Circuit board and electronic equipment

Abstract

The utility model provides a circuit board and electronic equipment. The circuit board comprises a substrate and a bonding pad, the bonding pad is fixed to the substrate, the first surface, away from the substrate, of the bonding pad comprises a first interval part, the first interval part protrudes or sinks relative to the first surface, and the first interval part extends in the first direction and divides the first surface into a first area and a second area in the second direction; wherein the second direction is perpendicular to the first direction; the bonding pad is used for being in welding conduction with a pin of one component through the first area, or the bonding pad is used for being in welding conduction with a pin of another component through the first area and the second area. According to the circuit board, the first spacing part is arranged on the bonding pad, and the first surface is divided into the first region and the second region by using the first spacing part, so that the circuit board can be conducted with components of the same type and different specifications through different regions, the compatibility of the circuit board is improved, and the reliability of the circuit board is improved. And the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, specifically to a circuit board and an electronic device. Background Technology

[0002] Circuit boards achieve electrical connection with various components through solder pads on the substrate. The area of ​​the solder pads is usually matched with the lead area of ​​the component to ensure the soldering quality between the pads and leads. However, components of the same type may exist in different specifications, and it is difficult for the solder pads to be compatible with the soldering of components of different specifications, thus affecting the user experience. Utility Model Content

[0003] This application provides a circuit board and an electronic device, wherein a first surface is divided into a first region and a second region by a first spacer, so that the pads can be soldered and connected to the pins of components of the same type but different specifications through the first region and the second region, thereby improving the compatibility of the circuit board and enhancing the user experience.

[0004] In a first aspect, this application provides a circuit board, which includes a substrate and pads. The pads are fixed to the substrate, and a first spacer portion is included on a first surface away from the substrate. The first spacer portion is raised or recessed relative to the first surface. The first spacer portion extends along a first direction and divides the first surface into a first region and a second region along a second direction; wherein the second direction is perpendicular to the first direction.

[0005] The pad is used to solder to the pins of one component via a first region, or the pad is used to solder to the pins of another component via a first region and a second region.

[0006] The circuit board provided in this application has pads on a substrate, which are used to enable the pins of components to conduct to the substrate. The circuit board also has a first spacer on the pads, which divides the first surface of the pads into a first region and a second region. The pads achieve soldering conduction with the pins of a component of one specification through the first region, or with the pins of a component of another specification through the first and second regions.

[0007] In this circuit, when the pad is soldered to the component through the first region, the first gap also limits the flow range of the solder paste applied to the first region during soldering, thereby ensuring the soldering quality between the pad and the component. That is, the circuit board provided in this application, by setting a first region and a second region on the first surface of the pad, facilitates soldering and connection between the pad and the pins of components of the same type but different specifications, while ensuring the soldering quality between the pad and the component. This improves the compatibility of the circuit board and enhances the user experience.

[0008] In one implementation, the first spacer is recessed relative to the first surface, and the depth of the first spacer is less than the thickness of the pad.

[0009] In this implementation, the first spacing portion is used to connect the pads in the first region and the pads in the second region, so as to ensure the area of ​​electrical connection between the pads and the pins when the pads are soldered to the component pins through the first region and the second region. This ensures the soldering quality between the circuit board and the components in this application.

[0010] In one implementation, the length of the first spacing portion along the first direction is less than the length of the pad.

[0011] In this implementation, the first spacing portion extends toward the sidewall of the pad along a first direction. Along the first direction, at least one end of the first spacing portion has a gap with the sidewall of the pad. This gap is used to connect the pads in the first region and the pads in the second region, ensuring the area of ​​electrical connection between the pad and the pin when the pad is soldered to the component pin through the first and second regions. This ensures the soldering quality between the circuit board and the components in this application.

[0012] In one implementation, the width of the first interval is greater than or equal to 0.2 mm along the second direction.

[0013] In this implementation, the first spacer is recessed relative to the first surface to ensure that the first spacer can absorb the solder paste flowing into it when the pads are soldered to the components through the first area. This prevents solder paste from overflowing into the second area and causing the pins to be pulled off course by the solder paste. The first spacer, with a width greater than or equal to 0.2 mm, ensures that it can absorb the solder paste during the soldering process, further reducing the impact of the solder paste on the pins. This ensures the soldering quality when the circuit board is connected to the components, improving the user experience.

[0014] In one implementation, the first spacer protrudes relative to the first surface, and the height of the first spacer relative to the first surface is greater than or equal to 0.08 mm and less than or equal to 0.1 mm.

[0015] In this implementation, the first spacer protrudes relative to the first surface to restrict the flow range of solder paste during the soldering process. The height of the first spacer is between 0.08mm and 0.1mm. This avoids poor soldering between the pin and the pad when the pad passes through the first and second regions to make contact with the component due to an excessively high first spacer. Conversely, it avoids poor blocking effect of the first spacer when the pad passes through the first region to make contact with the component due to an excessively low first spacer, which could lead to component misalignment. This ensures the soldering quality when the circuit board is connected to the components, improving the user experience.

[0016] In one implementation, the first surface further includes a second spacer portion located within the first region and protruding or recessed relative to the first surface. The second spacer portion extends along a second direction and divides the first region into a first sub-region and a second sub-region along the first direction. The pad is used to solder and conduct to the pin of a component through the first sub-region of the first region.

[0017] In this implementation, the second spacer protrudes or recesses relative to the first surface so that when the pad is soldered to the component through the first sub-region, the first spacer and the second spacer cooperate to limit the flow range of the solder paste, thereby ensuring the soldering quality of the circuit board and the component in this application.

[0018] In one implementation, the second spacer is recessed relative to the first surface, and the depth of the second spacer is less than the thickness of the pad.

[0019] In this implementation, the second spacing portion is used to connect the pads in the first sub-region and the pads in the second sub-region, so as to ensure the area of ​​electrical connection between the pads and the pins when the pads are soldered to the component pins through the first and second regions. This ensures the soldering quality between the circuit board and the components in this application.

[0020] In one implementation, the length of the second spacing portion along the second direction is less than the length of the pad.

[0021] In this implementation, the second spacing portion extends toward the sidewall of the pad along a second direction. Along the second direction, at least one end of the second spacing portion has a gap with the sidewall of the pad. This gap is used to connect the pads in the first sub-region and the pads in the second sub-region, ensuring the area of ​​electrical connection between the pad and the pin when the pad is soldered to the component pin through the first and second regions. This ensures the soldering quality between the circuit board and the components in this application.

[0022] In one implementation, the first surface further includes a third spacer portion located within the first region and protruding or recessed relative to the first surface. The third spacer portion extends along a first direction and divides the first region into a third sub-region and a fourth sub-region along a second direction. The third sub-region is located between the fourth sub-region and the second region. The pad is used for soldering and connecting to the pins of another component through the second region and the third sub-region.

[0023] In this implementation, the pad is used to solder and connect to the pin of one component via a third and fourth sub-region, or the pad is used to solder and connect to the pin of another component via a third sub-region of a second and first region. When the pad is connected to the pin via the third and fourth sub-regions, the first spacing portion restricts the flow range of solder paste during soldering, ensuring the soldering quality between the pad and the pin. When the pad is connected to the pin via the second and third sub-regions, the third spacing portion restricts the flow range of solder paste during soldering, ensuring the soldering quality between the pad and the pin.

[0024] In one implementation, the third spacer is recessed relative to the first surface, and the depth of the third spacer is less than the thickness of the pad.

[0025] In this implementation, the third spacing portion is used to connect the pads in the third sub-region and the pads in the fourth sub-region, so as to ensure the area of ​​electrical connection between the pads and the pins when the pads are soldered to the component pins through the third sub-region and the second region. This ensures the soldering quality between the circuit board and the components in this application.

[0026] In one implementation, the length of the third spacer along the first direction is less than the length of the pad.

[0027] In this implementation, the third spacing portion extends towards the sidewall of the pad along the second direction. Along the second direction, at least one end of the third spacing portion has a gap with the sidewall of the pad. This gap is used to connect the pads in the third sub-region and the pads in the fourth sub-region, ensuring the area of ​​electrical connection between the pad and the pin when the pad is soldered to the component pin through the third and fourth sub-regions. This ensures the soldering quality between the circuit board and the component in this application.

[0028] In one implementation, there are multiple pads, each fixed at intervals on the substrate, and the first regions of each pad that are used to solder and conduct to the same component are close to each other.

[0029] In this implementation, the two first regions of two adjacent pads along the second direction are close to each other, and the two first regions are located between the two first gaps of the two pads. When the pads of the circuit board of this application are soldered and connected to the components through the first regions, the two first gaps can, based on their own limiting effect on the flow range of solder paste, prevent the leads of the components from being pulled off to opposite sides of the components along the second direction under the action of the solder paste, thereby ensuring the soldering quality between the circuit board of this application and the components.

