank 202. The water in the buffer water tank 202 returns to the air source heat pump component 201 through the lower outlet to be heated again.

[0159] In the specific implementation of the above embodiments, the technical features can be combined in any non-contradictory way. For the sake of brevity, not all possible combinations of the above technical features are described. However, as long as the combination of these technical features is not contradictory, it should be considered to be within the scope of this specification.

[0160] The specific embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A heat pump system, characterized in that, include: An air source heat pump device (200) and a floor heating device (300); the outlet of the air source heat pump device (200) is connected to the inlet of the floor heating device (300) through a floor heating water supply pipe (960), the outlet of the floor heating device (300) is connected to the inlet of the air source heat pump device (200) through a floor heating return water pipe (970), and the floor heating water supply pipe (960) is connected to the floor heating return water pipe (970) through a first bypass pipe (901); A water source heat pump device (100) includes an inner tank (106) and a water source heat pump assembly located outside the inner tank (106). The water source heat pump assembly is used to heat the water in the inner tank (106). The inlet and outlet of the water source heat pump assembly are respectively connected to the floor heating return pipe (970) between the outlet of the floor heating device (300) and the connection position of the first bypass pipe (901), so that the air source heat pump device (200), the floor heating device (300) and the water source heat pump assembly can be connected end to end to form a first floor heating circulation loop, and the water source heat pump assembly and the floor heating device (300) can be connected end to end to form a second floor heating circulation loop. A temperature detection unit is used to detect the inlet water temperature of the floor heating device (300), the outlet water temperature of the floor heating device (300), the inlet water temperature of the water source heat pump component, and the water temperature downstream of the connection position between the floor heating return pipe (970) and the outlet of the water source heat pump component. The dew point detection unit is used to detect the dew point temperature of the indoor environment.

2. The heat pump system according to claim 1, characterized in that, The heat pump system also includes an indoor heat exchange device (400), the outlet of the air source heat pump device (200) is connected to the inlet of the indoor heat exchange device (400), and the outlet of the indoor heat exchange device (400) is connected to the inlet of the air source heat pump device (200) through a return water pipe (950). The inlet and outlet of the water source heat pump assembly can be selectively connected to the return water pipe (950) respectively, so that the first heat exchange circulation loop formed by the air source heat pump device (200), the indoor heat exchange device (400) and the water source heat pump assembly connected end to end is connected.

3. The heat pump system according to claim 2, characterized in that, The return water pipeline (950) has a first junction point and a second junction point arranged sequentially along the water flow direction therein. The inlet of the water source heat pump assembly is connected to the first junction point, and the outlet of the water source heat pump assembly is connected to the second junction point. The heat pump system also includes: A three-way inlet valve (720) is provided, wherein the first inlet A2 of the three-way inlet valve (720) is connected to the first junction point, and the second inlet B2 and outlet C2 of the three-way inlet valve (720) are connected in series to the pipeline connecting the underfloor heating return water pipe (970) and the water source heat pump assembly. The outlet C2 can be selectively connected to the first inlet A2 or the second inlet B2. A three-way valve (730) is provided, wherein the inlet A3 and the first outlet C3 of the three-way valve (730) are connected in series to the pipeline connecting the outlet of the water source heat pump assembly and the underfloor heating return pipe (970), the second outlet B3 of the three-way valve (730) is connected to the second junction, and the inlet A3 can be selectively connected to the first outlet C3 or the second outlet B3.

4. The heat pump system according to claim 3, characterized in that, The underfloor heating return pipe (970) has a first connection point and a second connection point arranged sequentially along the water flow direction therein; the inlet of the water source heat pump assembly is connected to the first connection point, and the outlet of the water source heat pump assembly is connected to the second connection point. The heat pump system also includes: A return water three-way valve (710) is provided, wherein the inlet C1 and the first outlet A1 of the return water three-way valve (710) are connected in series to the floor heating return water pipe (970) between the second connection point and the inlet of the air source heat pump device (200), the second outlet B1 of the return water three-way valve (710) is connected to the first bypass pipe (901), and the inlet C1 can be selectively connected to the first outlet A1 and / or the second outlet B1.

