Resistor element
By designing an insulating layer to isolate the resistor body and setting non-contact terminals in the resistor element, two independent resistor structures are formed, which solves the problem of low utilization rate of resistor elements on the circuit board, and realizes the reduction of circuit board area and miniaturization of electronic devices.
Patent Information
- Application Number
- CN202520134443.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-01-20
AI Technical Summary
How to improve the utilization rate of resistor components on circuit boards to reduce the area of the circuit boards and meet the miniaturization requirements of electronic devices.
Design a resistor element comprising a first resistor, a second resistor, a substrate, terminals, and an insulating layer. The resistor is isolated by the insulating layer, and non-contact terminals are provided at both ends of the resistor to form two independent resistor structures, thereby reducing the number of components on the circuit board.
By forming two independent resistor structures on the same resistor element, the number of resistor elements on the circuit board is reduced, the utilization rate of resistor element layout is improved, the circuit board design area is reduced, and the miniaturization of electronic products is facilitated.
Smart Images

Figure CN223871286U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of resistive element technology, and in particular to a resistive element. Background Technology
[0002] With the development of science and technology, most electronic devices are moving towards modular packaging and miniaturization. However, in practice, the volume of finished electronic devices needs to be designed based on the required area of the internal circuit board, which in turn needs to be designed based on the number of electronic components required. Generally speaking, most of the electronic components required on a circuit board are resistors. Therefore, how to reduce the number of resistors on a circuit board, improve the utilization rate of the circuit board layout, and thus reduce the area of the circuit board has become an urgent problem to be solved. Utility Model Content
[0003] This application proposes a resistor element to address the technical problem of how to improve the utilization rate of resistor elements on circuit boards.
[0004] To achieve the above objectives, embodiments of this application provide a resistive element, which includes: a first resistive body, a second resistive body, a substrate, a first terminal to a fourth terminal, a first insulating layer, and a second insulating layer;
[0005] The first resistive element covers the substrate;
[0006] The first insulating layer covers a first predetermined area on the first resistive body, and the first predetermined area is surrounded by a first electrode area;
[0007] The second resistive element covers a second predetermined area on the first insulating layer;
[0008] The second insulating layer covers the exposed area above the first preset area and the second preset area;
[0009] A second electrode region is provided above the first electrode region;
[0010] In the first direction, the two ends of the first electrode region and the second electrode region are used to respectively place the first terminal and the second terminal that are electrically connected to the first resistor;
[0011] In the second direction, the second electrode area is in contact with both ends of the second preset area. The first electrode area and the two ends of the second electrode area are used to place the third terminal and the fourth terminal, which are electrically connected to the second resistor, respectively. Neither the third terminal nor the fourth terminal is in contact with the first resistor.
[0012] In one embodiment, the resistive element further includes: a third insulating layer;
[0013] The third insulating layer covers the second insulating layer and fills the space in the first electrode area and the space in the second electrode area where the first terminal to the fourth terminal are not disposed.
[0014] In one embodiment, the relative heights of the first terminal to the fourth terminal are the same and are higher than or equal to the third insulating layer.
[0015] In one embodiment, the first resistor body is provided with a first through hole and a second through hole, the first through hole being disposed below the third terminal and the second through hole being disposed below the fourth terminal, and the first through hole and the second through hole being filled by the first insulating layer.
[0016] In one embodiment, the resistance values of the first resistor and the second resistor may be the same or different.
[0017] In one embodiment, the thickness of the first resistor and the second resistor may be the same or different, both falling within the range of 0.1 to 1000 μm.
[0018] In one embodiment, the first resistive element and the second resistive element may be made of the same or different materials.
[0019] In one embodiment, the first direction and the second direction are perpendicular to each other.
[0020] In one embodiment, both the first preset region and the second preset region are rectangles.
[0021] In one embodiment, the first preset region is disposed at the geometric center of the substrate, and the second preset region is disposed at the geometric center of the first preset region.