[0030] Secondly, this application provides an electronic device, which includes a housing, components, and a circuit board. The circuit board and components are housed within the housing, and the pins of the components are soldered to the pads of the circuit board for electrical connection.

[0031] In one implementation, the pin is used to solder and conduct to the pad through a first area of ​​the pad, and along the thickness direction of the circuit board, the projection of the pin on the pad contacts the first gap of the pad.

[0032] In this implementation, solder paste needs to be applied to the contact area between the pins and the pads when the components are soldered to the circuit board. The projection of the pins on the pads contacts the first spacing portion to reduce the distance between the pins and the first spacing portion, ensuring that any overflowing solder paste can be contained or blocked by the first spacing portion. This ensures the soldering quality of the circuit board to the components in this application.

[0033] In one implementation, the pin is used to solder and conduct to the pad through a first region and a second region of the pad, and the projection of the pin on the pad along the thickness direction of the circuit board at least covers a first gap of the pad.

[0034] In this implementation, the pin is used to cover the first gap to ensure that the pad can achieve soldering and conduction with the pin through the first region and the second region.

[0035] The electronic device of this application includes a circuit board provided by any of the above implementations, which uses a first spacing portion on the pads to form a first region and a second region, so as to facilitate communication with components of the same type but different sizes using different regions. This improves compatibility and enhances the user experience. Attached Figure Description

[0036] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0037] Figure 1 This is a schematic diagram of the structure of the electronic device provided in one embodiment of the present application;

[0038] Figure 2 Another structural schematic diagram of the electronic device provided in one embodiment of this application;

[0039] Figure 3 This is a schematic diagram of the circuit board provided in one embodiment of the present application;

[0040] Figure 4 A partially enlarged structural schematic diagram of the circuit board provided in one embodiment of this application;

[0041] Figure 5 A cross-sectional structural schematic diagram of the electronic device provided in one embodiment of this application;

[0042] Figure 6 Another cross-sectional structural schematic diagram of the electronic device provided in one embodiment of this application;

[0043] Figure 7 This is a cross-sectional structural schematic diagram of the electronic device provided in one embodiment of the present application;

[0044] Figure 8 This is a cross-sectional structural schematic diagram of the electronic device provided in one embodiment of the present application;

[0045] Figure 9 This is a cross-sectional structural diagram of the circuit board provided in an embodiment of this application;

[0046] Figure 10 This is a top view of the circuit board provided in an embodiment of this application;

[0047] Figure 11 This is another cross-sectional view of the circuit board provided in an embodiment of this application;

[0048] Figure 12 This is another top view of the circuit board provided in an embodiment of this application;

[0049] Figure 13 This is another cross-sectional structural schematic diagram of the circuit board provided in the embodiment of this application;

[0050] Figure 14 This is a schematic diagram of the structure of the electronic device provided in one embodiment of the present application in another embodiment;

[0051] Figure 15 This is a schematic diagram of the circuit board provided in one embodiment of the present application in another embodiment;

[0052] Figure 16A schematic diagram of the structure of the electronic device provided in another embodiment of this application;

[0053] Figure 17 This is a schematic diagram of the circuit board provided in one embodiment of the present application in yet another embodiment;

[0054] Figure 18 This is another top view of the circuit board provided in an embodiment of this application;

[0055] Figure 19 This is another top view of the circuit board provided in an embodiment of this application;

[0056] Figure 20 This is a schematic diagram of the circuit board structure provided in the embodiments of this application;

[0057] Figure 21 This is another schematic diagram of the circuit board structure provided in an embodiment of this application;

[0058] Figure 22 This is another schematic diagram of the circuit board provided in an embodiment of this application;

[0059] Figure 23 This is another schematic diagram of the circuit board structure provided in the embodiments of this application;

[0060] Figure 24 A schematic diagram of the structure of the electronic device provided in another embodiment of this application;

[0061] Figure 25 This is a schematic diagram of the structure of the circuit board provided in another embodiment of the present application;

[0062] Figure 26 This is a top view of the circuit board provided in an embodiment of this application;

[0063] Figure 27 This is a schematic diagram of the external structure of the electronic device provided in the embodiments of this application;

[0064] Figure 28 This is another schematic diagram of the external structure of the electronic device provided in the embodiments of this application;

[0065] Figure 29 This is another top view of the circuit board provided in an embodiment of this application;

[0066] Figure 30 This is another schematic diagram of the external structure of the electronic device provided in the embodiments of this application;

[0067] Figure 31 Another top view schematic diagram of the circuit board provided in the embodiment of this application;

[0068] Figure 32 This is another schematic diagram of the external structure of the electronic device provided in the embodiments of this application;

[0069] Figure 33 This is another top view schematic diagram of the circuit board provided in the embodiment of this application. Detailed Implementation

[0070] The technical solutions of the embodiments of this application will now be described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0071] The electronic device of this application includes a housing and a circuit board 100. The housing houses and protects the circuit board 100. The circuit board 100 processes received instructions and controls the modules of the electronic device to perform corresponding functions based on the instructions. In the embodiments of this application, the electronic device provided is one of a computer, mobile phone, tablet, or wearable device.

[0072] The electronic device of this application also includes multiple components 201, each component 201 being used to implement different functions of the electronic device. The housing is also used to house and protect each component 201. Each component 201 is mounted on a circuit board 100 and electrically connected to other electronic devices through the circuit board 100 to realize one or more functions of the electronic device. The pins 2011 of each component 201 are used for soldering and making contact with the pads 20 of the circuit board 100.

[0073] For each solder pad 20 of a component 201 that is soldered to be conductive, the solder pad 20 can be used to be compatible with two components 201 of the same type but different specifications. That is, the solder pad 20 is used to solder to be conductive with either of the two types of components 201. Specifically, for the components 201 involved in the various embodiments of this application, there are two different specifications, namely a first component 201a and a second component 201b. Among them, the size of the pins 2011 of the first component 201a and the second component 201b, and / or the spacing of the pins 2011 of the first component 201a and the second component 201b are different. For example, when the component 201 is a crystal oscillator, the specification of the first component 201a adopts the consumer electronics standard, and the specification of the second component 201b adopts the automotive standard.

[0074] For example, such as Figure 1 and Figure 2As shown, the area of ​​the pin 2011 of the first component 201a is smaller than the area of ​​the pin 2011 of the second component 201b, and the spacing between the two pins 2011 on opposite sides of the first component 201a is smaller than the spacing between the two pins 2011 on opposite sides of the second component 201b.

[0075] exist Figure 1 and Figure 2 In the schematic diagram shown, pins 2011 of the first component 201a and pins 2011 of the second component 201b can both be soldered to the pads 20 of the circuit board 100 for electrical connection. That is, the pads 20 of the circuit board 100 are used to accommodate the first component 201a and the second component 201b with different specifications.

[0076] For details, please refer to the following: Figure 3 and Figure 4 ,in Figure 3 This is a schematic diagram of the structure of the circuit board 100 provided in one embodiment of the present application. Figure 4 This is a partially enlarged structural schematic diagram of the circuit board 100 provided in one embodiment of the present application.

[0077] like Figure 3 and Figure 4 As shown, the circuit board 100 provided in this application includes a substrate 10 and pads 20. The pads 20 are fixed on the substrate 10, and components 201 mounted on the circuit board 100 are electrically connected to other components 201 through the pads 20. Specifically, the pads 20 are used to solder and connect to the pins 2011 of the components 201. The pads 20 include a first surface 21 facing away from the substrate 10. The first surface 21 includes a first spacer 30 extending along a first direction 001 and dividing the first surface 21 into a first region 221 and a second region 222 along a second direction 002. The first direction 001 and the second direction 002 are perpendicular to each other.

[0078] When the circuit board 100 of this application carries the first component 201a, such as Figure 1 and Figure 4 As shown, the pad 20 is soldered to the pin 2011 of the first component 201a through the first region 221. That is, when the component 201 selected by the circuit board 100 of this application is the first component 201a, the pin 2011 of the first component 201a is soldered together with the first region 221 of the pad 20 to achieve soldering connection between the pin 2011 of the first component 201a and the pad 20.

[0079] Specifically, during the soldering process between the first component 201a and the pad 20, solder paste 202 needs to be applied to the first area 221 of the pad 20 first. After the pin 2011 contacts the pad 20 through the solder paste 202, the circuit board 100 and the component 201 are placed in a reflow oven. The high temperature of the reflow oven melts the solder paste 202, which then wets the pin 2011 and the pad 20 due to its fluidity. Finally, the solder paste 202 is cooled and solidified to achieve soldering conductivity between the pin 2011 and the pad 20. The solder paste 202 is fluid under high temperature; in the reflow oven, it flows within a certain range along the plane of the first surface 21. During cooling, the solder paste 202 shrinks in size due to thermal expansion and contraction. Solder paste 202 outside the pin 2011 and the pad 20 may pull the pin 2011 off-center along the plane of the first surface 21. That is, when the pin 2011 of the component 201 selected by the circuit board 100 of this application only partially contacts the pad 20, the pin 2011 will be pulled off-center during the soldering process between the pin 2011 and the pad 20.

