Height-adaptive double-sided radio frequency chip performance test fixture

Abstract

The utility model provides a height-adaptive double-sided radio frequency chip performance test fixture. An upper test assembly comprises an upper seat, an upper mounting groove, an upper connecting groove and an upper limiting frame. According to the utility model, through unique upper and lower test assembly structures, such as cooperative operation of each part in a groove and assistance of an elastic gasket, accurate alignment and stable compression of the front and back test probes during double-sided chip test are ensured, the problems of alignment precision and compression strength are solved, and meanwhile, the precision of the chip is improved for poor flatness and inclination of the chip and height difference of a substrate. Slidable conductor connecting blocks and elastic gaskets in the upper test assembly and the lower test assembly can be adjusted in a self-adaptive mode, good contact is guaranteed, the error test rate is reduced, and the test consistency and accuracy are improved. Through the principles of thread transmission and the like in the height adjusting assembly and in cooperation with various limiting and buffering structures, accurate and stable height adjustment is achieved, the clamp is adaptive to chip specifications of different thicknesses, the universality and the use flexibility of the clamp are enhanced, and the cost is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip test technical field, especially a double -sided radio frequency chip performance test fixture of adaptive height. BACKGROUND

[0002] Due to the rapid development breakthrough of current semiconductor technology, the radio frequency highly integrated circuit is widely used because of small size and light weight, and the original modular radio frequency transceiver assembly or multichannel amplifier phase shifter radio frequency device, the digital analog conversion part is also packaged into the radio frequency chip form through the semiconductor technology, because the chip function is more, single layer layout has been unable to meet the requirement, under the premise of multilayer stacking or single layer double -sided chip is born, it has very obvious advantage from volume and use cost, greatly reduce the volume and weight of whole machine equipment, reduce the whole machine power consumption, and the reliability is also higher, can reduce many process assembly steps simultaneously, the stacked chip is double -sided structure, that is, the front and back have test points, and the stacked double -sided chip top can be directly attached antenna, and the space and cost are very advantageous, and the reliability is also very high, and it is the development mainstream of current radio frequency assembly, and also brings the following problems;

[0003] I. The stacked double -sided chip test has front and back, and the alignment accuracy and pressing force requirement are very high during testing, and the current market clamp cannot solve the problem;

[0004] II. Because of the process reason, the flatness of stacked double -sided chip is not good, and there is a possibility of inclination, and the current market double -sided clamp does not have the functions of automatically adapting to inclination and height difference, so that the contact is not good, the test consistency is poor, and the test error rate is 50%;

[0005] III. The chip substrate has height difference, so that the existing probe clamp cannot be in good contact with the uneven substrate;

[0006] Therefore, a double -sided radio frequency chip performance test fixture of adaptive height is provided. Utility model content

[0007] Therefore, the utility model hopes to provide a double -sided radio frequency chip performance test fixture of adaptive height to solve or alleviate the technical problems in the prior art, and at least provide a beneficial choice.

[0008] The technical scheme of the utility model embodiment is realized as follows: a double -sided radio frequency chip performance test fixture of adaptive height, including upper test component and lower test component;

[0009] The upper test assembly includes an upper seat, an upper mounting groove, an upper connecting groove, an upper limit groove, a first conductor connecting block, a second conductor connecting block, an upper elastic conductive pad, and an upper limit frame. The upper mounting groove is located at the center of the upper surface of the upper seat. The upper connecting groove is located in the middle of the inner wall of the upper mounting groove. Upper limit grooves are located at the front and rear of both sides of the inner bottom wall of the upper connecting groove. The first conductor connecting block is slidably connected to the inner wall of the upper limit groove. A second conductor connecting block is located at the center of the bottom of the first conductor connecting block, and the bottom of the second conductor connecting block penetrates through the center of the inner bottom wall of the upper limit groove. The upper elastic conductive pad is attached to the inner wall of the upper connecting groove. The outer side of the center of the upper surface of the first conductor connecting block is attached to the lower surface of the upper elastic conductive pad. The upper limit frame is fixedly connected to the inner bottom wall of the upper mounting groove. The upper surface of the upper elastic conductive pad is attached to the lower surface of the upper limit frame.

[0010] The lower test assembly includes a lower base, a lower mounting groove, a lower connecting groove, a lower limiting groove, a third conductor connecting block, a fourth conductor connecting block, a lower elastic conductive pad, and a lower limiting frame. The lower mounting groove is located at the center of the lower surface of the lower base. The lower connecting groove has a lower connecting groove located in the center of its inner top wall. Lower limiting grooves are located at the front and rear of the inner top wall of the lower connecting groove. A third conductor connecting block is slidably connected to the inner side wall of the lower limiting groove. A fourth conductor connecting block is located at the center of the top of the third conductor connecting block, with its top extending through the center of the inner top wall of the lower limiting groove. A lower elastic conductive pad is fitted to the inner side wall of the lower connecting groove. The outer side of the center of the lower surface of the third conductor connecting block is fitted to the upper surface of the lower elastic conductive pad. A lower limiting frame is fixedly connected to the inner bottom wall of the lower mounting groove. The lower surface of the lower elastic conductive pad is fitted to the upper surface of the lower limiting frame.

