Circuit board with high reflective film

Abstract

The utility model provides a circuit board with a high reflective film, which comprises a circuit board body, the circuit board body comprises an inner layer, and the upper surface of the inner layer is provided with a first modified copper foil layer, a first composite layer, a first solder mask layer and a high reflective film layer from bottom to top in sequence. A second modified copper foil layer, a second composite layer and a second solder mask layer are sequentially arranged on the lower surface of the inner layer from top to bottom; the first composite layer and the second composite layer are both composite layers formed by compounding plasma fluorocarbon coatings and silane coupling agents. Layer structure arrangement is optimized, and it is ensured that the structure has a good heat dissipation function.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a circuit board with a high-reflectivity film. Background Technology

[0002] Chinese Patent Publication No. CN221177991U, published on June 18, 2024, discloses a multi-layer, ultra-thick printed circuit board with a blind via structure. The board includes a circuit board with a through-hole at the top, a blind via fixedly connected to one side of the through-hole, a protective head movably connected to the top of the blind via, a rubber insulating layer fixedly connected inside the circuit board, an inner copper foil fixedly connected to one side of the rubber insulating layer, an epoxy resin layer fixedly connected to one side of the inner copper foil, silver powder fixedly connected inside the epoxy resin layer, buried vias fixedly connected inside the circuit board, a heat-resistant layer fixedly connected inside the through-hole, a waterproof layer fixedly connected to one side of the heat-resistant layer, and solder resist ink fixedly connected to one side of the waterproof layer. This invention, through its multi-layer, ultra-thick printed circuit board with a blind via structure, has advantages such as reasonable structural design, rapid heat dissipation, and impact resistance, effectively solving the problems and shortcomings of existing devices. The existing technology has the following drawbacks: while improving heat resistance, the structure is complex, increasing production difficulty, and the overall structure cannot achieve lightweight design. Therefore, improvement is urgently needed. Utility Model Content

[0003] Based on this, the purpose of this utility model is to provide a circuit board with a high-reflectivity film, optimize the layer structure, and ensure that the structure has good heat dissipation function.

[0004] This utility model provides a circuit board with a high-reflectivity film, including a circuit board body. The circuit board body includes an inner layer. The upper surface of the inner layer is provided with a first modified copper foil layer, a first composite layer, a first solder resist layer, and a high-reflectivity film layer from bottom to top. The lower surface of the inner layer is provided with a second modified copper foil layer, a second composite layer, and a second solder resist layer from top to bottom. The first composite layer and the second composite layer are both configured as composite layers composed of a plasma fluorocarbon coating and a silane coupling agent.

[0005] Preferably, both the first modified copper foil layer and the second modified copper foil layer are configured as copper foil layers with built-in nano-shielding particles.

[0006] Preferably, the thickness of the first modified copper foil layer is set to 1 oz to 1.5 oz; the thickness of the second modified copper foil layer is set to 1 oz to 1.5 oz.

[0007] Preferably, the thickness of the first composite layer is set to 0.1mm to 0.5mm; the thickness of the second composite layer is set to 0.1mm to 0.5mm.

[0008] Preferably, a waterproof layer is coated on each side edge of the circuit board body.

[0009] The beneficial effects of this utility model are as follows: The circuit board body includes an inner layer, a first modified copper foil layer, a first composite layer, a first solder resist layer, a high-reflectivity film layer, a second modified copper foil layer, a second composite layer, and a second solder resist layer. Among them, the modified copper foil layer improves the mechanical properties and reliability of the circuit board. Especially in high-frequency signal transmission, the modified copper foil can reduce signal attenuation and electromagnetic interference, and can effectively cope with heat dissipation and mechanical stress problems in complex circuit designs. By setting the composite layer, which is a composite layer composed of plasma fluorocarbon coating and silane coupling agent, the circuit board has excellent high temperature resistance and corrosion resistance, which can effectively reduce signal transmission loss and protect the circuit board from the influence of the external environment. In addition, it also improves the interlayer bonding force and blocks the moisture diffusion path. By setting the high-reflectivity film layer, heat can be prevented from being conducted to sensitive components. Attached Figure Description

[0010] Figure 1 This is a cross-sectional view of the present invention.