[0080] In this embodiment, the first spacer 30 protrudes or recesses relative to the first surface 21, and the first spacer 30 is used to limit the flow range of the solder paste 202. Specifically, when the first spacer 30 protrudes relative to the first surface 21, during the soldering process between the first component 201a and the pad 20, after the solder paste 202 in the reflow oven melts, the first spacer 30 can block the molten solder paste 202 from flowing along the second direction 002, thereby reducing the amount of solder paste 202 located outside the first region 221 and the pin 2011. When the first spacer 30 is recessed relative to the first surface 21, during the soldering process between the first component 201a and the pad 20, after the solder paste 202 in the reflow oven melts, the first spacer 30 can contain the melted solder paste 202 overflowing outward, so as to space the solder paste 202 flowing outside the pin 2011 from the solder paste 202 located between the pin 2011 and the first region 221, thereby reducing the impact of the solder paste 202 flowing outside the pin 2011 on the soldering of the pin 2011.

[0081] That is, by providing a first spacing portion 30, and making the first spacing portion 30 protrude or recess relative to the first surface 21, when the circuit board 100 of this application is soldered and connected to the pin 2011 of the first component 201a through the first area 221 of the pad 20, the first spacing portion 30 can limit the flow range of the solder paste 202 applied in the first area 221 during soldering, so as to avoid the phenomenon that the solder paste 202 located outside the pin 2011 and the pad 20 causes the pin 2011 to be pulled off course during the soldering process, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered and connected to the first component 201a.

[0082] In one embodiment, such as Figure 1 As shown, the pin 2011 of the first component 201a is used to solder and conduct to the pad 20 through the first region 221 of the pad 20. Along the thickness direction of the circuit board 100, the projection of the pin 2011 on the pad 20 contacts the first spacing portion 30 of the pad 20.

[0083] For details, please refer to the following: Figure 5 and Figure 6 ,in Figure 5 This is a cross-sectional structural diagram of the electronic device provided in one embodiment of this application. Figure 6 This is a schematic cross-sectional view of the electronic device provided in one embodiment of the present application.

[0084] like Figure 5 As shown, when the first spacer 30 protrudes relative to the first surface 21, the pin 2011 and the first spacer 30 are in contact with each other along the planar direction of the circuit board 100. Figure 6 As shown, when the first spacing portion 30 is recessed relative to the first surface 21, the projection of the pin 2011 on the pad 20 contacts the groove wall of the first spacing portion 30.

[0085] Understandably, the projection of the pin 2011 of the first component 201a onto the pad 20 contacts the first spacer 30 to reduce the distance between the pin 2011 and the first spacer 30, ensuring that any overflowing solder paste 202 can be contained or blocked by the first spacer 30. This ensures the soldering quality of the first component 201a on the circuit board 100 of this application.

[0086] In this embodiment of the application, when the circuit board 100 carries the second component 201b, such as Figure 2 and Figure 4 As shown, the pad 20 is soldered to the pin 2011 of the second component 201b through the first region 221 and the second region 222. That is, when the component 201 selected by the circuit board 100 of this application is the second component 201b, the pin 2011 of the second component 201b is soldered together with the first region 221 and the second region 222 of the pad 20 to achieve soldering connection between the pin 2011 of the second component 201b and the pad 20.

[0087] Specifically, during the soldering process between the second component 201b and the pad 20, solder paste 202 needs to be applied to the first region 221 and the second region 222 of the pad 20. After the pin 2011 contacts the pad 20 through the solder paste 202, the circuit board 100 and the component 201 are placed in a reflow oven. The high temperature of the reflow oven melts the solder paste 202, which then wets the pin 2011 and the pad 20 due to its fluidity. Finally, the solder paste 202 is cooled and solidified to achieve soldering conductivity between the pin 2011 and the pad 20. The solder paste 202 is fluid under high temperature; in the reflow oven, it flows along the plane of the first surface 21 beyond the pad 20. When too much solder paste 202 flows beyond the pad 20, it may cause the solder paste 202 to conduct with other components 201, resulting in solder bridging.

[0088] In this embodiment, the first spacer 30 protrudes or recesses relative to the first surface 21, and the first spacer 30 is used to limit the flow range of the solder paste 202. Specifically, when the first spacer 30 protrudes relative to the first surface 21, during the soldering process between the second component 201b and the pad 20, after the solder paste 202 in the reflow oven melts, the first spacer 30 can block the molten solder paste 202 from flowing along the second direction 002, thereby slowing down the speed at which the solder paste 202 flows out of the pad 20, thereby reducing the amount of solder paste 202 flowing out of the pad 20 and reducing the risk of solder bridging. When the first spacer 30 is recessed relative to the first surface 21, during the soldering process between the first component 201a and the pad 20, after the solder paste 202 in the reflow oven melts, the first spacer 30 can contain a portion of the flowing solder paste 202 to reduce the amount of solder paste 202 between the pin 2011 and the first surface 21, thereby reducing the amount of solder paste 202 flowing outside the pad 20 and reducing the risk of solder bridging.

[0089] That is, by providing a first spacing portion 30, and making the first spacing portion 30 protrude or recess relative to the first surface 21, when the circuit board 100 of this application is soldered and connected to the pin 2011 of the second component 201b through the first region 221 and the second region 222 of the solder pad 20, the first spacing portion 30 can limit the flow range of the solder paste 202 applied in the first region 221 and the second region 222 during soldering, so as to avoid the phenomenon of solder bridging during the soldering process, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered and connected to the second component 201b.

[0090] In one embodiment, along the thickness direction of the circuit board 100, the ratio between the contact area of ​​the pin 2011 of the first component 201a and the pad 20 and the area of ​​the pin 2011 of the first component 201a facing the surface of the substrate 10 is greater than or equal to 0.65, so as to ensure the welding reliability between the pin 2011 of the first component 201a and the pad 20.

[0091] In one embodiment, the pin 2011 of the second component 201b is used to solder and conduct to the pad 20 through the first region 221 and the second region 222 of the pad 20. Along the thickness direction of the circuit board 100, the projection of the pin 2011 on the pad 20 at least covers the first spacing portion 30 of the pad 20.

[0092] Please refer to the above. Figure 7 and Figure 8 ,in Figure 7 This is a schematic cross-sectional view of the electronic device provided in one embodiment of the present application. Figure 8 This is a cross-sectional structural schematic diagram of the electronic device provided in one embodiment of the present application.

[0093] like Figure 7 As shown, when the first spacer 30 protrudes relative to the first surface 21, the pins 2011 of the second component 201b are attached to the surface of the first spacer 30 facing away from the first surface 21. A gap is maintained between the pins 2011 of the second component 201b and the first surface 21 along the thickness direction of the substrate 10 to allow for the filling of solder paste 202. Figure 8 As shown, when the first spacer 30 is recessed relative to the first surface 21, the pin 2011 of the second component 201b is attached to the first surface 21 by solder paste 202.

[0094] In this embodiment, the projection of pin 2011 onto pad 20 covers the first spacing portion 30 to ensure the contact area between pin 2011 of the second component 201b and pad 20. This prevents pad 20 from shrinking its size to accommodate the first component 201a, which could lead to misalignment or poor soldering between pin 2011 of the second component 201b and pad 20 when accommodating pin 2011 of the second component 201b. In other words, the circuit board 100 achieves soldering continuity with pin 2011 of the second component 201b through the first region 221 and the second region 222 of pad 20, ensuring the soldering area between the second component 201b and pad 20 and guaranteeing the soldering quality of the second component 201b by the circuit board 100.

[0095] exist Figure 2In the schematic diagram shown, the surface area of ​​the pin 2011 of the second component 201b facing the pad 20 is greater than or equal to the area of ​​the first surface 21 of the pad 20. This ensures that the pin 2011 of the second component 201b can completely cover the pad 20, preventing the solder paste 202 located outside the pin 2011 and pad 20 from being pulled off-center due to the small size of the pin 2011. This guarantees the soldering quality of the second component 201b on the circuit board 100 of this application.

[0096] Therefore, the circuit board 100 of this application divides the first surface 21 of the pad 20 into a first region 221 and a second region 222 by providing a first spacing portion 30 on the pad 20. This allows the pad 20 to achieve soldering and conduction with the pins 2011 of components 201 of different specifications through the first region 221 and the second region 222, and ensures the soldering quality between the pins 2011 of the component 201 and the pad 20 during the soldering process. This improves the compatibility of the circuit board 100 of this application and enhances the user experience.