5. The heat pump system according to claim 4, characterized in that, The underfloor heating return pipe (970) is provided with a first one-way valve (610), which is located between the first connection point and the second connection point, and is used to ensure that the water in the underfloor heating return pipe (970) can only flow from the first connection point to the second connection point; And / or, the return water pipe (950) is provided with a second one-way valve (620), which is located between the first junction point and the second junction point, and is used to ensure that the water in the return water pipe (950) can only flow from the first junction point to the second junction point.

6. The heat pump system according to claim 4, characterized in that, The heat pump system further includes a first water pump (510), which is connected in series to the underfloor heating water supply pipe (960) and, along the water flow direction in the underfloor heating water supply pipe (960), the position where the underfloor heating water supply pipe (960) connects to the first bypass pipe (901) is located upstream of the first water pump (510); or the first water pump (510) is connected in series to the underfloor heating return water pipe (970) and, along the water flow direction in the underfloor heating return water pipe (970), the first water pump (510) is located upstream of the return water three-way valve (710); And / or, the outlet of the air source heat pump device (200) is connected to the inlet of the indoor heat exchange device (400) through a water supply pipe (940), and the heat pump system further includes a second water pump (520), which is connected in series to the water supply pipe (940) or the return water pipe (950).

7. The heat pump system according to claim 4, characterized in that, The water source heat pump assembly includes a compressor (101), a first heat exchanger (102), a throttling unit (103), and a second heat exchanger (104) connected end to end to form a heating circulation loop. The second heat exchanger (104) is used to heat the water in the inner tank (106). The inlet of the first heat exchanger (102) with a heat exchange channel is connected to the underfloor heating return pipe (970) through a heat exchange inlet pipe (980), and the outlet of the heat exchange channel is connected to the underfloor heating return pipe (970) through a heat exchange return pipe (990). A third heat exchanger (112) is connected in series on the heat exchange inlet pipe (980). The third heat exchanger (112) is located inside the inner tank (106) or around the inner tank (106). Along the water flow direction inside the heat exchange inlet pipe (980), the third heat exchanger (112) is located downstream of the inlet three-way valve (720).

8. The heat pump system according to claim 7, characterized in that, A third water pump (107) is connected in series on the heat exchange inlet pipe (980). Along the water flow direction in the heat exchange inlet pipe (980), the third water pump (107) is located downstream of the inlet three-way valve (720). Alternatively, a third water pump (107) is connected in series on the heat exchange return water pipe (990), and the third water pump (107) is located upstream of the outlet three-way valve (730) along the water flow direction in the heat exchange return water pipe (990).

9. The heat pump system according to claim 7, characterized in that, The heat exchange inlet pipe (980) includes a first inlet pipe located between the inlet of the third heat exchanger (112) and one end of the heat exchange inlet pipe (980) connected to the underfloor heating return pipe (970), and a second inlet pipe located between the outlet of the third heat exchanger (112) and the inlet of the heat exchange channel. The second inlet B2 and outlet C2 of the inlet three-way valve (720) are connected in series to the first inlet pipe. A second bypass pipe (902) is connected between the first inlet pipe and the second inlet pipe. The first inlet pipe between the second bypass pipe (902) and the first inlet pipe and the first connection point is selectively connected to the second bypass pipe (902) or the inlet of the third heat exchanger (112). Along the water flow direction in the first inlet pipe, the connection point between the second bypass pipe (902) and the first inlet pipe is located downstream of the inlet three-way valve (720).

10. The heat pump system according to claim 9, characterized in that, The water source heat pump device also includes a water inlet three-way valve (108). The inlet A4 and the first outlet B4 of the water inlet three-way valve (108) are connected in series to the first water inlet pipe. Along the water flow direction in the first water inlet pipe, the water inlet three-way valve (108) is located downstream of the water inlet three-way valve (720). The second outlet C4 of the water inlet three-way valve (108) is connected to the second bypass pipe (902), and the inlet A4 can be selectively connected to the first outlet B4 and / or the second outlet C4.