[0011] More preferably, an upper test groove is provided at the center of the lower surface of the upper seat, and an upper test base is fixedly connected to the inner sidewall of the upper test groove. The bottom of the second conductor connecting block extends through the top of the upper test base, and multiple upper test probes are provided at the middle of the lower surface of the upper test base and the bottom of the second conductor connecting block.

[0012] More preferably, the upper surface of the lower seat is provided with a lower test groove, the inner sidewall of the lower test groove is fixedly connected to the lower test seat, the top of the fourth conductor connecting block extends through the bottom of the lower test seat, a plurality of lower test probes are provided in the middle of the inner bottom wall of the lower test seat and the top of the fourth conductor connecting block, and a chip limiting frame is fixedly connected to the outer side of the inner bottom wall of the lower test seat.

[0013] More preferably, the top of the upper test component is provided with a height adjustment component; the height adjustment component includes an upper connecting seat, a threaded hole, a threaded cylinder, an adjustment knob, a limiting slide groove, a limiting slide column, an adjustment seat, a limiting slide hole, a first spring, a limiting head, a circular groove, a limiting pin, and a connecting hole;

[0014] A threaded hole is formed at the center of the upper surface of the upper connecting seat. A threaded cylinder is rotatably connected to the inner wall of the threaded hole. An adjusting knob is fixedly connected to the top of the threaded cylinder. A limiting groove is formed at the bottom of the upper connecting seat. Limiting sliding posts are provided at the four corners of the inner top wall of the limiting groove. An adjusting seat is slidably connected to the inner wall of the limiting groove. Limiting sliding holes are formed at the four corners of the upper surface of the adjusting seat. The outer wall of the limiting sliding post is slidably connected to the inner wall of the limiting sliding hole. A first spring is sleeved on the lower part of the outer wall of the limiting sliding post. The top of the spring is fitted to the bottom of the adjusting seat near the outer side of the limiting slide hole. The bottom of the limiting slide is welded with a limiting head. The bottom of the first spring is fitted to the upper surface of the limiting head near the outer side of the limiting slide. A circular groove is provided at the center of the upper surface of the adjusting seat. The outer bottom of the threaded cylinder is rotatably connected to the inner wall of the circular groove. Limiting pins are fixedly connected to the front and rear parts of both sides of the lower surface of the adjusting seat. Connecting holes are provided at the four corners of the upper surface of the upper seat. The outer wall of the limiting pin is slidably connected to the inner wall of the connecting hole.

[0015] More preferably, the lower surface of the adjusting seat is provided with upper limit holes on both the front and rear sides, and the upper surface of the upper seat is provided with lower limit holes on both the front and rear sides. The inner bottom wall of the lower limit hole is fitted with a second spring, and the top of the second spring is fitted with the inner top wall of the upper limit hole.

[0016] More preferably, a lower connecting seat is fixedly connected to the outer side wall of the lower seat, a test chamber is fixedly connected to the bottom of the lower connecting seat, and a base is fixedly connected to the bottom of the test chamber.

[0017] More preferably, the rear part of the upper surface of the lower connecting seat is hinged to the rear part of the lower surface of the upper connecting seat by a pin.

[0018] More preferably, the test chamber is provided with lower test connectors on both the front and rear sides.

[0019] More preferably, the upper connecting seat is fixedly connected to both sides of the bracket, and the bracket is provided with upper test connectors at the front and rear of both sides.

[0020] More preferably, a latch is installed in the middle of the front surface of the upper connecting seat.

[0021] The present invention has the following advantages due to the adoption of the above technical solution:

[0022] 1. This utility model, through its unique upper and lower test component structure, such as the coordinated operation of each component in the groove and the assistance of elastic pads, ensures that the test probes on both sides are accurately aligned and stably pressed during double-sided chip testing, thus solving the problems of alignment accuracy and pressing force. At the same time, for chip flatness, tilting and substrate height difference, the sliding conductor connecting block and elastic pad in the upper and lower test components can adaptively adjust to ensure good contact, reduce false test rate and improve test consistency and accuracy.

[0023] 2. This utility model utilizes the principle of threaded transmission through a height adjustment component, combined with various limiting and buffering structures, to achieve precise and stable height adjustment, adapting to chip specifications of different thicknesses, enhancing the versatility and flexibility of the fixture, and reducing costs.