[0022] This application provides a resistive element comprising: a first resistive body, a second resistive body, a substrate, first to fourth terminals, a first insulating layer, and a second insulating layer; the first resistive body covers the substrate; the first insulating layer covers a first predetermined region on the first resistive body, and a first electrode region surrounds the first predetermined region; the second resistive body covers a second predetermined region on the first insulating layer; the second insulating layer covers an exposed region above the first and second predetermined regions; wherein, a second electrode region is provided above the first electrode region; in a first direction, the two ends of the first and second electrode regions are respectively used to place the first terminal and the second terminal electrically connected to the first resistive body; in a second direction, the two ends of the second electrode region are in contact with the second predetermined region, and the two ends of the first and second electrode regions are respectively used to place the third terminal and the fourth terminal electrically connected to the second resistive body, wherein neither the third terminal nor the fourth terminal is in contact with the first resistive body. A first insulating layer is placed between the first and second resistive elements for electrical isolation. A first terminal and a second terminal, which do not contact the second resistive element, are respectively established at both ends of the first resistive element. A third terminal and a fourth terminal, which also do not contact the first resistive element, are respectively established at both ends of the second resistive element. A substrate and a second insulating layer are then combined to form a protective layer on the outside of this structure. In the resistor element composed of the above structure, the first terminal, the first resistive element, and the second terminal form one resistor structure, while the third terminal, the second resistive element, and the fourth terminal form another resistor. That is, two resistor structures exist on the same resistor element, which can reduce the space reserved for components on the circuit board and improve the layout utilization rate of resistor elements. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of a structure of the resistor element according to the first embodiment of this application;
[0025] Figure 2 This is a schematic diagram of another structure of the resistor element in the first embodiment of this application;
[0026] Figure 3 This is a schematic diagram of a second embodiment of the resistive element of this application;
[0027] Figure 4This is a schematic diagram of another structure of the resistor element in the second embodiment of this application;
[0028] Figure 5 This is a top view used to represent the division of the region.
[0029] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0030] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0031] This application discloses a resistive element, with reference to... Figure 1 or Figure 2 The resistive element includes: a first resistive body R1, a second resistive body R2, a substrate base, a first terminal T1 to a fourth terminal T4, a first insulating layer IN1 and a second insulating layer IN2;
[0032] The first resistor R1 covers the substrate base;
[0033] The first insulating layer IN1 covers a first preset area on the first resistor R1, and the first preset area is surrounded by a first electrode area; the second resistor R2 covers a second preset area on the first insulating layer IN1.
[0034] The second insulating layer IN2 covers the exposed area above the first preset area and the second preset area;
[0035] A second electrode region is provided above the first electrode region;
[0036] In the first direction, the two ends of the first electrode region and the second electrode region are used to place the first terminal T1 and the second terminal T2, which are electrically connected to the first resistor R1, respectively.
[0037] In the second direction, the second electrode area is in contact with both ends of the second preset area. The first electrode area and the two ends of the second electrode area are used to place the third terminal T3 and the fourth terminal T4, which are electrically connected to the second resistor R2, respectively. Neither the third terminal T3 nor the fourth terminal T4 is in contact with the first resistor R1.
[0038] It should be understood that, in this embodiment, the dashed lines in the figure only represent the boundary lines of the structure of a certain area inside the resistive element, such as the boundary line between the second resistive element R2 and the first insulating layer IN1, to facilitate understanding of the structure.
[0039] It should be noted that, in this embodiment, the first resistor R1 and the second resistor R2 can be understood as two conductive resistors. The first resistor R1 has a fixed first resistance value between its two ends, and correspondingly, the second resistor R2 has a fixed second resistance value between its two ends. To prevent short circuits between the first resistor R1 and the second resistor R2, a first insulating layer IN1 can be provided between them for electrical isolation. The substrate base is attached to the lower surface of the first resistor R1, providing mechanical support and heat dissipation for the entire resistive element, and also serving to maintain electrical isolation from the outside and protect the first resistor R1 from wear. The second insulating layer IN2 can maintain electrical isolation between the second resistor R2 and the outside, and also protect the second resistor R2 from wear.
