Pulse power supply
By designing heat dissipation channels and optimizing module layout in the pulse power supply, the problems of large size and low heat dissipation efficiency of traditional pulse power supplies have been solved, achieving miniaturization, efficient heat dissipation and high-precision output, and improving the stability and compatibility of the power supply.
Patent Information
- Application Number
- CN202520331931.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-27
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-02-27
AI Technical Summary
Traditional pulse power supplies are bulky, have low heat dissipation efficiency, large output current ripple, low accuracy, and lack regulation capability, making it difficult to meet the high-precision, low-ripple requirements of low-current scenarios.
A structure was designed that houses the heat sink and power module inside the enclosure. It utilizes heat dissipation channels and fans for efficient heat dissipation, and combines aluminum or copper heat sinks and fin structures to optimize the module layout and improve heat dissipation efficiency and stability.
It achieves miniaturization and efficient heat dissipation, improves the stability and reliability of the power supply, meets the requirements of high-precision and low-ripple output, and enhances the versatility and compatibility of the power supply.
Smart Images
Figure CN223872195U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of pulse power supply technology, and specifically to a pulse power supply. Background Technology
[0002] Traditional pulse power supplies suffer from problems such as large size, inconvenient installation, complex system due to water cooling and increased energy consumption, as well as large output current ripple, low accuracy and lack of regulation capability.
[0003] With the advancement of technology, the requirements for current and voltage accuracy, size, and heat dissipation performance have increased, especially in low-current scenarios where high-precision, low-ripple, and high-speed pulse power supplies are needed. In fields such as wafer pulse electroplating, TGV copper plating processes, and pulse technology research experiments, conventional pulse power supplies are unable to meet the accuracy and ripple requirements.
[0004] Therefore, it is urgent to develop pulse power supplies that are small in size, have high heat dissipation efficiency, and high-precision output. Utility Model Content
[0005] In view of this, the present invention provides a pulse power supply to solve the problems of large size and low heat dissipation efficiency of existing pulse power supplies.
[0006] In a first aspect, this utility model provides a pulse power supply, comprising:
[0007] The enclosure has an air inlet and an air outlet that are positioned opposite each other;
[0008] A radiator is installed inside the housing. The radiator has a top plate and side plates located on both sides of the top plate. A heat dissipation channel is formed between the bottom of the top plate and the side plates. One end of the heat dissipation channel is opposite to the air inlet, and the other end of the heat dissipation channel is opposite to the air outlet.
[0009] The power module is housed inside the enclosure and connected to the side panel of the radiator.
[0010] The power module is housed inside the enclosure and connected to the top plate of the radiator.
[0011] This utility model's technical solution has the following advantages: the air inlets and outlets positioned opposite each other on the enclosure form a good ventilation path, which, together with the heat sink, effectively dissipates heat from inside the enclosure, ensuring the pulse power supply operates at a suitable temperature and improving its stability and reliability. Specifically, the heat sink inside the enclosure has a certain height and width, providing sufficient installation space for the power modules and power modules, resulting in a more rational layout and avoiding mutual interference between modules. The suitable height and width allow the heat sink to better accommodate power modules and power modules of different specifications, improving the versatility and compatibility of the pulse power supply. The method of installing power modules on the side panels and power modules on the top panel helps to achieve layered heat transfer and dissipation, improving heat dissipation efficiency.
[0012] Optionally, it also includes a cooling fan, disposed at the inlet and / or outlet of the heat dissipation channel. The power module and the power supply module are respectively connected to the side plate and top plate of the heat sink, which can quickly transfer the heat generated during operation to the heat sink to achieve efficient heat dissipation.
[0013] Optionally, the cooling fans are housed within a fan housing, and multiple cooling fans are spaced apart along the length of the fan housing. The arrangement of the cooling fans enhances airflow within the heat dissipation channels, further improving the heat dissipation effect. The multiple cooling fans spaced apart along the length of the fan housing generate airflow more evenly, ensuring uniform heat dissipation.
[0014] Optionally, the fan box is disposed within the enclosure. This placement makes the overall structure more compact and reduces external interference. Furthermore, the fan box isolates the cooling fan from the interior of the enclosure. This isolation ensures the enclosure's internal seal, preventing dust and impurities from entering the enclosure through the fan and ensuring the safe operation of the electrical components inside the enclosure.
[0015] Optionally, it also includes a controller connected to the enclosure for centralized control and monitoring of pulse power supply parameters, performance, and fans.
[0016] Optionally, the heat sink is made of aluminum. Using aluminum for the heat sink provides good thermal conductivity, light weight, and low cost.