[0011] The reference numerals in the attached figures are: inner layer 10, first composite layer 13, first solder resist layer 12, high reflectivity film layer 11, second solder resist layer 14, second modified copper foil layer 15, second composite layer 17, and first modified copper foil layer 16. Detailed Implementation

[0012] To further understand the features, technical means, and specific objectives and functions achieved by this utility model, the following detailed description of this utility model is provided in conjunction with specific embodiments and accompanying drawings.

[0013] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0014] Please refer to Figure 1As shown, this utility model provides a circuit board with a high-reflectivity film, including a circuit board body. The circuit board body includes an inner layer 10. From bottom to top, the upper surface of the inner layer 10 is sequentially provided with a first modified copper foil layer 16, a first composite layer 13, a first solder resist layer 12, and a high-reflectivity film layer 11. From top to bottom, the lower surface of the inner layer 10 is sequentially provided with a second modified copper foil layer 15, a second composite layer 17, and a second solder resist layer 14. Both the first composite layer 13 and the second composite layer 17 are composite layers composed of a plasma fluorocarbon coating and a silane coupling agent. In this embodiment, a high-reflectivity film layer composed of a white alkali-developable photosensitive resin and a thermosetting resin is selected. This structure achieves the connection and fixation between layers through pressing, curing, and then coating. Modified copper foil layers enhance the mechanical properties and reliability of circuit boards, especially in high-frequency signal transmission. Modified copper foil can reduce signal attenuation and electromagnetic interference, and effectively address heat dissipation and mechanical stress issues in complex circuit designs. By setting a composite layer, which is a composite layer of plasma fluorocarbon coating and silane coupling agent, the circuit board has excellent high-temperature resistance and corrosion resistance, effectively reducing signal transmission losses and protecting the circuit board from external environmental influences. It also improves interlayer bonding and blocks moisture diffusion paths. By setting a high-reflectivity film layer, heat can be prevented from being conducted to sensitive components.

[0015] Preferably, both the first modified copper foil layer 16 and the second modified copper foil layer 15 are configured as copper foil layers with built-in nano-shielding particles. The built-in nano-shielding particles can be achieved by electroplating or spraying, thereby improving the shielding effect and high-temperature oxidation resistance.

[0016] Preferably, the thickness of the first modified copper foil layer 16 is set to 1 oz to 1.5 oz; the thickness of the second modified copper foil layer 15 is set to 1 oz to 1.5 oz. The thickness of the first composite layer 13 is set to 0.1 mm to 0.5 mm; the thickness of the second composite layer 17 is set to 0.1 mm to 0.5 mm.

[0017] Preferably, a waterproof layer is coated on each edge of the circuit board body to further improve the moisture resistance and waterproof performance of the structure.

[0018] The above-described embodiments are merely one implementation of this utility model, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A circuit board with a high-reflectivity film, comprising a circuit board body, the circuit board body including an inner layer (10), characterized in that: The upper surface of the inner layer (10) is provided with a first modified copper foil layer (16), a first composite layer (13), a first solder resist layer (12), and a high reflectivity film layer (11) from bottom to top. The lower surface of the inner layer (10) is provided with a second modified copper foil layer (15), a second composite layer (17), and a second solder resist layer (14) from top to bottom. The first composite layer (13) and the second composite layer (17) are both configured as composite layers composed of plasma fluorocarbon coating and silane coupling agent.

2. The circuit board with a high-reflectivity film according to claim 1, characterized in that: Both the first modified copper foil layer (16) and the second modified copper foil layer (15) are configured as copper foil layers with built-in nano-shielding particles.

3. A circuit board with a high-reflectivity film according to claim 1, characterized in that: The thickness of the first modified copper foil layer (16) is set to 1OZ to 1.5OZ; the thickness of the second modified copper foil layer (15) is set to 1OZ to 1.5OZ.

4. A circuit board with a high-reflectivity film according to claim 1, characterized in that: The thickness of the first composite layer (13) is set to 0.1 mm to 0.5 mm; the thickness of the second composite layer (17) is set to 0.1 mm to 0.5 mm.

5. A circuit board with a high-reflectivity film according to claim 1, characterized in that: A waterproof layer is coated on each edge of the circuit board body.

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