[0040] It is readily understood that, in this embodiment, to facilitate soldering of the resistive element, a first terminal T1, a second terminal T2, a third terminal T3, and a fourth terminal T4 may be provided. The first terminal T1 and the second terminal T2 are located above the first electrode region and the second electrode region on specific sides of the first resistive element R1, respectively, and are used to provide solder joints for the first resistive element R1. The third terminal T3 and the fourth terminal T4 are located within the first electrode region and the second electrode region connected to specific sides of the second resistive element R2, respectively, and are used to provide solder joints for the second resistive element R2.
[0041] In practical implementation, the substrate base is generally rectangular and can be set with two different directions to select the placement orientation of the substrate base. For example, the two longer opposite sides of the substrate base can be parallel to a first direction, while the two shorter opposite sides of the substrate base can be parallel to a second direction. A first resistor R1 can cover the upper surface of the substrate base, and a first insulating layer IN1 covers a first predetermined area in the middle of the upper surface of the first resistor R1. The first predetermined area is surrounded by a first electrode area, so the upper surfaces of the first resistor R1 at both ends in the first direction are in contact with the first electrode area. Furthermore, a second electrode area is provided above the first electrode area. The second predetermined area in the middle of the upper surface of the first predetermined area can be covered by a second resistor R2, with the outer sides of the second resistor R2 at both ends in the second direction in contact with the second electrode area. The upper surfaces of both the first and second predetermined areas are covered by a second insulating layer IN2. In this resistor element, a portion of the first electrode region in contact with the first resistor R1 and a portion of the second electrode region above it are respectively provided with a first terminal T1 and a second terminal T2; a portion of the second electrode region in contact with the second resistor R2 and a portion of the first electrode region below it are provided with a third terminal T3 and a fourth terminal T4. Thus, in the resistor element formed above, there is one solderable resistor structure in the first direction (first terminal T1 - first resistor R1 - second terminal T2), and also one solderable resistor structure in the second direction (third terminal T3 - second resistor R2 - fourth terminal T4), meaning that there are two solderable resistor structures on the same resistor element.
[0042] It is worth noting that, for some more detailed descriptions, see [link to relevant documentation]. Figure 1 or Figure 2 As shown in the relative positions, the lower surfaces of the first terminal T1 and the second terminal T2 can contact the first resistor R1, thereby electrically connecting them. To further improve the reliability of the first terminal T1 and the second terminal T2 and prevent them from falling off, in the first direction, the upper half of the inner surface of the first terminal T1 is fixed to one side of the second insulating layer IN2, and the lower half of the inner surface of the first terminal T2 is fixed to one side of the first insulating layer IN1 (on the same side as the second insulating layer IN2); correspondingly, in the first direction, the upper half of the inner surface of the second terminal T1 is fixed to the other side of the second insulating layer IN2, and the lower half of the inner surface of the first terminal T2 is fixed to the other side of the first insulating layer IN1 (on the same side as the second insulating layer IN2).
[0043] Similarly, to further improve the reliability of the third terminal T3 and the fourth terminal T4 and prevent them from falling off, in the second direction, the upper half of the inner surface of the third terminal T3 is fixed to one side of the second insulating layer IN2 and in contact with one side of the second resistor R2, and the lower half of the inner surface of the third terminal T3 is fixed to one side of the first insulating layer IN1 (on the same side as the second insulating layer IN2 and the second resistor R2); correspondingly, in the second direction, the upper half of the inner surface of the fourth terminal T4 is fixed to the other side of the second insulating layer IN2 and in contact with the other side of the second resistor R2, and the lower half of the inner surface of the fourth terminal T4 is fixed to the other side of the first insulating layer IN1 (on the same side as the second insulating layer IN2 and the second resistor R2).