[0097] It is worth mentioning that, in Figures 1-4 In the illustration, the positions of the first region 221 and the second region 222 are for reference only. In actual use, the pin 2011 of the first component 201a is soldered to the pad 20 through a region of the pad 20, and the region of the pad 20 used for soldering to the first component 201a is the first region 221.

[0098] In one embodiment, along the thickness direction of the circuit board 100, the ratio between the contact area of ​​the pin 2011 of the second component 201b and the pad 20 and the area of ​​the pin 2011 of the second component 201b facing the surface of the substrate 10 is greater than or equal to 0.65, so as to ensure the soldering reliability between the pin 2011 of the second component 201b and the pad 20.

[0099] In one embodiment, the first spacer 30 is recessed relative to the first surface 21, and the depth of the first spacer 30 is less than the thickness of the pad 20.

[0100] Please refer to the above. Figure 9 The diagram shows a cross-sectional view of the circuit board 100 provided in this embodiment of the application.

[0101] like Figure 9As shown, the first spacing portion 30 is also used to connect the pads 20 in the first region 221 and the pads 20 in the second region 222. The pads 20 in the first region 221 and the pads 20 in the second region 222 of the circuit board 100 are both connected to external circuits through traces within the substrate 10, ensuring that when the circuit board 100 carries the first component 201a, the first component 201a can be connected to external circuits through the pads 20. It is understood that the recess depth of the first spacing portion 30 relative to the first surface 21 is less than the thickness of the pads 20, so that the pads 20 in the first region 221 and the pads 20 in the second region 222 are interconnected, thereby reducing the trace size between the pads 20 and the substrate 10. That is, the interconnection between the pads 20 in the first region 221 and the pads 20 in the second region 222 simplifies the trace arrangement between the substrate 10 and the pads 20, reducing the manufacturing difficulty of the circuit board 100.

[0102] When the circuit board 100 of this application carries the second component 201b, the pins 2011 of the second component 201b are electrically connected to the pads 20 in the first region 221 and the second region 222. At this time, the contact area between the pins 2011 of the second component 201b and the first surface 21 is the area of ​​the electrical connection between the pins 2011 and the pads 20. It can be understood that the mutual conductivity between the pads 20 in the first region 221 and the pads 20 in the second region 222 avoids the phenomenon that only a single region being conductive would affect the area of ​​the electrical connection between the pins 2011 and the pads 20, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered to the component 201.

[0103] In one embodiment, the length L1 of the first spacing portion 30 along the first direction 001 is less than the length L2 of the first pad of the pad 20.

[0104] Please refer to the above. Figure 10 and Figure 11 ,in Figure 10 This is a top view of the circuit board 100 provided in an embodiment of this application. Figure 11 This is another cross-sectional view of the circuit board 100 provided in an embodiment of this application.

[0105] like Figure 10 and Figure 11As shown, the first spacing portion 30 is recessed relative to the first surface 21 and extends through the pad 20 along its thickness direction. The length L1 of the first spacing portion is less than the length L2 of the first pad, so that there is a gap between one end of the first spacing portion 30 along the first direction 001 and the sidewall 23 of the pad 20. This gap is used to conduct the connection between the pads in the first region 221 and the pads in the second region 222. On the one hand, this simplifies the routing between the substrate 10 and the pad 20, reducing the manufacturing difficulty of the circuit board 100 of this application. On the other hand, it avoids the phenomenon that only a single region is conductive, affecting the area of ​​the electrical connection between the pin 2011 and the pad 20, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered to the component 201.

[0106] In this embodiment, the first spacer 30 exposes the surface of the substrate 10 where the pads 20 are located. When the circuit board 100 carries the component 201, the first surface 21 of the pad 20 is coated with solder paste 202, and the pins 2011 of the component 201 are in contact with the solder paste 202 to facilitate soldering and connection between the pins 2011 and the pad 20. During the soldering process, the flux in the solder paste 202 forms gas at high temperature. This gas can enter between the substrate 10 and the pad 20 through the first spacer 30 and escape outward through the gap between the substrate 10 and the pad 20.

[0107] That is, the first spacer 30 also provides a channel for the flux in the solder paste 202 to escape, preventing the gas formed by the high temperature of the flux from escaping directly from between the pin 2011 and the pad 20, thereby affecting the soldering quality between the pin 2011 and the pad 20. This ensures the soldering quality of the circuit board 100 to the components 201 in this application.

[0108] exist Figure 10 In the illustrated embodiment, the two sidewalls 23 of the pad 20 arranged along the second direction 002 are both first sidewalls 231, and the two first sidewalls 231 are arranged on opposite sides of the first spacing portion 30, wherein one end of the first spacing portion 30 is spaced apart from the two first sidewalls 231. In another embodiment, as shown Figure 12 As shown, along the first direction 001, one end of the first spacing portion 30 is connected to a first sidewall 231, and the other end of the first spacing portion 30 is spaced apart from another first sidewall 231.

[0109] In one embodiment, along the second direction 002, the first width dimension D1 of the first spacing portion 30 is greater than or equal to 0.2 mm. The first spacing portion 30 is recessed relative to the first surface 21. When the width dimension D1 of the first spacing portion 30 is less than 0.2 mm, and the circuit board 100 of this application is equipped with the first component 201a, the solder paste 202 after high temperature melting will fill the first spacing portion 30 and overflow onto the surface of the pad 20 in the second region 222. At this time, when the pins 2011 of the first component 201a and the pad 20 are cooled, the solder paste 202 flowing into the second region 222 can pull the pins 2011 of the first component 201a to shift along the second direction 002 based on its own thermal expansion and contraction effect, thereby causing the pins 2011 of the first component 201a to be pulled off-center.

[0110] Therefore, when the first spacer 30 is recessed relative to the first surface 21, the first width dimension D1 of the first spacer 30 is limited to be greater than or equal to 0.2 mm. This ensures that the first spacer 30 can absorb the solder paste 202 flowing into the first spacer 30, prevents the solder paste 202 from overflowing into the second area 222, reduces the impact of the solder paste 202 on the pins 2011, ensures the soldering quality when the circuit board 100 is connected to the first component 201a, and improves the user experience.

[0111] In one embodiment, the first spacer portion 30 protrudes relative to the first surface 21, and the height H of the first spacer portion 30 relative to the first surface 21 is greater than or equal to 0.08 mm and less than or equal to 0.1 mm.

[0112] Please refer to the above. Figure 13 The diagram shows another cross-sectional view of the circuit board 100 provided in this embodiment of the application.

[0113] like Figure 13As shown, the first spacing portion 30 protrudes relative to the first surface 21. When the height H of the first spacing portion 30 relative to the first surface 21 is too high, and the circuit board 100 of this application is equipped with the second component 201b, the distance between the pin 2011 of the second component 201b and the first surface 21 of the pad 20 is too high. During the soldering process between the pin 2011 of the second component 201b and the pad 20, the solder paste 202 located between the pin 2011 and the first surface 21 may melt and flow directly outside the pin 2011, resulting in insufficient solder paste content in contact with the pin 2011, which may lead to poor soldering between the pin 2011 and the pad 20. When the height H of the first spacing portion 30 relative to the first surface 21 is too low, and the circuit board 100 of this application is equipped with the first component 201a, the blocking effect of the first spacing portion 30 on the solder paste 202 is reduced. The solder paste 202 may be molten at high temperature and cover the first spacer 30, thereby causing the first component 201a to be pulled off-center by the solder paste 202 during the cooling process.

[0114] Therefore, by limiting the height H of the first spacing portion 30 relative to the first surface 21 to between 0.08mm and 0.1mm, the soldering quality between the pins 2011 of the first component 201a and the second component 201b and the pad 20 can be guaranteed when the circuit board 100 of this application is soldered and connected with the first component 201a and the second component 201b, thereby improving the user experience.

[0115] In one embodiment, the first spacer 30 protrudes relative to the first surface 21, and the material used for the first spacer 30 will not chemically react with the solder paste 202. In another embodiment, the first spacer 30 protrudes relative to the first surface 21, and the material used for the first spacer 30 will not be wetted by the solder paste 202. Exemplarily, in one embodiment, the material of the first spacer 30 is a green oil bridge structure formed by preparing ink. In another embodiment, the material of the first spacer 30 is the same as the material of the pad 20.

[0116] In one embodiment, such as Figure 4 As shown, the first surface 21 of the pad 20 is rectangular in shape. The pad 20 extends along its own length direction on the surface of the substrate 10. The extension direction of the pad 20 is parallel to the first direction 001. When the first component 201 is mounted on the circuit board 100 of this application, the contact area between the projection of the pin 2011 of the first component 201 on the pad 20 and the first spacing portion 30 is increased. This ensures that the first spacing portion 30 restricts the flow range of the solder paste 202, ensures the soldering quality of the first component 201 on the circuit board 100 of this application, and improves the user experience.