[0017] Optionally, the power modules are arranged in at least two groups side-by-side on the top plate. Arranging at least two groups of power modules side-by-side on the top plate improves the power supply's output capacity and operating efficiency.
[0018] Optionally, a temperature sensor is provided between the two sets of power modules. This temperature sensor allows for real-time monitoring of the power module temperature, facilitating timely temperature control measures to prevent overheating damage.
[0019] Optionally, the power modules are arranged in two sets, symmetrically on both side plates of the heat sink. The symmetrical arrangement of the power modules on both side plates of the heat sink results in more uniform heat dissipation and a more balanced and stable structure.
[0020] Optionally, the radiator has at least two finned plates with fins facing each other. By arranging at least two finned plates with their fins facing each other, the heat dissipation area and air contact area are increased, significantly improving heat dissipation performance. Attached Figure Description
[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0022] Figure 1 This is a perspective view of a pulse power supply according to an embodiment of the present utility model;
[0023] Figure 2 for Figure 1 A rear-view perspective 3D view of the pulse power supply shown;
[0024] Figure 3 for Figure 1 The diagram shows a 3D view of the internal structure of the enclosure after the pulse power supply is concealed.
[0025] Figure 4 for Figure 3 A three-dimensional view from the rear view angle;
[0026] Figure 5 A 3D view of the radiator;
[0027] Figure 6 for Figure 5 A three-dimensional view of a single finned plate in the heat sink shown.
[0028] Explanation of reference numerals in the attached figures:
[0029] 1. Cabinet; 2. Air inlet; 3. Air outlet; 4. Heat sink; 5. Heat dissipation channel; 6. Power module; 7. Power module; 8. Cooling fan; 9. Fan box; 10. Controller; 11. Temperature sensor; 12. Fin plate. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0031] like Figure 1-4 The diagram illustrates a specific implementation of the pulse power supply provided in this embodiment, comprising: a housing 1, within which a heat sink 4, a power module 6, and a power module 7 are disposed. The housing 1 has an air inlet 2 and an air outlet 3 arranged opposite each other. These oppositely arranged air inlets 2 and 3 form an effective air convection channel, promoting air exchange between the inside and outside of the housing 1, improving heat dissipation efficiency, ensuring that the equipment inside the housing 1 operates in a suitable temperature environment, and extending the service life of the equipment. The clearly defined and relative air inlet and outlet directions make airflow more regular, reducing turbulence and localized heat accumulation, and improving the uniformity and stability of the heat dissipation effect.
[0032] like Figure 3 , Figure 4 As shown, the radiator 4 is installed inside the housing 1. The radiator 4 has a top plate and side plates located on both sides of the top plate. A heat dissipation channel 5 is formed between the bottom of the top plate and the side plates. One end of the heat dissipation channel 5 is opposite to the air inlet 2, and the other end of the heat dissipation channel 5 is opposite to the air outlet 3. By installing the radiator 4 inside the housing 1, the internal space of the housing 1 is fully utilized, making the overall structure more compact and reducing additional space occupation. The heat dissipation channel 5 formed by the bottom of the top plate and the side plates provides a clear path for airflow, allowing cool air to enter the heat dissipation channel 5 from the air inlet 2, fully absorb heat, and then be discharged from the air outlet 3, improving the efficiency and effect of heat dissipation. The two ends of the heat dissipation channel 5 are opposite to the air inlet 2 and the air outlet 3, respectively, ensuring smooth airflow, reducing airflow resistance and turbulence, and enhancing the stability and reliability of heat dissipation. This structure helps to achieve uniform heat dissipation, avoid local overheating, and improve the stability and reliability of the entire pulse power supply system.
[0033] like Figure 3 , Figure 4As shown, the power module 6 is disposed inside the housing 1 and connected to the side plate of the heat sink 4, while the power module 7 is disposed inside the housing 1 and connected to the top plate of the heat sink 4. Connecting the power module 6 to the side plate of the heat sink 4 and the power module 7 to the top plate utilizes the different surfaces of the heat sink 4, improving space utilization and making the internal structure of the housing 1 more compact. The heat generated by the power module 6 and the power module 7 during operation can be quickly transferred to the heat sink 4. The direct contact between the side plate and the top plate and the heat sink 4 facilitates efficient heat conduction, thereby effectively reducing the operating temperature of the modules and ensuring their stable and reliable operation. Installing different modules on the side plate and the top plate respectively helps to achieve zoned heat conduction and dissipation, avoiding heat concentration and further optimizing the heat dissipation effect.