[0024] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is an overall structural diagram of the present invention;

[0027] Figure 2 This is a structural diagram of the opening of the upper connecting seat of this utility model;

[0028] Figure 3 This is an exploded structural diagram of the height adjustment component of this utility model;

[0029] Figure 4 For the present utility model Figure 3 Another perspective on the structure diagram;

[0030] Figure 5 This is a disassembled structural diagram of the upper test component of this utility model;

[0031] Figure 6 For the present utility model Figure 5 Another perspective on the structure diagram;

[0032] Figure 7 This is a disassembled structural diagram of the lower test component of this utility model;

[0033] Figure 8 For the present utility model Figure 7 Another perspective on the structure diagram.

[0034] Reference numerals: 1. Upper test assembly; 10. Upper seat; 11. Upper mounting groove; 12. Upper connecting groove; 13. Upper limit groove; 14. First conductor connecting block; 15. Second conductor connecting block; 16. Upper elastic conductive pad; 17. Upper limit frame; 18. Upper test groove; 19. Upper test seat; 20. Upper test probe; 2. Lower test assembly; 21. Lower seat; 22. Lower mounting groove; 23. Lower connecting groove; 24. Lower limit groove; 25. Third conductor connecting block; 26. Fourth conductor connecting block; 27. Lower elastic conductive pad; 28. Lower limit frame; 29. ​​Lower test groove; 30. Lower test... 31. Test stand; 32. Lower test probe; 33. Chip limiting frame; 34. Lower connector; 35. Test box; 36. Base; 37. Pin; 38. Lower test connector; 39. Bracket; 40. Upper test connector; 41. Height adjustment assembly; 42. Upper connector; 43. Threaded hole; 44. Threaded cylinder; 45. Adjustment knob; 46. Limiting slide groove; 47. Limiting slide column; 48. Adjustment seat; 49. Limiting slide hole; 50. First spring; 51. Limiting head; 52. Circular groove; 53. Limiting pin; 54. Connecting hole; 55. Upper limiting hole; 56. Lower limiting hole; 57. Second spring; 58. Lock. Detailed Implementation

[0035] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0036] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0037] Example 1

[0038] like Figures 1-8 As shown, this utility model embodiment provides an adaptive height double-sided RF chip performance test fixture, including an upper test component 1 and a lower test component 2;

[0039] The upper test assembly 1 includes an upper seat 10, an upper mounting groove 11, an upper connecting groove 12, an upper limit groove 13, a first conductor connecting block 14, a second conductor connecting block 15, an upper elastic conductive pad 16, and an upper limit bracket 17. The upper mounting groove 11 is located at the center of the upper surface of the upper seat 10. The upper connecting groove 12 is located in the middle of the inner sidewall of the upper mounting groove 11. Upper limit grooves 13 are located at the front and rear of both sides of the inner bottom wall of the upper connecting groove 12. The first conductor connecting block 14 is slidably connected to the inner sidewall of the upper limit groove 13. The bottom center of the first conductor connecting block 14 is... A second conductor connecting block 15 is provided, the bottom of which penetrates the center of the inner bottom wall of the upper limit groove 13. An upper elastic conductive pad 16 is attached to the inner side wall of the upper connecting groove 12. The outer side of the center of the upper surface of the first conductor connecting block 14 is attached to the lower surface of the upper elastic conductive pad 16. An upper limit frame 17 is fixedly connected to the inner bottom wall of the upper mounting groove 11, and the upper surface of the upper elastic conductive pad 16 is attached to the lower surface of the upper limit frame 17. An upper mounting groove 11 is provided at the center of the upper surface of the upper seat 10. This groove is the upper limit for the installation of subsequent components. The frame 17 provides space and a positioning base. An upper connecting groove 12 is formed in the middle of the inner wall of the upper mounting groove 11, which accommodates the upper elastic conductive pad 16. Upper limit grooves 13 are formed on both the front and rear sides of the inner bottom wall of the upper connecting groove 12. A first conductor connecting block 14 is slidably connected to the inner wall of the upper limit groove 13, allowing the first conductor connecting block 14 to slide within a certain range within the upper limit groove 13 to adapt to different situations. A second conductor connecting block 15 is provided at the bottom center of the first conductor connecting block 14, with the bottom of the second conductor connecting block 15 penetrating through... At the center of the inner bottom wall of the upper limit groove 13, this structure is beneficial for signal transmission and adaptation to the chip surface conditions during testing. The inner side wall of the upper connecting groove 12 is attached to the upper elastic conductive pad 16. The outer side of the upper surface center of the first conductor connecting block 14 is attached to the lower surface of the upper elastic conductive pad 16. The upper elastic conductive pad 16 can generate elastic deformation according to contact pressure, etc., which plays a role in buffering, adapting to differences in chip surface and maintaining contact stability. The upper limit bracket 17 is used to limit the position of the upper elastic conductive pad 16 to ensure the stability and reliability of the structure.