[0117] In another embodiment, such as Figure 14 and Figure 15 As shown, the first surface 21 of the pad 20 is rectangular in shape. The pad 20 extends along its length on the surface of the substrate 10. The angle α between the extension direction of the pad 20 and the first direction 001 is greater than or equal to 40° and less than or equal to 50°. When the circuit board 100 of this application mounts the first component 201, the projection of the pin 2011 of the first component 201 on the pad 20 needs to contact the first spacing portion 30. The first spacing portion 30 is inclined relative to the extension direction of the pad 20. When the circuit board 100 of this application mounts the first component 201, the pin 2011 of the first component 201 is soldered to the pad 20 of the first region 221. At this time, there are gaps between the pin 2011 and the first spacing portion 30 along the extension direction of the pad 20 and perpendicular to the extension direction of the pad 20. During the soldering process, the solder paste 202 between the pad 20 and the pin 2011 can also flow toward the first spacer 30 along the extension direction of the pad 20 and perpendicular to the extension direction of the pad 20.

[0118] Understandably, the greater the distance between the pin 2011 and the first spacer 30, the more difficult it is for the molten solder paste 202 to flow to the first spacer 30. Correspondingly, the first spacer 30 has a smaller blocking effect on this portion of the solder paste 202. The circuit board 100 of this application controls the angle range between 40° and 50° to reduce the difference in gap area between the pin 2011 and the first spacer 30 in different directions. This ensures that the blocking effect of the first spacer 30 on the solder paste 202 in different directions is relatively consistent, thereby avoiding misalignment caused by uneven force on the pin 2011. This ensures the soldering quality of the first component 201 by the circuit board 100 of this application.

[0119] It is worth mentioning that, Figure 14 and Figure 15 The illustrations shown are for illustrative purposes only. In an embodiment where the first spacer 30 is inclined relative to the extending direction of the pad 20, while defining the angle between the first direction 001 and the extending direction of the pad 20, it is also necessary to ensure that the contact area between the pin 2011 of the first component 201 and the pad 20 is greater than or equal to twice the gap area between the pin 2011 and the first spacer 30 along the extending direction of the pad 20, or greater than or equal to twice the gap area between the pin 2011 and the first spacer 30 along the extending direction perpendicular to the extending direction of the pad 20. That is, in Figure 15In the illustration, the first region 221 includes a first spacing region 221a, a second spacing region 221b, and a bonding region 221c. The first spacing region 221a is the gap between the pin 2011 and the first spacing portion 30 along the extension direction of the pad 20. The second spacing region 221b is the gap between the pin 2011 and the first spacing portion 30 along the extension direction perpendicular to the pad 20. The bonding region 221c is the contact area between the pin 2011 and the pad 20. Correspondingly, the area of ​​the bonding region 221c is greater than or equal to twice the area of ​​the first spacing region 221a, or greater than or equal to twice the area of ​​the second spacing region 221b. This ensures the soldering quality of the circuit board 100 to the first component 201.

[0120] Therefore, based on the limitations of the above embodiments, the circuit board 100 of this application uses the first spacing portion 30 to divide the first surface 21 of the pad 20 into a first region 221 and a second region 222, so as to realize the soldering and conduction of the pad 20 with the pins 2011 of the component 201 of different specifications using the first region 221 and the second region 222, thereby improving the compatibility of the circuit board 100 of this application.

[0121] The circuit board 100 of this application also has a first spacer 30 that protrudes or recedes relative to the first surface 21, which limits the flow range of solder paste 202 when soldering components 201 to pads 20, thereby ensuring the soldering quality between the pads 20 and the leads 2011 of components 201. When the circuit board 100 of this application is applied to electronic devices, the circuit board 100 can ensure the soldering quality with components 201 through the first spacer 30 and improve compatibility, so that electronic devices can also improve compatibility while ensuring soldering quality.

[0122] The circuit board 100 of this application can also be applied to other usage scenarios where power signals are received and processed. For example, the structure of the circuit board 100 is applied to electronic devices such as tablets, computers, mobile phones, and wearable devices. This application does not impose any particular limitations on this. Because the circuit board 100 of this application includes a first spacing portion 30, the first spacing portion 30 can improve the compatibility of the circuit board 100 of this application while ensuring soldering quality. In other usage scenarios, electronic devices using the circuit board 100 of this application have better compatibility and higher soldering quality.

[0123] In one embodiment, the first surface 21 further includes a second spacer 40, which is located within the first region 221 and protrudes or recesses relative to the first surface 21. The second spacer 40 extends along a second direction 002 and divides the first region 221 into a first sub-region 2211 and a second sub-region 2212 along a first direction 001. The pad 20 is used to solder and conduct to a pin 2011 of a component 201 through the first sub-region 2211 of the first region 221.

[0124] Please refer to the above. Figure 16 and Figure 17 ,in Figure 16 This is a schematic diagram of the structure of the electronic device provided in another embodiment of this application. Figure 17 This is a schematic diagram of the structure of the circuit board 100 provided in an embodiment of this application in yet another embodiment.

[0125] like Figure 16 and Figure 17 As shown, the circuit board 100 of this application is used to be compatible with the second component 201b and the first component 201a. Specifically, the pad 20 is soldered and connected to the first component 201a through the first sub-region 2211, and the pad 20 is soldered and connected to the second component 201b through the first sub-region 2211, the second sub-region 2212, and the second region 222. In this embodiment, the area of ​​the pin 2011 of the first component 201a is smaller than the area of ​​the pin 2011 of the second component 201b, and the spacing between the two pins 2011 on opposite sides of the first component 201a is smaller than the spacing between the two pins 2011 on opposite sides of the second component 201b.

[0126] In this embodiment of the application, when the circuit board 100 carries the first component 201a, such as Figure 16 As shown, the pad 20 is soldered to the pin 2011 of the first component 201a through the first sub-region 2211. That is, when the component 201 selected by the circuit board 100 of this application is the first component 201a, the pin 2011 of the first component 201a is soldered to the first sub-region 2211 of the pad 20 to form a single unit, thereby achieving soldering connection between the pin 2011 of the first component 201a and the pad 20.

[0127] Specifically, during the soldering process between the first component 201a and the pad 20, solder paste 202 needs to be applied to the first sub-region 2211 of the pad 20. After the pin 2011 contacts the pad 20 through the solder paste 202, the circuit board 100 and the component 201 are placed in a reflow oven. The high temperature of the reflow oven melts the solder paste 202, which adheres to the pin 2011 and the pad 20 due to its fluidity. Finally, the solder paste 202 is cooled and solidified to achieve soldering conductivity between the pin 2011 and the pad 20. The solder paste 202 is fluid under high temperature; in the reflow oven, it flows along the plane of the first surface 21 within a certain range. During cooling, the solder paste 202 shrinks due to thermal expansion and contraction, which may cause the pin 2011 to shift along the plane of the first surface 21. That is, when the pin 2011 of the component 201 selected by the circuit board 100 of this application only partially contacts the pad 20, the pin 2011 will be pulled off-center during the soldering process between the pin 2011 and the pad 20.

[0128] In this embodiment, the second spacer 40 protrudes or recesses relative to the first surface 21. The second spacer 40 is used to cooperate with the first spacer 30 to further restrict the flow range of the solder paste 202. Specifically, when the second spacer 40 protrudes relative to the first surface 21, during the soldering process between the first component 201a and the pad 20, after the solder paste 202 in the reflow oven melts, the first spacer 30 can block the molten solder paste 202 from flowing along the second direction 002, and the second spacer 40 can block the molten solder paste 202 from flowing along the first direction 001, thereby ensuring that the solder paste 202 on the pad 20 is located between the first sub-region 2211 and the pin 2011. When the second spacer 40 is recessed relative to the first surface 21, during the soldering process between the first component 201a and the pad 20, after the solder paste 202 in the reflow oven melts, both the first spacer 30 and the second spacer 40 can contain the melted solder paste 202 overflowing outward, so as to space the solder paste 202 flowing outside the pin 2011 from the solder paste 202 located between the pin 2011 and the first sub-region 2211, thereby reducing the impact of the solder paste 202 flowing outside the pin 2011 on the soldering of the pin 2011.

[0129] That is, by providing a first spacing portion 30 and a second spacing portion 40, and making both the first spacing portion 30 and the second spacing portion 40 protrude or recess relative to the first surface 21, when the circuit board 100 of this application is soldered and connected to the pin 2011 of the first component 201a through the first sub-region 2211 of the pad 20, the second spacing portion 40 can cooperate with the first spacing portion 30 to limit the flow range of the solder paste 202 applied in the first sub-region 2211 during soldering, so as to avoid the phenomenon that the solder paste 202 causes the pin 2011 to be pulled off-center during the soldering process, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered and connected to the first component 201a.