[0034] like Figure 3 As shown, this embodiment also includes a cooling fan 8, which is located at the inlet of the heat dissipation channel 5. The cooling fan 8 actively draws in cool air from the outside into the heat dissipation channel 5, increasing the amount and velocity of cool air entering the channel and improving heat dissipation efficiency. This helps to create positive pressure within the heat dissipation channel 5, allowing cool air to flow more evenly across the radiator 4, reducing localized heat buildup and improving the overall uniformity of heat dissipation. Furthermore, being installed at the inlet minimizes the thermal impact on the fan, which helps extend its lifespan and maintain stable performance.
[0035] Of course, the above description is not limiting. In some alternative embodiments, the cooling fan 8 may also be located at the outlet of the heat dissipation channel 5.
[0036] like Figure 1 , Figure 3 As shown, in this embodiment, the cooling fans 8 are disposed within the fan housing 9, and multiple cooling fans 8 are spaced apart along the length of the fan housing 9. Disposing of the cooling fans 8 within the fan housing 9 protects the fans, reducing the impact of dust and debris, and also makes the fan installation more stable. The spaced arrangement of multiple cooling fans 8 along the length of the fan housing 9 generates a stronger and more uniform airflow, increasing the airflow speed and volume within the heat dissipation channel 5, thus enhancing the heat dissipation effect. The spaced arrangement avoids mutual interference between fans, ensuring that each fan can operate normally, and improving the stability and reliability of the fan system.
[0037] like Figure 1 , Figure 3As shown, in this embodiment, the fan box 9 is disposed inside the housing 1, making the entire cooling fan 8 system an integrated part inside the housing 1, saving external space and making the overall structure more compact and aesthetically pleasing. This prevents the fan box 9 from being exposed to the outside of the housing 1 and subjected to collisions or damage, improving the safety and stability of the fan system. Being located inside the housing 1 helps reduce the corrosion of the fan box 9 and the fan by external dust, moisture, etc., extending the fan's service life.
[0038] like Figure 3 As shown, this embodiment also includes a controller 10, which is connected to the housing 1. This shortens the wiring between the controller 10 and components such as the power module 6, power module 7, and fan, reducing signal transmission loss and interference, and improving the accuracy and timeliness of control over the power module 6, power module 7, and fan. This connection method allows the controller 10 and the fan to form a relatively tight combination, facilitating overall installation, debugging, and maintenance. It also saves the space occupied by the controller 10 alone within the housing 1, optimizing the internal layout of the housing 1.
[0039] It should be noted that in this embodiment, the heat sink 4 is made of aluminum. Aluminum has excellent thermal conductivity, which can quickly conduct the heat generated by the power module 6 and the power module 7 away, improving heat dissipation efficiency and ensuring the normal operating temperature of the equipment. Aluminum is lightweight, and using aluminum to make the heat sink 4 helps to reduce the weight of the entire pulse power supply, facilitating the installation and relocation of the equipment. Aluminum has good corrosion resistance, and is not easily corroded by environmental factors during long-term use, extending the service life of the heat sink 4. Aluminum is relatively inexpensive, allowing for control of production costs while meeting heat dissipation requirements.
[0040] Of course, the above description is not limiting. In some alternative embodiments, the heat sink 4 can be made of copper, which has better thermal conductivity than aluminum, but is relatively more expensive. Alternatively, some new thermally conductive composite materials, such as aluminum-based silicon carbide, can be used to improve heat dissipation performance.
[0041] like Figure 4 As shown in this embodiment, the power modules 7 are arranged in at least two groups side-by-side on the top plate. This improves the output power and operating efficiency of the pulse power supply, meeting the needs of applications requiring higher power. The side-by-side arrangement facilitates independent control and monitoring of each group of power modules 7; if one group fails, the others can continue to operate, improving the system's reliability and stability. It also helps to evenly distribute the heat generated by the power modules 7, avoiding localized overheating, thereby improving heat dissipation and ensuring the normal operation of the equipment.
[0042] like Figure 4As shown in this embodiment, a temperature sensor 11 is installed between the two sets of power modules 7. This sensor can accurately monitor the temperature changes of the power modules 7 during operation, providing timely temperature feedback so that appropriate heat dissipation measures can be taken or the operating status adjusted. Because it is located between the two sets of power modules 7, the measured temperature better reflects the overall average temperature of the power modules 7, avoiding the limitations of single-point measurement and improving the accuracy and reliability of temperature monitoring. This helps to detect potential overheating problems in advance, prevent equipment failure and damage caused by excessive temperature, and extend the service life of the equipment.