[0044] Neither the third terminal T3 nor the fourth terminal T4 is in contact with the first resistor R1 below, and they can be filled with an insulator (e.g., Figure 1 The situation shown is as follows: Figure 1 In the example, the third terminal T3 and the first resistor R1 are filled by the first insulator IN1. Alternatively, the third terminal T3 or the fourth terminal T4 can be left floating between the third terminal T3 and the first resistor R1 (e.g., Figure 2 In the case of (such as in the case of contact between the two), or other settings that can achieve non-contact between the two. This ensures that in the entire resistive element, the first terminal T1 and the second terminal T2 form an independent resistive structure only with the first resistive body R1, while the third terminal T3 and the fourth terminal T4 form another independent resistive structure only with the second resistive body R2, and there is no electrical interference between the two.
[0045] It is worth noting that, Figure 2 This is just one example of a floating configuration, where a section below the third terminal T3 is left floating. In practice, a portion of the first resistor R1 can also be left floating. It should not be assumed that this embodiment only protects against situations like this. Figure 2 The specific situation is shown.
[0046] In summary, each time this type of resistor is used for soldering on a circuit board, one less resistor soldering position can be required on the board. Reducing the number of resistors needed improves the utilization rate of resistor layout on the circuit board, significantly reducing the design area of the circuit board and facilitating the miniaturization of electronic products.
[0047] This application provides a resistive element comprising: a first resistive body, a second resistive body, a substrate, first to fourth terminals, a first insulating layer, and a second insulating layer; the first resistive body covers the substrate; the first insulating layer covers a first predetermined region on the first resistive body, and the first predetermined region surrounds a first electrode region; the second resistive body covers a second predetermined region on the first insulating layer; the second insulating layer covers an exposed region above the first and second predetermined regions; wherein, a second electrode region is provided above the first electrode region; in a first direction, the two ends of the first and second electrode regions are respectively used to place the first terminal and the second terminal electrically connected to the first resistive body; in a second direction, the two ends of the second electrode region are in contact with the two ends of the second predetermined region, and the two ends of the first and second electrode regions are respectively used to place the third terminal and the fourth terminal electrically connected to the second resistive body. A first insulating layer is placed between the first and second resistive elements for electrical isolation. A first terminal and a second terminal, which do not contact the second resistive element, are respectively established at both ends of the first resistive element. A third terminal and a fourth terminal, which also do not contact the first resistive element, are respectively established at both ends of the second resistive element. A substrate and a second insulating layer are then combined to form a protective layer on the outside of this structure. In the resistor element composed of the above structure, the first terminal, the first resistive element, and the second terminal form one resistor structure, while the third terminal, the second resistive element, and the fourth terminal form another resistor. That is, two resistor structures exist on the same resistor element, which can reduce the space reserved for components on the circuit board and improve the layout utilization rate of resistor elements.
[0048] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to that in Embodiment 1 above can be referred to the above description, and will not be repeated hereafter. Based on this, please refer to... Figure 3 or Figure 4 The resistive element further includes: a third insulating layer IN3;
[0049] The third insulating layer IN3 covers the second insulating layer IN2 and fills the space in the first electrode area and the second electrode area where the first terminal T1 to the fourth terminal T4 are not disposed.
[0050] It should be noted that, in this embodiment, to further protect the internal electrical structure of the resistive element, a third insulating layer IN3 can be provided above the second insulating layer IN2. Furthermore, the third insulating layer IN3 can fill the space between the first terminal T1 and the fourth terminal T4 (partial areas of the first electrode region and the second electrode region) to further protect the first resistive element R1 and the second resistive element R2, preventing them from direct contact with the outside. It can be considered that the third insulating layer IN3 in the figure encloses the second insulating layer IN2; therefore, the dashed lines inside the figure can represent the enclosed second insulating layer IN2 and the second resistive element R2 enclosed by the second insulating layer IN2.
[0051] It is worth noting that the third insulating layer IN3 can also be used to make silkscreen to indicate information such as the model number of the resistor element, making it convenient for users.
[0052] Furthermore, in this embodiment, the relative heights of the first terminal T1 to the fourth terminal T4 are the same, and are higher than or equal to the third insulating layer IN3.