[0130] It is worth mentioning that, compared to Figure 1 and Figure 2 The first component 201a and the second component 201b are shown in the illustration. This application... Figure 16 and Figure 17 In the illustration, the pin 2011 of the first component 201a is further reduced in size to correspond to the component 201 with a further reduced size. Therefore, this embodiment of the application improves the compatibility of the circuit board 100 by providing a second spacing portion 40, enabling the second spacing portion 40 to cooperate with the first spacing portion 30.

[0131] In one embodiment, the first surface 21 further includes two second spacers 40, which are located within the first region 221 and protrude or recess relative to the first surface 21. Each second spacer 40 extends along a second direction 002 and divides the first region 221 into a first sub-region 2211 and a second sub-region 2212 along a first direction 001. The boundary of the first sub-region 2211 is formed by the first spacer 30 and the two second spacers 40. The pad 20 is used to solder and conduct to the pin 2011 of a component 201 through the first sub-region 2211 of the first region 221.

[0132] For details, please refer to the following: Figure 18 The diagram shown is another top view of the circuit board 100 provided in this embodiment of the application.

[0133] like Figure 18As shown, pad 20 is soldered and connected to first component 201a through first sub-region 2211, and pad 20 is soldered and connected to second component 201b through first sub-region 2211, second sub-region 2212, and second region 222. When the circuit board 100 of this application is equipped with first component 201a, the two second spacing portions 40 further restrict the flow range of solder paste 202, further avoid the influence of solder paste 202 on pin 2011 during cooling and solidification, further ensure the soldering quality of circuit board 100 to component 201, and improve the user experience.

[0134] It is worth mentioning that, Figure 18 Compared to Figure 17 In the illustrated embodiment, the relative position of the first sub-region 2211 on the pad 20 changes along the first direction 001. This is a matching setting based on the actual soldering position of the first component 201a and the pad 20. It is understood that in other embodiments, when the component 201 selected by the circuit board 100 of this application is... Figure 12 When soldering the first sub-region 2211 of pad 20 in the example shown, it can also be done using the same method as... Figure 16 and Figure 17 The different specifications of the components 201 shown in the figure correspond to the further reduction in the size of the pins 2011 of the component 201, so as to further match the components 201 with smaller pin 2011 sizes.

[0135] In one embodiment, such as Figure 17 As shown, the pin 2011 of the first component 201a is soldered to the pad 20 via the first sub-region 2211 of the pad 20. Along the thickness direction of the circuit board 100, the projection of the pin 2011 onto the pad 20 also contacts the second spacing portion 40 of the pad 20. Correspondingly, when the second spacing portion 40 protrudes relative to the first surface 21, the pin 2011 and the second spacing portion 40 are in contact with each other along the plane of the circuit board 100. When the second spacing portion 40 is recessed relative to the first surface 21, the projection of the pin 2011 onto the pad 20 contacts the groove wall of the second spacing portion 40.

[0136] Understandably, the projection of the pin 2011 of the first component 201a onto the pad 20 contacts the second spacer 40 to reduce the distance between the pin 2011 and the second spacer 40, ensuring that any overflowing solder paste 202 can be contained or blocked by the second spacer 40. This further ensures the soldering quality of the first component 201a on the circuit board 100 of this application.

[0137] In one embodiment, the second spacer 40 is recessed relative to the first surface 21, and the depth of the second spacer 40 is less than the thickness of the pad 20. Based on the above description of the first spacer 30, the recess depth of the second spacer 40 relative to the first surface 21 is less than the thickness of the pad 20, so that the pads 20 in the first sub-region 2211 and the pads 20 in the second sub-region 2212 are interconnected, thereby reducing the trace size between the pads 20 and the substrate 10, simplifying the trace arrangement between the substrate 10 and the pads 20, and reducing the manufacturing difficulty of the circuit board 100 of this application.

[0138] On the other hand, when the circuit board 100 of this application carries the second component 201b, the mutual conduction of the pads 20 in the first sub-region 2211 and the pads 20 in the second sub-region 2212 also avoids the phenomenon that the area of ​​the electrical connection between the pin 2011 and the pad 20 is affected by only a single region conducting, thereby ensuring the welding quality when the circuit board 100 of this application is soldered to the component 201.

[0139] In one embodiment, the length L3 of the second spacing portion 40 along the second direction 002 is less than the length L4 of the second pad 20. Based on the above description of the first spacing portion 30, the second spacing portion 40 extends along the second direction 002 toward the second sidewall 232 of the pad 20. Along the first direction 001, a gap exists between one end of the second spacing portion 40 and the second sidewall 232 of the pad 20. This gap is used to connect the pads in the first region 221 and the pads in the second region 222. This simplifies the routing between the substrate 10 and the pads 20, reducing the manufacturing difficulty of the circuit board 100 of this application. Furthermore, it avoids the phenomenon that only a single region is connected, affecting the area of ​​the electrical connection between the pin 2011 and the pad 20, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered to the component 201.

[0140] In this embodiment, the second spacer 40 is recessed relative to the first surface 21 and extends through the pad 20 along its thickness direction. In this case, the second spacer 40 exposes the surface of the substrate 10 where the pad 20 is located, providing a channel for the flux in the solder paste 202 to escape, preventing the gas generated by the high temperature of the flux from directly escaping between the pin 2011 and the pad 20, thus affecting the soldering quality between the pin 2011 and the pad 20. This ensures the soldering quality of the circuit board 100 to the components 201.

[0141] In one embodiment, along the second direction 002, the second width dimension D2 of the second spacing portion 40 is greater than or equal to 0.2 mm. The second spacing portion 40 is recessed relative to the first surface 21. When the second spacing portion 40 is recessed relative to the first surface 21, the circuit board 100 of this application limits the second width dimension D2 of the second spacing portion 40 to be greater than or equal to 0.2 mm to ensure the capacity of the second spacing portion 40 to receive the solder paste 202 flowing into the second spacing portion 40, avoid the solder paste 202 overflowing into the second region 222, reduce the impact of the solder paste 202 on the pins 2011, ensure the soldering quality when the circuit board 100 of this application is connected to the first component 201a, and improve the user experience.

[0142] In one embodiment, the second spacer portion 40 protrudes relative to the first surface 21, and the height of the second spacer portion 40 relative to the first surface 21 is greater than or equal to 0.08 mm and less than or equal to 0.1 mm. By limiting the height of the second spacer portion 40 relative to the first surface 21 to between 0.08 mm and 0.1 mm, the circuit board 100 of this application can ensure the soldering quality between the pins 2011 of the first component 201a and the second component 201b and the pad 20 when the circuit board 100 is soldered and connected with the first component 201a and the second component 201b, thereby improving the user experience.

[0143] In one embodiment, such as Figure 16 and Figure 17 As shown, the projection shape of the first spacing portion 30 on the pad 20 is the same as the projection shape of the second spacing portion 40 on the pad 20. Figure 16 In the illustrated figure, the projection shape of the first spacing portion 30 onto the pad 20 is rectangular. In another embodiment, as shown... Figure 19 As shown, the projection shape of the first spacing portion 30 onto the pad 20 is triangular. In another embodiment, as... Figure 20 As shown, the projection shape of the first spacing portion 30 onto the pad 20 is a parallelogram. In another embodiment, as... Figure 21 As shown, the projection shape of the first spacing portion 30 onto the pad 20 is hexagonal. In another embodiment, as... Figure 22 As shown, the projection shape of the first spacing portion 30 onto the pad 20 is elliptical. In another embodiment, as... Figure 23 As shown, the projection shape of the first spacing portion 30 onto the pad 20 is cross-shaped. It is understood that the projection shape of the first spacing portion 30 onto the pad 20 can also be other, and this application does not impose any particular limitation on this.

[0144] It is worth noting that the extension directions of the first spacing portion 30 and the second spacing portion 40 do not refer to the length direction of the first spacing portion 30 and the second spacing portion 40. The first direction 001 and the second direction 002 are only used to show the relative shape of the first spacing portion 30 and the second spacing portion 40 on the pad 20. They are only used to show that the first spacing portion 30 has a certain size in the first direction 001 and the second spacing portion 40 has a certain size in the second direction 002, and do not represent the actual shape.

[0145] In one embodiment, both the first spacer portion 30 and the second spacer portion 40 are recessed relative to the first surface 21. Along the thickness direction of the substrate 10, the ratio between the sum of the projected areas of the first spacer portion 30 and the second spacer portion 40 on the first surface 21 and the area of ​​the first surface 21 is less than or equal to 0.35. Therefore, when the second component 201b is mounted on the circuit board 100 of this application, the contact area between the second component 201b and the pad 20 is guaranteed. This ensures the soldering quality of the second component 201b on the circuit board 100 of this application.