[0040] The lower test assembly 2 includes a lower base 21, a lower mounting groove 22, a lower connecting groove 23, a lower limiting groove 24, a third conductor connecting block 25, a fourth conductor connecting block 26, a lower elastic conductive pad 27, and a lower limiting frame 28. The lower mounting groove 22 is located at the center of the lower surface of the lower base 21. The lower connecting groove 23 is located in the middle of the inner top wall of the lower mounting groove 22. The lower limiting groove 24 is located at both the front and rear of the inner top wall of the lower connecting groove 23. The third conductor connecting block 25 is slidably connected to the inner sidewall of the lower limiting groove 24. A fourth conductor connecting block 26 is provided at the top center of the third conductor connecting block 25. The top of the fourth conductor connecting block 26 penetrates the center of the inner top wall of the lower limiting groove 24. A lower elastic conductive pad 27 is attached to the inner side wall of the lower connecting groove 23. The outer side of the lower surface center of the third conductor connecting block 25 is attached to the upper surface of the lower elastic conductive pad 27. A lower limiting frame 28 is fixedly connected to the inner bottom wall of the lower mounting groove 22. The lower surface of the lower elastic conductive pad 27 is attached to the upper surface of the lower limiting frame 28.

[0041] A fourth conductor connecting block 26 is provided at the top center of the third conductor connecting block 25. The top of the fourth conductor connecting block 26 penetrates the center of the inner top wall of the lower limiting groove 24, which facilitates signal transmission and adapts to the conditions of the lower surface of the chip. A lower elastic conductive pad 27 is attached to the inner side wall of the lower connecting groove 23. The outer side of the lower surface center of the third conductor connecting block 25 is attached to the upper surface of the lower elastic conductive pad 27. The lower elastic conductive pad 27 adapts to the unevenness and pressure changes of the lower surface of the chip. The lower limiting frame 28 limits and supports the lower elastic conductive pad 27.

[0042] In one embodiment, specifically: an upper test groove 18 is provided at the center of the lower surface of the upper seat 10, and an upper test base 19 is fixedly connected to the inner sidewall of the upper test groove 18. The bottom of the second conductor connecting block 15 passes through the top of the upper test base 19. Multiple upper test probes 20 are provided in the middle of the lower surface of the upper test base 19 and the bottom of the second conductor connecting block 15. The bottom of the second conductor connecting block 15 passes through the top of the upper test base 19 and extends a certain distance from the bottom of the upper test base 19. Multiple upper test probes 20 are provided in the middle of the lower surface of the upper test base 19 and the bottom of the second conductor connecting block 15. The upper test probes 20 are used to contact the test points on the upper surface of the chip to realize signal input and output and perform chip performance testing.

[0043] In one embodiment, specifically: a lower test groove 29 is formed on the upper surface of the lower base 21, and a lower test base 30 is fixedly connected to the inner wall of the lower test groove 29. The top of the fourth conductor connecting block 26 extends through the bottom of the lower test base 30. Multiple lower test probes 31 are provided in the middle of the inner bottom wall of the lower test base 30 and the top of the fourth conductor connecting block 26. A chip limiting frame 32 is fixedly connected to the outer side of the inner bottom wall of the lower test base 30. The top of the fourth conductor connecting block 26 extends through the bottom of the lower test base 30 and extends a certain distance from the top of the lower test base 30. Multiple lower test probes 31 are provided in the middle of the inner bottom wall of the lower test base 30 and the top of the fourth conductor connecting block 26. The lower test probes 31 contact the test points on the lower surface of the chip for testing. The chip limiting frame 32 is fixedly connected to the outer side of the inner bottom wall of the lower test base 30. The chip limiting frame 32 is used to position the chip when placing the chip to ensure that the chip can be accurately placed in the test position and that the test points on the lower surface of the chip correspond correctly to the lower test probes 31.