[0043] like Figure 4 As shown, in this embodiment, the power module 6 has two sets, symmetrically arranged on both side plates of the heat sink 4. This makes the weight distribution on both sides of the heat sink 4 more uniform, improving the stability and balance of the entire device. The symmetrical layout helps to evenly conduct heat on the heat sink 4, avoiding local overheating and thus improving the overall heat dissipation efficiency of the heat sink 4. It also facilitates unified wiring and management of the two sets of power modules 6, reducing wiring clutter and intersections, and improving the reliability and maintainability of the circuit.
[0044] Of course, the above description is not limiting. In some alternative embodiments, the power module 6 can adopt an asymmetrical layout, flexibly arranged according to the heat distribution characteristics of the heat sink 4 or the space constraints inside the enclosure 1. Two sets of power modules 6 can be placed on different side panels, but heat dissipation is ensured through a reasonable heat-conducting structure. The mounting angle or height of the power module 6 on the side panel can be changed to adapt to special installation requirements or optimize the heat dissipation airflow.
[0045] like Figure 5 , Figure 6 As shown, in this embodiment, the radiator 4 has at least two finned plates 12 with fins arranged opposite each other. By arranging the fins on the at least two finned plates 12 opposite each other, the contact area between the air and the fins is increased, improving heat exchange efficiency and thus enhancing the heat dissipation capacity of the radiator 4. The oppositely arranged fins form a relatively narrow airflow channel, which can guide air to flow through the fins more concentratedly and quickly, accelerating heat dissipation. This structure helps to distribute and transfer heat more evenly within the radiator 4, avoiding localized overheating and improving the overall heat dissipation performance and stability of the radiator 4.
[0046] Specifically, such as Figure 5 , Figure 6As shown, in this embodiment, the radiator 4 is constructed by fins on four finned plates 12 arranged in pairs facing each other. This pairwise arrangement of the four finned plates 12 greatly increases the contact area between the radiator 4 and the air, significantly improving heat exchange efficiency and thus achieving more efficient heat dissipation. The opposing fins form complex airflow channels, generating more turbulence within the radiator 4, enhancing the heat transfer between the air and the fins, and further optimizing heat dissipation performance. This structure improves the stability and strength of the radiator 4, enabling it to better withstand external vibrations and impacts, ensuring the reliability of the radiator 4 during operation.
[0047] Of course, the above description is not limiting. In some alternative embodiments, the number of finned plates 12 can be changed, such as increasing to six or decreasing to two, depending on actual heat dissipation requirements and space constraints. The relative angle of the fins can be varied, for example, no longer being completely parallel but facing each other at a certain angle, to change airflow and heat exchange characteristics. The shape of the fins can be changed from the common flat plate shape to corrugated, serrated, etc., to increase surface area and turbulence effect.
[0048] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and all such modifications and variations fall within the scope of the present invention.
Claims
1. A pulse power supply, characterized in that, include: The housing (1) has an air inlet (2) and an air outlet (3) arranged opposite to each other; A radiator (4) is installed inside the housing (1). The radiator (4) has a top plate and side plates located on both sides of the top plate. A heat dissipation channel (5) is formed between the bottom of the top plate and the side plates. One end of the heat dissipation channel (5) is opposite to the air inlet (2), and the other end of the heat dissipation channel (5) is opposite to the air outlet (3). The power module (6) is installed inside the housing (1) and connected to the side plate of the heat sink (4); The power module (7) is disposed inside the housing (1) and connected to the top plate of the radiator (4).
2. The pulse power supply according to claim 1, characterized in that, Also includes: A cooling fan (8) is provided at the inlet and / or outlet of the heat dissipation channel (5).
3. The pulse power supply according to claim 2, characterized in that, The cooling fan (8) is disposed inside the fan box (9), and multiple cooling fans (8) are disposed at intervals along the length of the fan box (9) inside the fan box (9).
4. The pulse power supply according to claim 3, characterized in that, The fan box (9) is located inside the housing (1).
5. The pulse power supply according to claim 1, characterized in that, Also includes: The controller (10) is connected to the housing (1).
6. The pulse power supply according to any one of claims 1-5, characterized in that, The heat sink (4) is made of aluminum.
7. The pulse power supply according to any one of claims 1-5, characterized in that, The power modules (7) have at least two sets arranged side by side on the top plate.
8. The pulse power supply according to claim 7, characterized in that, A temperature sensor (11) is provided between the two sets of power modules (7).
9. The pulse power supply according to any one of claims 1-5, characterized in that, The power module (6) has two sets, which are symmetrically arranged on both sides of the heat sink (4).
10. The pulse power supply according to any one of claims 1-5, characterized in that, The radiator (4) has at least two finned plates (12) with fins arranged opposite each other.