[0146] In one embodiment, the first surface 21 further includes a third spacer 50, which is located within the first region 221 and protrudes or recesses relative to the first surface 21. The third spacer 50 extends along a first direction 001 and divides the first region 221 into a third sub-region 2213 and a fourth sub-region 2214 along a second direction 002. The third sub-region 2213 is located between the fourth sub-region 2214 and the second region 222. The pad 20 is used to solder and conduct to the pin 2011 of another component 201 through the second region 222 and the third sub-region 2213.

[0147] Please refer to the above. Figure 24 and Figure 25 ,in Figure 24 This is a schematic diagram of the structure of the electronic device provided in another embodiment of this application. Figure 25 This is a schematic diagram of the circuit board 100 provided in another embodiment of this application. The diagram is provided for clarity in describing the connection method between the pins 2011 and pads 20 of the second component 201b. Figure 24 The schematic diagram shown has a cut-out of pin 2011.

[0148] like Figure 24 and Figure 25As shown, the circuit board 100 of this application is used to be compatible with the second component 201b and the first component 201a. Specifically, the pad 20 is soldered to the first component 201a through the third sub-region 2213 and the fourth sub-region 2214, and the pad 20 is soldered to the second component 201b through the third sub-region 2213 and the second region 222. The spacing between the two pins 2011 on opposite sides of the first component 201a is smaller than the spacing between the two pins 2011 on opposite sides of the second component 201b.

[0149] In this embodiment of the application, when the circuit board 100 carries the second component 201b, such as Figure 24 As shown, the pad 20 is soldered to the pin 2011 of the second component 201b through the third sub-region 2213 and the fourth sub-region 2214. That is, when the component 201 selected by the circuit board 100 of this application is the second component 201b, the pin 2011 of the second component 201b is soldered together with the third sub-region 2213 and the fourth sub-region 2214 of the pad 20 to achieve soldering connection between the pin 2011 of the second component 201b and the pad 20.

[0150] Specifically, during the soldering process between the second component 201b and the pad 20, solder paste 202 needs to be applied to the third sub-region 2213 and the fourth sub-region 2214 of the pad 20. After the pin 2011 contacts the pad 20 through the solder paste 202, the circuit board 100 and the component 201 are placed in a reflow oven. The high temperature of the reflow oven melts the solder paste 202, which adheres to the pin 2011 and the pad 20 due to its fluidity. Finally, the solder paste 202 is cooled and solidified to achieve soldering conductivity between the pin 2011 and the pad 20. The solder paste 202 is fluid under high temperature; in the reflow oven, it flows along the plane of the first surface 21 within a certain range. During cooling, the solder paste 202 shrinks due to thermal expansion and contraction, which may pull the pin 2011 off-center along the plane of the first surface 21. That is, when the pin 2011 of the component 201 selected by the circuit board 100 of this application only partially contacts the pad 20, the pin 2011 will be pulled off-center during the soldering process between the pin 2011 and the pad 20.

[0151] In this embodiment, the third spacer 50 protrudes or recesses relative to the first surface 21, and the third spacer 50 is used to limit the flow range of the solder paste 202. Specifically, when the third spacer 50 protrudes relative to the first surface 21, during the soldering process between the second component 201b and the pad 20, after the solder paste 202 in the reflow oven melts, the third spacer 50 can block the molten solder paste 202 from flowing along the second direction 002, thereby ensuring that the solder paste 202 on the pad 20 is located between the pad 20 and the pin 2011. When the third spacer 50 is recessed relative to the first surface 21, during the soldering process between the second component 201b and the pad 20, after the solder paste 202 in the reflow oven melts, the third spacer 50 can contain the melted solder paste 202 overflowing outward, so as to space the solder paste 202 flowing outside the pin 2011 from the solder paste 202 located between the pin 2011 and the pad 20, thereby reducing the impact of the solder paste 202 flowing outside the pin 2011 on the soldering of the pin 2011.

[0152] That is, by providing a third spacer 50, and making the third spacer 50 protrude or recess relative to the first surface 21, when the circuit board 100 of this application is soldered and connected to the pin 2011 of the second component 201b through the third sub-region 2213 and the second region 222 of the pad 20, the third spacer 50 can limit the flow range of the solder paste 202 applied in the third sub-region 2213 and the second region 222 during soldering, so as to avoid the phenomenon that the solder paste 202 causes the pin 2011 to be pulled off course during the soldering process, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered and connected to the second component 201b.

[0153] It is worth noting that, compared to the second component 201b in other embodiments, this application... Figure 24 and Figure 25 The pins 2011 of the second component 201b are relatively small, and the spacing between the pins 2011 on both sides is relatively large. Correspondingly, the contact area between the pins 2011 of the second component 201b and the pad 20 is smaller than the area of ​​the first surface 21 of the pad 20. Therefore, this embodiment of the application improves the compatibility of the circuit board 100 by providing a third spacing portion 50, allowing the third spacing portion 50 to cooperate with the first spacing portion 30.

[0154] In one embodiment, such as Figure 24As shown, the pin 2011 of the second component 201b is soldered and connected to the pad 20 through the third sub-region 2213 and the second region 222 of the pad 20. Along the thickness direction of the circuit board 100, the projection of the pin 2011 onto the pad 20 also contacts the third spacer 50 of the pad 20. Correspondingly, when the third spacer 50 protrudes relative to the first surface 21, the pin 2011 and the third spacer 50 are in contact with each other along the plane of the circuit board 100. When the third spacer 50 is recessed relative to the first surface 21, the projection of the pin 2011 onto the pad 20 contacts the groove wall of the third spacer 50.

[0155] Understandably, the projection of the pin 2011 of the second component 201b onto the pad 20 contacts the third spacer 50 to reduce the distance between the pin 2011 and the third spacer 50, ensuring that any overflowing solder paste 202 can be contained or blocked by the third spacer 50. This further ensures the soldering quality of the second component 201b on the circuit board 100 of this application.

[0156] In one embodiment, the third spacer 50 is recessed relative to the first surface 21, and the depth of the third spacer 50 is less than the thickness of the pad 20. Based on the above description of the first spacer 30, the recess depth of the third spacer 50 relative to the first surface 21 is less than the thickness of the pad 20, so that the pads 20 in the third sub-region 2213 and the pads 20 in the fourth sub-region 2214 are interconnected, thereby reducing the trace size between the pads 20 and the substrate 10, simplifying the trace arrangement between the substrate 10 and the pads 20, and reducing the manufacturing difficulty of the circuit board 100 of this application.

[0157] On the other hand, when the circuit board 100 of this application carries the second component 201b, the mutual conduction of the pads 20 in the third sub-region 2213 and the pads 20 in the fourth sub-region 2214 also avoids the phenomenon that the area of ​​the electrical connection between the pin 2011 and the pad 20 is affected by only a single region conducting, thereby ensuring the welding quality when the circuit board 100 of this application is soldered to the component 201.

[0158] In one embodiment, the length L5 of the third spacing portion 50 along the first direction 001 is less than the length L2 of the first pad of the pad 20. Based on the above description of the first spacing portion 30, the third spacing portion 50 extends along the first direction 001 toward the first sidewall 231 of the pad 20. Along the first direction 001, there is a gap between one end of the third spacing portion 50 and the first sidewall 231 of the pad 20. This gap is used to connect the pad 20 in the third sub-region 2213 and the pad in the fourth sub-region 2214. This simplifies the routing between the substrate 10 and the pad 20, reducing the manufacturing difficulty of the circuit board 100 of this application. Furthermore, it avoids the phenomenon that only a single area is connected, affecting the area of ​​the electrical connection between the pin 2011 and the pad 20, thereby ensuring the soldering quality when the circuit board 100 of this application is soldered to the component 201.

[0159] In this embodiment, the third spacer 50 is recessed relative to the first surface 21 and extends through the pad 20 along its thickness direction. In this case, the third spacer 50 exposes the surface of the substrate 10 where the pad 20 is located, providing a channel for the flux in the solder paste 202 to escape, preventing the gas generated by the high temperature of the flux from directly escaping between the pin 2011 and the pad 20, thus affecting the soldering quality between the pin 2011 and the pad 20. This ensures the soldering quality of the circuit board 100 to the components 201.

[0160] In one embodiment, along the second direction 002, the third width dimension D3 of the third spacing portion 50 is greater than or equal to 0.2 mm. The third spacing portion 50 is recessed relative to the first surface 21. When the third spacing portion 50 is recessed relative to the first surface 21, the circuit board 100 of this application limits the third width dimension D3 of the third spacing portion 50 to be greater than or equal to 0.2 mm to ensure the capacity of the third spacing portion 50 to receive the solder paste 202 flowing into the third spacing portion 50, avoid the solder paste 202 overflowing into the second region 222, reduce the impact of the solder paste 202 on the pins 2011, ensure the soldering quality when the circuit board 100 of this application is connected to the second component 201b, and improve the user experience.