[0044] In one embodiment, specifically: a height adjustment component 4 is provided on the top of the upper test component 1; the height adjustment component 4 includes an upper connecting seat 40, a threaded hole 41, a threaded cylinder 42, an adjustment knob 43, a limiting slide groove 44, a limiting slide post 45, an adjustment seat 46, a limiting slide hole 47, a first spring 48, a limiting head 49, a circular groove 50, a limiting pin 51, and a connecting hole 52;

[0045] A threaded hole 41 is provided at the center of the upper surface of the upper connecting seat 40. A threaded cylinder 42 is rotatably connected to the inner wall of the threaded hole 41. An adjusting knob 43 is fixedly connected to the top of the threaded cylinder 42. A limiting groove 44 is provided at the bottom of the upper connecting seat 40. A limiting slide post 45 is provided at each of the four corners of the inner top wall of the limiting groove 44. An adjusting seat 46 is slidably connected to the inner wall of the limiting groove 44. A limiting slide hole 47 is provided at each of the four corners of the upper surface of the adjusting seat 46. The outer wall of the limiting slide post 45 is slidably connected to the inner wall of the limiting slide hole 47. A first spring 48 is sleeved on the lower part of the outer wall of the limiting slide post 45. The top of the first spring 48 is attached to the bottom of the adjusting seat 46 near the outside of the limiting slide hole 47. The bottom of the limiting slide column 45 is welded with a limiting head 49. The bottom of the first spring 48 is attached to the upper surface of the limiting head 49 near the outside of the limiting slide column 45. A circular groove 50 is provided at the center of the upper surface of the adjusting seat 46. The bottom of the outer side of the threaded cylinder 42 is rotatably connected to the inner wall of the circular groove 50. Limiting pins 51 are fixedly connected to the front and rear sides of the lower surface of the adjusting seat 46. Connecting holes 52 are provided at the four corners of the upper surface of the upper seat 10. The outer wall of the limiting pin 51 is slidably connected to the inner wall of the connecting hole 52.

[0046] An adjusting knob 43 is fixedly connected to the top of the threaded cylinder 42. Rotating the adjusting knob 43 can drive the threaded cylinder 42 to rotate. A limiting groove 44 is provided at the bottom of the upper connecting seat 40. Limiting sliding posts 45 are provided at the four corners of the inner top wall of the limiting groove 44. An adjusting seat 46 is slidably connected to the inner side wall of the limiting groove 44. Limiting sliding holes 47 are provided at the four corners of the upper surface of the adjusting seat 46. The outer side wall of the limiting sliding post 45 is slidably connected to the inner side wall of the limiting sliding hole 47. This structure restricts the movement direction of the adjusting seat 46, so that it can only move up and down along the limiting groove 44, and maintains a certain position during the movement. Stable; the first spring 48 acts as a buffer and auxiliary positioning, providing elastic force when the adjusting seat 46 moves; the outer bottom of the threaded cylinder 42 is rotatably connected to the inner wall of the circular groove 50, which allows the adjusting seat 46 to move up and down when the threaded cylinder 42 rotates; the front and rear sides of the lower surface of the adjusting seat 46 are fixedly connected to limit pins 51, and the upper surface of the upper seat 10 is provided with connecting holes 52 at the four corners. The outer wall of the limit pin 51 is slidably connected to the inner wall of the connecting hole 52, which further enhances the stability of the connection between the adjusting seat 46 and the upper seat 10 and the accuracy of the movement.

[0047] In one embodiment, specifically: upper limit holes 53 are provided on both the front and rear sides of the lower surface of the adjusting seat 46, and lower limit holes 54 are provided on both the front and rear sides of the upper surface of the upper seat 10. A second spring 55 is attached to the inner bottom wall of the lower limit hole 54, and the top of the second spring 55 is attached to the inner top wall of the upper limit hole 53. The upper limit hole 53, the lower limit hole 54, and the second spring 55 play an auxiliary limiting and buffering role in the height adjustment process, preventing excessive adjustment or damage to components due to accidental situations, and also helping to maintain the relative stability of the structure during testing.

[0048] In one embodiment, specifically: a lower connecting seat 33 is fixedly connected to the outer wall of the lower seat 21, a test housing 34 is fixedly connected to the bottom of the lower connecting seat 33, and a base 35 is fixedly connected to the bottom of the test housing 34. The lower connecting seat 33 serves as a bridge connecting the lower seat 21 with other components. The test housing 34, fixedly connected to the bottom of the lower connecting seat 33, is used to house some test circuits, control equipment, etc., and works in conjunction with the entire test fixture. The base 35, fixedly connected to the bottom of the test housing 34, provides a stable support foundation for the entire test fixture, ensuring that the fixture will not shake or shift during the test.

[0049] In one embodiment, specifically: the rear part of the upper surface of the lower connector 33 is hinged to the rear part of the lower surface of the upper connector 40 by a pin 36. This hinge structure allows the upper connector 40 to rotate relative to the lower connector 33, making it convenient to open the fixture to place the chip before testing and to open the fixture to remove the chip after testing.

[0050] In one embodiment, specifically: both the front and rear sides of the test housing 34 are provided with lower test connectors 37. The lower test connectors 37 are used to connect external test equipment or transmit test signals, and work together with the lower test probes 31 on the lower test socket 30 to realize the transmission of test signals for chip performance.