[0053] It is easy to understand that, in this embodiment, to facilitate the soldering of the resistive elements, the tops of the first terminal T1, the second terminal T2, the third terminal T3, and the fourth terminal T4 should be at the same height relative to the substrate base, or within a very small margin of error. Furthermore, each relative height must be at least no lower than the third insulating layer IN3, reducing soldering difficulty and decreasing the defect rate during the customer's soldering process (reflow soldering).
[0054] Furthermore, in this embodiment, the first resistor R1 is provided with a first through hole and a second through hole. The first through hole is located below the third terminal T3, and the second through hole is located below the fourth terminal T4. The first through hole and the second through hole are filled by the first insulating layer IN1.
[0055] It should be understood that, Figure 3 as well as Figure 4 The image only shows the relative position of the first through hole, not the relative position of the second through hole. The shapes of the first and second through holes can be cubes.
[0056] It is easy to understand that in this embodiment, the first resistor R1 also has a first through hole and a second through hole. The first through hole can be located below the third terminal T3, and the second through hole can be located below the fourth terminal T4. This increases the distance between the third terminal T3 and the fourth terminal T4 and the first resistor R1. Furthermore, both the first and second through holes can be filled with an insulating layer, such as any one of the first insulating layer IN1, the second insulating layer IN2, or the third insulating layer IN3. This allows the third terminal T3 to be fixed to the insulating layer filled with the first through hole below, further improving the reliability of the third terminal T3, making it more difficult to detach. The situation for the fourth terminal T4 is similar and will not be described further. Simultaneously, since the third terminal T3 and the fourth terminal T4 are isolated by the insulating layer and do not contact the first resistor R1, electrical interference between the connection circuit formed by "first terminal T1 - first resistor R1 - second terminal T2" and the connection circuit formed by "third terminal T3 - second resistor R2 - fourth terminal T4" can be effectively reduced.
[0057] In specific implementation, only the arrangement between the first through hole and the third terminal T3 will be used as an example, such as... Figure 3 As shown, the top view cross-section of the first through hole should be larger than the top view cross-section of the third terminal T3, and the three sides of the top view cross-section of the first through hole that intersect with the first resistor R1 are all extended outward by a certain distance relative to the corresponding three sides of the top view cross-section of the third terminal T3, thereby ensuring that the bottom surfaces of the third terminal T3 do not contact the first resistor R1. As another specific case, such as... Figure 4 As shown, in Figure 3 Based on this, the outer side of the third terminal T3 is also recessed by a certain distance, making the probability of the third terminal T3 coming into contact with the outside less, further reducing the possibility of the third terminal T3 falling off due to external force, and thus improving reliability. The relationship between the second through hole and the fourth terminal T3 is similar to the two cases mentioned above, and will not be repeated.
[0058] Furthermore, in this embodiment, the resistance values of the first resistor R1 and the second resistor R2 may be the same or different.
[0059] It is easy to understand that the resistance of the first resistor R1 between the first terminal T1 and the second terminal T2 is a first resistance value, and the resistance of the second resistor R2 between the third terminal T3 and the fourth terminal T4 is a second resistance value. In this embodiment, the first resistance value and the second resistance value can be the same or different, and no specific limitation is made here.
[0060] Furthermore, in this embodiment, the thickness of the first resistor R1 and the second resistor R2 may be the same or different, both falling within the range of 0.1 to 1000 μm.
[0061] It is easy to understand that both the first resistor R1 and the second resistor R2 must have a certain thickness, with the thickness of the first resistor R1 being the first thickness and the thickness of the second resistor R2 being the second thickness. In this embodiment, the first thickness and the second thickness can be the same or different, and no specific limitation is made here.
[0062] It is worth noting that since the first resistor R1 and the second resistor R2 are both located within the same resistive element cluster, the thickness of both resistor R1 and resistor R2 cannot be too thick and must be kept within a certain range to minimize the volume of the resistive element. In this embodiment, both the first and second thicknesses can be within the range of 0.1 to 1000 μm.
[0063] Furthermore, in this embodiment, the first resistor R1 and the second resistor R2 may be made of the same or different materials.
[0064] It is easy to understand that the first resistor R1 and the second resistor R2 can be made of the same conductive material or different conductive materials, and no specific limitation is made here.