[0161] In one embodiment, the third spacer portion 50 protrudes relative to the first surface 21, and the height of the third spacer portion 50 relative to the first surface 21 is greater than or equal to 0.08 mm and less than or equal to 0.1 mm. By limiting the height of the third spacer portion 50 relative to the first surface 21 to between 0.08 mm and 0.1 mm, the circuit board 100 of this application can ensure the soldering quality between the pins 2011 of the second component 201b and the pad 20 when the circuit board 100 is soldered to the second component 201b, thereby improving the user experience.

[0162] It is worth noting that the first spacing portion 30, the second spacing portion 40, and the third spacing portion 50 proposed in the above embodiments of this application can all be matched and set according to the actual situation of the component 201 to improve the compatibility of the circuit board 100 of this application. Specifically, based on the setting of the first spacing portion 30, if the area of ​​the pin 2011 of the component 201 is relatively small, and the size of the pin 2011 along the first direction 001 is smaller than the size of the pad 20, then the second spacing portion 40 can be set on the first direction 001 to block the flow range of the solder paste 202 along the first direction 001. If the size of the pin 2011 of the component 201 along the second direction 002 is smaller than the size of the pad 20 along the second direction 002, then the third spacing portion 50 can be set on the second direction 002 to block the flow range of the solder paste 202 along the second direction 002.

[0163] For example, such as Figure 26 As shown, the first surface 21 includes a second spacer 40 and a third spacer 50, both of which are located in the first region 221. The first spacer 30, second spacer 40, and third spacer 50 are used to cooperate in forming the external environment of the mounting area 223. When the circuit board 100 of this application mounts the first component 201a, the pins 2011 of the first component 201a are soldered and connected to the pads 20 through the mounting area 223.

[0164] In one embodiment, along the first direction 001, the size of the pad 20 of the first region 221 is larger than the size of the pad 20 of the second region 222.

[0165] Please refer to the above. Figures 27-29 ,in, Figure 27 This is a schematic diagram of the external structure of the electronic device provided in the embodiments of this application. Figure 28 This is another schematic diagram of the external structure of the electronic device provided in the embodiment of this application. Figure 29 This is another top view of the circuit board 100 provided in an embodiment of this application.

[0166] like Figures 27-29As shown, the first surface 21 also includes a third spacer 50 located within the first region 221. When the circuit board 100 of this application mounts the second component 201b, along the second direction 002, the third spacer 50 restricts the flow range of the solder paste 202. Along the first direction 001, the extension dimension of the third spacer 50 is smaller than the size of the pad 20 in the first region 221, and greater than or equal to the size of the pad 20 in the second region 222. It can be understood that the extension dimension of the third spacer 50 is set to further enhance the blocking effect of the third spacer 50 on the solder paste 202 when the circuit board 100 of this application mounts the second component 201b, thereby further ensuring the soldering quality of the circuit board 100 on the second component 201b.

[0167] Among them, Figure 27 and Figure 28 In the illustrated embodiment, the dimension of pin 2011 of the first component 201a along the first direction 001 is larger than the dimension of pin 2011 of the second component 201b. That is, in this application... Figure 29 The arrangement of the pads 20 shown enables the circuit board 100 of this application to be compatible with Figure 27 and Figure 28 The first component 201a and the second component 201b shown further enhance the compatibility of the circuit board 100 of this application.

[0168] In one embodiment, there are multiple pads 20, each pad 20 is fixed at intervals on the substrate 10, and the first regions 221 of each pad 20 used for soldering and connecting with the same component 201 are close to each other.

[0169] For details, please refer to the following: Figure 30 and Figure 31 ,in Figure 30 This is another schematic diagram of the external structure of the electronic device provided in the embodiments of this application. Figure 31 This is another top view of the circuit board 100 provided in an embodiment of this application.

[0170] like Figure 30 and Figure 31As shown, the two first regions 221 of two adjacent pads 20 along the second direction 002 are close to each other, and the two first regions 221 are located between the two first intervals 30 of the two pads 20. Based on the function of the first intervals 30 in limiting the flow range of solder paste 202, it can be understood that when the circuit board 100 of this application is equipped with the first component 201a, the two pins 2011 of the first component 201a are soldered and connected to the pads 20 through the two first regions 221 respectively. At this time, the two pins 2011 of the first component 201a are located between the two first intervals 30 along the second direction 002. The two first intervals 30 can, based on their own limiting effect on the flow range of solder paste 202, prevent the pins 2011 of the first component 201a from being pulled to the opposite sides of the first component 201a along the second direction 002 under the action of the solder paste 202, thereby ensuring the soldering quality between the circuit board 100 of this application and the component 201.

[0171] In one embodiment, the circuit board 100 further includes a plurality of second pads 60, each second pad 60 being fixed at intervals on the substrate 10, and at least one second pad 60 and at least one pad 20 being used to solder and conduct to each pin 2011 of the same component 201.

[0172] Please refer to the above. Figure 32 and Figure 33 ,in Figure 32 This is another schematic diagram of the external structure of the electronic device provided in the embodiments of this application. Figure 33 This is another top view of the circuit board 100 provided in an embodiment of this application.

[0173] like Figure 32 and Figure 33 As shown, when some pins 2011 in the first component 201a and the second component 201b have the same size, these pins 2011 are used to solder and conduct to the second pad 60. It is understood that when the relative positions and sizes of some pins 2011 in two different specifications of components 201 required to be mounted on the circuit board 100 of this application are the same, the circuit board 100 can differentiate the pads that conduct to the same component 201 to ensure compatibility while reducing the manufacturing difficulty of the circuit board 100 and facilitating its fabrication.

[0174] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the scope of protection of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A circuit board, characterized in that, The circuit board includes a substrate and pads. The pads are fixed to the substrate. The pads have a first spacer portion on a first surface away from the substrate. The first spacer portion is raised or recessed relative to the first surface. The first spacer portion extends along a first direction and divides the first surface into a first region and a second region along a second direction. The second direction is perpendicular to the first direction. The pad is used to solder to the pins of a component through the first area, or the pad is used to solder to the pins of another component through the first area and the second area.

2. The circuit board according to claim 1, characterized in that, The first spacer is recessed relative to the first surface, and the depth of the first spacer is less than the thickness of the pad, or the length of the first spacer along the first direction is less than the length of the pad.

3. The circuit board according to claim 2, characterized in that, Along the second direction, the width of the first interval is greater than or equal to 0.2 mm.

4. The circuit board according to claim 1, characterized in that, The first spacer protrudes relative to the first surface, and the height of the first spacer relative to the first surface is greater than or equal to 0.08 mm and less than or equal to 0.1 mm.

5. The circuit board according to any one of claims 1-4, characterized in that, The first surface further includes a second spacer portion located within the first region and protruding or recessed relative to the first surface. The second spacer portion extends along the second direction and divides the first region into a first sub-region and a second sub-region along the first direction. The pad is used to solder and conduct to the pins of the component through the first sub-region of the first region.

6. The circuit board according to claim 5, characterized in that, The second spacer is recessed relative to the first surface, and the depth of the second spacer is less than the thickness of the pad, or the length of the second spacer along the second direction is less than the length of the pad.

7. The circuit board according to any one of claims 1-4, characterized in that, The first surface further includes a third spacer portion located within the first region and protruding or recessed relative to the first surface. The third spacer portion extends along the first direction and divides the first region into a third sub-region and a fourth sub-region along the second direction. The third sub-region is located between the fourth sub-region and the second region. The pad is used for soldering and conducting with the pins of the other component through the second region and the third sub-region.

8. The circuit board according to claim 7, characterized in that, The third spacer is recessed relative to the first surface, and the depth of the third spacer is less than the thickness of the pad, or the length of the third spacer along the first direction is less than the length of the pad.

9. The circuit board according to any one of claims 1-4, characterized in that, The number of pads is multiple, and each pad is fixed at intervals on the substrate. The first areas of each pad that is used to solder and conduct to the same component are close to each other.

10. An electronic device, characterized in that, The electronic device includes a housing, components, and a circuit board as described in any one of claims 1-9, wherein the circuit board and the components are housed within the housing, and the pins of the components are soldered to the pads of the circuit board for electrical connection.

11. The electronic device according to claim 10, characterized in that, The pin is used to conduct through a first area of ​​the pad to the pad, and along the thickness direction of the circuit board, the projection of the pin on the pad contacts a first gap of the pad.

12. The electronic device according to claim 10, characterized in that, The pin is used to solder and conduct to the pad through a first region and a second region of the pad, and along the thickness direction of the circuit board, the projection of the pin on the pad at least covers a first gap of the pad.

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