[0051] In one embodiment, specifically: brackets 38 are fixedly connected to both sides of the upper connector 40, and upper test connectors 39 are provided at the front and rear of both sides of the brackets 38. The upper test connectors 39 are also used to connect external test equipment or transmit test signals, and cooperate with the upper test probes 20 on the upper test base 19 to complete the signal interaction in the chip performance test process.

[0052] In one embodiment, specifically: a latch 56 is installed in the middle of the front surface of the upper connecting seat 40. The latch 56 can lock the upper connecting seat 40 and the lower connecting seat 33 together after the clamp is closed, preventing the clamp from opening due to accidental circumstances during the test, and ensuring the safety and stability of the test.

[0053] Example 2

[0054] This embodiment provides a usage process for an adaptive height double-sided RF chip performance testing fixture:

[0055] The RF chip to be tested is accurately placed on the lower test seat 30 of the lower test assembly 2. The chip limiting frame 32 fixed on the outer side of the inner bottom wall of the lower test seat 30 can position the chip to ensure that the chip can be accurately placed in the test position, so that the test points on the chip correspond to the lower test probes 31 of the lower test seat 30, which prepares for subsequent good contact testing. The fixture is closed by rotating the upper connecting seat 40 along the pin 36. The relative positional relationship between the upper test assembly 1 and the RF chip is observed. If it is found that the initial spacing between the two is not appropriate, which may affect the accurate contact between the upper test probe 20 and the test points on the upper surface of the chip and the lower test probe 31 and the test points on the lower surface of the chip, then the height needs to be adjusted.

[0056] The height of the upper test component 1 is adjusted by rotating the adjustment knob 43 in the height adjustment component 4. Specifically, the adjustment knob 43 is fixedly connected to the threaded cylinder 42. When the adjustment knob 43 is rotated, the threaded cylinder 42 rotates in the threaded hole 41 of the upper connecting seat 40. Since the outer bottom of the threaded cylinder 42 is rotatably connected to the circular groove 50 of the adjustment seat 46, the rotation of the threaded cylinder 42 will drive the adjustment seat 46 to move up and down relative to the upper connecting seat 40. During the movement of the adjustment seat 46, the limiting sliding holes 47 at its four corners cooperate with the limiting sliding pins 45 that pass through the limiting sliding grooves 44 at the bottom of the upper connecting seat 40. The outer wall of the limiting sliding pin 45 slides in the limiting sliding hole 47 to ensure the directional stability of the movement of the adjustment seat 46. At the same time, the lower part of the outer wall of the limiting sliding pin 45 is fitted with The first spring 48 extends and retracts as the adjusting seat 46 moves, serving as a buffer and auxiliary positioning function. The limiting pins 51, which are fixedly connected to the front and rear sides of the lower surface of the adjusting seat 46, slide within the connecting holes 52 of the upper seat 10, further ensuring the smoothness of the movement of the adjusting seat 46. In addition, the upper limit holes 53 on the front and rear sides of the lower surface of the adjusting seat 46, the lower limit holes 54 on the front and rear sides of the upper surface of the upper seat 10, and the second spring 55 in between also play a certain limiting and buffering role during the height adjustment process, preventing over-adjustment or abnormal shaking. Continuously rotate the adjusting knob 43 until the upper test component 1 reaches a suitable height, so that the upper test probe 20 can accurately correspond to the test point on the upper surface of the chip and maintain good contact after the fixture is closed.

[0057] After height adjustment, the clamp is closed by rotating the upper connecting seat 40 along the pin 36, causing the upper test assembly 1 to move downwards and contact the chip placed on the lower test assembly 2. When the upper test seat 19 at the center of the lower surface of the upper seat 10 is pressed down with the upper test assembly 1, multiple upper test probes 20 provided at the center of the lower surface of the upper test seat 19 and the bottom of the second conductor connecting block 15 will contact the test points on the upper surface of the chip. During this contact process, the structure in the upper mounting groove 11 plays an adaptive role, and the first conductor connecting block 14 slidably connected in the upper limit groove 13 can adjust according to the chip. The flatness and height difference of the chip surface are adaptively adjusted within the groove. The second conductor connecting block 15 at the bottom center can accurately transmit the signal to the connected upper test probe 20. At the same time, the upper elastic conductive pad 16, which is attached to the inner wall of the upper connecting groove 12, will elastically deform according to the contact pressure and the chip surface. On the one hand, it ensures that the upper test probe 20 maintains good and stable contact with the test point on the chip surface through elastic force. On the other hand, it can adapt to the tilt or height difference that may exist on the chip surface, and avoid test errors caused by poor contact.