[0065] Furthermore, in this embodiment, the first direction and the second direction are perpendicular to each other.
[0066] As is readily understood, in this embodiment, in order to keep the first terminal T1, the second terminal T2, the third terminal T3, and the fourth terminal T4 as far apart as possible, the first direction and the second direction mentioned above can be perpendicular directions, so that the distance between the first terminal T1, the second terminal T2, the third terminal T3, and the fourth terminal T4 can be kept as large as possible and can be equal.
[0067] Furthermore, in this embodiment, both the first preset area and the second preset area are rectangles.
[0068] It is easy to understand that the reference Figure 3 Since the substrate base is generally rectangular, the first resistor R1 covering the substrate base is also generally rectangular. To facilitate the subsequent design of the first insulating layer IN1, the second resistive layer, etc., and to simplify the manufacturing process, the first preset area and the second preset area can also be designed as rectangular.
[0069] Furthermore, in this embodiment, the first preset region is disposed at the geometric center of the substrate base, and the second preset region is disposed at the geometric center of the first preset region.
[0070] It is easy to understand that the reference Figure 3In this embodiment, to make the resistive element easier to solder, the first terminal T1 and the second terminal T2 need to be as symmetrical as possible, and the third terminal T3 and the fourth terminal T4 need to be as symmetrical as possible. Therefore, in the design, the first preset region where the first insulating layer IN1, which defines the second resistive element R2, is located is preferably placed in the geometric center region above the substrate base (first resistive element R1), and the corresponding second preset region can also preferably be placed in the geometric center region above the first preset region (first insulating layer IN1).
[0071] The above are merely preferred embodiments of this application and do not limit the scope of this patent application. Any equivalent structural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A resistive element, characterized in that, The resistive element includes: a first resistive body, a second resistive body, a substrate, a first terminal to a fourth terminal, a first insulating layer, and a second insulating layer; The first resistive element covers the substrate; The first insulating layer covers a first predetermined area on the first resistive body, and the first predetermined area is surrounded by a first electrode area; The second resistive element covers a second predetermined area on the first insulating layer; The second insulating layer covers the exposed area above the first preset area and the second preset area; A second electrode region is provided above the first electrode region; In the first direction, the two ends of the first electrode region and the second electrode region are used to respectively place the first terminal and the second terminal that are electrically connected to the first resistor; In the second direction, the second electrode area is in contact with both ends of the second preset area. The first electrode area and the two ends of the second electrode area are used to place the third terminal and the fourth terminal, which are electrically connected to the second resistor, respectively. Neither the third terminal nor the fourth terminal is in contact with the first resistor.
2. The resistive element as described in claim 1, characterized in that, The resistive element further includes: a third insulating layer; The third insulating layer covers the second insulating layer and fills the space in the first electrode area and the space in the second electrode area where the first terminal to the fourth terminal are not disposed.
3. The resistive element as described in claim 2, characterized in that, The relative heights of the first terminal to the fourth terminal are the same, and are higher than or equal to the third insulating layer.
4. The resistive element as described in claim 1, characterized in that, The first resistor body has a first through hole and a second through hole. The first through hole is located below the third terminal, and the second through hole is located below the fourth terminal. The first through hole and the second through hole are filled by the first insulating layer.
5. The resistive element as described in claim 1, characterized in that, The resistance values of the first resistor and the second resistor may be the same or different.
6. The resistive element as described in claim 1, characterized in that, The thickness of the first resistor and the second resistor may be the same or different, both falling within the range of 0.1 to 1000 μm.
7. The resistive element as claimed in claim 1, characterized in that, The first resistive element and the second resistive element may be made of the same or different materials.
8. The resistive element as claimed in claim 1, characterized in that, The first direction and the second direction are perpendicular to each other.
9. The resistive element as claimed in claim 1, characterized in that, Both the first preset area and the second preset area are rectangles.
10. The resistive element as claimed in claim 1, characterized in that, The first preset region is located at the geometric center of the substrate, and the second preset region is located at the geometric center of the first preset region.