[0058] Meanwhile, the lower test base 30 on the upper surface of the lower base 21 maintains good contact with the test points on the lower surface of the chip through multiple lower test probes 31 set in the middle of its inner bottom wall and the top of the fourth conductor connecting block 26. The chip limiting frame 32 fixed on the outer side of the inner bottom wall of the lower test base 30 not only plays a positioning role when the chip is placed, but also helps to maintain the stability of the chip position during the test contact process, ensuring accurate contact between the lower test probes 31 and the test points on the lower surface of the chip. The structure in the lower mounting groove 22 also plays an adaptive role. The third conductor connecting block 25 can slide in the lower limiting groove 24 to adapt to the situation of the lower surface of the chip. The lower elastic conductive pad 27 will generate elastic deformation according to the contact pressure, ensuring good contact between the lower test probes 31 and the test points on the lower surface of the chip and signal transmission.

[0059] Once the upper and lower test components have made good contact with the chip, the lower test connectors 37 on both sides of the test housing 34 connected by the lower connector 33 and the upper test connectors 39 on both sides of the brackets 38 of the upper connector 40 can input test signals to the chip and receive signals fed back by the chip, thus officially starting the test of the RF chip performance. During the test, due to the special structural design of the upper and lower test components, even if the chip has certain flatness issues or substrate height differences, the accuracy and stability of the test can still be guaranteed, avoiding false tests caused by poor contact.

[0060] After the test is completed, the fixture is opened by rotating the upper connector 40 along the pin 36, and the tested chip is removed from the lower test holder 30, so that the next chip test process can be carried out. During the separation process, the upper elastic conductive pad 16 and the lower elastic conductive pad 27 will return to their initial state, thereby pushing the second conductor connecting block 15 and the fourth conductor connecting block to reset, preparing for the next test.

[0061] Through the above testing process, this adaptive height RF chip performance testing fixture can effectively solve the problems of alignment accuracy, loose tension, and adaptation to tilt and height difference encountered in the testing process of stacked double-sided chips, and achieve accurate and stable testing of RF chip performance.

[0062] The above description is merely a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this utility model, and these should all be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A height-adaptive double-sided RF chip performance testing fixture, characterized in that: It includes an upper test component (1) and a lower test component (2); The upper test assembly (1) includes an upper seat (10), an upper mounting groove (11), an upper connecting groove (12), an upper limit groove (13), a first conductor connecting block (14), a second conductor connecting block (15), an upper elastic conductive pad (16), and an upper limit frame (17). The upper mounting groove (11) is provided at the center of the upper surface of the upper seat (10). The upper connecting groove (12) is provided in the middle of the inner sidewall of the upper mounting groove (11). The upper limit groove (13) is provided in the front and rear of both sides of the inner bottom wall of the upper connecting groove (12). The first conductor connecting block (13) is slidably connected to the inner sidewall of the upper limit groove (13). Block (14), a second conductor connecting block (15) is provided at the bottom center of the first conductor connecting block (14), the bottom of the second conductor connecting block (15) penetrates through the center of the inner bottom wall of the upper limit groove (13), an upper elastic conductive pad (16) is attached to the inner side wall of the upper connecting groove (12), the outer side of the center of the upper surface of the first conductor connecting block (14) is attached to the lower surface of the upper elastic conductive pad (16), an upper limit frame (17) is fixedly connected to the inner bottom wall of the upper mounting groove (11), and the upper surface of the upper elastic conductive pad (16) is attached to the lower surface of the upper limit frame (17); The lower test assembly (2) includes a lower base (21), a lower mounting groove (22), a lower connecting groove (23), a lower limiting groove (24), a third conductor connecting block (25), a fourth conductor connecting block (26), a lower elastic conductive pad (27), and a lower limiting frame (28). The lower mounting groove (22) is provided at the center of the lower surface of the lower base (21). The lower connecting groove (23) is provided in the middle of the inner top wall of the lower mounting groove (22). The lower limiting groove (24) is provided at both the front and rear of the inner top wall of the lower connecting groove (23). The third conductor connecting block is slidably connected to the inner side wall of the lower limiting groove (24). (25) A fourth conductor connecting block (26) is provided at the top center of the third conductor connecting block (25). The top of the fourth conductor connecting block (26) penetrates the center of the inner top wall of the lower limiting groove (24). A lower elastic conductive pad (27) is attached to the inner side wall of the lower connecting groove (23). The outer side of the lower surface center of the third conductor connecting block (25) is attached to the upper surface of the lower elastic conductive pad (27). A lower limiting frame (28) is fixedly connected to the inner bottom wall of the lower mounting groove (22). The lower surface of the lower elastic conductive pad (27) is attached to the upper surface of the lower limiting frame (28).

2. The adaptive height double-sided RF chip performance testing fixture according to claim 1, characterized in that: An upper test groove (18) is provided at the center of the lower surface of the upper seat (10). An upper test seat (19) is fixedly connected to the inner wall of the upper test groove (18). The bottom of the second conductor connecting block (15) passes through the top of the upper test seat (19). Multiple upper test probes (20) are provided at the middle of the lower surface of the upper test seat (19) and the bottom of the second conductor connecting block (15).

3. The adaptive height double-sided RF chip performance testing fixture according to claim 1, characterized in that: The upper surface of the lower seat (21) is provided with a lower test groove (29), and the inner sidewall of the lower test groove (29) is fixedly connected to a lower test seat (30). The top of the fourth conductor connecting block (26) extends through the bottom of the lower test seat (30). Multiple lower test probes (31) are provided in the middle of the inner bottom wall of the lower test seat (30) and the top of the fourth conductor connecting block (26). A chip limiting frame (32) is fixedly connected to the outer side of the inner bottom wall of the lower test seat (30).

4. The adaptive height double-sided RF chip performance testing fixture according to claim 1, characterized in that: The upper test assembly (1) is provided with a height adjustment assembly (4) at its top; the height adjustment assembly (4) includes an upper connecting seat (40), a threaded hole (41), a threaded cylinder (42), an adjustment knob (43), a limiting slide groove (44), a limiting slide column (45), an adjustment seat (46), a limiting slide hole (47), a first spring (48), a limiting head (49), a circular groove (50), a limiting pin (51), and a connecting hole (52); A threaded hole (41) is provided at the center of the upper surface of the upper connecting seat (40). A threaded cylinder (42) is rotatably connected to the inner wall of the threaded hole (41). An adjusting knob (43) is fixedly connected to the top of the threaded cylinder (42). A limiting groove (44) is provided at the bottom of the upper connecting seat (40). A limiting slide post (45) is provided at each of the four corners of the inner top wall of the limiting groove (44). An adjusting seat (46) is slidably connected to the inner wall of the limiting groove (44). A limiting slide hole (47) is provided at each of the four corners of the upper surface of the adjusting seat (46). The outer wall of the limiting slide post (45) is slidably connected to the inner wall of the limiting slide hole (47). A first spring (48) is sleeved on the lower part of the outer wall of the limiting slide post (45). The top of the spring (48) is attached to the bottom of the adjusting seat (46) near the outside of the limiting slide hole (47). The bottom of the limiting slide (45) is welded with a limiting head (49). The bottom of the first spring (48) is attached to the upper surface of the limiting head (49) near the outside of the limiting slide (45). A circular groove (50) is provided at the center of the upper surface of the adjusting seat (46). The bottom of the outer side of the threaded cylinder (42) is rotatably connected to the inner side wall of the circular groove (50). Limiting pins (51) are fixedly connected to the front and rear sides of the lower surface of the adjusting seat (46). Connecting holes (52) are provided at the four corners of the upper surface of the upper seat (10). The outer side wall of the limiting pin (51) is slidably connected to the inner side wall of the connecting hole (52).

5. The adaptive height double-sided RF chip performance test fixture according to claim 4, characterized in that: The lower surface of the adjusting seat (46) is provided with upper limit holes (53) on both the front and rear sides. The upper surface of the upper seat (10) is provided with lower limit holes (54) on both the front and rear sides. The inner bottom wall of the lower limit hole (54) is fitted with a second spring (55), and the top of the second spring (55) is fitted with the inner top wall of the upper limit hole (53).

6. The adaptive height double-sided RF chip performance testing fixture according to claim 1, characterized in that: The lower seat (21) is fixedly connected to the outer side wall of the lower seat (21), and the test box (34) is fixedly connected to the bottom of the lower seat (33). The test box (34) is fixedly connected to the bottom of the base (35).

7. The adaptive height double-sided RF chip performance test fixture according to claim 6, characterized in that: The rear part of the upper surface of the lower connecting seat (33) is hinged to the rear part of the lower surface of the upper connecting seat (40) by a pin (36).

8. The adaptive height double-sided RF chip performance test fixture according to claim 6, characterized in that: The test chamber (34) is provided with lower test connectors (37) on both the front and rear sides.

9. The adaptive height double-sided RF chip performance test fixture according to claim 4, characterized in that: The upper connecting seat (40) is fixedly connected to two sides of a bracket (38), and upper test connectors (39) are provided on the front and rear sides of both sides of the bracket (38).

10. The adaptive height double-sided RF chip performance testing fixture according to claim 9, characterized in that: A latch (56) is installed in the middle of the front surface of the upper connecting seat (40).

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